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Intel® Apollo Lake-I processor-based ultra compact embedded platform

Adlink MXE-210

MPN:

MXE-210

Manufacturer L3 Communications

ADLINK

Description:

Adlink is pleased to announce our newest IIoT-ready platform, the MXE-210. With dual functionality as a gateway and controller, the palm-size MXE-210 Series is industrial grade EMC-certified and fully operational in environments from -40°C to 85°C. The robust and reliable MXE-210 series supports a broad range of applications including transportation, industrial automation, agriculture, aquaculture, smart city, and more. 

The MXE-210 series provides high expansion capability, multiple wireless connectivity, and comprehensive security for IIoT use. Based on the Intel® Atom x7-E3950/x5-E3930 processor, the MXE-210 Series is compatible to AWS Greengrass, Microsoft Azure IoT Edge, PrismTech VORTEX Edge Connect to deliver edge computing capability. With rich I/O, the MXE-210 Series supports a wide range of communication protocols for data exchange and control, as well as DDS (Data Distribution Service). And hardware and software integrity are assured with TPM 2.0, Intel® Boot Guard, and Secured Boot.

Features:

  • 3-min value props overview

    Compact, robust and reliable construction

  • Minimum footprint (A6 palm size)
  • Wide temperature support from -40°C to 85°C
  • Industrial grade EMC standard EN61000-6-4/2 certified; EN 50155 EMC compliance
  • IIoT-ready

  • Compatible with a wide range of communication protocols such as Modbus, EtherCAT, DDS, MQTT, CANbus, CANOpen for data exchange by Vortex Edge Connect
  • Supports Wi-Fi, BT, LoRa, 3G and 4G LTE wireless connectivity
  • Simplify global cellular IoT deployments with eSIM (embedded SIM) for more rugged and secure design
  • Security building blocks

  • Built-in TPM 2.0 (Trusted Platform Module) provides hardware-based security
  • Intel® Boot Guard and Secure Boot features provide the protection of preventing unauthorized software and malware takeover from Boot to OS

Industrial ATX motherboard with 6th/7th Gen Intel Core® i7/i5/i3 processor

Adlink IMB-M43H

MPN:

0000008RVQ

Manufacturer L3 Communications

ADLINK

Description:

Adlink is pleased to announce that the latest ATX industrial motherboard IMB-M43H now released. 

IMB-M43H is an ATX motherboard supporting the Desktop 6th and 7th Generation Intel Core® i7/i5/i3 Processors with Intel® H110 Chipset, providing the most cost-competitive solution anywhere in embedded computing and fulfilling the specific needs of all users requiring 5 PCI add-on cards. With high-speed data transfer interfaces such as PCIe 3.0/2.0, USB 3.0, and SATA 6 Gb/s (SATA III), dual-channel DDR4 memory up to 32 GB in two DIMM slots for industrial automation applications, the ADLINK IMB-M43H carries significant competitive advantage in the market. This leading, rugged I/O design enhances user experience with robust device compatibility, durable connectivity, and extreme environment readiness.

Features:

  • 6th (Sky Lake)/7th (Kaby Lake) Gen Intel Corei CPU
  • 6th Gen Intel Corei CPU supports OS windows 7
  • Up to 32 GB Dual-channel DDR4 2133/2400 MHz
  • 5xPCI+2xPCIe for automation application
  • Rugged I/O
  • Unique power design to ensure stable USB power of 5V ±5%
  • IEC 61000-4-2~6 (Performance Criterion A), CE/FCC class B Certified D

M material, high-permability ferrite, toroid, 2152 AI, 15000 permeability, parylene

Magnetics M Material

MPN:

YM-40502-TC

Manufacturer L3 Communications

Magnetics Inc

Description:

M material is a new, high-permeability (15,000µ) material designed for optimum impedance performance across frequency ranges. High-permeability ferrite materials provide superior loss factor, frequency response, temperature performance and product consistency. M material is suitable for signal, choke, and filter applications such as common mode chokes, EMI suppression filters, signal processing and broadband transformers.

M material, high-permability ferrite, toroid, 2963 AI, 15000 permeability, parylene

Magnetics M Material

MPN:

YM-40601-TC

Manufacturer L3 Communications

Magnetics Inc

Description:

M material is a new, high-permeability (15,000µ) material designed for optimum impedance performance across frequency ranges. High-permeability ferrite materials provide superior loss factor, frequency response, temperature performance and product consistency. M material is suitable for signal, choke, and filter applications such as common mode chokes, EMI suppression filters, signal processing and broadband transformers.

M material, high-permability ferrite, toroid, 12535 AI, 15000 permeability, bare

Magnetics M Material

MPN:

0M-40705-TC

Manufacturer L3 Communications

Magnetics Inc

Description:

M material is a new, high-permeability (15,000µ) material designed for optimum impedance performance across frequency ranges. High-permeability ferrite materials provide superior loss factor, frequency response, temperature performance and product consistency. M material is suitable for signal, choke, and filter applications such as common mode chokes, EMI suppression filters, signal processing and broadband transformers.

M material, high-permability ferrite, toroid, 6199 AI, 15000 permeability, parylene

Magnetics M Material

MPN:

YM-40603-TC

Manufacturer L3 Communications

Magnetics Inc

Description:

M material is a new, high-permeability (15,000µ) material designed for optimum impedance performance across frequency ranges. High-permeability ferrite materials provide superior loss factor, frequency response, temperature performance and product consistency. M material is suitable for signal, choke, and filter applications such as common mode chokes, EMI suppression filters, signal processing and broadband transformers.

M material, high-permability ferrite, toroid, 6199 AI, 15000 permeability, bare

Magnetics M Material

MPN:

0M-40603-TC

Manufacturer L3 Communications

Magnetics Inc

Description:

M material is a new, high-permeability (15,000µ) material designed for optimum impedance performance across frequency ranges. High-permeability ferrite materials provide superior loss factor, frequency response, temperature performance and product consistency. M material is suitable for signal, choke, and filter applications such as common mode chokes, EMI suppression filters, signal processing and broadband transformers.

M material, high-permability ferrite, toroid, 6644 AI, 15000 permeability, bare

Magnetics M Material

MPN:

0M-41003-TC

Manufacturer L3 Communications

Magnetics Inc

Description:

M material is a new, high-permeability (15,000µ) material designed for optimum impedance performance across frequency ranges. High-permeability ferrite materials provide superior loss factor, frequency response, temperature performance and product consistency. M material is suitable for signal, choke, and filter applications such as common mode chokes, EMI suppression filters, signal processing and broadband transformers.

M material, high-permability ferrite, toroid, 12535 AI, 15000 permeability, parylene

Magnetics M Material

MPN:

YM-40705-TC

Manufacturer L3 Communications

Magnetics Inc

Description:

M material is a new, high-permeability (15,000µ) material designed for optimum impedance performance across frequency ranges. High-permeability ferrite materials provide superior loss factor, frequency response, temperature performance and product consistency. M material is suitable for signal, choke, and filter applications such as common mode chokes, EMI suppression filters, signal processing and broadband transformers.

M material, high-permability ferrite, toroid, 6644 AI, 15000 permeability, epoxy

Magnetics M Material

MPN:

ZM-41003-TC

Manufacturer L3 Communications

Magnetics Inc

Description:

M material is a new, high-permeability (15,000µ) material designed for optimum impedance performance across frequency ranges. High-permeability ferrite materials provide superior loss factor, frequency response, temperature performance and product consistency. M material is suitable for signal, choke, and filter applications such as common mode chokes, EMI suppression filters, signal processing and broadband transformers.

M material, high-permability ferrite, toroid, 9988 AI, 15000 permeability, epoxy

Magnetics M Material

MPN:

ZM-41005-TC

Manufacturer L3 Communications

Magnetics Inc

Description:

M material is a new, high-permeability (15,000µ) material designed for optimum impedance performance across frequency ranges. High-permeability ferrite materials provide superior loss factor, frequency response, temperature performance and product consistency. M material is suitable for signal, choke, and filter applications such as common mode chokes, EMI suppression filters, signal processing and broadband transformers.

M material, high-permability ferrite, toroid, 9988 AI, 15000 permeability, bare

Magnetics M Material

MPN:

0M-41005-TC

Manufacturer L3 Communications

Magnetics Inc

Description:

M material is a new, high-permeability (15,000µ) material designed for optimum impedance performance across frequency ranges. High-permeability ferrite materials provide superior loss factor, frequency response, temperature performance and product consistency. M material is suitable for signal, choke, and filter applications such as common mode chokes, EMI suppression filters, signal processing and broadband transformers.

M material, high-permability ferrite, toroid, 6644 AI, 15000 permeability, parylene

Magnetics M Material

MPN:

YM-41003-TC

Manufacturer L3 Communications

Magnetics Inc

Description:

M material is a new, high-permeability (15,000µ) material designed for optimum impedance performance across frequency ranges. High-permeability ferrite materials provide superior loss factor, frequency response, temperature performance and product consistency. M material is suitable for signal, choke, and filter applications such as common mode chokes, EMI suppression filters, signal processing and broadband transformers.

M material, high-permability ferrite, toroid, 17163 AI, 15000 permeability, bare

Magnetics M Material

MPN:

0M-41206-TC

Manufacturer L3 Communications

Magnetics Inc

Description:

M material is a new, high-permeability (15,000µ) material designed for optimum impedance performance across frequency ranges. High-permeability ferrite materials provide superior loss factor, frequency response, temperature performance and product consistency. M material is suitable for signal, choke, and filter applications such as common mode chokes, EMI suppression filters, signal processing and broadband transformers.

M material, high-permability ferrite, toroid, 9988 AI, 15000 permeability, parylene

Magnetics M Material

MPN:

YM-41005-TC

Manufacturer L3 Communications

Magnetics Inc

Description:

M material is a new, high-permeability (15,000µ) material designed for optimum impedance performance across frequency ranges. High-permeability ferrite materials provide superior loss factor, frequency response, temperature performance and product consistency. M material is suitable for signal, choke, and filter applications such as common mode chokes, EMI suppression filters, signal processing and broadband transformers.

M material, high-permability ferrite, toroid, 17163 AI, 15000 permeability, parylene

Magnetics M Material

MPN:

YM-41206-TC

Manufacturer L3 Communications

Magnetics Inc

Description:

M material is a new, high-permeability (15,000µ) material designed for optimum impedance performance across frequency ranges. High-permeability ferrite materials provide superior loss factor, frequency response, temperature performance and product consistency. M material is suitable for signal, choke, and filter applications such as common mode chokes, EMI suppression filters, signal processing and broadband transformers.

M material, high-permability ferrite, toroid, 8476 AI, 15000 permeability, epoxy

Magnetics M Material

MPN:

ZM-41306-TC

Manufacturer L3 Communications

Magnetics Inc

Description:

M material is a new, high-permeability (15,000µ) material designed for optimum impedance performance across frequency ranges. High-permeability ferrite materials provide superior loss factor, frequency response, temperature performance and product consistency. M material is suitable for signal, choke, and filter applications such as common mode chokes, EMI suppression filters, signal processing and broadband transformers.

M material, high-permability ferrite, toroid, 8476 AI, 15000 permeability, bare

Magnetics M Material

MPN:

0M-41306-TC

Manufacturer L3 Communications

Magnetics Inc

Description:

M material is a new, high-permeability (15,000µ) material designed for optimum impedance performance across frequency ranges. High-permeability ferrite materials provide superior loss factor, frequency response, temperature performance and product consistency. M material is suitable for signal, choke, and filter applications such as common mode chokes, EMI suppression filters, signal processing and broadband transformers.

M material, high-permability ferrite, toroid, 10974 AI, 15000 permeability, epoxy

Magnetics M Material

MPN:

ZM-41406-TC

Manufacturer L3 Communications

Magnetics Inc

Description:

M material is a new, high-permeability (15,000µ) material designed for optimum impedance performance across frequency ranges. High-permeability ferrite materials provide superior loss factor, frequency response, temperature performance and product consistency. M material is suitable for signal, choke, and filter applications such as common mode chokes, EMI suppression filters, signal processing and broadband transformers.

M material, high-permability ferrite, toroid, 8494 AI, 15000 permeability, epoxy

Magnetics M Material

MPN:

ZM-42206-TC

Manufacturer L3 Communications

Magnetics Inc

Description:

M material is a new, high-permeability (15,000µ) material designed for optimum impedance performance across frequency ranges. High-permeability ferrite materials provide superior loss factor, frequency response, temperature performance and product consistency. M material is suitable for signal, choke, and filter applications such as common mode chokes, EMI suppression filters, signal processing and broadband transformers.

M material, high-permability ferrite, toroid, 7917 AI, 15000 permeability, epoxy

Magnetics M Material

MPN:

ZM-41605-TC

Manufacturer L3 Communications

Magnetics Inc

Description:

M material is a new, high-permeability (15,000µ) material designed for optimum impedance performance across frequency ranges. High-permeability ferrite materials provide superior loss factor, frequency response, temperature performance and product consistency. M material is suitable for signal, choke, and filter applications such as common mode chokes, EMI suppression filters, signal processing and broadband transformers.

M material, high-permability ferrite, toroid, 17313 AI, 15000 permeability, epoxy

Magnetics M Material

MPN:

ZM-42212-TC

Manufacturer L3 Communications

Magnetics Inc

Description:

M material is a new, high-permeability (15,000µ) material designed for optimum impedance performance across frequency ranges. High-permeability ferrite materials provide superior loss factor, frequency response, temperature performance and product consistency. M material is suitable for signal, choke, and filter applications such as common mode chokes, EMI suppression filters, signal processing and broadband transformers.

M material, high-permability ferrite, toroid, 11072 AI, 15000 permeability, epoxy

Magnetics M Material

MPN:

ZM-42507-TC

Manufacturer L3 Communications

Magnetics Inc

Description:

M material is a new, high-permeability (15,000µ) material designed for optimum impedance performance across frequency ranges. High-permeability ferrite materials provide superior loss factor, frequency response, temperature performance and product consistency. M material is suitable for signal, choke, and filter applications such as common mode chokes, EMI suppression filters, signal processing and broadband transformers.

BX3105 Wi-Fi and Bluetooth combo module with embedded antenna

Sierra Wireless BX3105

MPN:

BX3105

Manufacturer L3 Communications

Sierra Wireless

Description:

The BX3105 Wi-Fi and Bluetooth 4.2 pre-certified module offers simple and fast integration with free unlimited FOTA and built-in cloud connectivity from AirVantage®, ideal for quickly and cost effectively adding wireless communication.

This module supports 802.11 b/g/n and dual-mode Bluetooth Classic and Bluetooth Low Energy (BLE), connecting industrial applications requiring a secure connection to Wi-Fi and Bluetooth on a single module.

Designed in an industrial-grade common flexible form factor (CF3®), BX3105 enables system integrators to build their devices on the most scalable module platform in the world.

Features:

  • Hostless – Embedded TCP/IP and Bluetooth Stacks with simple UART interface makes it easy to integrate
  • Certification – Full regulatory certifications (FCC, RED, IC, JRF, and BQB Bluetooth) for faster time to market
  • Common form factor – Compact CF3®, form factor for scalability across technologies including cellular
  • Industrial-grade – Built to stay connected in harsh environments and extreme temperatures
  • Cloud connected – Secure device-to-cloud architecture with AirVantage®
  • FOTA upgrades – Includes FREE unlimited firmware over-the-air (FOTA) upgrades for the lifetime of the module to keep your deployments optimised and easier to maintain
  • Secure boot – Prevents unauthorised code on the target and to keep the connectivity secure
  • Interfaces – Includes UART, I2C, SDIO or SPI (Multiplexed), I2S digital audio and GPIOs
  • Integrated antenna – Quickly and easily add advanced wireless communications
  • Low power – Offers best-in-class low power when not transmitting in sleep and stand-by modes

BX3100 Wi-Fi and Bluetooth combo module

Sierra Wireless BX3100

MPN:

BX3100

Manufacturer L3 Communications

Sierra Wireless

Description:

The BX3100 Wi-Fi and Bluetooth 4.2 pre-certified module offers simple and fast integration with free unlimited FOTA and built-in cloud connectivity from AirVantage®, ideal for quickly and cost effectively adding wireless communication.

This module supports 802.11 b/g/n and dual-mode Bluetooth Classic and Bluetooth Low Energy (BLE), connecting industrial applications requiring a secure connection to Wi-Fi and Bluetooth on a single module.

Designed in an industrial-grade common flexible form factor (CF3®), BX3100 enables system integrators to build their devices on the most scalable module platform in the world.

Features:

  • Hostless – Embedded TCP/IP and Bluetooth Stacks with simple UART interface makes it easy to integrate
  • Certification – Full regulatory certifications (FCC, RED, IC, JRF, and BQB Bluetooth) for faster time to market
  • Common form factor – Compact CF3®, form factor for scalability across technologies including cellular
  • Industrial-grade – Built to stay connected in harsh environments and extreme temperatures
  • Cloud connected – Secure device-to-cloud architecture with AirVantage®
  • FOTA upgrades – Includes FREE unlimited firmware over-the-air (FOTA) upgrades for the lifetime of the module to keep your deployments optimised and easier to maintain
  • Secure boot – Prevents unauthorised code on the target and to keep the connectivity secure
  • Interfaces – Includes UART, I2C, SDIO or SPI (Multiplexed), I2S digital audio, GPIOs, and LGA pad for external antenna
  • Low power – Offers best-in-class low power when not transmitting in sleep and stand-by modes

SFP transceiver for IEEE C37.94 teleprotection, 2Mb/s, single mode, 60km

Coretek CT-0155TSP series

MPN:

CT-0155TSP-MB7L-E 2M

Manufacturer L3 Communications

Coretek

Description:

The CT-0155TSP-MB7L-E 2M from Coretek Opto Corp. is the high performance and cost-effective module for serial optical data communication applications specified for 2Mb/s. It operates with +3.3V power supply. The module is intended for single mode fibre, operates at a nominal wavelength of 1310nm and complies with multi-source agreement (MSA) small form factor pluggable (SFP). Each module is integrated digital diagnostics functions via an I2C serial interface.

The module is a duplex LC connector transceiver designed to provide an IEEE C37.94 / IEC 62843 link for 2Mb/s long-reach applications. The characteristics are performed in accordance with Telcordia Specification GR-468-CORE.

Features:

  • 1310nm FP LD
  • Data rate: 2Mb/s, NRZ
  • Single +3.3V power supply
  • RoHS compliant and lead-free
  • AC/AC differential electrical interface
  • Compliant with multi-source agreement (MSA) small form factor pluggable (SFP)
  • Compliant with SFF-8472 digital diagnostic monitoring interface
  • Duplex LC connector
  • Compatible with IEEE C37.94 / IEC 62843 standard

SFP transceiver for IEEE C37.94 teleprotection, 2Mb/s, single mode, 40km

Coretek CT-0155TSP series

MPN:

CT-0155TSP-MB6L-E 2M

Manufacturer L3 Communications

Coretek

Description:

The CT-0155TSP-MB6L-E 2M from Coretek Opto Corp. is the high performance and cost-effective module for serial optical data communication applications specified for 2Mb/s. It operates with +3.3V power supply. The module is intended for single mode fibre, operates at a nominal wavelength of 1310nm and complies with multi-source agreement (MSA) small form factor pluggable (SFP). Each module is integrated digital diagnostics functions via an I2C serial interface.

The module is a duplex LC connector transceiver designed to provide an IEEE C37.94 / IEC 62843 link for 2Mb/s long-reach applications. The characteristics are performed in accordance with Telcordia Specification GR-468-CORE.

Features:

  • 1310nm FP LD
  • Data rate: 2Mb/s, NRZ
  • Single +3.3V power supply
  • RoHS compliant and lead-free
  • AC/AC differential electrical interface
  • Compliant with multi-source agreement (MSA) small form factor pluggable (SFP)
  • Compliant with SFF-8472 digital diagnostic monitoring interface
  • Duplex LC connector
  • Compatible with IEEE C37.94 / IEC 62843 standard

SFP transceiver for IEEE C37.94 teleprotection, 2Mb/s, single mode, 80km

Coretek CT-0155TSP series

MPN:

CT-0155TSP-KB8L-E 2M

Manufacturer L3 Communications

Coretek

Description:

The CT-0155TSP-KB8L-E 2M from Coretek Opto Corp. is the high performance and cost-effective module for serial optical data communication applications specified for 2Mb/s. It operates with +3.3V power supply. The module is intended for single mode fibre, operates at a nominal wavelength of 1550nm and complies with multi-source agreement (MSA) small form factor pluggable (SFP). Each module is integrated digital diagnostics functions via an I2C serial interface.

The module is a duplex LC connector transceiver designed to provide an IEEE C37.94 / IEC 62843 link for 2Mb/s intermediate reach applications. The characteristics are performed in accordance with Telcordia Specification GR-468-CORE.

Features:

  • 1550 nm DFB LD
  • Data rate: 2Mb/s, NRZ
  • Single +3.3V power supply
  • RoHS compliant and lead-free
  • AC/AC differential electrical interface
  • Compliant with multi-source agreement (MSA) small form factor pluggable (SFP)
  • Compliant with SFF-8472 digital diagnostic monitoring interface
  • Duplex LC connector
  • Compatible with IEEE C37.94 / IEC 62843 standard

SFP transceiver for IEEE C37.94 teleprotection, 2Mb/s, single mode, 120km

Coretek CT-0155TSP series

MPN:

CT-0155TSP-KBAL-E 2M

Manufacturer L3 Communications

Coretek

Description:

The CT-0155TSP-KBAL-E 2M from Coretek Opto Corp. is the high performance and cost-effective module for serial optical data communication applications specified for 2Mb/s. It operates with +3.3V power supply. The module is intended for single mode fibre, operates at a nominal wavelength of 1550nm and complies with multi-source agreement (MSA) small form factor pluggable (SFP). Each module is integrated digital diagnostics functions via an I2C serial interface.

The module is a duplex LC connector transceiver designed to provide an IEEE C37.94 / IEC 62843 link for 2Mb/s long-reach applications. The characteristics are performed in accordance with Telcordia Specification GR-468-CORE.

Features:

  • 1550 nm DFB LD
  • Data rate: 2Mb/s, NRZ
  • Single +3.3V power supply
  • RoHS compliant and lead-free
  • AC/AC differential electrical interface
  • Compliant with multi-source agreement (MSA) small form factor pluggable (SFP)
  • Compliant with SFF-8472 digital diagnostic monitoring interface
  • Duplex LC connector
  • Compatible with IEEE C37.94 / IEC 62843 standard

Six-channel, 4K60Hz video QSFP+ transceiver – Quad transmit and bi-directional channel

Coretek CT-6025VQT-CB4L

MPN:

CT-6025VQT-CB4L

Manufacturer L3 Communications

Coretek

Description:

The CT-6025VQT-CB4L QSFP+ optical transceiver from Coretek Opto. Corp., is a high performance and cost-effective solution to optically multiplex and transmit 4K60Hz video signals. It provides four transmit channels for video signal transmission and two channels (one transmit and one receive) for data signal transmission.

For video signals, this transceiver uses one TOSA, composed of four channels of CWDM DFB LD with different wavelengths to optically multiplex video signals and transmit them via a single mode fibre. Each channel supports 6Gb/s at up to 10km. For data signals, this transceiver uses a 2.5Gb/s bi-directional OSA to send and receive data signals via a second single fibre.

By adopting the standard QSFP+ LC dual core package with pin configuration adjusted for video signals, the CT-6025VQT-CB4L is a highly reliable solution optimised for 4K60Hz applications.

Features:

    • Video-dedicated transceiver
    • Hot-pluggable QSFP+ form factor
    • One quad-TOSA and BOSA:
      • 4 x 6Gb/s CWDM uncooled DFB channels (1270nm, 1290nm, 1310nm, 1330nm)
      • 1 x 2.5Gb/s Bi-Directional (1310nm Tx / 1550nm Rx)
    • Up to 10km on SMF
    • Power dissipation <4.0W
    • Duplex LC connector
    • Single +3.3V power supply
    • Commercial temperature range -10°C to 70°C
    • RoHS-6 compliant (lead-free)

Six-channel, 4K60Hz video QSFP+ transceiver – Quad receive and bi-directional channel

Coretek CT-6025VQR-CB4L

MPN:

CT-6025VQR-CB4L

Manufacturer L3 Communications

Coretek

Description:

The CT-6025VQR-CB4L QSFP+ optical transceiver from Coretek Opto. Corp., is a high performance and cost-effective solution to optically de-multiplex 4K60Hz video signals. It provides four receive channels for receiving and de-multiplexing video signals and two channels (one transmit and one receive) for data signal transmission.

For video signals, this transceiver uses one ROSA, composed of four channels of PIN detector with TIA and thin film filter for different wavelengths to optically de-multiplex video signals transmitted via a single mode fibre. Each channel supports 6Gb/s at up to 10km. For data signals, this transceiver uses a 2.5Gb/s bi-directional OSA to send and receive data signals via a second single fibre.

By adopting the standard QSFP+ LC dual core package with pin configuration adjusted for video signals, the CT-6025VQR-CB4L is a highly reliable solution optimised for 4K60Hz applications.

Features:

    • Video-dedicated transceiver
    • Hot-pluggable QSFP+ form factor
    • One quad-ROSA and BOSA:
      • 4 x 6Gb/s PIN-TIA channels (1270nm, 1290nm, 1310nm, 1330nm)
      • 1 x 2.5Gb/s Bi-Directional (1550nm Tx / 1310nm Rx)
    • Up to 10km on SMF
    • Power dissipation <4.0W
    • Duplex LC connector
    • Single +3.3V power supply
    • Commercial temperature range -10°C to 70°C
    • RoHS-6 compliant (lead-free)

Expandable, fanless embedded computer with 6th Gen Intel® Core™ processor, 1 PCIe x16 + 3 PCI (MVP-6010) or 2 PCIe x16 + 2 PCI (MVP-6020)

MVP-6010 / 6020 series

MPN:

MVP-6010 / 6020 series

Manufacturer L3 Communications

ADLINK

Description:

The MVP-6010/6020 series value line of fanless embedded computing platforms, incorporating the 6th Generation Intel® Core™ processor, provides one PCIex16 and three PCI or two PCIex16 and two PCI expansion slots, 1 mini PCIe slot and single-side access for I/O ports, optimizing easy maintenance in industrial automation environments. The series retains the robust design of all ADLINK MXC/MXE lines, at a new extremely cost-effective price point.

The MVP-6010/6020 series supports dual-channel DDR4 memory for more powerful computing and the Intel® HD Graphics 530 speeds graphics performance. Along with a versatile I/O array and flexible expansion capacity, the MVP-6010/6020 Series fully satisfies all the needs of industrial automation with the performance demanded by vision inspection, motion control, and surveillance applications. Fanless construction not only overcomes contaminant and noise challenges presented by harsh IA environments, the elimination of problematic structural elements that negatively affect MTBF greatly increases life cycle expectations for the platform. 

Features:

  • 6th Generation Intel® Core™ i7/i5/i3 Skylake FCLGA1151 processor + H110 (MVP-6010)/ Q170 (MVP-6020) chipset
  • Dual-channel DDR4 SO-DIMM sockets support up to 32 GB memory
  • 1 PCIex16 and 3 PCI (MVP-6010)/ 2 PCIex16 and 2 PCI (MVP-6020) expansion slots available, supporting Gen3 PCIe cards
  • Support for 2 independent displays with on-board 2x DisplayPort, 1x DVI-D, and 1x VGA ports onboard
  • 6 External USB ports (4x USB 3.0, 2x USB 2.0), 1 internal USB 2.0 port
  • 3 Intel GbE ports with teaming function
  • Built-in 8CH DI and 8CH DO, 2 software-programmable RS-232/422/485 + 2 RS-232 ports
  • Fanless operation from 0°C to 50°C (with 35W CPU), and 0°C to 40°C (with 65W CPU)

Intel® Core™ i7-6820EQ Fanless Embedded Computer

Adlink MXC-6400 Serie Fanless embedded computer

MPN:

MXC-6401D

Manufacturer L3 Communications

ADLINK

Description:

ADLINK is pleased to announce its new MXC-6401D of high-performance expandable fanless embedded computers, featuring 6th generation Intel® Core™ i7-6820EQ processor (codename Skylake) and the QM170 chipset. Featuring leading performance, high storage density from 4 x 2.5 inches SATA drives, and rugged fanless construction withstanding operating shock up to 50G and vibration to 5Grms, the MXC-6401D Series fully meets the needs of intelligent transportation systems for rolling stock, maritime operations, in-vehicle infotainment, and high-speed data processing and mission-critical industrial automation.

View our wide range of Embedded Computer

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Features:

  • 6th generation Intel® Core™ i7-6820EQ processor (codename Skylake) with QM170 chipset
  • Dual-channel DDR4 2133MHz SO-DIMM sockets accept up to 32GB of memory
  • Support for up to 3 independent displays, accelerated HW media codecs enabling Ultra HD 4K
  • PCI and 2 PCIe Gen3 x8 (or 1 PCIe Gen3 x16) slots
  • World-class MTBF withstanding up to 5Grm vibration and 50G shock
  • Superior -20°C to 60 (70)°C operating temperature range
  • Front-mounted I/O includes 2x DisplayPort + DVI-I, 3x GbE, 4x COM, 6x USB 3.0, and 16x isolated DI/O
  • 2x 2.5 inch hot-swappable SATA drive bays
  • Remote management from preloaded SEMA 3.0 w/ Cloud Access
  • 4x 2.5 inch SATA III installation capability with RAID 0/1/5/10 support, via 2 hot-swappable 2.5 inch SATA III trays, 2 internal 2.5 inch SATA III ports, and 1 CFast socket

Intel® Core™ i5-6440EQ Fanless Embedded Computer

Adlink MXC-6400 Serie Fanless embedded computer

MPN:

MXC-6402D

Manufacturer L3 Communications

ADLINK

Description:

ADLINK is pleased to announce its new MXC-6402D of high-performance expandable fanless embedded computers, featuring 6th generation Intel® Core™ i5-6440EQ processor (codename Skylake) and the QM170 chipset. Featuring leading performance, high storage density from 4x 2.5 inches SATA drives, and rugged fanless construction withstanding operating shock up to 50G and vibration to 5Grms, the MXC-6402D Series fully meets the needs of intelligent transportation systems for rolling stock, maritime operations, in-vehicle infotainment, and high-speed data processing and mission-critical industrial automation.

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Features:

  • 6th generation Intel® Core™ i7-6820EQ processor (codename Skylake) with QM170 chipset
  • Dual-channel DDR4 2133MHz SO-DIMM sockets accept up to 32GB of memory
  • Support for up to 3 independent displays, accelerated HW media codecs enabling Ultra HD 4K
  • PCI and 2 PCIe Gen3 x8 (or 1 PCIe Gen3 x16) slots
  • World-class MTBF withstanding up to 5Grm vibration and 50G shock
  • Superior -20°C to 60 (70)°C operating temperature range
  • Front-mounted I/O includes 2x DisplayPort + DVI-I, 3x GbE, 4x COM, 6x USB 3.0, and 16x isolated DI/O
  • 2x 2.5 inch hot-swappable SATA drive bays
  • Remote management from preloaded SEMA 3.0 w/ Cloud Access
  • 4x 2.5 inch SATA III installation capability with RAID 0/1/5/10 support, via 2 hot-swappable 2.5 inch SATA III trays, 2 internal 2.5 inch SATA III ports, and 1 CFast socket

Intel® Core™ i3-6100E Fanless Embedded Computer

Adlink MXC-6400 Serie Fanless embedded computer

MPN:

MXC-6403D

Manufacturer L3 Communications

ADLINK

Description:

ADLINK is pleased to announce its new MXC-6403D of high-performance expandable fanless embedded computers, featuring 6th generation Intel® Core™ i3-6100E processor (codename Skylake) and the QM170 chipset. Featuring leading performance, high storage density from 4x 2.5 inches SATA drives, and rugged fanless construction withstanding operating shock up to 50G and vibration to 5Grms, the MXC-6403D Series fully meets the needs of intelligent transportation systems for rolling stock, maritime operations, in-vehicle infotainment, and high-speed data processing and mission-critical industrial automation.

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Features:

  • 6th generation Intel® Core™ i7-6820EQ processor (codename Skylake) with QM170 chipset
  • Dual-channel DDR4 2133MHz SO-DIMM sockets accept up to 32GB of memory
  • Support for up to 3 independent displays, accelerated HW media codecs enabling Ultra HD 4K
  • PCI and 2 PCIe Gen3 x8 (or 1 PCIe Gen3 x16) slots
  • World-class MTBF withstanding up to 5Grm vibration and 50G shock
  • Superior -20°C to 60 (70)°C operating temperature range
  • Front-mounted I/O includes 2x DisplayPort + DVI-I, 3x GbE, 4x COM, 6x USB 3.0, and 16x isolated DI/O
  • 2x 2.5 inch hot-swappable SATA drive bays
  • Remote management from preloaded SEMA 3.0 w/ Cloud Access
  • 4x 2.5 inch SATA III installation capability with RAID 0/1/5/10 support, via 2 hot-swappable 2.5 inch SATA III trays, 2 internal 2.5 inch SATA III ports, and 1 CFast socket

2U Rackmount MICA Network Appliance with Intel® Xeon® E5-2630 v3 Processor

Adlink CSA-7200 Serie MICA Network Appliance

MPN:

CSA-7200-0001

Manufacturer L3 Communications

ADLINK

Description:

Adlink' CSA-7200-0001 2U 19" MICA Network Appliance with Intel® Xeon® Processor E5-2630 v3/v4 and Intel® C610 Chipset. The CSA-7200 family is the first product based on Modular Industrial Cloud Architecture (MICA). The CSA-7200 features an IO intensive architecture with up to 64x SFP+ ports, high scalability with four Network Interface Module (NIM) slots, 2.5 inches SATA drive bays, additional storage interfaces (M.2 SSD), and is an ideal platform for communications infrastructure deployment.

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Features:

  • Modular Industrial Cloud Architecture (MICA) platform
  • Advanced LAN bypass features; bypass modes of each NIM can be set independently through BIOS or IPMI interface
  • 12x DDR4 memory slots for up to 192GB memory to meet the requirement of network packet processing
  • 3x 2.5" hot-swappable SATA drive bays, supports additional storage expansion via PCIe or M.2
  • Intelligent system management compatible with IPMI 2.0, supports SOL and adaptive fan speeds
  • Support for PacketManager software to provide data plane software stacks for dynamic layer 3 forwarding and flow-based forwarding, accelerating development of customer applications
  • Integrates Wind River® Titanium Server, and open source software including Intel® DPDK, Open vSwitch and nDPI, facilitating the building of packet parsing applications

2U Rackmount MICA Network Appliance with Intel® Xeon® E5-2680 v3 Processor

Adlink CSA-7200 Serie MICA Network Appliance

MPN:

CSA-7200-0002

Manufacturer L3 Communications

ADLINK

Description:

Adlink' CSA-7200-0002 2U 19" MICA Network Appliance with Intel® Xeon® Processor E5-2680 v3/v4 and Intel® C610 Chipset. The CSA-7200 family is the first product based on Modular Industrial Cloud Architecture (MICA). The CSA-7200 features an IO intensive architecture with up to 64x SFP+ ports, high scalability with four Network Interface Module (NIM) slots, 2.5 inches’ SATA drive bays, additional storage interfaces (M.2 SSD), and is an ideal platform for communications infrastructure deployment.

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Features:

  • Modular Industrial Cloud Architecture (MICA) platform
  • Advanced LAN bypass features; bypass modes of each NIM can be set independently through BIOS or IPMI interface
  • 12x DDR4 memory slots for up to 192GB memory to meet the requirement of network packet processing
  • 3x 2.5" hot-swappable SATA drive bays, supports additional storage expansion via PCIe or M.2
  • Intelligent system management compatible with IPMI 2.0, supports SOL and adaptive fan speeds
  • Support for PacketManager software to provide data plane software stacks for dynamic layer 3 forwarding and flow-based forwarding, accelerating development of customer applications
  • Integrates Wind River® Titanium Server, and open source software including Intel® DPDK, Open vSwitch and nDPI, facilitating the building of packet parsing applications

Fanless Embedded Computer, Intel® Core™ i7-6820EQ

Adlink MXE-5500 Series Fanless Embedded computer

MPN:

MXE-5501

Manufacturer L3 Communications

ADLINK

Description:

ADLINK is pleased to announce the release of the new Matrix MXE-5501 fanless embedded computer, featuring 6th generation Intel® Core™ i7 processor (Skylake), delivering outstanding performance with robust construction, rich I/O, user-friendly access in a compact package.

The MXE-5500 sustains reliable performance while at -20°C to 70°C, shock up to 50G, and vibration up to 5Grms, making it is the optimal solution for ITS, surveillance, industrial automation and logistic automation applications. Moreover, MXE-5500’s AFM (adaptive function module) capability offers fast application-specific access for medium volume operations, reducing development time and cost by up to 50%.

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Features:

  • Powerful yet Compact
  • 6th Generation Intel® Core™ i7 processors (Skylake) in a compact enclosure
  • DDR4 memory support up to 32GB
  • Excellent MTBF, outstanding vibration (5G)/shock (100G) sustainability
  • Superior -20 to 60 (70)°C operating temperature range
  • Easy Maintenance, Easy Management
  • Single side access rich I/O, includes 2x DisplayPort + DVI-I, 4x GbE, 6x COM, 4x USB 3.0+4x USB 2.0, 8x isolated DI/O
  • Dual 2.5 inch hot-swappable SATA drive bays for easy storage maintenance
  • Varied storage options, 2x 2.5" swappable SATA III (6.0 Gb/s), 1x M.2 2280, 1x CFast
  • Remote management with preloaded SEMA 3.0 w/ Cloud Access
  • Scalable & Fast-Customization Speeds Time to Market
  • AFM design provides fast access for application-specific operations
  • Reusable cross-platform I/O simplifies development, reducing Time to Market and TCO

Fanless Embedded Computer, Intel® Core™ i5-6440EQ

Adlink MXE-5500 Series Fanless Embedded computer

MPN:

MXE-5502

Manufacturer L3 Communications

ADLINK

Description:

ADLINK is pleased to announce the release of the new Matrix MXE-5502 fanless embedded computer, featuring 6th generation Intel® Core™ i5 processor (Skylake), delivering outstanding performance with robust construction, rich I/O, user-friendly access in a compact package.

The MXE-5500 sustains reliable performance while at -20°C to 70°C, shock up to 50G, and vibration up to 5Grms, making it is the optimal solution for ITS, surveillance, industrial automation and logistic automation applications. Moreover, MXE-5500’s AFM (adaptive function module) capability offers fast application-specific access for medium volume operations, reducing development time and cost by up to 50%.

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Features:

  • Powerful yet Compact
  • 6th Generation Intel® Core™ i5 processors (Skylake) in a compact enclosure
  • DDR4 memory support up to 32GB
  • Excellent MTBF, outstanding vibration (5G)/shock (100G) sustainability
  • Superior -20 to 60 (70)°C operating temperature range
  • Easy Maintenance, Easy Management
  • Single side access rich I/O, includes 2x DisplayPort + DVI-I, 4x GbE, 6x COM, 4x USB 3.0+4x USB 2.0, 8x isolated DI/O
  • Dual 2.5 inch hot-swappable SATA drive bays for easy storage maintenance
  • Varied storage options, 2x 2.5" swappable SATA III (6.0 Gb/s), 1x M.2 2280, 1x CFast
  • Remote management with preloaded SEMA 3.0 w/ Cloud Access
  • Scalable & Fast-Customization Speeds Time to Market
  • AFM design provides fast access for application-specific operations
  • Reusable cross-platform I/O simplifies development, reducing Time to Market and TCO

Fanless Embedded Computer, Intel® Core™ i3-6100E

Adlink MXE-5500 Series Fanless Embedded computer

MPN:

MXE-5503

Manufacturer L3 Communications

ADLINK

Description:

ADLINK is pleased to announce the release of the new Matrix MXE-5503 fanless embedded computer, featuring 6th generation Intel® Core™ i3 processor (Skylake), delivering outstanding performance with robust construction, rich I/O, user-friendly access in a compact package.

The MXE-5500 sustains reliable performance while at -20°C to 70°C, shock up to 50G, and vibration up to 5Grms, making it is the optimal solution for ITS, surveillance, industrial automation and logistic automation applications. Moreover, MXE-5500’s AFM (adaptive function module) capability offers fast application-specific access for medium volume operations, reducing development time and cost by up to 50%.

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Features:

  • Powerful yet Compact
  • 6th Generation Intel® Core™ i3 processors (Skylake) in a compact enclosure
  • DDR4 memory support up to 32GB
  • Excellent MTBF, outstanding vibration (5G)/shock (100G) sustainability
  • Superior -20 to 60 (70)°C operating temperature range
  • Easy Maintenance, Easy Management
  • Single side access rich I/O, includes 2x DisplayPort + DVI-I, 4x GbE, 6x COM, 4x USB 3.0+4x USB 2.0, 8x isolated DI/O
  • Dual 2.5 inch hot-swappable SATA drive bays for easy storage maintenance
  • Varied storage options, 2x 2.5" swappable SATA III (6.0 Gb/s), 1x M.2 2280, 1x CFast
  • Remote management with preloaded SEMA 3.0 w/ Cloud Access
  • Scalable & Fast-Customization Speeds Time to Market
  • AFM design provides fast access for application-specific operations
  • Reusable cross-platform I/O simplifies development, reducing Time to Market and TCO

Robust Fanless Embedded Computer, 6th Generation Intel Core i7-i5-i3

Adlink MVP-6000 Series Fanless Embedded computer

MPN:

MVP-6000 Series

Manufacturer L3 Communications

ADLINK

Description:

ADLINK is pleased to announce the release of the MVP-6000 Series, first in a new value line of fanless embedded computing platforms. Incorporating the 6th Generation Intel® Core™ processor, the MVP-6000’s price point suits practically any industrial automation operation, with its perfect combination of features and performance making it an ideal solution.

The MVP-6000 supports DDR4 memory for more powerful computing, the Intel® HD Graphics 530 enhances graphic performance, and one PCIe x16 slot, one PCI slot, one mPCIe slot and single-side access for I/O ports, resulting in complete satisfaction of industrial automation requirements with the performance demanded by vision inspection and motion control environments.

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Features:

  • Optimised Fit for Industrial Automation
  • Best combination of price/spec/size
  • Fully compatible with ADLINK’s full spectrum of motion and I/O cards
  • Robust and Reliable
  • Fanless
  • Maximized thermal efficiency for desktop CPU
  • Front I/O access for easy maintenance
  • Superior Computing Performance
  • 30% boost in performance from 6th Generation Intel® Core™ i7/i5/i3 processors
  • Dual-channel DDR4 2133 MHz support
  • 100% increase in graphics performance with the Intel® HD Graphic 530
  • Finally, the MVP-6000 retains the proven robust reliability of ADLINK’s Matrix MXC/MXE lines, overcoming the environmental challenges presented by demanding IA operational fields.

Fanless Embedded Computer, Intel® Atom™ E3845 Quad Core

AdlinkMXE-1401 Fanless Embedded Computer

MPN:

MXE-1401

Manufacturer L3 Communications

ADLINK

Description:

ADLINK is pleased to announce the release of our new Matrix MXE-1401 series of rugged quad-core fanless computers, featuring the latest generation of Intel® Atom™ E3845 processors with adaptive features including a wide variety of application-specific capabilities, maximized customization, and environmental standard. As a standard product, MXE-1401 provides powerful function with an integrated quad-core Intel® Atom™ E3845 processor, and the most I/O ports in its class. Its excellent MTBF, outstanding vibration (5G)/shock (100G) sustainability and superior -40 to 70°C operating temperature range make it an ideal choice for mission critical applications.

In additional to optimal functionality, the MXE-1401 stands out with the new AFM (adaptive function module) design. AFM provides fast access to application-specific customers, while the reusable cross-platform I/O simplifies development, reducing time to market and TCO. ADLINK’s AFM meets and exceeds the requirements of customers requiring customization for medium volume projects, with competitive pricing and speed to market.

Combining powerful features, user-friendly design, rich I/O, and wireless capability in a compact and robust package, the ADLINK MXE-1401 is an ideal choice for a wide range of applications supporting intelligent transportation, in-vehicle multimedia, and surveillance and factory automation applications.

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Extreme Outdoor Server, Single/Dual Intel® Xeon® E5-2418L v2, 2.0GHz

Adlink ETOS-1000 Serie

MPN:

ETOS-1000/D2418L v2/M16GB/mSATA 32GB

Manufacturer L3 Communications

ADLINK

Description:

ADLINK’s new ETOS-1000 is the first high-performance mobile edge computing (MEC) platform specifically designed for extreme environments and outdoor telecom/networking applications. Based on the dual Intel® Xeon® E5-2400 v2 family of processors, the ETOS-1000 MEC platform enables Telecom Equipment Manufacturers (TEMs) and application providers to deliver data center performance at the edge of the network. The ETOS-1000 provides IT and cloud-computing capabilities within the Radio Access Network (RAN) in close proximity to mobile subscribers. This offers a service environment characterized by proximity, ultra-low latency, and high-bandwidth that allows content, services, and applications to be accelerated, maintaining a customer’s high-level Quality of Experience (QoE).

The ETOS-1000 mobile edge computing platform provides computing resources, storage capacity, connectivity and access to user traffic and real-time radio and network information. This allows operators to offer context-related services that can differentiate and monetize the user experience. In addition, since the data is processed at the edge in the RAN environment, the ETOS-1000 reduces backhaul costs and improves the infrastructure’s efficiency with more intelligent and optimized networks. And with the onset of network functions virtualization (NFV) infrastructure, having data center performance at the edge of networks can enable specific virtualized network functions (VNFs) closer to the consumer, improving QoE. Attributes such as shock and vibration resistance, -40˚C to +55˚C operating temperature range, and IP65 water and dust ingress rating make the ETOS-1000 an ideal solution for outdoor and extreme environments. The ETOS-1000 can also utilize ADLINK’s application ready intelligent platform (ARiP) software, which includes PacketManager, remote management functions, and system management APIs for application developers. ARiPs enable customers to focus primarily on their application instead of the IoT platform building blocks required for cloud computing. The ETOS-1000 reduces maintenance costs by eliminating fans and filters and offering worry-free, weather-resistant, high-speed connections for copper or fiber options.

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Features:

  • Single/Dual Intel® Xeon® E5-2418L v2 (6C/12T) 2.0GHz
  • Six memory sockets support VLP RDIMM DDR3-1333/1600 REG/ECC up to 96 GB
  • Intel® C604 Chipset
  • Dual 10G SFP+ ports
  • Dual 10/100/1000 BASE-T ports
  • IP65 water and dust proof
  • Fanless, conduction cooled, aluminum chassis
  • Wide temperature range capability

Extreme Outdoor Server, Single/Dual Intel® Xeon® E5-2428L v2, 1.8GHz

Adlink ETOS-1000 Serie

MPN:

ETOS-1000/D2428L v2/M16GB/mSATA 32GB

Manufacturer L3 Communications

ADLINK

Description:

ADLINK’s new ETOS-1000 is the first high-performance mobile edge computing (MEC) platform specifically designed for extreme environments and outdoor telecom/networking applications. Based on the dual Intel® Xeon® E5-2400 v2 family of processors, the ETOS-1000 MEC platform enables Telecom Equipment Manufacturers (TEMs) and application providers to deliver data center performance at the edge of the network. The ETOS-1000 provides IT and cloud-computing capabilities within the Radio Access Network (RAN) in close proximity to mobile subscribers. This offers a service environment characterized by proximity, ultra-low latency, and high-bandwidth that allows content, services, and applications to be accelerated, maintaining a customer’s high-level Quality of Experience (QoE).

The ETOS-1000 mobile edge computing platform provides computing resources, storage capacity, connectivity and access to user traffic and real-time radio and network information. This allows operators to offer context-related services that can differentiate and monetize the user experience. In addition, since the data is processed at the edge in the RAN environment, the ETOS-1000 reduces backhaul costs and improves the infrastructure’s efficiency with more intelligent and optimized networks. And with the onset of network functions virtualization (NFV) infrastructure, having data center performance at the edge of networks can enable specific virtualized network functions (VNFs) closer to the consumer, improving QoE. Attributes such as shock and vibration resistance, -40˚C to +55˚C operating temperature range, and IP65 water and dust ingress rating make the ETOS-1000 an ideal solution for outdoor and extreme environments. The ETOS-1000 can also utilize ADLINK’s application ready intelligent platform (ARiP) software, which includes PacketManager, remote management functions, and system management APIs for application developers. ARiPs enable customers to focus primarily on their application instead of the IoT platform building blocks required for cloud computing. The ETOS-1000 reduces maintenance costs by eliminating fans and filters and offering worry-free, weather-resistant, high-speed connections for copper or fiber options.

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Features:

  • Single/Dual Intel® Xeon® E5-2428L v2 (8C/16T) 1.8GHz
  • Six memory sockets support VLP RDIMM DDR3-1333/1600 REG/ECC up to 96 GB
  • Intel® C604 Chipset
  • Dual 10G SFP+ ports
  • Dual 10/100/1000 BASE-T ports
  • IP65 water and dust proof
  • Fanless, conduction cooled, aluminum chassis
  • Wide temperature range capability

Extreme Outdoor Server, Single/Dual Intel® Xeon® E5-2448L v2, 1.8GHz

Adlink ETOS-1000 Serie

MPN:

ETOS-1000/D2448L v2/M16GB/mSATA 32GB

Manufacturer L3 Communications

ADLINK

Description:

ADLINK’s new ETOS-1000 is the first high-performance mobile edge computing (MEC) platform specifically designed for extreme environments and outdoor telecom/networking applications. Based on the dual Intel® Xeon® E5-2400 v2 family of processors, the ETOS-1000 MEC platform enables Telecom Equipment Manufacturers (TEMs) and application providers to deliver data center performance at the edge of the network. The ETOS-1000 provides IT and cloud-computing capabilities within the Radio Access Network (RAN) in close proximity to mobile subscribers. This offers a service environment characterized by proximity, ultra-low latency, and high-bandwidth that allows content, services, and applications to be accelerated, maintaining a customer’s high-level Quality of Experience (QoE).

The ETOS-1000 mobile edge computing platform provides computing resources, storage capacity, connectivity and access to user traffic and real-time radio and network information. This allows operators to offer context-related services that can differentiate and monetize the user experience. In addition, since the data is processed at the edge in the RAN environment, the ETOS-1000 reduces backhaul costs and improves the infrastructure’s efficiency with more intelligent and optimized networks. And with the onset of network functions virtualization (NFV) infrastructure, having data center performance at the edge of networks can enable specific virtualized network functions (VNFs) closer to the consumer, improving QoE. Attributes such as shock and vibration resistance, -40˚C to +55˚C operating temperature range, and IP65 water and dust ingress rating make the ETOS-1000 an ideal solution for outdoor and extreme environments. The ETOS-1000 can also utilize ADLINK’s application ready intelligent platform (ARiP) software, which includes PacketManager, remote management functions, and system management APIs for application developers. ARiPs enable customers to focus primarily on their application instead of the IoT platform building blocks required for cloud computing. The ETOS-1000 reduces maintenance costs by eliminating fans and filters and offering worry-free, weather-resistant, high-speed connections for copper or fiber options.

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Features:

  • Single/Dual Intel® Xeon® E5-2448L v2 (10C/20T) 1.8GHz
  • Six memory sockets support VLP RDIMM DDR3-1333/1600 REG/ECC up to 96 GB
  • Intel® C604 Chipset
  • Dual 10G SFP+ ports
  • Dual 10/100/1000 BASE-T ports
  • IP65 water and dust proof
  • Fanless, conduction cooled, aluminum chassis
  • Wide temperature range capability

Databus simulation and analysis software

Ballard COPilot6 Software

MPN:

CoPilot 6

Manufacturer L3 Communications

Astronics Ballard Technology

Description:

CoPilot is the quick and easy way to interact with avionics databuses. It handles virtually any task, so you won't need to write your own software. CoPilot will support multiple hardware devices and protocols simultaneously.

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Features:

  • Auto discovery of hardware and bus activity
  • Simultaneous operation of multiple protocols
  • Flexible data representation
  • View and manipulate data in engineering units
  • Automated test environment (ATE)
  • Powerful scripting environment
  • Comprehensive program security
  • Sophisticated graphical displays
  • Hardware and software playback
  • Error injection

Portable ARINC 615/603 Data Loader

Ballard DL615 DataLoader

MPN:

DL-615

Manufacturer L3 Communications

Astronics Ballard Technology

Description:

The DL 615 turns any Microsoft Windows PC into an ARINC 615-3 and ARINC 603 data loader. The DL 615 is the modern replacement for outmoded 3½-inch floppy disk only ARINC 615 portable data loaders (PDL). Any PC running Microsoft® Windows® can perform data loads using the USB to ARINC 429 interface, cables, and software included with the DL 615. While being as simple to use as older floppy disk PDLs, the DL 615 provides record keeping, flexibility in data management, and powerful features for troubleshooting and enabling data loads into difficult LRUs.

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Features:

  • Replaces old 3½-inch floppy disk only PDLs
  • Use with any MS Windows® compatible PC
  • ARINC 615-3 and 603 protocols
  • Load from floppy, HD, USB, CD, DVD, or network
  • Clear indicators for load progress and status
  • Efficient multi-file, multi-disk and extra-large loads
  • Numerous logging options
  • Protocol recording and diagnostic tools
  • Configurable for problematic LRUs

ARINC 717 Test Set

Ballard TS717 Test SET

MPN:

TS-717

Manufacturer L3 Communications

Astronics Ballard Technology

Description:

The TS 717 Test Set for ARINC 717 is a convenient, easy-to-use tool for test and maintenance of aircraft systems that are tied to the Digital Flight Data Recorder (DFDR). The compact interface/cable hardware is conveniently stored in a rugged carrying case for easy transport and quick deployment. To use, simply connect one end to the aircraft test plug, the other to the USB port on any Windows® computer, and the accompanying CoPilot software displays the user-specified data received from a Digital Flight Data Acquisition Unit (DFDAU) or DFDR output databus.

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Features:

  • Easy to use
  • Receives, displays and transmits ARINC 573 and 717 data
  • Displays data in multiple radices
  • Shows bus speed and position status
  • Auto speed and sync detection
  • Selectable word, subframe, and superframe
  • Also available with ARINC 429 support
  • Applications:
  • 717 (and optional 429) analysis, test, and simulation
  • Flightline and AOG support
  • Data recording
  • Avionics validation/testing

USB 1553 to MIL-STD-1553 Interfaces

Ballard USB1553 Adapter

MPN:

USB 1553

Manufacturer L3 Communications

Astronics Ballard Technology

Description:

The USB 1553 family of pocket-sized USB adapters enable computers to communicate with, simulate, test, and monitor 1553 equipment and systems. These rugged USB 2.0 peripherals feature extensive MIL-STD-1553 functionality and are compatible with virtually all modern PC laptop, desktop, tablet, and netbook computers. They support maximum data throughput on all 1553 channels and have a large 32 MB built-in memory. All power necessary for operation is provided via the single USB port. Plug and Play and Hot Swap features make it easy to install and move between computers.

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Features:

  • Up to 2 Dual Redundant MIL-STD-1553 Channels
  • 8 Avionics Discrete I/O
  • IRIG A/B PWM and AM
  • USB 2.0 Bus Powered—No External Power Supply Needed
  • 32 MB Data Memory
  • RoHS Compliant Design
  • Standard Black or Flight Test Orange Case
  • Small, Portable, and Rugged
  • Boards also available without enclosure for embedded use

USB 429 to ARINC 429/717 Interfaces

Ballard USB429 Adapter

MPN:

USB 429

Manufacturer L3 Communications

Astronics Ballard Technology

Description:

The USB 429 family of pocket-sized USB adapters enable computers to communicate with, simulate, test, and monitor ARINC 429 and 717 equipment and systems. These rugged USB 2.0 peripherals feature extensive 429/717 functionality and are compatible with virtually all modern PC laptop, desktop, tablet, and netbook computers. They support maximum data throughput on all ARINC channels and have a large 32 MB built-in memory. All power necessary for operation is provided via the single USB port. Plug and Play and Hot Swap features make it easy to install and move between computers.

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Features:

  • Up to 16 ARINC 429 Channels
  • Up to 4 ARINC 717 Channels
  • 8 Avionics Discrete I/O
  • IRIG A/B PWM and AM
  • USB 2.0 Bus Powered—No External Power Supply Needed
  • 32 MB Data Memory
  • RoHS Compliant Design
  • Standard Black or Flight Test Orange Case
  • Small, Portable, and Rugged
  • Boards also available without enclosure for embedded use

USB 708 to ARINC 708 Interfaces

Ballard USB708 Adapter

MPN:

USB 708

Manufacturer L3 Communications

Astronics Ballard Technology

Description:

The USB 708 series of products are pocket-sized USB adapters that enable computers to interface with ARINC 708 and similar weather radar display databuses. They have extensive functionality for testing weather radar CDUs (Control-Display Units) and T-R (Transmit-Receive) units for monitoring, recording, and playing back data, and for simulating weather radar systems. The ARINC 708 display databus is sometimes referred to as ARINC 453. The USB 708 is compatible with virtually all modern PC laptop, desktop, tablet, and netbook computers, and all power necessary for operation is provided via the single USB port. Plug and Play and Hot Swap features make it easy to install and move between computers.

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Features:

  • Up to 4 ARINC 708 Channels
  • 8 Avionics Discrete I/O
  • IRIG A/B PWM and AM
  • USB 2.0 Bus Powered—No External Power Supply Needed
  • 32 MB Data Memory
  • RoHS Compliant Design
  • Standard Black or Flight Test Orange Case
  • Small, Portable, and Rugged

USB Multi-Protocol Avionics Interface

Ballard USBMulti Adapter

MPN:

USBMulti

Manufacturer L3 Communications

Astronics Ballard Technology

Description:

These pocket-sized USB adapters are the easy and portable way to interface your computer to multiple avionics databuses including: MIL-STD-1553, EBR 1553, ARINC 429, ARINC 708, ARINC 717, Serial, and Discrete I/O.

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Features:

  • Interface USB to Multiple Avionics Databus Protocols with a Single Unit
  • 8 Avionics Discrete I/O
  • IRIG A/B PWM and AM
  • USB 2.0 Bus Powered-No External Power Supply Needed
  • 32 MB Data Memory
  • RoHS Compliant Design
  • Standard Black or Flight Test Orange Case
  • Small, Portable, and Rugged
  • Boards also available without enclosure for embedded use

Aircraft Interface Device

Ballard AB2-AID Aircraft Interface Device

MPN:

AB2-AID

Manufacturer L3 Communications

Astronics Ballard Technology

Description:

The AB2-AID is ready to go with high-performance avionics I/O combined with valuable built-in features such as a 9-port Ethernet switch, Ethernet to serial bridge, and 8GB flash memory. All in a compact, rugged package for easier integration and longer life.

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Features:

  • Optimal combination of avionics I/O and operational features
  • Certified device with FAA Parts Manufacturer Approval (PMA)
  • Based on proven AB2000 design deployed on over 30 aircraft platforms
  • Lightweight and low power
  • Integrated 9-port Ethernet switch
  • multiple AID models available
  • Numerous expansion options

OmnibusBox™ II Databus to Network interfaces

Ballard TechOmniBoxII Interface

MPN:

OmniBusBox™ II

Manufacturer L3 Communications

Astronics Ballard Technology

Description:

The OmniBusBox II (OBB2) enables computers and networks to interface with multiple avionics databuses for testing, validating and simulating commercial and military avionics equipment and systems. These versatile units can be controlled through Ethernet or USB, or can be programmed to operate standalone. Readily available as Commercial Off-The-Shelf (COTS) products, the OBB2 is perfect for challenging simulation, test, interface, bridging, control, simulation and data recording applications. The OmniBusBox II is the next-generation of Astronics Ballard Technology's popular OmniBusBox product with faster I/O and processing capabilities. The OBB2 is highly configurable and includes built-in standard peripherals (Ethernet, serial, USB and high quality audio lines), along with four internal Cores that can be populated with a variety of databus protocols and discrete I/O modules. With the newest advanced set of MIL-STD-1553 and ARINC 429 modules, users can verify wave form compatibilities, test functions of bus shorts and opens, and—when combined with our CoPilot® software—perform lab, production and flight test verification and simulation right out of the box.

Architecture - At the heart of the OmniBusBox II is a P1022 Freescale PowerPC processor and Astronics Ballard Technology's FPGA protocol engines. In addition to the built-in standard peripherals and core I/O functions, PMC/XMC and Mini-PCIe sites provide additional I/O expansion, including ARINC 664, CAN, IEEE 1394 and wireless protocols. The OBB2 includes extensive timing synchronization with multiple sources including 10MHz, PPS, IEEE 1588 and IRIG A/B. The 1U high case is easily placed on a desk or rack mountable. Though designed primarily as a lab product, the OBB2 has potential for use in large fixed-wing aircraft and light vehicle applications.

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Features:

  • Dual Core PPC Embedded Processor
  • Ethernet, serial and USB
  • Multiple protocols
  • Extensive timing features
  • GSM, WiFi and GPS (optional)
  • Return to factory settings feature
  • Accepts lab and aircraft power
  • Two- and four-I/O module versions are available. Each has different built-in expansion capabilities.

Gateway platform, Intel® Quark™ Processor-Based IoT

MXE-101i

MPN:

MXE-101i

Manufacturer L3 Communications

ADLINK

Description:

ADLINK's new Matrix MXE-100i IoT gateway platform, supporting Intel® Gateway Solutions for the Internet of Things (IoT), provides an extremely compact IoT gateway platform. Based on the Intel® Quark™ SoC X1021, and integrating Wind River® Intelligent Device Platform XT and McAfee Embedded Control, the MXE-100i, combined with ADLINK's embedded SEMA cloud solution, delivers the manageability and security critical to IoT-based operation.

With the implementation of ADLINK's proprietary SEMA Cloud solution, the MXE-100i maximises manageability and security for a world of applications, delivering efficient remote monitoring of system activity and health in real time, system control over a robust secured channel, and complete, fully manageable utilisation of system resources.

2 High-Speed LAN, two COM, three USB 2.0 host and SDIO, dual mini PCIe slots and USIM socket supporting communication with connections such as, WiFi, BT and 3G optimises connectivity and saves system power as well. The MXE-100i enables seamless interconnection, ensuring interoperability between systems. Matrix's proven rugged construction assures operation in harsh environments with operating vibration up to 5Grms, shock tolerance up to 100 G and an extended operating temperature range of -20°C to 70°C option. All told, the MXE-100i presents an intelligent, robust embedded system supporting wide application development and easy service deployment, presenting outstanding performance in Internet of Things, Intelligent Transportation, Facility Management, and Industrial Automation applications.

Features:

  • Intel® Quark™ SoC X1021
  • Extremely compact: 120 mm (W) x 100 mm (D) x 55 mm (H)
  • 3x USB 2.0, 2x 10/100 LAN ports, 2x COM ports, 1x SDIO
  • 2x mPCIe slots, 1x USIM slot
  • 3x user defined LED
  • Built-in ADLINK SEMA Cloud solution
  • Optional DIN-rail / wall mounting, onboard WiFi and TPM
  • Full support for Intel® Gateway Solutions for the Internet of Things (IoT)

ControlSafe™ Platform, SIL4 COTS Fail-Safe System

Aretsyn ControlSafe Platform

MPN:

CSP-CSC-CORE-AC-01

Manufacturer L3 Communications

Artesyn Embedded Technologies

Description:

Artesyn's ControlSafe™ Platform SIL4 COTS Fail-Safe System for Train Control and Rail Signaling. Leveraging over 30 years of expertise in developing highly reliable and available embedded computer systems, Artesyn Embedded Technologies is a premier supplier of commercial off-the-shelf (COTS) fail-safe computer systems to rail system integrators and rail application providers. With all reliability, availability, maintainability and safety (RAMS) processes designed to be certified to EN50126, all safety-related software to EN50128, and hardware to EN50129, Artesyn’s ControlSafe Platform (CSP) can be deployed in SIL4 safety application environments. Based on open standards, Artesyn’s ControlSafe Platform is a cost-effective solution that enables application developers and system integrators to substantially accelerate time-to-market without being deterred by the potentially high costs and risks associated with the stringent SIL4 system development and certification process. Artesyn is committed to building long-term partnerships with our customers, based on proven and reliable systems with consistent performance. The ControlSafe Platform further strengthens this commitment by providing rail industry customers with an unmatched, highly reliable platform with 15 years of planned product life and 25 years of extended support and service.

Artesyn’s ControlSafe Platform is designed to deliver best-in-class system availability as high as 99.9999%, which means that system downtime is limited to less than a few seconds per year. Artesyn has successfully completed extensive modeling and analysis by its team of highly qualified staff to confirm that the ControlSafe Platform meets all the functional safety, reliability and availability requirements mandated by rail standards and specifications.

Adhering to Artesyn’s future-proof development philosophy, the ControlSafe Platform is modular, scalable and designed to seamlessly accommodate additional I/O interfaces as well as upgraded processors throughout the product life cycle. Artesyn is focused on continued platform development to build a comprehensive product line. A new initiative is the development of a discrete I/O expansion box which enables customers to seamlessly integrate our ControlSafe Platform in a variety of rail signaling applications. Our ultimate goal is to enhance customers’ competitive position by allowing them to focus their development efforts on differentiating end applications.

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Features:

  • Highly integrated COTS solution designed to be certified to SIL4 safety standards
  • Designed to deliver system availability as high as six nines (99.9999%)
  • Modular and scalable for deployment in many rail applications
  • Innovative data lock-step architecture allows seamless technology upgrades
  • Hardware-based voting mechanism maximizes application software transparency
  • 15 years planned product life and 25 years of extended support and service
  • Backed up by a global service organization
  • Rugged design compliant with EN 50155
  • Growing product portfolio to enable future rolling stock and trackside deployment

Media Cloud Server with 8 Intel® Xeon® Processor E3-1200 v3 Series, 2U Rackmount

MCS-2040

MPN:

MCS-2040

Manufacturer L3 Communications

ADLINK

Description:

The increasing prevalence of high-bandwidth multimedia applications in use over the network, such as video streaming and conferencing, remote education, remote medical services and real-time video analytics, requires providers to upgrade media server performance in order to deliver a high quality user experience. However, general purpose rack servers currently available on the market were not specifically designed for media applications, lacking the required levels of performance and compute density.

In contrast to general purpose rack servers which usually have at most two CPUs and perform software video transcoding, the Adlink Media Cloud Server is an Application Ready Intelligent Platform (ARIP) for advanced video applications with high density computing performance that is designed from the ground up to meet the technical considerations specific to media servers while being cost-effective and easy to maintain.

Features:

  • Four hot-pluggable compute nodes
  • Features (per node)
  • Two independent systems communicate via GbE
  • Dual sockets support 4th Gen Intel® Core™ i7/i5/i3 and Xeon® Processor E3-1200 v3 (LGA 1150)
  • 4 DIMMs, up to 32GB DDR3 memory (16GB/system)
  • Quad GbE via RJ-45 (2 per system)
  • 4x hot -swappable 2.5 inch SATA drive bays
  • 2x 1600W redundant power supply
  • Adlink MediaManager

Embedded platform, quad-core Intel® Atom™ processor E3845, ultra compact

MXE-201

MPN:

MXE-201

Manufacturer L3 Communications

ADLINK

Description:

Matrix MXE-200/200i ultra-compact embedded platform, based on the Intel® Atom™ SoC processor E3845/E3826, delivers the most reliable I/O design for maximum connectivity, housing full aluminum alloy enclosure with industry-class construction make it the best embedded system of choice for industrial automation and applications demanding reliability in harsh environment. Combined with ADLINK's embedded SEMA Cloud solution, MXE-200/200i delivers the manageability and robustness required by mission critical operations. In addition, MXE-200i fully support Intel® IoT Gateway , integrated Wind River® Intelligent Device Platform XT, and McAfee Embedded Control all together guarantee the essential cornerstone manageability and security critical to IoT-ready platforms.

With its two GbE LAN, two COM, two USB 2.0 and one USB 3.0 host ports, optional four isolated DI and four isolated DO w/ interrupt support, dual mini PCIe slots with one mSATA support and USIM socket support communication with connections such as WiFi, BT, 3G, and LTE, the MXE-200/200i enables seamless interconnection, ensuring inter operability between systems. Matrix's proven rugged construction assures operation in harsh environments with operating shock tolerance up to 100 G and an extended operating temperature range up to -20°C to 70°C option.

Implementation of ADLINK's proprietary SEMA Cloud tool, the MXE-200/200i maximizes manageability and security for a world of applications, delivering efficient remote monitoring of system activity and health in real time, system control over a robust secured channel, and complete, fully manageable utilization of system resources.

All told, the MXE-200/200i presents an intelligent, robust embedded system supporting wide application development and easy service deployment, presenting outstanding performance in Intelligent Transportation, Facility Management, Industrial Automation and Internet of Things (IoT).

Features:

  • Intel® Atom™ SoC processor E3845/E3826
  • Extremely compact: 120 (W) x 100 (D) x 55 (H) mm
  • 1x HDMI, 2x USB 2.0 + 1x USB 3.0, 2x GbE ports, optional 4 isolated DI/O
  • 2x mPCIe slots (one supporting mSATA), 1x USIM socket, 1x SDIO
  • Optional DIN-Rail / Wall mounting
  • Built-in ADLINK SEMA Cloud solution
  • Full support Intel® IoT Gateway

Embedded platform, duo-core Intel® Atom™ processor E3826, ultra compact

MXE-202

MPN:

MXE-202

Manufacturer L3 Communications

ADLINK

Description:

Matrix MXE-200/200i ultra-compact embedded platform, based on the Intel® Atom™ SoC processor E3845/E3826, delivers the most reliable I/O design for maximum connectivity, housing full aluminum alloy enclosure with industry-class construction make it the best embedded system of choice for industrial automation and applications demanding reliability in harsh environment. Combined with ADLINK's embedded SEMA Cloud solution, MXE-200/200i delivers the manageability and robustness required by mission critical operations. In addition, MXE-200i fully support Intel® IoT Gateway , integrated Wind River® Intelligent Device Platform XT, and McAfee Embedded Control all together guarantee the essential cornerstone manageability and security critical to IoT-ready platforms.

With its two GbE LAN, two COM, two USB 2.0 and one USB 3.0 host ports, optional four isolated DI and four isolated DO w/ interrupt support, dual mini PCIe slots with one mSATA support and USIM socket support communication with connections such as WiFi, BT, 3G, and LTE, the MXE-200/200i enables seamless interconnection, ensuring inter operability between systems. Matrix's proven rugged construction assures operation in harsh environments with operating shock tolerance up to 100 G and an extended operating temperature range up to -20°C to 70°C option.

Implementation of ADLINK's proprietary SEMA Cloud tool, the MXE-200/200i maximizes manageability and security for a world of applications, delivering efficient remote monitoring of system activity and health in real time, system control over a robust secured channel, and complete, fully manageable utilization of system resources.

All told, the MXE-200/200i presents an intelligent, robust embedded system supporting wide application development and easy service deployment, presenting outstanding performance in Intelligent Transportation, Facility Management, Industrial Automation and Internet of Things (IoT).

Features:

  • Intel® Atom™ SoC processor E3845/E3826
  • Extremely compact: 120 (W) x 100 (D) x 55 (H) mm
  • 1x HDMI, 2x USB 2.0 + 1x USB 3.0, 2x GbE ports, optional 4 isolated DI/O
  • 2x mPCIe slots (one supporting mSATA), 1x USIM socket, 1x SDIO
  • Optional DIN-Rail / Wall mounting
  • Built-in ADLINK SEMA Cloud solution
  • Full support Intel® IoT Gateway

Embedded IoT gateway platform, duo-core Intel® Atom™ processor E3826

MXE-202i

MPN:

MXE-202i

Manufacturer L3 Communications

ADLINK

Description:

Matrix MXE-200/200i ultra-compact embedded platform, based on the Intel® Atom™ SoC processor E3845/E3826, delivers the most reliable I/O design for maximum connectivity, housing full aluminum alloy enclosure with industry-class construction make it the best embedded system of choice for industrial automation and applications demanding reliability in harsh environment. Combined with ADLINK's embedded SEMA Cloud solution, MXE-200/200i delivers the manageability and robustness required by mission critical operations. In addition, MXE-200i fully support Intel® IoT Gateway , integrated Wind River® Intelligent Device Platform XT, and McAfee Embedded Control all together guarantee the essential cornerstone manageability and security critical to IoT-ready platforms.

With its two GbE LAN, two COM, two USB 2.0 and one USB 3.0 host ports, optional four isolated DI and four isolated DO w/ interrupt support, dual mini PCIe slots with one mSATA support and USIM socket support communication with connections such as WiFi, BT, 3G, and LTE, the MXE-200/200i enables seamless interconnection, ensuring inter operability between systems. Matrix's proven rugged construction assures operation in harsh environments with operating shock tolerance up to 100 G and an extended operating temperature range up to -20°C to 70°C option.

Implementation of ADLINK's proprietary SEMA Cloud tool, the MXE-200/200i maximizes manageability and security for a world of applications, delivering efficient remote monitoring of system activity and health in real time, system control over a robust secured channel, and complete, fully manageable utilization of system resources.

All told, the MXE-200/200i presents an intelligent, robust embedded system supporting wide application development and easy service deployment, presenting outstanding performance in Intelligent Transportation, Facility Management, Industrial Automation and Internet of Things (IoT).

Features:

  • Intel® Atom™ SoC processor E3845/E3826
  • Extremely compact: 120 (W) x 100 (D) x 55 (H) mm
  • 1x HDMI, 2x USB 2.0 + 1x USB 3.0, 2x GbE ports, optional 4 isolated DI/O
  • 2x mPCIe slots (one supporting mSATA), 1x USIM socket, 1x SDIO
  • Optional DIN-Rail / Wall mounting
  • Built-in ADLINK SEMA Cloud solution
  • Full support Intel® IoT Gateway

Coldplate mount system, HPERC series, i7 processor, high-performance, extreme rugged

HPERC-IBR-HC

MPN:

HPERC-IBR-HC

Manufacturer L3 Communications

ADLINK

Description:

Inside the tiny footprint of HPERC™ lives the power of 3rd generation Intel® Core™ i7 processor and optional GPGPU parallel processing engine. Dual removable secure erase RAID-0 SSDs provide 12Gb/s throughput and security for deployment in hostile environments. Easy configuration and expansion allows for fast integration of custom rugged embedded applications. HPERC™ reserves connector pins for expansion interfaces. The GPGPU sits on a 16-lane 3rd generation PCI Express interface. Uniquely-keyed MIL-DTL-38999 connectors provide a wide array of fast IO. Built with proven Ampro reliability, the rugged capabilities of HPERC™ are ideal for ground, air and sea deployments. HPERC™ systems survive shock, resist corrosion and galvanic oxidation, and perform in the humid jungle, the heat of the desert, and the bitter cold of frozen mountain passes.

Features:

  • SWaP efficient sealed SFF System
  • VITA 75 coldplate mounting
  • Soldered DDR3L-1333 8GB - Up to 16GB RAM
  • Quad Gigabit Ethernet
  • Ultra-Fast Solid-State-RAID
  • Available GPGPU on 16-lane 3rd Generation PCI Express
  • Triple Display (DP/HDMI/DVI)
  • Extreme Rugged™ operating temperature: -40?XC to +85?XC

Finned-convection system, HPERC series, i7 processor, high-performance, extreme rugged

HPERC-IBR-HH

MPN:

HPERC-IBR-HH

Manufacturer L3 Communications

ADLINK

Description:

Inside the tiny footprint of HPERC™ lives the power of 3rd generation Intel® Core™ i7 processor and optional GPGPU parallel processing engine. Dual removable secure erase RAID-0 SSDs provide 12Gb/s throughput and security for deployment in hostile environments. Easy configuration and expansion allows for fast integration of custom rugged embedded applications. HPERC™ reserves connector pins for expansion interfaces. The GPGPU sits on a 16-lane 3rd generation PCI Express interface. Uniquely-keyed MIL-DTL-38999 connectors provide a wide array of fast IO. Built with proven Ampro reliability, the rugged capabilities of HPERC™ are ideal for ground, air and sea deployments. HPERC™ systems survive shock, resist corrosion and galvanic oxidation, and perform in the humid jungle, the heat of the desert, and the bitter cold of frozen mountain passes.

Features:

  • SWaP efficient sealed SFF System
  • Intel® Core™ i7 dual or quad core Processor
  • Soldered DDR3L-1333 8GB, up to 16GB RAM
  • Quad Gigabit Ethernet
  • Ultra-Fast Solid-State-RAID
  • Available GPGPU on 16-lane 3rd Generation PCI Express
  • Triple Display (DP/HDMI/DVI)
  • VITA 75 mount with passive cooling

Fanless computer, Intel® Core™ i7-3610QE, 1 PCI + 1 PCIe x16

MXC-6311D

MPN:

MXC-6311D

Manufacturer L3 Communications

ADLINK

Description:

The Matrix MXC-6300 series is a high-performance fanless embedded computer integrating a 3rd generation Intel® Core™ i7/ i5/i3 processor and QM77 chipset to provide powerful computing and excellent graphic performance. Graphic-intensive and computing-oriented applications including image and vision measurement, machine automation, maritime automation, surveillance and high-resolution medical imaging can all benefit.

Increased PCI & PCI express (Gen2) expansion slots allow installation of a variety of PCI, PCIex8 or PCIex16 add-on cards, meeting the needs of application platform development environments. In addition, the MXC-6300 series offers 2 x DisplayPort and 1 x DVI-I port for three independent display support connections, 4 x USB3.0 and 2 x USB2.0 ports, and 2 GbE LAN ports with teaming function. The two 2.5" onboard SATA III ports with high speed SATA 6 Gb/s and RAID 0, 1 ensure all data in the RAID array is fully backed up. Built-in 16CH isolated DIO provides overall industrial control.

Delivering high quality, durability and compact construction, the MXC-6300 leverages a reliable fanless and cable-free configuration, optimal thermal dissipation, and easy installation for flexible and user-friendly system development and application implementation in harsh environments.

Features:

  • Supports 3rd generation Intel® Core™ i7/i5/i3 processor + QM77 chipset
  • 2 x DDR3 SO-DIMM socket, support up to 16GB memory
  • 2 PCIe x8 + 1 PCI slots or 1 PCIe x16 + 1 PCI expansion slots, supporting PCIe Gen2
  • 3 independent display with onboard 2 Display Port + 1 DVI-I
  • 2 Intel® GbE ports with teaming function, Intel® iAMT 8.0
  • 6 external USB ports (4 USB 3.0 + 2 USB 2.0) + 1 internal USB 2.0, 2 CFast sockets, onboard SATA III for 2x2.5 inch HDD/SSD installation, SATA 6Gb/s and RAID 0,1 support
  • Built-in 9 VDC to 32 VDC wide-range DC power input
  • Rugged, up to -20°C to 60°C (-4°F to 140°F) fanless operation (w/ industrial SSD)

Fanless computer, Intel® Core™ i5-3610ME, 1 PCI + 1 PCIe x16

MXC-6312D

MPN:

MXC-6312D

Manufacturer L3 Communications

ADLINK

Description:

The Matrix MXC-6300 series is a high-performance fanless embedded computer integrating a 3rd generation Intel® Core™ i7/ i5/i3 processor and QM77 chipset to provide powerful computing and excellent graphic performance. Graphic-intensive and computing-oriented applications including image and vision measurement, machine automation, maritime automation, surveillance and high-resolution medical imaging can all benefit.

Increased PCI & PCI express (Gen2) expansion slots allow installation of a variety of PCI, PCIex8 or PCIex16 add-on cards, meeting the needs of application platform development environments. In addition, the MXC-6300 series offers 2 x DisplayPort and 1 x DVI-I port for three independent display support connections, 4 x USB3.0 and 2 x USB2.0 ports, and 2 GbE LAN ports with teaming function. The two 2.5" onboard SATA III ports with high speed SATA 6 Gb/s and RAID 0, 1 ensure all data in the RAID array is fully backed up. Built-in 16CH isolated DIO provides overall industrial control.

Delivering high quality, durability and compact construction, the MXC-6300 leverages a reliable fanless and cable-free configuration, optimal thermal dissipation, and easy installation for flexible and user-friendly system development and application implementation in harsh environments.

Features:

  • Supports 3rd generation Intel® Core™ i7/i5/i3 processor + QM77 chipset
  • 2 x DDR3 SO-DIMM socket, support up to 16GB memory
  • 2 PCIe x8 + 1 PCI slots or 1 PCIe x16 + 1 PCI expansion slots, supporting PCIe Gen2
  • 3 independent display with onboard 2 Display Port + 1 DVI-I
  • 2 Intel® GbE ports with teaming function, Intel® iAMT 8.0
  • 6 external USB ports (4 USB 3.0 + 2 USB 2.0) + 1 internal USB 2.0, 2 CFast sockets, onboard SATA III for 2x2.5 inch HDD/SSD installation, SATA 6Gb/s and RAID 0,1 support
  • Built-in 9 VDC to 32 VDC wide-range DC power input
  • Rugged, up to -20°C to 60°C (-4°F to 140°F) fanless operation (w/ industrial SSD)

Fanless computer, Intel® Core™ i3-3120ME, 1 PCI + 1 PCIe x16

MXC-6313D

MPN:

MXC-6313D

Manufacturer L3 Communications

ADLINK

Description:

The Matrix MXC-6300 series is a high-performance fanless embedded computer integrating a 3rd generation Intel® Core™ i7/ i5/i3 processor and QM77 chipset to provide powerful computing and excellent graphic performance. Graphic-intensive and computing-oriented applications including image and vision measurement, machine automation, maritime automation, surveillance and high-resolution medical imaging can all benefit.

Increased PCI & PCI express (Gen2) expansion slots allow installation of a variety of PCI, PCIex8 or PCIex16 add-on cards, meeting the needs of application platform development environments. In addition, the MXC-6300 series offers 2 x DisplayPort and 1 x DVI-I port for three independent display support connections, 4 x USB3.0 and 2 x USB2.0 ports, and 2 GbE LAN ports with teaming function. The two 2.5" onboard SATA III ports with high speed SATA 6 Gb/s and RAID 0, 1 ensure all data in the RAID array is fully backed up. Built-in 16CH isolated DIO provides overall industrial control.

Delivering high quality, durability and compact construction, the MXC-6300 leverages a reliable fanless and cable-free configuration, optimal thermal dissipation, and easy installation for flexible and user-friendly system development and application implementation in harsh environments.

Features:

  • Supports 3rd generation Intel® Core™ i7/i5/i3 processor + QM77 chipset
  • 2 x DDR3 SO-DIMM socket, support up to 16GB memory
  • 2 PCIe x8 + 1 PCI slots or 1 PCIe x16 + 1 PCI expansion slots, supporting PCIe Gen2
  • 3 independent display with onboard 2 Display Port + 1 DVI-I
  • 2 Intel® GbE ports with teaming function, Intel® iAMT 8.0
  • 6 external USB ports (4 USB 3.0 + 2 USB 2.0) + 1 internal USB 2.0, 2 CFast sockets, onboard SATA III for 2x2.5 inch HDD/SSD installation, SATA 6Gb/s and RAID 0,1 support
  • Built-in 9 VDC to 32 VDC wide-range DC power input
  • Rugged, up to -20°C to 60°C (-4°F to 140°F) fanless operation (w/ industrial SSD)

Fanless computer, Intel® Core™ i7-3610QE, 3 PCI + 1 PCIe x16

MXC-6321D

MPN:

MXC-6321D

Manufacturer L3 Communications

ADLINK

Description:

The Matrix MXC-6300 series is a high-performance fanless embedded computer integrating a 3rd generation Intel® Core™ i7/ i5/i3 processor and QM77 chipset to provide powerful computing and excellent graphic performance. Graphic-intensive and computing-oriented applications including image and vision measurement, machine automation, maritime automation, surveillance and high-resolution medical imaging can all benefit.

Increased PCI & PCI express (Gen2) expansion slots allow installation of a variety of PCI, PCIex8 or PCIex16 add-on cards, meeting the needs of application platform development environments. In addition, the MXC-6300 series offers 2 x DisplayPort and 1 x DVI-I port for three independent display support connections, 4 x USB3.0 and 2 x USB2.0 ports, and 2 GbE LAN ports with teaming function. The two 2.5" onboard SATA III ports with high speed SATA 6 Gb/s and RAID 0, 1 ensure all data in the RAID array is fully backed up. Built-in 16CH isolated DIO provides overall industrial control.

Delivering high quality, durability and compact construction, the MXC-6300 leverages a reliable fanless and cable-free configuration, optimal thermal dissipation, and easy installation for flexible and user-friendly system development and application implementation in harsh environments.

Features:

  • Supports 3rd generation Intel® Core™ i7/i5/i3 processor + QM77 chipset
  • 2 x DDR3 SO-DIMM socket, support up to 16GB memory
  • 2 PCIe x8 + 1 PCI slots or 1 PCIe x16 + 1 PCI expansion slots, supporting PCIe Gen2
  • 3 independent display with onboard 2 Display Port + 1 DVI-I
  • 2 Intel® GbE ports with teaming function, Intel® iAMT 8.0
  • 6 external USB ports (4 USB 3.0 + 2 USB 2.0) + 1 internal USB 2.0, 2 CFast sockets, onboard SATA III for 2x2.5 inch HDD/SSD installation, SATA 6Gb/s and RAID 0,1 support
  • Built-in 9 VDC to 32 VDC wide-range DC power input
  • Rugged, up to -20°C to 60°C (-4°F to 140°F) fanless operation (w/ industrial SSD)

Fanless computer, Intel® Core™ i5-3610ME, 3 PCI + 1 PCIe x16

MXC-6322D

MPN:

MXC-6322D

Manufacturer L3 Communications

ADLINK

Description:

The Matrix MXC-6300 series is a high-performance fanless embedded computer integrating a 3rd generation Intel® Core™ i7/ i5/i3 processor and QM77 chipset to provide powerful computing and excellent graphic performance. Graphic-intensive and computing-oriented applications including image and vision measurement, machine automation, maritime automation, surveillance and high-resolution medical imaging can all benefit.

Increased PCI & PCI express (Gen2) expansion slots allow installation of a variety of PCI, PCIex8 or PCIex16 add-on cards, meeting the needs of application platform development environments. In addition, the MXC-6300 series offers 2 x DisplayPort and 1 x DVI-I port for three independent display support connections, 4 x USB3.0 and 2 x USB2.0 ports, and 2 GbE LAN ports with teaming function. The two 2.5" onboard SATA III ports with high speed SATA 6 Gb/s and RAID 0, 1 ensure all data in the RAID array is fully backed up. Built-in 16CH isolated DIO provides overall industrial control.

Delivering high quality, durability and compact construction, the MXC-6300 leverages a reliable fanless and cable-free configuration, optimal thermal dissipation, and easy installation for flexible and user-friendly system development and application implementation in harsh environments.

Features:

  • Supports 3rd generation Intel® Core™ i7/i5/i3 processor + QM77 chipset
  • 2 x DDR3 SO-DIMM socket, support up to 16GB memory
  • 2 PCIe x8 + 1 PCI slots or 1 PCIe x16 + 1 PCI expansion slots, supporting PCIe Gen2
  • 3 independent display with onboard 2 Display Port + 1 DVI-I
  • 2 Intel® GbE ports with teaming function, Intel® iAMT 8.0
  • 6 external USB ports (4 USB 3.0 + 2 USB 2.0) + 1 internal USB 2.0, 2 CFast sockets, onboard SATA III for 2x2.5 inch HDD/SSD installation, SATA 6Gb/s and RAID 0,1 support
  • Built-in 9 VDC to 32 VDC wide-range DC power input
  • Rugged, up to -20°C to 60°C (-4°F to 140°F) fanless operation (w/ industrial SSD)

Fanless computer, Intel® Core™ i3-3120ME, 3 PCI + 1 PCIe x16

MXC-6323D

MPN:

MXC-6323D

Manufacturer L3 Communications

ADLINK

Description:

The Matrix MXC-6300 series is a high-performance fanless embedded computer integrating a 3rd generation Intel® Core™ i7/ i5/i3 processor and QM77 chipset to provide powerful computing and excellent graphic performance. Graphic-intensive and computing-oriented applications including image and vision measurement, machine automation, maritime automation, surveillance and high-resolution medical imaging can all benefit.

Increased PCI & PCI express (Gen2) expansion slots allow installation of a variety of PCI, PCIex8 or PCIex16 add-on cards, meeting the needs of application platform development environments. In addition, the MXC-6300 series offers 2 x DisplayPort and 1 x DVI-I port for three independent display support connections, 4 x USB3.0 and 2 x USB2.0 ports, and 2 GbE LAN ports with teaming function. The two 2.5" onboard SATA III ports with high speed SATA 6 Gb/s and RAID 0, 1 ensure all data in the RAID array is fully backed up. Built-in 16CH isolated DIO provides overall industrial control.

Delivering high quality, durability and compact construction, the MXC-6300 leverages a reliable fanless and cable-free configuration, optimal thermal dissipation, and easy installation for flexible and user-friendly system development and application implementation in harsh environments.

Features:

  • Supports 3rd generation Intel® Core™ i7/i5/i3 processor + QM77 chipset
  • 2 x DDR3 SO-DIMM socket, support up to 16GB memory
  • 2 PCIe x8 + 1 PCI slots or 1 PCIe x16 + 1 PCI expansion slots, supporting PCIe Gen2
  • 3 independent display with onboard 2 Display Port + 1 DVI-I
  • 2 Intel® GbE ports with teaming function, Intel® iAMT 8.0
  • 6 external USB ports (4 USB 3.0 + 2 USB 2.0) + 1 internal USB 2.0, 2 CFast sockets, onboard SATA III for 2x2.5 inch HDD/SSD installation, SATA 6Gb/s and RAID 0,1 support
  • Built-in 9 VDC to 32 VDC wide-range DC power input
  • Rugged, up to -20°C to 60°C (-4°F to 140°F) fanless operation (w/ industrial SSD)

Fanless computer, Intel® Celeron 1020E

MXC-6305D

MPN:

MXC-6305D

Manufacturer L3 Communications

ADLINK

Description:

The Matrix MXC-6300 series is a high-performance fanless embedded computer integrating a 3rd generation Intel® Core™ i7/ i5/i3 processor and QM77 chipset to provide powerful computing and excellent graphic performance. Graphic-intensive and computing-oriented applications including image and vision measurement, machine automation, maritime automation, surveillance and high-resolution medical imaging can all benefit.

Increased PCI & PCI express (Gen2) expansion slots allow installation of a variety of PCI, PCIex8 or PCIex16 add-on cards, meeting the needs of application platform development environments. In addition, the MXC-6300 series offers 2 x DisplayPort and 1 x DVI-I port for three independent display support connections, 4 x USB3.0 and 2 x USB2.0 ports, and 2 GbE LAN ports with teaming function. The two 2.5" onboard SATA III ports with high speed SATA 6 Gb/s and RAID 0, 1 ensure all data in the RAID array is fully backed up. Built-in 16CH isolated DIO provides overall industrial control.

Delivering high quality, durability and compact construction, the MXC-6300 leverages a reliable fanless and cable-free configuration, optimal thermal dissipation, and easy installation for flexible and user-friendly system development and application implementation in harsh environments.

Features:

  • Supports 3rd generation Intel® Core™ i7/i5/i3 processor + QM77 chipset
  • 2 x DDR3 SO-DIMM socket, support up to 16GB memory
  • 2 PCIe x8 + 1 PCI slots or 1 PCIe x16 + 1 PCI expansion slots, supporting PCIe Gen2
  • 3 independent display with onboard 2 Display Port + 1 DVI-I
  • 2 Intel® GbE ports with teaming function, Intel® iAMT 8.0
  • 6 external USB ports (4 USB 3.0 + 2 USB 2.0) + 1 internal USB 2.0, 2 CFast sockets, onboard SATA III for 2x2.5 inch HDD/SSD installation, SATA 6Gb/s and RAID 0,1 support
  • Built-in 9 VDC to 32 VDC wide-range DC power input
  • Rugged, up to -20°C to 60°C (-4°F to 140°F) fanless operation (w/ industrial SSD)

2U Rackmount Network Appliance with Intel® Xeon® Processor

AdLink CSA-5200 2U Rack mount with Intel processor

MPN:

CSA-5200

Manufacturer L3 Communications

ADLINK

Description:

The ADLINK CSA-5200 is a 2U 19 inch Rackmount Network Appliance with 4th Generation Intel® processor Xeon® E3-1200 v3 and Intel® C226 Chipset. The CSA-5200 features up to 32x GbE ports or 8x SFP+ with an I/O intensive architecture, high scalability with four Network Interface Module (NIM) slots, 2.5 inch/3.5 icnch SATA drive bays, additional storage interfaces (SATADOM, CFast), and is an ideal platform for communications infrastructure deployment.

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Features:

  • 4th Gen Intel® processor Xeon® E3-1200 v3 with Intel® C226 Chipset
  • High scalability with four Network Interface Module (NIM) slots and four 2.5inch/3.5 inch SATA drive bays
  • Maximum 32x GbE/SEP ports or 8x SFP+ with I/O intensive architecture
  • Flexible storage options: SATA drive, SATADOM, CFast
  • ADLINK ARIP (Application Ready Intelligent Platform) designed for network communications

Fanless Embedded Computer, Intel® Atom™ Quad-Core Processor

Adlink MXC-2300

MPN:

MXC-2300

Manufacturer L3 Communications

ADLINK

Description:

Featuring the latest Intel® Atom™ E3845 processor (Formerly Bay Trail), the Matrix MXC-2300 series excels with minimal power consumption, exceptional 3D graphics, and powerful media acceleration, delivering a leading improvement in performance and cost- efficiency over any previous generation Atom-based system. Features include dual-port CAN connectivity supported by a Philips SJA1000 controller that can run independently or bridged at the same time, bus arbitration and error detection with auto correction and re-transmission capability, and 16-CH isolated DI/O for general industrial control. An increased total 3PCI/PCIe expansion slot count allows installation of a variety of off-the-shelf PCI/PCIe cards for configurable applications, and an internal PCI Express Mini Card socket and USIM slot support extension of additional functions, such as wireless connection. In addition, the MXC-2300 series offers one DisplayPort and one DVI-I port for dual independent display with full HD, four USB 2.0 and one USB 3.0 ports, and 2 GbE LAN ports with teaming function.

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Features:

  • Intel® Atom™ E3845 processor with 4 core @1.91 GHz SoC
  • 2x DDR3L SO-DIMM, supporting up to 8 GB memory
  • 2 PCI + 1 PCIe x4 or 3 PCI expansion slots
  • Built-in dual-port isolated CAN and 16-CH isolated DI and DO
  • 1 DisplayPort + 1 DVI-I
  • 2 Intel GbE ports with teaming function, 1 USB 3.0 + 4 USB 2.0 ports
  • 1 external CF slot and 1 internal PCIe Mini Card socket with USIM socket
  • 2 software-programmable RS-232/422/485 + 2 RS-232 ports
  • Built-in 9 to 32 VDC wide-range DC power input
  • Rugged, -20°C to 70°C Fanless operation (w/ industrial SSD)
  • Built-in ADLINK SEMA 2.2 (Smart Embedded Management Agent)

Android 4.0 Industrial Mobile Handheld Computer

Adlink IMX-3000 Android 4.0 Industrial Mobile Handheld Computer

MPN:

IMX-3000

Manufacturer L3 Communications

ADLINK

Description:

Android 4.0 Industrial Mobile Handheld Computer from Adlink.

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Features:

  • 3.8" WVGA (480 x 800) TFT-LCD; sunlight readable; capacitive 5-point touch panel
  • 5M pixel camera with AF flash LED (standard) / 2M pixel CMOS without AF (option)
  • Rechargeable 2600mAh Li-ion battery / 3.7V
  • 1.2m drop and IP54 sealing
  • Wireless radio: WLAN radio: IEEE 802.11 b/g/n WPAN: V4.0 WWAN: WCDMA 850 / 1900 / 2100 ; GSM 850 / 900 / 1800 / 1900; HSDPA: 7.2Mb/s; HSUPA: 5.76 Mb/s NFC PN544 (13.56 MHz)
  • GPS - enabled and AGPS supported
  • Data capture: CCD / 1D laser engine / 2D imager / NFC PN544 (13.56MHz)

Windows CE 6.0 R3 Industrial Mobile Handheld Computer

Adlink IMX-9000 Windows CE 6.0 R3 Industrial Mobile Handheld Computer

MPN:

IMX-9000

Manufacturer L3 Communications

ADLINK

Description:

Windows CE 6.0 R3 Industrial Mobile Handheld Computer

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Features:

  • 3.5" QVGA (240 x 320) TFT-LCD ; sunlight readable
  • 5M pixel camera; auto focus; adjustable flash
  • High capacity rechargeable 3000mAh Li-ion battery
  • Integrated GPS fast positioning
  • Data capture: 1D laser engine/2D imager HF RFID (13.56MHz) data capture: ISO15693, ISO14443A
  • Wireless radio: WLAN: IEEE 802.11 b/g/n WPAN: Bluetooth V2.1,+ EDR Class II WWAN: GSM + EDGE/GPRS Module
  • 1.5m drop and IP65 sealing

4U Server-Grade System with Dual Intel® Xeon® Processor E5 Extended ATX

Adlink TRL-40 4U Server-Grade System with Dual Intel Xeon Processor E5 Extended ATX Server Board

MPN:

TRL-40

Manufacturer L3 Communications

ADLINK

Description:

The ADLINK TRL-40 is a 4U Server-Grade System supporting the Intel® Xeon® Processor E5-2600 product family in LGA2011 package to deliver a scalable high performance platform for a wide array of industrial applications. The TRL-40 supports 32/22nm dual CPUs at up to 2.4 GHz with integrated memory controllers and Direct Media Interface (DMI) connectivity to the Intel® C604 Chipset. Dual channel DDR3 1600 MHz memory is supported up to a maximum of 128 GB in eight DIMM slots.

These advanced features, coupled with integrated graphics, four PCI Express x16 slots, one PCI Express x8 slot, one PCI Express x4 slot, dual PCI Express-based Gigabit Ethernet, six SATA 6 Gb/s ports and two SATA 3Gb/s ports make the TRL-40 ideal for vision and video solution, medical, test and measurement, and telecom applications requiring a high-performance, easy-to-deploy and reliable system.

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Features:

  • Dual LGA2011 Intel® Xeon® Processor E5
  • Eight memory sockets support DDR3-1600 REG/ECC or Non-ECC up to 128GB
  • 4x PCIe x16 Gen3, 1x PCIe x8 Gen3 and 1x PCIe x4 Gen2 (physical PCIe x8 slot)
  • IPMI 2.0 Remote Management
  • 600W or 1000W PS/2 single power supply or 600W mini-redundant power supply
  • Supports three 5.25", five 3.5" drive bays with true anti-vibration design

4th Generation Intel® Core™ i7 Processor-Based Fanless Embedded Computer

Adlink MXE-5400 Powerful 4th Generation Intel Core i7 Processor-Based Fanless Embedded Computer

MPN:

MXE-5400

Manufacturer L3 Communications

ADLINK

Description:

ADLINK's new Matrix MXE-5400 series of rugged designed quad-core fanless computers, featuring the latest 4th generation Intel® Core™ i7-4700EQ (codename: Haswell) delivers outstanding processor performance with minimum power consumption. Intel's Quick Sync Technology and Core IPG equip the MXE-5400 with marketleading performance boost in image/video related applications.

With the implementation of Intel® vPro™ (iAMT™ 9.0, TXT, TPM 1.2, Intel VT) technology and ADLINK'sproprietary SEMA (Smart Embedded Management Agent) tool, the MXE-5400 maximises manageability andsecurity for a world of applications. Together they provide efficient remote monitoring of system activity and health in real time, system control over a robust secured channel, and fully manageable complete utilization of system resources.

The MXE-5400 series accommodates rich I/O interfaces in a compact system size, offering versatile connection to a wide range of applications. Dual mini PCIe slots and USIM socket empower the MXE-5400 to act as a communications hub for a variety of wireless connections, such as BT/WiFi and 3G. One of the two slots is configurable to a mini SATA interface, cooperating with internal SATA storage to deliver RAID 0/1/5 functionality.

Leveraging proprietary mechanical engineering, the MXE-5400 series continues to offer all the popular features of the Matrix E series, including cable-free construction, wide operating temperature ranges, and 5 Grms vibration resistance. The entire ADLINK Matrix line undergoes rigorous testing for operational verification.

Combing superior processor performance, security and manageability, superior wireless capability, and rich I/O, in a compact and robust package, the ADLINK MXE-5400 is an ideal choice for a wide range of applications supporting intelligent transportation, in-vehicle multimedia, and surveillance and factory automation applications.

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Features:

  • Equipped with 4th generation Intel® Core™ i7-4700EQ processor
  • Intel® Quick Sync Video technology supported with ADLINK MSDK+
  • Intel® vPro™ technology for security and manageability (iAMT™ 9.0, TPM 1.2, TXT, Intel® VT™)
  • Built-in ADLINK SEMA 2.2 (Smart Embedded Management Agent)
  • Rich I/O : DVI-I+2x DisplayPorts, 6x USB 3.0, 4x GbE ports, 8x isolated DI/O
  • 2x SATA-III (6.0 Gb/s) ports, 2x mPCIe slots (one supporting mSATA SSD)
  • Rugged design for -20ºC to 60ºC fanless operation (w/industrial SSD)

Extreme Rugged Cold plate mount System 3rd Generation Intel Core i7 CPU

Adlink HPERC-IBR-MC High Performance Extreme Rugged Cold plate mount System with 3rd Generation Intel Core i7 CPU

MPN:

HPERC-IBR-MC

Manufacturer L3 Communications

ADLINK

Description:

Sealed rugged COTS computing platform

Inside the tiny footprint of HPERC-IBR-MC lives the power of 3rd generation Intel® Core™ i7 processor and optional GP-GPU parallel processing engine. Dual removable secure erase RAID-0 SSDs provide 12Gb/s throughput and security for deployment in hostile environments.

Easy configuration and expansion allows for fast integration of custom rugged embedded applications. HPERC-IBR-MC reserves connector pins for expansion interfaces.

The GPGPU sits on a 16-lane 3rd generation PCI Express interface. Uniquely-keyed MIL-DTL-38999 connectors provide a wide array of fast IO.

Built with proven reliability, the rugged capabilities of HPERC-IBR-MC is ideal for ground, air and sea deployments.

HPERC-IBR-MC systems survive shock, resist corrosion and galvanic oxidation, and perform in the humid jungle, the heat of the desert, and the bitter cold of frozen mountain passes.

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Features:

  • SWaP efficient sealed SFF System
  • VITA-75.22 Cold plate Mounting
  • 3rd Generation Intel® Core™ i7 Processor
  • Soldered DDR3L-1333 8GB - Up to 16GB RAM
  • Quad Gigabit Ethernet
  • Ultra-Fast 12GB/s Solid-State-RAID
  • Available GP-GPU on 16-lane 3rd Generation PCI Express
  • Three Digital Display Port/HDMI/DVI
  • Simple User Expansion and Configuration

Rugged Finned-convection System with 3rd Generation Intel Core i7 CPU

Adlink HPERC-IBR-MH High Performance Extreme Rugged Finned-convection System with 3rd Generation Intel Core i7 CPU

MPN:

HPERC-IBR-MH

Manufacturer L3 Communications

ADLINK

Description:

Inside the tiny footprint of HPERC™ lives the power of 3rd generation Intel® Core™ i7 processor and optional GPGPU parallel processing engine. Dual removable secure erase RAID-0 SSDs provide 12Gb/s throughput and security for deployment in hostile environments.

Easy configuration and expansion allows for fast integration of custom rugged embedded applications. HPERC™ reserves connector pins for expansion interfaces. The GPGPU sits on a 16-lane 3rd generation PCI Express interface. Uniquely-keyed MIL-DTL-38999 connectors provide a wide array of fast IO.

Built with proven Ampro reliability, the rugged capabilities of HPERC™ are ideal for ground, air and sea deployments. HPERC™ systems survive shock, resist corrosion and galvanic oxidation, and perform in the humid jungle, the heat of the desert, and the bitter cold of frozen mountain passes.

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Features:

  • SWaP efficient sealed SFF System
  • 3rd Generation Intel® Core™ i7 Processor
  • Soldered DDR3L-1333 8GB - Up to 16GB RAM
  • Quad Gigabit Ethernet
  • Ultra-Fast 12GB/s Solid-State-RAID
  • Available GP-GPU on 16-lane 3rd Generation PCI Express
  • Three Digital DisplayPort/HDMI/DVI
  • Simple User Expansion and Configuration

Embedded Computer System with IMB-T10 Mini-ITX Motherboard

Adlink MIX110-D2550M2G320-00 Embedded Computer System with IMB-T10 Mini-ITX Motherboard with MK-101, IMB-T10A, 2GB RAM, 320HDD, 75W adapter

MPN:

MIX110-D2550M2G320-00

Manufacturer L3 Communications

ADLINK

Description:

The MIX-110 is an embedded computer system based on the IMB-T10A Mini-ITX form factor industrial motherboard supporting onboard Intel AtomTM Processor D2550, Intel NM10 Express Chipset and single channel DDR3 1066/800MHz memory (up to 4GB) in two SODIMM slots. Features include integrated Intel GMA HD 3650 (VGA, DVI-D outputs), dual Gigabit Ethernet, six USB 2.0 ports, and an externally accessible anti-shock drive bay for two 2.5" SATA 3Gb/s drives. The MIX-110 provides a PCI Ex-press Mini Card slot for Wi-Fi module.

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Features:

  • Intel® Atom™ Processor D2550
  • Two optional 2.5” storage drive bays
  • VGA, DVI-D display output
  • RS-232/422/485 COM port

Embedded Computer System with IMB-T10 Mini-ITX Motherboard

Adlink MIX110-D2550M2G64-00 Embedded Computer System with IMB-T10 Mini-ITX Motherboard with MK-101, IMB-T10A, 2GB RAM, 64G SSD, 75W adapter

MPN:

MIX110-D2550M2G64-00

Manufacturer L3 Communications

ADLINK

Description:

The MIX-110 is an embedded computer system based on the IMB-T10A Mini-ITX form factor industrial motherboard supporting onboard Intel AtomTM Processor D2550, Intel NM10 Express Chipset and single channel DDR3 1066/800MHz memory (up to 4GB) in two SODIMM slots. Features include integrated Intel GMA HD 3650 (VGA, DVI-D outputs), dual Gigabit Ethernet, six USB 2.0 ports, and an externally accessible anti-shock drive bay for two 2.5" SATA 3Gb/s drives. The MIX-110 provides a PCI Ex-press Mini Card slot for Wi-Fi module.

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Features:

  • Intel® Atom™ Processor D2550
  • Two optional 2.5” storage drive bays
  • VGA, DVI-D display output
  • RS-232/422/485 COM port

MK-101, IMB-T10 on-board Atom D2550, 75W adapter (bare-bone system)

Adlink MIX110-NNN-00 MK-101, IMB-T10 on-board Atom D2550, 75W adapter (bare-bone system)

MPN:

MIX110-NNN-00

Manufacturer L3 Communications

ADLINK

Description:

The MIX-110 is an embedded computer system based on the IMB-T10A Mini-ITX form factor industrial motherboard supporting onboard Intel AtomTM Processor D2550, Intel NM10 Express Chipset and single channel DDR3 1066/800MHz memory (up to 4GB) in two SODIMM slots. Features include integrated Intel GMA HD 3650 (VGA, DVI-D outputs), dual Gigabit Ethernet, six USB 2.0 ports, and an externally accessible anti-shock drive bay for two 2.5" SATA 3Gb/s drives. The MIX-110 provides a PCI Ex-press Mini Card slot for Wi-Fi module.

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Features:

  • Intel® Atom™ Processor D2550
  • Two optional 2.5” storage drive bays
  • VGA, DVI-D display output
  • RS-232/422/485 COM port

OmniBusBox™ Ethernet/USB Avionics Databus Interface

Ballard OmniBusBox Ethernet/USB Avionics Databus Interface

MPN:

OmniBusBox™

Manufacturer L3 Communications

Astronics Ballard Technology

Description:

The OmniBusBox has the power and flexibility to operate as a simple or intelligent peripheral (USB or Ethernet) or as a stand-alone embedded computer. It provides the solution to networked test and simulation systems, and is a unique alternative to plug in cards. The OmniBusBox can be ordered with up to two modules to support a variety of avionics databus protocols. Features include a PowerPC processor, USB 2.0, Ethernet, serial, CompactFlash, digital I/O, and IRIG.

OmniBus is a highly-flexible and high-performance family of avionics databus interfaces combining a selection of industry-standard platforms (PCI/cPCI, VME, PMC and Ethernet/USB) with a wide-viariety of I/O choices (MIL-STD-1553, ARINC 429, ARINC 708, ARINC 717, Serial, CSDB and Discrete).

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Features:

  • OmniBus Modules: 2
  • High channel counts
  • Mixed protocols
  • PowerPC® user processor
  • Ethernet and USB ports
  • CompactFlash® slot
  • IRIG time synchronization
  • Can be upgraded/reconfigured
  • Size: 1.7 (1U) x 12 x 9.6 in (44 x 305 x 244 mm)
  • Weight:3.5 lb (1.6 kg)
  • Mounting: table-top, bolt-down, or rack mount

Embedded Rugged Computer for Demanding Applications

Ballard-AB3000

MPN:

AB3000

Manufacturer L3 Communications

Astronics Ballard Technology

Description:

The rugged AB3000 is a family of compact, conduction-cooled computers for use in demanding environments. These versatile systems include many built-in standard peripherals, avionics databuses, and user interfaces, as well as PMC expansion capability. With the addition of application software, the AB3000 provides a readily available Commercial Off-The-Shelf (COTS) solution to challenging interface, bridging, control, and audio/display problems. The AB3000 is available in over 100 different configurations to meet a wide variety of needs.


Typical applications for the AB3000 include data and protocol conversion, databus and network bridging, data servers, data recorders, communications, power controllers, federated controllers and multiple net-centric applications. In addition, the AB3000 can support voice and visual processing for cockpit voice actions, canned message delivery, workstation expansion and more. The AB3000 is small, lightweight and loaded with capabilities for easy integration into today's modern aircraft, UAVs, and ground mobile platforms.

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Features:

  • Versatile computer system
  • Intel® Atom™ E680T processor
  • 2D/3D graphics engine
  • Standard computer I/O
  • Avionics databuses
  • PMC expansion site

Avionics BusBox Embedded Computer for Rugged Applications

Ballard-AB2000

MPN:

AB2000

Manufacturer L3 Communications

Astronics Ballard Technology

Description:

The Avionics BusBox 2000 (AB2000) series of products are small, lightweight, conduction cooled, embedded computers for rugged environments. These off-the-shelf computers have many built-in standard peripherals and interfaces for various avionics databuses, as well as PMC expansion capability. With the addition of application software, the AB2000 provides a readily available Commercial Off-The-Shelf (COTS) solution to challenging interface, bridging and control problems. The AB2000 is available in many configurations to meet a variety of needs.


Typical applications for the AB2000 include data and protocol conversion, databus and network bridging, data servers, data recorders, communications, power controllers, federated controllers and multiple net-centric applications. The AB2000 delivers outstanding performance for applications on the ground and in the air. They are ideal for helicopter, fixed wing and ground mobile platforms.

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Features:

  • Versatile Computer System
  • PowerPC® Processor
  • Standard Computer I/O
  • Avionics Databuses
  • PMC Expansion Slot

Intel Core i7-620LE 2.0 GHz Fan-less Expandable Embedded Computer

ADLink MXC-6201D Intel Core i7-620LE 2.0 GHz Fan-less Expandable Embedded Computer with PCI/PCIe Slots

MPN:

MXC-6201D

Manufacturer L3 Communications

ADLINK

Description:

The Matrix MXC-6000 series of powerful fanless, expandable embedded computers feature the new Intel® Core i7 2.0 GHz processor for maximized computing. The MXC-6000 inherits its exceptional fanless and cablefree design from ADLINK's existing Matrix C series.

The MXC-6000 series Intel® Core i7 2.0 GHz processor and Intel® QM57 chipset deliver a level of performance ideal for image and vision measurement and automation applications. PCI and PCIe slots allow integration of off-the-shelf PCI/PCIe cards for development of configurable application platforms. 16 built-in isolated DIO channels enable standardized industrial control. A DVI-I connector output on the front panel allows direct connection to a LCD panel, and one eSATA port supports storage expansion or hot-swapping SATA drives.

Leveraging a reliable fanless and durable cable-free design, the MXC-6000 series exhibits excellent dependability in harsh environments, where severe temperature variation and vibration may exist. The MXC-6000 series provides an optional hot-pluggable fan module to dissipate heat generated within the system when high power consumption PCI/PCIe cards are installed. This inventive mechanical design retains a cable-free structure which dramatically improves thermal stability when PCI/PCIe cards are installed.

The MXC-6000 also provides an USB 2.0 port internally located on a riser card, enabling heightened reliability for secure applications, with license keys or password encryption on an internal USB dongle dramatically improve system security. Combining a reliable design with more computing power and innovative features, the Matrix MXC-6000 series is the optimal choice on which to base any rugged application system.

Combining a reliable design with more computing power and innovative features, the Matrix MXC-6000 series is the optimal choice on which to base any rugged application system.

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Features:

  • Intel® Core i7-620LE 2.0 GHz processor + Intel® QM57 chipset
  • Configurable, providing PCI and PCIe x4 slots
  • Rugged, -10°C to 60°C fan-less operation
  • Built-in 9 VDC to 32 VDC wide-range DC power input
  • VGA+DVI-D display by DVI-I connector
  • Dual 1000/100/10 Mbps Ethernet ports, 2 RS-232 ports and 2 software-selectable RS-232/422/485 ports
  • USB 2.0 port internally on riser card, built-in 16-CH isolated DI and 16-CH isolated DO
  • RAID 0, 1 function available through 2 internal SATA-connected HDD or one internal SATA-connected HDD and one external eSATA-connected HDD

Embedded Computer System with Core™ i7/i5 MI-220 Mini-ITX motherboard

ADLink MIX-220-I727M8G500-00 Embedded Computer System with Core i7/i5 MI-220 Mini-ITX motherboard

MPN:

MIX-220-I727M8G500-00

Manufacturer L3 Communications

ADLINK

Description:

The MIX-220 is an embedded computer system based on the MI-220 Mini-ITX form factor industrial motherboard supporting 32nm process quad/dual-core Intel® Core™ i7/i5/i3 and Celeron® processors, Intel® QM67 Express chipset and Dual Channel DDR3 1066/1333MHz (up to 8GB) in two SODIMM slots. Features include integrated Intel® HD Graphics (VGA, DVI-D, HDMI out- puts), dual Gigabit Ethernet, six USB 2.0 ports, four serial ports (1x RS-232/422/485, 3x RS-232), and an externally accessible anti-shock drive bay for two 2.5' SATA 6Gb/s drives. The MIX-220 provides a PCIe x16 slot and PCI slot with card holder for add-on cards up to 190mm in length, and a PCI Express Mini Card slot for SSD or Wi-Fi module. Active cooling is provided by dual 6cm fans with air filters that are easily accessible for cleaning or replacement, and wall mount brackets allow for flexible installation.

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Features:

  • Intel® Core™ i7/i5/i3 Processor
  • HDMI, DVI, VGA display output
  • 1x PCI Express x16 + 1x PCI slot via riser card
  • Two 2.5 inch SATA drive bays support RAID 0, 1
  • FlexATX power supply
  • Based on MK-122 chassis

Embedded Computer System with Core™ i7/i5 MI-220 Mini-ITX motherboard

ADLink MIX-220-I525M4G250-00 Embedded Computer System with Core i7/i5 MI-220 Mini-ITX motherboard

MPN:

MIX-220-I525M4G250-00

Manufacturer L3 Communications

ADLINK

Description:

The MIX-220 is an embedded computer system based on the MI-220 Mini-ITX form factor industrial motherboard supporting 32nm process quad/dual-core Intel® Core™ i7/i5/i3 and Celeron® processors, Intel® QM67 Express chipset and Dual Channel DDR3 1066/1333MHz (up to 8GB) in two SODIMM slots. Features include integrated Intel® HD Graphics (VGA, DVI-D, HDMI out- puts), dual Gigabit Ethernet, six USB 2.0 ports, four serial ports (1x RS-232/422/485, 3x RS-232), and an externally accessible anti-shock drive bay for two 2.5' SATA 6Gb/s drives. The MIX-220 provides a PCIe x16 slot and PCI slot with card holder for add-on cards up to 190mm in length, and a PCI Express Mini Card slot for SSD or Wi-Fi module. Active cooling is provided by dual 6cm fans with air filters that are easily accessible for cleaning or replacement, and wall mount brackets allow for flexible installation.

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Features:

  • Intel® Core™ i7/i5/i3 Processor
  • HDMI, DVI, VGA display output
  • 1x PCI Express x16 + 1x PCI slot via riser card
  • Two 2.5 inch SATA drive bays support RAID 0, 1
  • FlexATX power supply
  • Based on MK-122 chassis

Embedded Computer System with Core™ i7/i5 MI-220 Mini-ITX motherboard

ADLink MIX-220-I323M2G250-00 Embedded Computer System with Core i7/i5 MI-220 Mini-ITX motherboard

MPN:

MIX-220-I323M2G250-00

Manufacturer L3 Communications

ADLINK

Description:

The MIX-220 is an embedded computer system based on the MI-220 Mini-ITX form factor industrial motherboard supporting 32nm process quad/dual-core Intel® Core™ i7/i5/i3 and Celeron® processors, Intel® QM67 Express chipset and Dual Channel DDR3 1066/1333MHz (up to 8GB) in two SODIMM slots. Features include integrated Intel® HD Graphics (VGA, DVI-D, HDMI out- puts), dual Gigabit Ethernet, six USB 2.0 ports, four serial ports (1x RS-232/422/485, 3x RS-232), and an externally accessible anti-shock drive bay for two 2.5' SATA 6Gb/s drives. The MIX-220 provides a PCIe x16 slot and PCI slot with card holder for add-on cards up to 190mm in length, and a PCI Express Mini Card slot for SSD or Wi-Fi module. Active cooling is provided by dual 6cm fans with air filters that are easily accessible for cleaning or replacement, and wall mount brackets allow for flexible installation.

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Features:

  • Intel® Core™ i7/i5/i3 Processor
  • HDMI, DVI, VGA display output
  • 1x PCI Express x16 + 1x PCI slot via riser card
  • Two 2.5 inch SATA drive bays support RAID 0, 1
  • FlexATX power supply
  • Based on MK-122 chassis

Embedded Computer System with Core™ i7/i5 MI-220 Mini-ITX motherboard

ADLink MIX-220-B810M2G250-00 Embedded Computer System with Core i7/i5 MI-220 Mini-ITX motherboard

MPN:

MIX-220-B810M2G250-00

Manufacturer L3 Communications

ADLINK

Description:

The MIX-220 is an embedded computer system based on the MI-220 Mini-ITX form factor industrial motherboard supporting 32nm process quad/dual-core Intel® Core™ i7/i5/i3 and Celeron® processors, Intel® QM67 Express chipset and Dual Channel DDR3 1066/1333MHz (up to 8GB) in two SODIMM slots. Features include integrated Intel® HD Graphics (VGA, DVI-D, HDMI out- puts), dual Gigabit Ethernet, six USB 2.0 ports, four serial ports (1x RS-232/422/485, 3x RS-232), and an externally accessible anti-shock drive bay for two 2.5' SATA 6Gb/s drives. The MIX-220 provides a PCIe x16 slot and PCI slot with card holder for add-on cards up to 190mm in length, and a PCI Express Mini Card slot for SSD or Wi-Fi module. Active cooling is provided by dual 6cm fans with air filters that are easily accessible for cleaning or replacement, and wall mount brackets allow for flexible installation.

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Features:

  • Intel® Core™ i7/i5/i3 Processor
  • HDMI, DVI, VGA display output
  • 1x PCI Express x16 + 1x PCI slot via riser card
  • Two 2.5 inch SATA drive bays support RAID 0, 1
  • FlexATX power supply
  • Based on MK-122 chassis

Intel® Atom™ D2550/ N2600 Intelligent Health Care Platform with Rich I/O

ADLink TPZ-1301 Intel Atom D2550/ N2600 Intelligent Health Care Platform with Rich I/O

MPN:

TPZ-1301

Manufacturer L3 Communications

ADLINK

Description:

The Topaz TPZ-1300 is the first in ADLINK's new family of intelligent health care platforms. Based on the Intel® Atom™ D2550/N2600 processor, the TPZ-1300 provides excellent computing performance and outstanding power conservation. A fanless and cable-free structure ensures extended durability for long-term usage, providing a noiseless solution satisfying stringent medical application requirements. The TPZ-1300 significantly benefits system integrators with an innovative space-saving compact configuration and rich I/O design for maximum flexibility. An internal PCI Express Mini Card socket and USIM slot team to support a variety of extension functions, such as wireless connection (3G/WiFi/BT), video capture, Secure Access Modules (SAM), and many others.

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Features:

  • Energy-efficient platforms featuring Intel® Atom™ D2550/N2600 processors + NM10 chipsets
  • Fanless, cable-free design with extended MTBF and reliability
  • Medical safety IEC/EN-60601 certified
  • Compact size for ease of system installation and integration
  • Easy-to-clean housing
  • Built-in 6 VDC to 36 VDC wide-range DC inputs
  • Rich I/O: 2 RS-232/422/485 + 2 RS-232, 3 GbE ports, 6 USB 2.0, 4 Digital I/O, DVI+VGA.
  • Extended function support from mini PCIe slots with USIM.

Intel® Atom™ D2550/ N2600 Intelligent Health Care Platform with Rich I/O

ADLink TPZ-1302 Intel Atom D2550/ N2600 Intelligent Health Care Platform with Rich I/O

MPN:

TPZ-1302

Manufacturer L3 Communications

ADLINK

Description:

The Topaz TPZ-1300 is the first in ADLINK's new family of intelligent health care platforms. Based on the Intel® Atom™ D2550/N2600 processor, the TPZ-1300 provides excellent computing performance and outstanding power conservation. A fanless and cable-free structure ensures extended durability for long-term usage, providing a noiseless solution satisfying stringent medical application requirements. The TPZ-1300 significantly benefits system integrators with an innovative space-saving compact configuration and rich I/O design for maximum flexibility. An internal PCI Express Mini Card socket and USIM slot team to support a variety of extension functions, such as wireless connection (3G/WiFi/BT), video capture, Secure Access Modules (SAM), and many others.

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Features:

  • Energy-efficient platforms featuring Intel® Atom™ D2550/N2600 processors + NM10 chipsets
  • Fanless, cable-free design with extended MTBF and reliability
  • Medical safety IEC/EN-60601 certified
  • Compact size for ease of system installation and integration
  • Easy-to-clean housing
  • Built-in 6 VDC to 36 VDC wide-range DC inputs
  • Rich I/O: 2 RS-232/422/485 + 2 RS-232, 3 GbE ports, 6 USB 2.0, 4 Digital I/O, DVI+VGA.
  • Extended function support from mini PCIe slots with USIM.

Intel® Atom™ D2550/ N2600 Fanless Embedded Computer with Rich I/O

ADLink MXE-1301 Intel Atom D2550/ N2600 Fanless Embedded Computer with Rich I/O

MPN:

MXE-1301

Manufacturer L3 Communications

ADLINK

Description:

The Matrix MXE-1300 is the latest addition to ADLINK's Matrix line of embedded computers. Based on the Intel® Atom™ D2550/N2600 processor, the MXE-1300 provides excellent computing performance and outstanding power conservation. Three Intel® Gigabit Ethernet ports deliver abundant support for a variety of internet/ intranet applications, and four digital I/O ports maximize flexibility for inter-device communication. An internal PCI Express Mini Card socket and USIM slot support extension functions, such as wireless connection (3G/WiFi/BT/GPS), video capture, Secure Access Modules (SAM), and others. With its ruggedized architecture and rich I/O, the MXE-1300 is the best choice for industrial automation/ intelligent transportation systems, facility management, and applications demanding reliability in harsh environments. In addition, the MXE-1300 can meet the needs of digital surveillance with a supporting 3.5 inch HDD.

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Features:

  • Intel® Atom™ D2550/N2600 processor + NM10 chipset
  • 3.5 inch HDD support with internal SATA II interface (MXE-1311/MXE-1312)
  • 2 software-programmable RS-232/422/485 + 2 RS-232 ports
  • 3 1000/100/10 Mbps Ethernet ports, 6 USB 2.0 ports, 4 digital input and output
  • 1 external CF slot and 1 internal PCIe Mini Card socket with USIM slot
  • Built-in wide-range DC power input
  • - 6 VDC to 36 VDC for MXE-1301/MXE-1302
  • - 9 VDC to 36 VDC for MXE-1311/MXE-1312
  • Rugged, -20°C to 70°C fanless operation (w/ industrial SSD)

Intel® Atom™ D2550/ N2600 Fanless Embedded Computer with Rich I/O

ADLink MXE-1302 Intel Atom D2550/ N2600 Fanless Embedded Computer with Rich I/O

MPN:

MXE-1302

Manufacturer L3 Communications

ADLINK

Description:

The Matrix MXE-1300 is the latest addition to ADLINK's Matrix line of embedded computers. Based on the Intel® Atom™ D2550/N2600 processor, the MXE-1300 provides excellent computing performance and outstanding power conservation. Three Intel® Gigabit Ethernet ports deliver abundant support for a variety of internet/ intranet applications, and four digital I/O ports maximize flexibility for inter-device communication. An internal PCI Express Mini Card socket and USIM slot support extension functions, such as wireless connection (3G/WiFi/BT/GPS), video capture, Secure Access Modules (SAM), and others. With its ruggedized architecture and rich I/O, the MXE-1300 is the best choice for industrial automation/ intelligent transportation systems, facility management, and applications demanding reliability in harsh environments. In addition, the MXE-1300 can meet the needs of digital surveillance with a supporting 3.5 inch HDD.

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Features:

  • Intel® Atom™ D2550/N2600 processor + NM10 chipset
  • 3.5 inch HDD support with internal SATA II interface (MXE-1311/MXE-1312)
  • 2 software-programmable RS-232/422/485 + 2 RS-232 ports
  • 3 1000/100/10 Mbps Ethernet ports, 6 USB 2.0 ports, 4 digital input and output
  • 1 external CF slot and 1 internal PCIe Mini Card socket with USIM slot
  • Built-in wide-range DC power input
  • - 6 VDC to 36 VDC for MXE-1301/MXE-1302
  • - 9 VDC to 36 VDC for MXE-1311/MXE-1312
  • Rugged, -20°C to 70°C fanless operation (w/ industrial SSD)

Intel® Atom™ D2550/ N2600 Fanless Embedded Computer with Rich I/O

ADLink MXE-1311 Intel Atom D2550/ N2600 Fanless Embedded Computer with Rich I/O

MPN:

MXE-1311

Manufacturer L3 Communications

ADLINK

Description:

The Matrix MXE-1300 is the latest addition to ADLINK's Matrix line of embedded computers. Based on the Intel® Atom™ D2550/N2600 processor, the MXE-1300 provides excellent computing performance and outstanding power conservation. Three Intel® Gigabit Ethernet ports deliver abundant support for a variety of internet/ intranet applications, and four digital I/O ports maximize flexibility for inter-device communication. An internal PCI Express Mini Card socket and USIM slot support extension functions, such as wireless connection (3G/WiFi/BT/GPS), video capture, Secure Access Modules (SAM), and others. With its ruggedized architecture and rich I/O, the MXE-1300 is the best choice for industrial automation/ intelligent transportation systems, facility management, and applications demanding reliability in harsh environments. In addition, the MXE-1300 can meet the needs of digital surveillance with a supporting 3.5 inch HDD.

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Features:

  • Intel® Atom™ D2550/N2600 processor + NM10 chipset
  • 3.5 inch HDD support with internal SATA II interface (MXE-1311/MXE-1312)
  • 2 software-programmable RS-232/422/485 + 2 RS-232 ports
  • 3 1000/100/10 Mbps Ethernet ports, 6 USB 2.0 ports, 4 digital input and output
  • 1 external CF slot and 1 internal PCIe Mini Card socket with USIM slot
  • Built-in wide-range DC power input
  • - 6 VDC to 36 VDC for MXE-1301/MXE-1302
  • - 9 VDC to 36 VDC for MXE-1311/MXE-1312
  • Rugged, -20°C to 70°C fanless operation (w/ industrial SSD)

Intel® Atom™ D2550/ N2600 Fanless Embedded Computer with Rich I/O

ADLink MXE-1312 Intel Atom D2550/ N2600 Fanless Embedded Computer with Rich I/O

MPN:

MXE-1312

Manufacturer L3 Communications

ADLINK

Description:

The Matrix MXE-1300 is the latest addition to ADLINK's Matrix line of embedded computers. Based on the Intel® Atom™ D2550/N2600 processor, the MXE-1300 provides excellent computing performance and outstanding power conservation. Three Intel® Gigabit Ethernet ports deliver abundant support for a variety of internet/ intranet applications, and four digital I/O ports maximize flexibility for inter-device communication. An internal PCI Express Mini Card socket and USIM slot support extension functions, such as wireless connection (3G/WiFi/BT/GPS), video capture, Secure Access Modules (SAM), and others. With its ruggedized architecture and rich I/O, the MXE-1300 is the best choice for industrial automation/ intelligent transportation systems, facility management, and applications demanding reliability in harsh environments. In addition, the MXE-1300 can meet the needs of digital surveillance with a supporting 3.5 inch HDD.

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Features:

  • Intel® Atom™ D2550/N2600 processor + NM10 chipset
  • 3.5 inch HDD support with internal SATA II interface (MXE-1311/MXE-1312)
  • 2 software-programmable RS-232/422/485 + 2 RS-232 ports
  • 3 1000/100/10 Mbps Ethernet ports, 6 USB 2.0 ports, 4 digital input and output
  • 1 external CF slot and 1 internal PCIe Mini Card socket with USIM slot
  • Built-in wide-range DC power input
  • - 6 VDC to 36 VDC for MXE-1301/MXE-1302
  • - 9 VDC to 36 VDC for MXE-1311/MXE-1312
  • Rugged, -20°C to 70°C fanless operation (w/ industrial SSD)

3rd Generation Intel® Core™ i7/i5/i3 processor-based Fanless System

ADLink MXC-6301D High Performance 3rd Generation Intel Core i7/i5/i3 processor-based Fanless System with PCI/PCIe (Gen2) Slots

MPN:

MXC-6301D

Manufacturer L3 Communications

ADLINK

Description:

The Matrix MXC-6300 series is a high-performance fanless embedded computer integrating a 3rd generation Intel® Core™ i7/ i5/i3 processor and QM77 chipset to provide powerful computing and superior graphic performance. Graphic-intensive and computing-oriented applications including image and vision measurement, machine automation, maritime automation, surveillance and high-resolution medical imaging all benefit. Increased PCI & PCI express (Gen2) expansion slots allow installation of a variety of PCI, PCIex8 or PCIex16 add-on cards, meeting the needs of application platform development environments. In addition, the MXC-6300 series offers 2xDisplayPort and 1xDVI-I port for three independent display support connections, 4xUSB3.0 and 2xUSB2.0 ports, and 2 GbE LAN ports with teaming function. The two 2.5' onboard SATA III ports with high speed SATA 6 Gb/s and RAID 0, 1 ensure all data in the RAID array is fully backed up. Built-in 16CH isolated DIO provides overall industrial control. Delivering high quality, durable and compact construction, the MXC-6300 leverages a reliable fanless and cable-free configuration, optimal thermal dissipation, and easy installation for flexible and user-friendly system features development and application implementation in harsh environments.

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Features:

  • Supports 3rd generation Intel® Core™ i7/i5/i3 processor + QM77 chipset
  • 2 x DDR3 SO-DIMM socket, supporting up to 16GB memory
  • 2 PCIe x8 + one PCI slots or 1 PCIe x16 + 1 PCI expansion slots, supporting PCIe Gen2
  • 3 independent display capability with onboard 2 DisplayPort + 1 DVI-I
  • 6 external USB ports (4 USB 3.0 + 2 USB 2.0) + 1 internal USB 2.0
  • 2 Intel® GbE ports with teaming function, Intel® iAMT 8.0
  • 2 CFast sockets, onboard SATA III for 2x2.5 inch HDD/SSD installation, SATA 6Gb/s and RAID 0,1 support
  • Built-in 9 VDC to 32 VDC wide-range DC power input
  • Rugged, up to -20°C to 60°C (-4˚F to 140˚F) fanless operation (w/ industrial SSD)

3rd Generation Intel® Core™ i7/i5/i3 processor-based Fanless System

ADLink MXC-6302D High Performance 3rd Generation Intel Core i7/i5/i3 processor-based Fanless System with PCI/PCIe (Gen2) Slots

MPN:

MXC-6302D

Manufacturer L3 Communications

ADLINK

Description:

The Matrix MXC-6300 series is a high-performance fanless embedded computer integrating a 3rd generation Intel® Core™ i7/ i5/i3 processor and QM77 chipset to provide powerful computing and superior graphic performance. Graphic-intensive and computing-oriented applications including image and vision measurement, machine automation, maritime automation, surveillance and high-resolution medical imaging all benefit. Increased PCI & PCI express (Gen2) expansion slots allow installation of a variety of PCI, PCIex8 or PCIex16 add-on cards, meeting the needs of application platform development environments. In addition, the MXC-6300 series offers 2xDisplayPort and 1xDVI-I port for three independent display support connections, 4xUSB3.0 and 2xUSB2.0 ports, and 2 GbE LAN ports with teaming function. The two 2.5' onboard SATA III ports with high speed SATA 6 Gb/s and RAID 0, 1 ensure all data in the RAID array is fully backed up. Built-in 16CH isolated DIO provides overall industrial control. Delivering high quality, durable and compact construction, the MXC-6300 leverages a reliable fanless and cable-free configuration, optimal thermal dissipation, and easy installation for flexible and user-friendly system features development and application implementation in harsh environments.

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Features:

  • Supports 3rd generation Intel® Core™ i7/i5/i3 processor + QM77 chipset
  • 2 x DDR3 SO-DIMM socket, supporting up to 16GB memory
  • 2 PCIe x8 + one PCI slots or 1 PCIe x16 + 1 PCI expansion slots, supporting PCIe Gen2
  • 3 independent display capability with onboard 2 DisplayPort + 1 DVI-I
  • 6 external USB ports (4 USB 3.0 + 2 USB 2.0) + 1 internal USB 2.0
  • 2 Intel® GbE ports with teaming function, Intel® iAMT 8.0
  • 2 CFast sockets, onboard SATA III for 2x2.5 inch HDD/SSD installation, SATA 6Gb/s and RAID 0,1
  • support
  • Built-in 9 VDC to 32 VDC wide-range DC power input
  • Rugged, up to -20°C to 60°C (-4˚F to 140˚F) fanless operation (w/ industrial SSD)

3rd Generation Intel® Core™ i7/i5/i3 processor-based Fanless System

ADLink MXC-6303D High Performance 3rd Generation Intel Core i7/i5/i3 processor-based Fanless System with PCI/PCIe (Gen2) Slots

MPN:

MXC-6303D

Manufacturer L3 Communications

ADLINK

Description:

The Matrix MXC-6300 series is a high-performance fanless embedded computer integrating a 3rd generation Intel® Core™ i7/ i5/i3 processor and QM77 chipset to provide powerful computing and superior graphic performance. Graphic-intensive and computing-oriented applications including image and vision measurement, machine automation, maritime automation, surveillance and high-resolution medical imaging all benefit. Increased PCI & PCI express (Gen2) expansion slots allow installation of a variety of PCI, PCIex8 or PCIex16 add-on cards, meeting the needs of application platform development environments. In addition, the MXC-6300 series offers 2xDisplayPort and 1xDVI-I port for three independent display support connections, 4xUSB3.0 and 2xUSB2.0 ports, and 2 GbE LAN ports with teaming function. The two 2.5' onboard SATA III ports with high speed SATA 6 Gb/s and RAID 0, 1 ensure all data in the RAID array is fully backed up. Built-in 16CH isolated DIO provides overall industrial control. Delivering high quality, durable and compact construction, the MXC-6300 leverages a reliable fanless and cable-free configuration, optimal thermal dissipation, and easy installation for flexible and user-friendly system features development and application implementation in harsh environments.

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Features:

  • Supports 3rd generation Intel® Core™ i7/i5/i3 processor + QM77 chipset
  • 2 x DDR3 SO-DIMM socket, supporting up to 16GB memory
  • 2 PCIe x8 + one PCI slots or 1 PCIe x16 + 1 PCI expansion slots, supporting PCIe Gen2
  • 3 independent display capability with onboard 2 DisplayPort + 1 DVI-I
  • 6 external USB ports (4 USB 3.0 + 2 USB 2.0) + 1 internal USB 2.0
  • 2 Intel® GbE ports with teaming function, Intel® iAMT 8.0
  • 2 CFast sockets, onboard SATA III for 2x2.5 inch HDD/SSD installation, SATA 6Gb/s and
  • RAID 0,1 support
  • Built-in 9 VDC to 32 VDC wide-range DC power input
  • Rugged, up to -20°C to 60°C (-4˚F to 140˚F) fanless operation (w/ industrial SSD)

Intel® Atom™ Fan-less Configurable Controller with PCI/PCIe Slots

ADLink APC-P0003 Intel Atom Fan-less Configurable Controller with PCI/PCIe Slots

MPN:

APC-P0003

Manufacturer L3 Communications

ADLINK

Description:

PACwiz, ADLINK's solution for IEC 61131-3 application with motion control, enables you to access ADLINK products via PLC-like languages. The concept of PAC wiz is composed of two parts: PACwiz Platform and PACwiz IDE. You can develop IEC 61131-3 applications in PACwiz IDE just like you are developing applications with traditional PLCs. These applications are then downloaded to your PACwiz Platform.


PACwiz Platform is a PC-based well-integrated automation solution. Up to 2016 DI/Os and 64 servo axes, or 558 AI/O points and 64 servo axes can be controlled by a single platform. PACwiz Platform includes both the features of a PC, such as high-performance computing power, mass storage devices, and built-in network connectivity, and the features of a PLC, such as compact and robust design, real-time scan behavior and intuitive graphical programming. PACwiz Platform can connect to common LCD touch panels monitors for its display and operation interface, and thus no specialized industrial HMI is required. You can choose from developing your own control programs in an IDE supporting the Windows XP series of operating systems or editing the HMI screen in the PLC project before downloading to PACwiz Platform.


PACwiz PLC is composed of the CoDeSys SP RTE by 3S and a driver interface by ADLINK. This is the realtime and IEC 61131-3 engine of PACwiz Platform, and enables you to run IEC 61131-3 tasks with a cycle time less than 1 ms in the Windows XP series of operating systems. PACwiz PLC directly drives the corresponding hardware without using any Windows resources. Thus I/O lines and servo axes keep running normally even when Windows has crashed (i.e. the infamous 'Blue Screen of Death'). PACwiz PLC also provides the ability to automatically start up and run. In other words, it can be configured to automatically start up, load a default program, and run the loaded program after PACwiz Platform boots up.


PACwiz IDE is the CoDeSys IDE from 3S and a corresponding TSP from PACwiz Platform. CoDeSys IDE includes programming editors, a complier and several diagnostic and commissioning functions. The programming editor provides a friendly programming interface and features for each language used. Variables Auto Declare, Auto Format, Syntax Coloring and Input Assistance reduce possibility of typos and speed up application development. The excellent built-in compiler of CoDeSys IDE generates fast native code to run and support all IEC 61131-3 data types and non-standard types such as pointers to user-defined types, which offers large flexibility during programming. When it comes to debugging, CoDeSys IDE supports common features such as Forcing Variables, Breakpoints and Single Step. An Online Change feature also enables PACwiz PLC keeping running when downloading modified programs to avoid possible loss if the machine stops.

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Features:

  • Compatible with IEC 61131-3 syntax, including five commonly-used PLC syntaxes; PLC users can switch to a PC-based solution without further training
  • Built-in visualization editor allows use of standard VGA monitor instead of expensive specialized HMI devices
  • Built-in ADLINK motion function blocks
  • Real-time capability allows set up of tasks to within a 1 ms cycle time; no additional RTOS is required
  • Support of distributed I/O and motion modules allows for flexible wiring, easy expansion, and reducing wiring costs
  • Native CPU code and independent core from Windows faster performance than the competition; code will continue to execute even when Windows has crashed (blue screen of death)
  • Rugged fan-less and cable-less design; without moving parts and internal cables dramatically decrease product reliability and durability.

MXC-2002D/HDD 160G (Intel® Atom™ Fan-less Configurable Controller)

ADLink APC-P0003-1030

MPN:

APC-P0003-1030

Manufacturer L3 Communications

ADLINK

Description:

PACwiz, ADLINK's solution for IEC 61131-3 application with motion control, enables you to access ADLINK products via PLC-like languages. The concept of PAC wiz is composed of two parts: PACwiz Platform and PACwiz IDE. You can develop IEC 61131-3 applications in PACwiz IDE just like you are developing applications with traditional PLCs. These applications are then downloaded to your PACwiz Platform.


PACwiz Platform is a PC-based well-integrated automation solution. Up to 2016 DI/Os and 64 servo axes, or 558 AI/O points and 64 servo axes can be controlled by a single platform. PACwiz Platform includes both the features of a PC, such as high-performance computing power, mass storage devices, and built-in network connectivity, and the features of a PLC, such as compact and robust design, real-time scan behavior and intuitive graphical programming. PACwiz Platform can connect to common LCD touch panels monitors for its display and operation interface, and thus no specialized industrial HMI is required. You can choose from developing your own control programs in an IDE supporting the Windows XP series of operating systems or editing the HMI screen in the PLC project before downloading to PACwiz Platform.


PACwiz PLC is composed of the CoDeSys SP RTE by 3S and a driver interface by ADLINK. This is the realtime and IEC 61131-3 engine of PACwiz Platform, and enables you to run IEC 61131-3 tasks with a cycle time less than 1 ms in the Windows XP series of operating systems. PACwiz PLC directly drives the corresponding hardware without using any Windows resources. Thus I/O lines and servo axes keep running normally even when Windows has crashed (i.e. the infamous 'Blue Screen of Death'). PACwiz PLC also provides the ability to automatically start up and run. In other words, it can be configured to automatically start up, load a default program, and run the loaded program after PACwiz Platform boots up.


PACwiz IDE is the CoDeSys IDE from 3S and a corresponding TSP from PACwiz Platform. CoDeSys IDE includes programming editors, a complier and several diagnostic and commissioning functions. The programming editor provides a friendly programming interface and features for each language used. Variables Auto Declare, Auto Format, Syntax Coloring and Input Assistance reduce possibility of typos and speed up application development. The excellent built-in compiler of CoDeSys IDE generates fast native code to run and support all IEC 61131-3 data types and non-standard types such as pointers to user-defined types, which offers large flexibility during programming. When it comes to debugging, CoDeSys IDE supports common features such as Forcing Variables, Breakpoints and Single Step. An Online Change feature also enables PACwiz PLC keeping running when downloading modified programs to avoid possible loss if the machine stops.

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Features:

  • Compatible with IEC 61131-3 syntax, including five commonly-used PLC syntaxes; PLC users can switch to a PC-based solution without further training
  • Built-in visualization editor allows use of standard VGA monitor instead of expensive specialized HMI devices
  • Built-in ADLINK motion function blocks
  • Real-time capability allows set up of tasks to within a 1 ms cycle time; no additional RTOS is required
  • Support of distributed I/O and motion modules allows for flexible wiring, easy expansion, and reducing wiring costs
  • Native CPU code and independent core from Windows faster performance than the competition; code will continue to execute even when Windows has crashed (blue screen of death)
  • Rugged fan-less and cable-less design; without moving parts and internal cables dramatically decrease product reliability and durability.

MXC-2002/M2G/HDD 160G (Intel® Atom™ Fan-less Configurable Controller)

ADLink APC-P0003-1040

MPN:

APC-P0003-1040

Manufacturer L3 Communications

ADLINK

Description:

PACwiz, ADLINK's solution for IEC 61131-3 application with motion control, enables you to access ADLINK products via PLC-like languages. The concept of PAC wiz is composed of two parts: PACwiz Platform and PACwiz IDE. You can develop IEC 61131-3 applications in PACwiz IDE just like you are developing applications with traditional PLCs. These applications are then downloaded to your PACwiz Platform.


PACwiz Platform is a PC-based well-integrated automation solution. Up to 2016 DI/Os and 64 servo axes, or 558 AI/O points and 64 servo axes can be controlled by a single platform. PACwiz Platform includes both the features of a PC, such as high-performance computing power, mass storage devices, and built-in network connectivity, and the features of a PLC, such as compact and robust design, real-time scan behavior and intuitive graphical programming. PACwiz Platform can connect to common LCD touch panels monitors for its display and operation interface, and thus no specialized industrial HMI is required. You can choose from developing your own control programs in an IDE supporting the Windows XP series of operating systems or editing the HMI screen in the PLC project before downloading to PACwiz Platform.


PACwiz PLC is composed of the CoDeSys SP RTE by 3S and a driver interface by ADLINK. This is the realtime and IEC 61131-3 engine of PACwiz Platform, and enables you to run IEC 61131-3 tasks with a cycle time less than 1 ms in the Windows XP series of operating systems. PACwiz PLC directly drives the corresponding hardware without using any Windows resources. Thus I/O lines and servo axes keep running normally even when Windows has crashed (i.e. the infamous 'Blue Screen of Death'). PACwiz PLC also provides the ability to automatically start up and run. In other words, it can be configured to automatically start up, load a default program, and run the loaded program after PACwiz Platform boots up.


PACwiz IDE is the CoDeSys IDE from 3S and a corresponding TSP from PACwiz Platform. CoDeSys IDE includes programming editors, a complier and several diagnostic and commissioning functions. The programming editor provides a friendly programming interface and features for each language used. Variables Auto Declare, Auto Format, Syntax Coloring and Input Assistance reduce possibility of typos and speed up application development. The excellent built-in compiler of CoDeSys IDE generates fast native code to run and support all IEC 61131-3 data types and non-standard types such as pointers to user-defined types, which offers large flexibility during programming. When it comes to debugging, CoDeSys IDE supports common features such as Forcing Variables, Breakpoints and Single Step. An Online Change feature also enables PACwiz PLC keeping running when downloading modified programs to avoid possible loss if the machine stops.

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Features:

  • Compatible with IEC 61131-3 syntax, including five commonly-used PLC syntaxes; PLC users can switch to a PC-based solution without further training
  • Built-in visualization editor allows use of standard VGA monitor instead of expensive specialized HMI devices
  • Built-in ADLINK motion function blocks
  • Real-time capability allows set up of tasks to within a 1 ms cycle time; no additional RTOS is required
  • Support of distributed I/O and motion modules allows for flexible wiring, easy expansion, and reducing wiring costs
  • Native CPU code and independent core from Windows faster performance than the competition; code will continue to execute even when Windows has crashed (blue screen of death)
  • Rugged fan-less and cable-less design; without moving parts and internal cables dramatically decrease product reliability and durability.

Intel® Core i7-620LE 2.0 GHz Fan-less Expandable Embedded Computer

ADLink MXC-6101D Intel Core i7-620LE 2.0 GHz Fan-less Expandable Embedded Computer with PCI Slots

MPN:

MXC-6101D

Manufacturer L3 Communications

ADLINK

Description:

The Matrix MXC-6000 series of powerful fanless, expandable embedded computers feature the new Intel® Core i7 2.0 GHz processor for maximized computing. The MXC-6000 inherits its exceptional fanless and cablefree design from ADLINK's existing Matrix C series.


The MXC-6000 series Intel® Core i7 2.0 GHz processor and Intel® QM57 chipset deliver a level of performance ideal for image and vision measurement and automation applications. PCI and PCIe slots allow integration of off-the-shelf PCI/PCIe cards for development of configurable application platforms. 16 built-in isolated DIO channels enable standardized industrial control. A DVI-I connector output on the front panel allows direct connection to a LCD panel, and one eSATA port supports storage expansion or hot-swapping SATA drives.


Leveraging a reliable fanless and durable cable-free design, the MXC-6000 series exhibits excellent dependability in harsh environments, where severe temperature variation and vibration may exist. The MXC-6000 series provides an optional hot-pluggable fan module to dissipate heat generated within the system when high power consumption PCI/PCIe cards are installed. This inventive mechanical design retains a cable-free structure which dramatically improves thermal stability when PCI/PCIe cards are installed.


The MXC-6000 also provides an USB 2.0 port internally located on a riser card, enabling heightened reliability for secure applications, with license keys or password encryption on an internal USB dongle dramatically improve system security. Combining a reliable design with more computing power and innovative features, the Matrix MXC-6000 series is the optimal choice on which to base any rugged application system.


Combining a reliable design with more computing power and innovative features, the Matrix MXC-6000 series is the optimal choice on which to base any rugged application system.

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Features:

  • Intel® Core i7-620LE 2.0 GHz processor + Intel® QM57 chipset
  • Configurable, providing PCI and PCIe x4 slots
  • Rugged, -10°C to 60°C fan-less operation
  • Built-in 9 VDC to 32 VDC wide-range DC power input
  • VGA+DVI-D display by DVI-I connector
  • Dual 1000/100/10 Mbps Ethernet ports, 2 RS-232 ports and 2 software-selectable RS-232/422/485 ports
  • USB 2.0 port internally on riser card, built-in 16-CH isolated DI and 16-CH isolated DO
  • RAID 0, 1 function available through 2 internal SATA-connected HDD or one internal SATA-connected HDD and one external eSATA-connected HDD

Automation Controller with Four COM Ports (Intel Atom N270 1.6 GHz CPU)

ADLink DPAC-1000 Distributed Programmable Automation Controller with Four COM Ports (Intel Atom N270 1.6 GHz CPU)

MPN:

DPAC-1000

Manufacturer L3 Communications

ADLINK

Description:

The ADLINK DPAC-1000 series of embedded PC's combines the embedded PC technology and distributed I/O modules to form a compact, vertically mountable, highly-extendable, and fast time-to market Programmable Automation Controller (PAC) solution. The DPAC-1000 enables direct connection of serial communication devices. In addition, DPAC systems have passed safety regulations such as UL and TUV certification.

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Features:

  • CPU: Intel® Atom™ N270, FSB 533, 1.6 GHz
  • On-board Memory: 1 GB DDR2 SDRAM Compact & Fan-less design
  • Equipped with 4 serial communication ports; 3 of them are selectable for RS-232/422/485 (auto flow control)
  • Designed to integrate ADLINK NuDAM to form a remote data acquisition controller
  • Windows® XP Embedded (default: English Version)
  • Smart UI with Programmable Buttons and Digital Display
  • High Tolerant Vibration and Shock Capability

Automation Controller with Four COM Ports (Intel Atom N270 1.6 GHz CPU)

ADLink DPAC-1000-1N Distributed Programmable Automation Controller with Four COM Ports (Intel Atom N270 1.6 GHz CPU)

MPN:

DPAC-1000-1N

Manufacturer L3 Communications

ADLINK

Description:

The ADLINK DPAC-1000 series of embedded PC's combines the embedded PC technology and distributed I/O modules to form a compact, vertically mountable, highly-extendable, and fast time-to market Programmable Automation Controller (PAC) solution. The DPAC-1000 enables direct connection of serial communication devices. In addition, DPAC systems have passed safety regulations such as UL and TUV certification.

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Features:

  • CPU: Intel® Atom™ N270, FSB 533, 1.6 GHz
  • On-board Memory: 1 GB DDR2 SDRAM Compact & Fan-less design
  • Equipped with 4 serial communication ports; 3 of them are selectable for RS-232/422/485 (auto flow control)
  • Designed to integrate ADLINK NuDAM to form a remote data acquisition controller
  • Windows® XP Embedded (default: English Version)
  • Smart UI with Programmable Buttons and Digital Display
  • High Tolerant Vibration and Shock Capability

Automation Controller with Four COM Ports (Intel Atom N270 1.6 GHz CPU)

ADLink DPAC-1000-11 Distributed Programmable Automation Controller with Four COM Ports (Intel Atom N270 1.6 GHz CPU)

MPN:

DPAC-1000-11

Manufacturer L3 Communications

ADLINK

Description:

The ADLINK DPAC-1000 series of embedded PC's combines the embedded PC technology and distributed I/O modules to form a compact, vertically mountable, highly-extendable, and fast time-to market Programmable Automation Controller (PAC) solution. The DPAC-1000 enables direct connection of serial communication devices. In addition, DPAC systems have passed safety regulations such as UL and TUV certification.

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Features:

  • CPU: Intel® Atom™ N270, FSB 533, 1.6 GHz
  • On-board Memory: 1 GB DDR2 SDRAM Compact & Fan-less design
  • Equipped with 4 serial communication ports; 3 of them are selectable for RS-232/422/485 (auto flow control)
  • Designed to integrate ADLINK NuDAM to form a remote data acquisition controller
  • Windows® XP Embedded (default: English Version)
  • Smart UI with Programmable Buttons and Digital Display
  • High Tolerant Vibration and Shock Capability

Extreme Rugged™ Intel® Core™2 Duo COTS Military Computer

ADLink MIL840 Extreme Rugged Intel Core2 Duo COTS Military Computer

MPN:

MIL840

Manufacturer L3 Communications

ADLINK

Description:

MilSystem mission computers are high-performance systems designed for tight integration into military vehicle and other platforms. MIL-STD-D38999 connectors, rugged-by-design internal components, and completely passive cooling maximize reliability for operations in harsh conditions. MilSystems provide shock and vibration immunity exceeding MIL-STD-810F standards, and operate at full CPU speed over a wide temperature range of -40 to +75°C

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Features:

  • Passive convection-cooled chassis
  • Intel® Core™2 Duo processor
  • Uniquely-keyed D38999 connectors
  • Tested to MIL-STD-810G standards
  • Internal expansion for Mini PCI and PCIe Mini Card
  • Wide range input: 12 to 32 VDC
  • Windows® XP Professional or Ubuntu Linux® Preinstalled
  • Windows® CE, QNX®, and VxWorks® supported

Wall mount Chassis for ATX Industrial Motherboard

ADLink NS-608MB-350 Wall mount Chassis for ATX Industrial Motherboard

MPN:

NS-608MB-350

Manufacturer L3 Communications

ADLINK

Description:

The NS-608MB-350 from ADLink is a Wall mount Chassis for ATX Industrial Motherboard

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Features:

  • Supports Mini-ITX, microATX, FlexATX, ATX industrial motherboards
  • One 5.25 inch, two 3.5 inch external drive bays and three internal 3.5 inch drive bays
  • Drive bay with shock and vibration resistant design
  • Two USB and one PS/2 keyboard connectors on front panel
  • 12cm cooling fan (85 CFM)
  • PS2 ATX power supply

ReadySystem 1U, ReadyBoard 850, T3100 1.9GHz CPU, 4GB RAM, 160GB HDD

ADLink RB1-S85A-R-T31M4G160-00

MPN:

RB1-S85A-R-T31M4G160-00

Manufacturer L3 Communications

ADLINK

Description:

Core™2 Duo EPIC Single Board Computer with SUMIT™ Expansion and GM45/ICH9-M Chipset

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Features:

  • Intel® Core™2 Duo Processor
  • Intel® GM45 Express Chipset
  • Dual Channel DDR3 SODIMM up to 4GB
  • Dual Gigabit Ethernet
  • PCI-104 and SUMIT expansion
  • Single/Dual Channel 18/24-bit LVDS and Analogue VGA

ReadySystem 1U, ReadyBoard 850, T3100 1.9GHz CPU, 4GB RAM, 160GB HDD

ADLink RB1-S85A-R-T31M4G160-01

MPN:

RB1-S85A-R-T31M4G160-01

Manufacturer L3 Communications

ADLINK

Description:

Core™2 Duo EPIC Single Board Computer with SUMIT™ Expansion and GM45/ICH9-M Chipset

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Features:

  • Intel® Core™2 Duo Processor
  • Intel® GM45 Express Chipset
  • Dual Channel DDR3 SODIMM up to 4GB
  • Dual Gigabit Ethernet
  • PCI-104 and SUMIT expansion
  • Single/Dual Channel 18/24-bit LVDS and Analogue VGA

MilSystem Starter Kit - MC1, MC2, MC3 Breakout Cables, AC Adapter

Image Not Available

MPN:

MIL-ACC-US

Manufacturer L3 Communications

ADLINK

Description:

Starter kit for MilSystem mission computers.

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RuffSystem™ Starter Kit - AC Adapter, Software, and Documentation

Image Not Available

MPN:

RUF-ACC-US

Manufacturer L3 Communications

ADLINK

Description:

RuffSystem™ Starter Kit - AC Adapter, Software, and Documentation.

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NITX-315 with Wind River and Meego Bootable USB Sticks and Power Adaptor

Image Not Available

MPN:

NITX-315-DEVKIT

Manufacturer L3 Communications

Artesyn Embedded Technologies

Description:

The Wind River On-Board Embedded Development Kit for the NITX-300 Seed Board is ideally suited for developers that wish to develop graphics applications, as well as for those developers that wish to run multiple applications using the on-board hypervisor technology. The 30-day evaluation software includes Wind River Hypervisor with VxWorks and Wind River Linux as Guest OS. Wind River Linux is pre-integrated with the Intel® Embedded Media and Graphics Driver.


The LiveUSB stick that accompanies the kit is pre-installed with both the Wind River Workbench IDE for embedded development and the Tilcon GUI tools for graphics development.


By working closely together, Artesyn Embedded Technologies and Wind River are making development access easier, faster and more affordable than ever by putting all the tools in one box for customer evaluation.

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Features:

  • Nano-ITX Motherboard
  • Power supply
  • Drivers CD
  • SATA power cable
  • Wind River On-Board Embedded Development Kit including:
  • One (1) Getting Started with Wind River guide
  • One (1) 16GB LiveUSB stick containing Workbench 3.2.3, Hypervisor 1.2, WR Linux 4.0, VxWorks 6.8.2 and Tilcon 5.8.1
  • One (1) 4GB microSD pre-loaded with Wind River Hypervisor 1.2 running VxWorks 6.8.2 and Wind River Linux 4 as Guest OS

40 W Industrial-Grade AC-DC Adapter (-20 to 70°C)

Image Not Available

MPN:

40W AC Adapter

Manufacturer L3 Communications

ADLINK

Description:

ADLink 40 W Industrial-Grade AC-DC Adapter (-20 to 70°C)

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63 W Industrial-Grade AC-DC Adapter (-20 to 70°C)

Image Not Available

MPN:

60W AC Adapter

Manufacturer L3 Communications

ADLINK

Description:

ADLink 63 W Industrial-Grade AC-DC Adapter (-20 to 70°C)

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Avionics BusBox Lightweight Embedded Computer

Ballard-AB1000

MPN:

AB1000

Manufacturer L3 Communications

Astronics Ballard Technology

Description:

Astronics Ballard Technology's Avionics BusBox is a small lightweight embedded computer with built-in interfaces for standard peripherals and for various avionics databuses. Under the direction of its application specific software, the Avionics BusBox can autonomously perform tasks that involve receiving information from some interfaces and processing and mapping the information into other interfaces.

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Features:

  • PowerPC 405GPr processor (266 MHz)
  • 64 MB SDRAM
  • 16 MB Flash
  • Real Time Clock (with 650+ hours of backup)
  • CompactFlash slot (with power fail protection)
  • High resolution timer for time-tagging events (1us)
  • Embedded Linux Operating System

1U Computer System with Core™2 Duo EPIC ReadyBoard™850 SBC

ADLink RB1-S85A 1U Computer System with Core2 Duo EPIC ReadyBoard850 SBC

MPN:

RB1-S85A

Manufacturer L3 Communications

ADLINK

Description:

Core™2 Duo EPIC Single Board Computer with SUMIT™ Expansion and GM45/ICH9-M Chipset

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Features:

  • Intel® Core™2 Duo Processor
  • Intel® GM45 Express Chipset
  • Dual Channel DDR3 SODIMM up to 4GB
  • Dual Gigabit Ethernet
  • PCI-104 and SUMIT expansion
  • Single/Dual Channel 18/24-bit LVDS and Analogue VGA

ReadySystem 1U, ReadyBoard 850, P8400 2.26GHz CPU, 4GB RAM, 160GB HDD

ADLink RB1-S85A-R-P84M4G160-0

MPN:

RB1-S85A-R-P84M4G160-0

Manufacturer L3 Communications

ADLINK

Description:

Core™2 Duo EPIC Single Board Computer with SUMIT™ Expansion and GM45/ICH9-M Chipset

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Features:

  • Intel® Core™2 Duo Processor
  • Intel® GM45 Express Chipset
  • Dual Channel DDR3 SODIMM up to 4GB
  • Dual Gigabit Ethernet
  • PCI-104 and SUMIT expansion
  • Single/Dual Channel 18/24-bit LVDS and Analogue VGA

ReadySystem 1U, ReadyBoard 850, P8400 2.26GHz CPU, 4GB RAM, 160GB HDD

ADLink RB1-S85A-R-P84M4G160-01

MPN:

RB1-S85A-R-P84M4G160-01

Manufacturer L3 Communications

ADLINK

Description:

Core™2 Duo EPIC Single Board Computer with SUMIT™ Expansion and GM45/ICH9-M Chipset

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Features:

  • Intel® Core™2 Duo Processor
  • Intel® GM45 Express Chipset
  • Dual Channel DDR3 SODIMM up to 4GB
  • Dual Gigabit Ethernet
  • PCI-104 and SUMIT expansion
  • Single/Dual Channel 18/24-bit LVDS and Analogue VGA

9-Port Ethernet Switch with Gigabit Switch/Uplink Port

Ballard AB2-ES 9-Port Ethernet Switch with Gigabit Switch/Uplink Port

MPN:

AB2-ES

Manufacturer L3 Communications

Astronics Ballard Technology

Description:

The AB2-ES is a full-featured managed or unmanaged Ethernet switch box suitable for networking applications in both conduction and convection cooled systems. The 9-port switch includes eight (8) 10/100 Mbps switch ports and one 10/100/1000 Mbps switch/uplink port, all accessible through MIL-SPEC connectors on the front of the unit. The switch box is suitable for fixed wing, helicopter and ground mobile applications.

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Features:

  • Managed or unmanaged operation
  • Gigabit host port
  • Conduction or convection cooled
  • Built-In Test (BIT)
  • Designed for rugged use
  • Compact size

Single-wide ARCX box, ARCX 4000 series, i7 processor, one PMC/XMC site

ARCX-4110-00

MPN:

ARCX-4110-00

Manufacturer L3 Communications

Acromag

Description:

Intel® Core™ i7 or i5 CPU

The ARCX mission computer is a customizable-off-the-shelf, SWaP-optimized deployable solution. This rugged, small form factor box is manufactured to IP67 standards for a dependable, sealed system with a cableless and fanless design. Employing Intel Core i7 or i5, the newest generation of multi-core Intel processors delivers significant performance advancements.

Thick circuit boards and advanced thermal management allow the computer to operate reliably under hostile conditions. This rugged computer can withstand extreme shock and vibration tested to MIL-STD-810 specifications. Typical applications include military/aerospace deployable systems such as: vetronics, C4ISR, payload management, as well as command and control for drones and robotics.

Features:

  • Rugged, embedded computer with 4th generation Intel Core i7/i5 processing
  • Single or double PMC/XMC expansion site versions
  • Sealed to IP67 standards against dirt and water
  • Shock/vibration tested to MIL-STD-810G specifications
  • Customizable expansion and optional power filter
  • MIL-DTL-38999 high-density connector front panel

Single-wide ARCX box, ARCX 4000 series, i7 processor, one PMC/XMC site, plus power filter option

ARCX-4110-PF

MPN:

ARCX-4110-PF

Manufacturer L3 Communications

Acromag

Description:

Intel® Core™ i7 or i5 CPU

The ARCX mission computer is a customizable-off-the-shelf, SWaP-optimized deployable solution. This rugged, small form factor box is manufactured to IP67 standards for a dependable, sealed system with a cableless and fanless design. Employing Intel Core i7 or i5, the newest generation of multi-core Intel processors delivers significant performance advancements.

Thick circuit boards and advanced thermal management allow the computer to operate reliably under hostile conditions. This rugged computer can withstand extreme shock and vibration tested to MIL-STD-810 specifications. Typical applications include military/aerospace deployable systems such as: vetronics, C4ISR, payload management, as well as command and control for drones and robotics.

Features:

  • Rugged, embedded computer with 4th generation Intel Core i7/i5 processing
  • Single or double PMC/XMC expansion site versions
  • Sealed to IP67 standards against dirt and water
  • Shock/vibration tested to MIL-STD-810G specifications
  • Customizable expansion and optional power filter
  • MIL-DTL-38999 high-density connector front panel

Double-wide ARCX box, ARCX 4000 series, i7 processor, dual PMC/XMC sites

ARCX-4120-00

MPN:

ARCX-4120-00

Manufacturer L3 Communications

Acromag

Description:

Intel® Core™ i7 or i5 CPU

The ARCX mission computer is a customizable-off-the-shelf, SWaP-optimized deployable solution. This rugged, small form factor box is manufactured to IP67 standards for a dependable, sealed system with a cableless and fanless design. Employing Intel Core i7 or i5, the newest generation of multi-core Intel processors delivers significant performance advancements.

Thick circuit boards and advanced thermal management allow the computer to operate reliably under hostile conditions. This rugged computer can withstand extreme shock and vibration tested to MIL-STD-810 specifications. Typical applications include military/aerospace deployable systems such as: vetronics, C4ISR, payload management, as well as command and control for drones and robotics.

Features:

  • Rugged, embedded computer with 4th generation Intel Core i7/i5 processing
  • Single or double PMC/XMC expansion site versions
  • Sealed to IP67 standards against dirt and water
  • Shock/vibration tested to MIL-STD-810G specifications
  • Customizable expansion and optional power filter
  • MIL-DTL-38999 high-density connector front panel

Double-wide ARCX box, ARCX 4000 series, i7 processor, dual PMC/XMC sites, plus power filter option

ARCX-4120-PF

MPN:

ARCX-4120-PF

Manufacturer L3 Communications

Acromag

Description:

Intel® Core™ i7 or i5 CPU

The ARCX mission computer is a customizable-off-the-shelf, SWaP-optimized deployable solution. This rugged, small form factor box is manufactured to IP67 standards for a dependable, sealed system with a cableless and fanless design. Employing Intel Core i7 or i5, the newest generation of multi-core Intel processors delivers significant performance advancements.

Thick circuit boards and advanced thermal management allow the computer to operate reliably under hostile conditions. This rugged computer can withstand extreme shock and vibration tested to MIL-STD-810 specifications. Typical applications include military/aerospace deployable systems such as: vetronics, C4ISR, payload management, as well as command and control for drones and robotics.

Features:

  • Rugged, embedded computer with 4th generation Intel Core i7/i5 processing
  • Single or double PMC/XMC expansion site versions
  • Sealed to IP67 standards against dirt and water
  • Shock/vibration tested to MIL-STD-810G specifications
  • Customizable expansion and optional power filter
  • MIL-DTL-38999 high-density connector front panel

Single-wide ARCX box, ARCX 4000 series, i5 processor, one PMC/XMC site

ARCX-4310-00

MPN:

ARCX-4310-00

Manufacturer L3 Communications

Acromag

Description:

Intel® Core™ i7 or i5 CPU

The ARCX mission computer is a customizable-off-the-shelf, SWaP-optimized deployable solution. This rugged, small form factor box is manufactured to IP67 standards for a dependable, sealed system with a cableless and fanless design. Employing Intel Core i7 or i5, the newest generation of multi-core Intel processors delivers significant performance advancements.

Thick circuit boards and advanced thermal management allow the computer to operate reliably under hostile conditions. This rugged computer can withstand extreme shock and vibration tested to MIL-STD-810 specifications. Typical applications include military/aerospace deployable systems such as: vetronics, C4ISR, payload management, as well as command and control for drones and robotics.

Features:

  • Rugged, embedded computer with 4th generation Intel Core i7/i5 processing
  • Single or double PMC/XMC expansion site versions
  • Sealed to IP67 standards against dirt and water
  • Shock/vibration tested to MIL-STD-810G specifications
  • Customizable expansion and optional power filter
  • MIL-DTL-38999 high-density connector front panel

Single-wide ARCX box, ARCX 4000 series, i5 processor, one PMC/XMC site, plus power filter option

ARCX-4310-PF

MPN:

ARCX-4310-PF

Manufacturer L3 Communications

Acromag

Description:

Intel® Core™ i7 or i5 CPU

The ARCX mission computer is a customizable-off-the-shelf, SWaP-optimized deployable solution. This rugged, small form factor box is manufactured to IP67 standards for a dependable, sealed system with a cableless and fanless design. Employing Intel Core i7 or i5, the newest generation of multi-core Intel processors delivers significant performance advancements.

Thick circuit boards and advanced thermal management allow the computer to operate reliably under hostile conditions. This rugged computer can withstand extreme shock and vibration tested to MIL-STD-810 specifications. Typical applications include military/aerospace deployable systems such as: vetronics, C4ISR, payload management, as well as command and control for drones and robotics.

Features:

  • Rugged, embedded computer with 4th generation Intel Core i7/i5 processing
  • Single or double PMC/XMC expansion site versions
  • Sealed to IP67 standards against dirt and water
  • Shock/vibration tested to MIL-STD-810G specifications
  • Customizable expansion and optional power filter
  • MIL-DTL-38999 high-density connector front panel

Double-wide ARCX box, ARCX 4000 series, i5 processor, dual PMC/XMC sites

ARCX-4320-00

MPN:

ARCX-4320-00

Manufacturer L3 Communications

Acromag

Description:

Intel® Core™ i7 or i5 CPU

The ARCX mission computer is a customizable-off-the-shelf, SWaP-optimized deployable solution. This rugged, small form factor box is manufactured to IP67 standards for a dependable, sealed system with a cableless and fanless design. Employing Intel Core i7 or i5, the newest generation of multi-core Intel processors delivers significant performance advancements.

Thick circuit boards and advanced thermal management allow the computer to operate reliably under hostile conditions. This rugged computer can withstand extreme shock and vibration tested to MIL-STD-810 specifications. Typical applications include military/aerospace deployable systems such as: vetronics, C4ISR, payload management, as well as command and control for drones and robotics.

Features:

  • Rugged, embedded computer with 4th generation Intel Core i7/i5 processing
  • Single or double PMC/XMC expansion site versions
  • Sealed to IP67 standards against dirt and water
  • Shock/vibration tested to MIL-STD-810G specifications
  • Customizable expansion and optional power filter
  • MIL-DTL-38999 high-density connector front panel

Double-wide ARCX box, ARCX 4000 series, i5 processor, dual PMC/XMC sites, plus power filter option

ARCX-4320-PF

MPN:

ARCX-4320-PF

Manufacturer L3 Communications

Acromag

Description:

Intel® Core™ i7 or i5 CPU

The ARCX mission computer is a customizable-off-the-shelf, SWaP-optimized deployable solution. This rugged, small form factor box is manufactured to IP67 standards for a dependable, sealed system with a cableless and fanless design. Employing Intel Core i7 or i5, the newest generation of multi-core Intel processors delivers significant performance advancements.

Thick circuit boards and advanced thermal management allow the computer to operate reliably under hostile conditions. This rugged computer can withstand extreme shock and vibration tested to MIL-STD-810 specifications. Typical applications include military/aerospace deployable systems such as: vetronics, C4ISR, payload management, as well as command and control for drones and robotics.

Features:

  • Rugged, embedded computer with 4th generation Intel Core i7/i5 processing
  • Single or double PMC/XMC expansion site versions
  • Sealed to IP67 standards against dirt and water
  • Shock/vibration tested to MIL-STD-810G specifications
  • Customizable expansion and optional power filter
  • MIL-DTL-38999 high-density connector front panel

PowerNet™ ATDS Bridge System (RM)

Sabtech PX-R1000-01-BRG PowerNet ATDS Bridge System (RM)

MPN:

PX-R1000-01-BRG

Manufacturer L3 Communications

IXI Technology

Description:

The PowerNet™ ATDS Bridge System Connects Airborne Tactical Data System (ATDS) equipment via Ethernet. ATDS is a serial communication link conforming to MIL-STD-188-203-1A (Appendix D2). ATDS is used in equipment that supports Tactical Digital information Link-A (TADIL-A) or its NATO designation Link-11. The PowerNet™ Bridge provides a transparent hardware and protocol conversion that allows Data Terminal Set (DTS), Tactical Data System (TDS) and cryptographic equipment to communicate over a network without modification to either end. Moving the ATDS link to a network architecture eliminates cable length limitations and allows for implementation of redundant paths through the network fabric, greatly improving the survivability of the interface. With the PowerNet™ Bridge System it’s now possible for ATDS equipment to connect virtually anywhere within the reach of a network connection.

PowerNet™ Bridge System Architecture

The PowerNet™ Bridge System consists of two PowerNet™ servers one connected to the legacy ATDS device at each end of the interface. The servers connect together over a dedicated or shared Ethernet network. In operation, the servers convert the ATDS channel protocol into Ethernet packets that are transmitted and converted back to ATDS at the distant end. The PowerNet™ server is typically mounted near the legacy equipment to make the ATDS cable Run as short as possible.

Channel Protocol

Each PowerNet™ servers run as firmware protocol module that communicates with the legacy device on its end. At power up the server initiates the protocol program with no user intervention providing automatic, transparent “pass-through” operation of the legacy channel.

Designed for survival

The PowerNet™ Bridge system is designed with dual Ethernet ports to significantly increase reliability. When configured to operate in dual port mode, if one interface goes down, operation continues without delay or interruption on the surviving path.

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Features:

  • 19” Rackmount Version – The 19” rackmount version is self-contained with its own power supply. It occupies only 1U of rack space and has front-mounted ATDS and Ethernet connectors for efficient cable management . It is small form factor allows multiple units to be stacked in a central location forming a communication gateway or mounted separately where space is limited.

PowerNet™ ATDS Bridge System

Sabtech PX-x1000-01-BRG PowerNet ATDS Bridge System

MPN:

PX-x1000-01-BRG

Manufacturer L3 Communications

IXI Technology

Description:

The PowerNet™ ATDS Bridge System Connects Airborne Tactical Data System (ATDS) equipment via Ethernet. ATDS is a serial communication link conforming to MIL-STD-188-203-1A (Appendix D2). ATDS is used in equipment that supports Tactical Digital information Link-A (TADIL-A) or its NATO designation Link-11. The PowerNet™ Bridge provides a transparent hardware and protocol conversion that allows Data Terminal Set (DTS), Tactical Data System (TDS) and cryptographic equipment to communicate over a network without modification to either end. Moving the ATDS link to a network architecture eliminates cable length limitations and allows for implementation of redundant paths through the network fabric, greatly improving the survivability of the interface. With the PowerNet™ Bridge System it’s now possible for ATDS equipment to connect virtually anywhere within the reach of a network connection.

PowerNet™ Bridge System Architecture

The PowerNet™ Bridge System consists of two PowerNet™ servers one connected to the legacy ATDS device at each end of the interface. The servers connect together over a dedicated or shared Ethernet network. In operation, the servers convert the ATDS channel protocol into Ethernet packets that are transmitted and converted back to ATDS at the distant end. The PowerNet™ server is typically mounted near the legacy equipment to make the ATDS cable Run as short as possible.

Channel Protocol

Each PowerNet™ servers run as firmware protocol module that communicates with the legacy device on its end. At power up the server initiates the protocol program with no user intervention providing automatic, transparent “pass-through” operation of the legacy channel.

Designed for survival

The PowerNet™ Bridge system is designed with dual Ethernet ports to significantly increase reliability. When configured to operate in dual port mode, if one interface goes down, operation continues without delay or interruption on the surviving path.

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Features:

  • Rugged Version – The Rugged PowerNet™ server is designed to meet the environmental specifications required for naval shipboard application. It offers the same capabilities of the other versions in a standalone ruggedized enclosure.

Model Embedded Systems SIU3-3 Conduction Cooled

NeWhite paperort Coloured-Glass Alternative Filters

MPN:

SIU3-3

Manufacturer L3 Communications

North Atlantic Industries

Description:

The SIU3-3 is a highly configurable, rugged system or subsystem ideally suited to support a multitude of Mil-Aero applications that require high-density I/O, communications, Ethernet switching and processing. Mix-and-match up to nine different functions on three, 3U cPCI boards for a fully integrated and testged COTs solution. The SIU3-3 delivers off-the-shelf solutions to accelerate deployment of SWaP-constrained platforms such as combat vehicles, helicopters and UAVs.

Architected for Versatility

NAI's Custom-on-Standard Architecture™ (COSA™) gives customers the freedom to select a single board computer (SBC) processor (if required), and couple it with a choice of high-density I/O, communications or Ethernet switch functions. The COSA™ architecture is packaged in a rugged chassis designed to operate reliably in extreme temperature, shock, vibration and EMI environments. EMI filters and gaskets meet or exceed MIL-STD-461F and MIL-STD-810G requirements.

If required, the SIU3-3 offers a choice of Intel® i7 3517UE, Intel N2800 ATOM™, Freescale PowerPC™ P2041 or ARM Cortex™ A9, 3U cPCI processors, enabling customers to choose their ideal SBC. Each SBC supports COSA™ to maximize configurability, versatility and field-proven reliability. Software support includes Windows® 7 Embedded, Wind River Linux or Wind River® VxWorks®. All I/O and communications libraries are included.

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Features:

  • COSATM Architecture
  • 40+ I/O, Communications or Ethernet Switch functions
  • PowerPC®, Intel® Core i7® or ARM SBC Processor
  • VICTORY Interface Services
  • SBC-less stand-alone operation supported via Ethernet connection
  • Windows®, Linux and VxWorks® OS Support
  • Fast Boot Capability
  • Reduced SWaP
  • COTS/NDI System
  • Customer Configurable I/O, Communications and Processing
  • 3 x 3U cPCI Slots
  • Sense & Response System
  • Continuous Background
  • Built-in-Test (BIT)

Model Embedded Systems SIU3-5 Conduction Cooled

NeWhite paperort Coloured-Glass Alternative Filters

MPN:

SIU3-5

Manufacturer L3 Communications

North Atlantic Industries

Description:

The SIU3-5 is a highly configurable, rugged system or subsystem ideally suited to support a multitude of Mil-Aero applications that require high-density I/O, communications, Ethernet switching and processing. Mix-and-match up to 15 different functions on five, 3U cPCI boards for a fully integrated and tested COTS solution. The SIU3-5 delivers off-the-shelf solutions to accelerate deployment of SWaP-constrained platforms such as combat vehicles, helicopters and UAVs.

Architected for Versatility

NAI's Custom-on-Standard Architecture™ (COSA™) gives customers the freedom to select a single board computer (SBC) processor (if required), and couple it with a choice of high-density I/O, communications or Ethernet switch functions. The COSA™ architecture is packaged in a rugged chassis designed to operate reliably in extreme temperature, shock, vibration and EMI environments. EMI filters and gaskets meet or exceed MIL-STD-461F and MIL-STD-810G requirements.

If required, the SIU3-5 offers a choice of Intel™ i7 3517UE, Intel N2800 ATOM™, Freescale™ PowerPC™ P2041 or ARM™ Cortex™ A9, 3U cPCI processors, enabling customers to choose their ideal SBC. Each SBC supports COSA™ to maximize configurability, versatility and field-proven reliability. Software support includes Windows® 7 Embedded, Wind River Linux or Wind River® VxWorks®. All I/O and communi-cations libraries are included.

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Features:

  • COSATM Architecture
  • 40+ I/O, Communications or Ethernet Switch functions
  • PowerPC®, Intel® Core i7® or ARM SBC Processor
  • VICTORY Interface Services
  • SBC-less stand-alone operation supported via Ethernet connection
  • Windows®, Linux and VxWorks® OS Support
  • Fast Boot Capability
  • Reduced SWaP
  • COTS/NDI System
  • Customer Configurable I/O, Communications and Processing
  • 5 x 3U cPCI Slots
  • Sense & Response System
  • Continuous Background
  • Built-in-Test (BIT)

Sensor Interface Unit

North Atlantic Industries SIU-6 Sensor Interface Unit

MPN:

SIU-6

Manufacturer L3 Communications

North Atlantic Industries

Description:

Taking advantage of our high density Multifunction I/O and Power Supply products, the SIU6 offers unprecedented Intelligent I/O™ in an integrated compact conduction cooled system for data acquisition, distribution and processing applications. Our unique modular architecture allows for a wide selection of different I/O and communications functions such as A/D, D/A, TTL, RTD, Discrete I/O, Synchro/Resolver-to-Digital and LVDT, Digital-to-Synchro/Resolver and DLV, BC/RT/MT MIL-STD-1553, high speed Sync/Async RS232/422/485, ARINC 429 and CANBus. This approach increases package density, saves enclosure slots and reduces power consumption. A fully integrated backplane and front panel architecture eliminates the need for custom internal cabling or wiring. Continuous background BIT support monitors each channel. A fault is immediately reported and the specific channel is identified. A processor option allows pre-processing of raw I/O data. This capability can provide significant benefits including: - Formatting and packetizing I/O data for immediate use by the system or mission processor - Specific routines can be implemented for individual data channels. A typical example would be an average of data over a specified number of samples.


- Allow routines to be implemented for multiple data channel monitoring and event handling. For example allow a discrete channel activation to output a specific D/A channel.

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Features:

  • High Density Multi-Function I/O Subsystem
  • I/O access and control via 10/100/1000BaseT Ethernet
  • Integrated backplane to front panel connector configuration
  • Intelligent I/O™ combinations of up to:
  •  - 192 Programmable 0V to 60V Discrete I/O channels
  •  - 120 16-Bit Programmable A/D or D/A channels
  •  - 36 16-Bit Digital to Synchro/Resolver channels
  •  - 36 16-Bit Digital to LVDT Channels
  •  - 48 16-Bit Synchro/Resolver to Digital channels
  •  - 48 16-Bit LVDT to Digital Channels
  •  - 72 16-Bit Resistance Temperature Detector channels
  • Communications support for up to:
  •  - 24 MIL-STD-1553 BC/RT/MT channels
  •  - 48 Independent & Isolated CANBus channels
  •  - 48 Programmable Sync/Async RS232/422/485 channels
  •  - 72 Programmable ARINC 429/575 channels
  •  - 48 Encoder/Counter Channels
  • Optional Processor Support
  •  - PowerPC™ 8536
  •  - Analog Devices Blackfin® Low Power Processor
  •  - VxWorks®, Linux, Windows® CE
  • Continuous background BIT monitoring on all channels
  • Software Support Kit (SSK) and Drivers available
  • Low profile, rugged base-plate cooled chassis
  • -40°C to +71°C Operation

Nano Interface Unit

North Atlantic Industries NIU1 Nano Interface Unit

MPN:

NIU1

Manufacturer L3 Communications

North Atlantic Industries

Description:

Taking advantage of NAI’s modular high density COTS, Intelligent I/O™ and integrated Power Supply products, the NIU1 offers unprecedented I/O capabilities in an integrated, compact, nano-sized subsystem. Additionally, by using dual Gig-E as its main interface I/O, communication, measurement and simulation functions for data acquisition, distribution and processing applications are now easily integrated into larger systems without the need of costly updates to existing large systems. NAI’s unique modular architecture supports a wide selection/configuration of different I/O, motion simulation/measurement and communications functions such as: A/D, D/A, TTL, RTD; Discrete I/O; Synchro/Resolver-to-Digital and LVDT; Digital-to-Synchro/Resolver and DLV; dual channel redundant BC/RT/MT MIL-STD-1553; high speed Sync/Async RS232/422/423/485; ARINC 429/575 and CANBus. This approach provides a simple integration effort for dedicated I/O interface capability to existing or new applications, targeting specific interfacing requirements. A fully integrated backplane and front panel architecture eliminates the need for custom internal cabling or wiring. Leveraging proven NAI Intelligent I/O™ module capability provides programmable/flexible command and control with continuous background built-in-test (BIT) support providing online health and status monitoring, whereby a fault is detected, reported and the specific channel identified.

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Features:

  • Dual 10/100/1000BaseT Ethernet-to-Intelligent I/O™ interface and communications
  • 28VDC input power nominal (typical vehicle power w/ 18-36 VDC range)
  • Power over Ethernet (PoE) support (IEEE 802.3at and 802.3af Powered Device (PD) application compliant)
  • Only 1.5”H x 1.6”D x 6.5”L @ 16 oz. (454 g) with 3 mounting possibilities
  • Intelligent I/O™ function support includes:
  • 16-Ch programmable 0V to 60V Discrete I/O
  • 16-Ch programmable TTL or Differential I/O
  • 10-Ch 16-bit programmable A/D or D/A
  • 3-Ch 16-bit Digital to Synchro/Resolver
  • 3-Ch 16-bit Digital to LVDT
  • 4-Ch 16-bit Synchro/Resolver to Digital
  • 4-Ch 16-bit LVDT to Digital
  • 6-Ch 16-bit Resistance Temperature Detector (RTD)
  • 4-Ch Absolute SSI or Incremental A-Quad-B Encoder / Counter
  • Communications function support includes:
  • 2-Ch MIL-STD-1553 Dual Redundant BC/RT/MT channels
  • 4-Ch independent and isolated CANBus channels
  • 4-Ch programmable Sync/Async RS232/422/423/485 channels
  • 6-Ch programmable ARINC 429/575 channels
  • Continuous Background Built-in-Test per channel
  • Software Support Kit (SSK) and drivers available
  • -40°C to +71°C operation, conduction cooled

14-Bit A/D Simultaneous Sample and Hold Analog Input Module

Acromag IOS-341 14-Bit A/D Simultaneous Sample and Hold Analog Input Module

MPN:

IOS-341

Manufacturer L3 Communications

Acromag

Description:

IOS Modules plug into the 4-slot carrier card that is integrated within the I/O Server. Different modules can mix or match in any combination to meet the I/O requirements.


IOS-341 modules provide fast, high resolution, simultaneous A/D conversion of up to eight channels.


These modules have sixteen analog inputs which are sampled as two eight-channel banks. Eight A/D converters (ADCs) permit simultaneous conversion of all eight channels in a bank. A FIFO buffer holds the first bank's data while the second bank is converted. Conversion of each bank requires only 8μS, and all 16 channels can be sampled in just 16μS.


Flexible configuration options give you extensive control over the conversion process. The channels or bank to be converted, timing, scan mode, and other parameters are user-programmable. Interrupt support adds further control to flag a FIFO that is full or filled to a user-defined threshold level.

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Features:

  • 16 differential inputs (±10V DC input range)
  • Eight 14-bit A/D converters with simultaneous multi-channel conversion
  • 8μS conversion time (125KHz) for 8-channel bank
  • FIFO buffer with 512 sample memory
  • Programmable conversion timer
  • Programmable channel conversion control
  • External trigger input and output
  • Continuous and single-cycle conversion modes
  • Interrupt generation for FIFO threshold conditions
  • Precision calibration voltages stored on-board
  • Simultaneous channel conversion and on-board memory enable megahertz throughput rates.
  • Programmable interrupts simplify data acquisition by providing greater control.
  • -40 to 85°C operating temperature range

Digital Output Module, 32 Port-Isolated Channels (SSRs)

Acromag IOS-445 Digital Output Module, 32 Port-Isolated Channels (SSRs)

MPN:

IOS-445

Manufacturer L3 Communications

Acromag

Description:

IOS Modules plug into the 4-slot carrier card that is integrated within the I/O Server. Different modules can mix or match in any combination to meet the I/O requirements.


IOS-445 modules provide 32 isolated solid-state relay outputs to safely control discrete devices.


A major IOS-445 advantage is its flexibility. The module supports wide range bipolar (AC or DC) voltage switching. Each port can be configured for high or low-side switches. The outputs are TTL-compatible when configured as low side switches using on-board socketed pull-up resistors.


Isolation protects your computer system from noise, transient signals, and field wiring faults. Outputs are grouped into four 8-channel ports. Ports are isolated via solid-state relays from the logic and from each other.


Read back buffers simplify output status monitoring. And for easy closed-loop monitoring of critical control signals, use the IOS-445 with an IOS-440 input module.

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Features:

  • 32 bipolar solid state relays
  • High/low-side switch configuration
  • Port-isolated output channels
  • ±60V AC/DC voltage range
  • High speed processing (0 wait states)
  • TTL-compatible
  • Failsafe power-up and system reset
  • Output read back function
  • Socketed pull-up resistors for low-side switching applications
  • Current-limited solid-state relays
  • Unique ground reference points for each port permits AC and DC switching on one module.
  • Pins are compatible with IOS-440 input module for loopback monitoring.
  • -40 to 85°C operating temperature range

48-Channel Digital I/O Module

Acromag IOS-470 48-Channel Digital I/O Module

MPN:

IOS-470

Manufacturer L3 Communications

Acromag

Description:

IOS Modules plug into the 4-slot carrier card that is integrated within the I/O Server. Different modules can mix or match in any combination to meet the I/O requirements.


IOS-470 I/O Server modules provide 48 general-purpose, bi-directional I/O points to economically monitor and control a large quantity of digital devices.


Each channel has interrupt capability for detecting low-to-high or high-to-low transitions. Change-of-state interrupts are supported using paired channels. Debounce eliminates interrupts from noise and switching transients for error-free edge detection.


IOS-470 outputs are full-featured. They have socketed pull-ups and provide closed-loop read back status monitoring. TTL level thresholds and 15mA sink capability allow a direct interface to standard relay racks. And for safety, outputs go to a failsafe state upon power-up/reset without any instantaneous toggling to prevent false alarms.

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Features:

  • 48 bi-directional input/output channels
  • TTL-compatible inputs
  • CMOS-compatible open-drain outputs
  • Interrupt support for each channel
  • Input debounce
  • Electronic overvoltage protection on individual channels
  • Open drain outputs with socketed pull-ups
  • Output read back registers
  • Output read back capability eliminates the need for additional input channels to verify the output channel state.
  • Output channels do not glitch after a power up/reset to eliminate false alarms.
  • -40 to 85°C operating temperature range

Counter/Timer Industrial I/O Server Module with Ten 16-Bit-TTL

Acromag IOS-482 Counter/Timer Industrial I/O Server Module with Ten 16-Bit-TTL Counter/Timers

MPN:

IOS-482

Manufacturer L3 Communications

Acromag

Description:

IOS Modules plug into the 4-slot carrier card that is integrated within the I/O Server. Different modules can mix or match in any combination to meet the I/O requirements.


IOS-480 models, available in a variety of configurations, provide up to ten counter/timer channels for counting events, generating waveform control signals, measuring pulse widths or periodic rates, and monitoring operations.


Support for internal or external triggering simplifies the synchronization of operations to specific events. Counter functions can use internally generated clocks or an externally supplied clock.

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Features:

  • Up to ten 16-bit counter/timers (IOS-482)
  • Available with both TTL and RS422 driver interface (IOS-483 only)
  • 8 or 32MHz clock time base
  • Single counter/timer modes:
  • - Event counting
  • - Frequency measurement
  • - Period/pulse-width measurement
  • - Quadrature position measurement
  • - Square wave/pulse train generation
  • - Time/period interrupter
  • - Pulse width generation
  • Most configuration is handled by a single register which minimizes programming.
  • Pull-ups are socketed for easy adjustment.
  • -40 to 85°C operating temperature range

Non-isolated industrial I/O server communication module

Acromag IOS-520 Non-isolated industrial I/O server communication module

MPN:

IOS-520

Manufacturer L3 Communications

Acromag

Description:

IOS Modules plug into the 4-slot carrier card that is integrated within the I/O Server. Different modules can mix or match in any combination to meet the I/O requirements.


IOS-520 modules provide eight asynchronous serial communication ports from a single carrier slot. Software-configuration helps you quickly set baud rates, character-sizes, stop bits, and parity. Signal support for RTS/CTS handshaking is also included.


For more efficient data processing, each serial port is equipped with 64-character FIFO buffers on the transmit and receive lines.


The data ports generate individually controlled transmit, receive, line status, and data set interrupts. Since unique interrupt vectors may be assigned to each port, it is easy for you to identify and locate the interrupt source. Also, a priority shifting scheme prevents continuous interrupts from one port from blocking interrupts from another.

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Features:

  • Eight EIA232 ports
  • 64-byte transmit FIFO buffers
  • 64-byte receive FIFO buffers
  • Interrupts with unique vectors for each port
  • Programmable baud rate (up to 230Kbps)
  • Individual handshake lines (RTS, CTS) on each channel
  • Line-break and false start-bit detection
  • Industry-standard 16C654 family UART includes software-compatible 16C450 mode
  • High-density design lowers per-port costs and saves carrier card slots for other functions.
  • 64-byte FIFO buffers minimize CPU interaction for improved system performance.
  • Each serial channel provides handshake support to simplify interfacing with modems.
  • -40 to 85°C operating temperature range

Non-isolated industrial I/O server communication module

Acromag IOS-521 Non-isolated industrial I/O server communication module

MPN:

IOS-521

Manufacturer L3 Communications

Acromag

Description:

IOS Modules plug into the 4-slot carrier card that is integrated within the I/O Server. Different modules can mix or match in any combination to meet the I/O requirements.


IOS-521 modules provide eight asynchronous serial communication ports from a single carrier slot. Software-configuration helps you quickly set baud rates, character-sizes, stop bits, and parity.


For more efficient data processing, each serial port is equipped with 64-character FIFO buffers on the transmit and receive lines.


The data ports generate individually controlled transmit, receive, line status, data set, and flow control interrupts. Since unique interrupt vectors may be assigned to each port, it is easy for you to identify and locate the interrupt source. Also, a priority shifting scheme prevents continuous interrupts from one port from blocking interrupts from another.

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Features:

  • Eight asynchronous, full duplex RS422B serial ports (supports RS485)
  • 64-byte transmit FIFO buffers
  • 64-byte receive FIFO buffers
  • Interrupts with unique vectors for each port
  • Programmable baud rate (up to 921.6Kbps)
  • Line-break and false start-bit detection
  • Failsafe receivers
  • Socketed termination and bias resistors
  • Industry-standard 16C654 family UART includes software-compatible 16C450 mode
  • High-density design lowers per-port costs and saves carrier card slots for other functions.
  • 64-byte FIFO buffers minimize CPU interaction for improved system performance.
  • -40 to 85°C operating temperature range

Dual-Channel CAN Bus Interface Module

Acromag IOS-560 Dual-Channel CAN Bus Interface Module

MPN:

IOS-560

Manufacturer L3 Communications

Acromag

Description:

IOS Modules plug into the 4-slot carrier card that is integrated within the I/O Server. Different modules can mix or match in any combination to meet the I/O requirements.


IOS-560 modules provide two independent CAN bus interface channels. Each channel has a NXP SJA1000 CAN controller with a TJA1043 transceiver. The advantage of this design is that it allows reporting of bus fault conditions directly from the TJA1043 transceivers. It also has the ability to transmit, receive and perform message filtering on extended and standard messages.


Using CAN to network controllers, actuators, sensors, and transducers provides many benefits to system developers. First, the ready availability of multi-sourced components and tools can significantly reduce design time. Next, the small, light cables used by CAN help lower connection costs. Additionally, CAN has fewer connections which improves reliability.

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Features:

  • Two complete CAN bus interfaces
  • NXP SJA1000 CAN bus controller with high-speed TJA1043 CAN transceiver
  • 1000V isolation, channel-to-channel and channel-to-host (IP560-i models)
  • ISO 11898 compliance for Part A (11-bit) and Part B extended (29-bit) arbitration IDs
  • CAN 2.0B protocol compatibility (extended frame passive in PCA82C200 compatibility mode)
  • Data rates of up to 1Mb/s
  • Supports 8MHz IP operation
  • -40 to 85°C operating temperature range
  • TXD dominant clamping handler with diagnosis
  • RXD recessive clamping handler with diagnosis
  • TXD-to-RXD short-circuit handler with diagnosis
  • Bus line short-circuit diagnosis
  • Bus dominant clamping diagnosis
  • PCA82C200 mode (BasicCAN mode is default)
  • Extended receive buffer (64-byte FIFO)
  • 24 MHz clock frequency
  • PeliCAN mode extensions:
  • Error counters with read/write access
  • Programmable error warning limit
  • Last error code register
  • Error interrupt for each CAN-bus error
  • Arbitration lost interrupt with detailed bit position
  • Single-shot transmission (no re-transmission)
  • Listen only mode (no acknowledge, no active error flags)
  • Hot plugging support (software driven bit rate detection)
  • Acceptance filter extension (4-byte code, 4-byte mask)
  • Reception of own messages (self reception request)
  • Undervoltage detection on VBAT
  • Listen-only mode for node diagnosis and failure containment

FPGA Industrial I/O Server Module JTAG-Reconfigurable Cyclone IIDigital I/O

Acromag IOS-EP202 FPGA Industrial I/O Server Module JTAG-Reconfigurable Cyclone II Digital I/O, 24 EIA-485 Differential I/O

MPN:

IOS-EP202

Manufacturer L3 Communications

Acromag

Description:

IOS Modules plug into the 4-slot carrier card that is integrated within the I/O Server. Different modules can mix or match in any combination to meet the I/O requirements.


The IOS-EP200 series of I/O modules provides a user-customizable Altera® Cyclone® II FPGA. The module allows users to develop and store their own instruction set in the FPGA for adaptive computing applications. Typical uses include specialized communication systems over RS422/485 networks, test fixture simulation of signals over TTL-switched lines, and analysis of acquired data using specialized mathematical formulas such as those developed with MathWorks MatLab® software.


The FPGA on Acromag's IOS-EP200 modules can control up to 48 TTL or 24 RS485 I/O signals or a mix of both types. Another model interfaces 24 LVDS I/O channels. User application programs are downloaded through the JTAG port or via the bus directly into the FPGA. A pre-programmed internal CPLD facilitates initialization by acting as the bus controller during power-up and while the program is downloading. This bus controller is limited to functions necessary for power-up and downloading. After the program downloads, the FPGA takes control of the bus and the CPLD disables.

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Features:

  • Altera Cyclone II EP2C20 FPGA
  • Four models available:
  • IOS-EP201: 48 TTL I/O lines
  • IOS-EP202: 24 differential RS485 I/O lines
  • IOS-EP203: 24 TTL and 12 RS485 I/O lines
  • IOS-EP204: 24 LVDS I/O lines
  • FPGA programmable via JTAG port or bus
  • Local static RAM (64K x 16) under FPGA control
  • LVTTL external clock connected directly to the FPGA
  • Supports 8MHz and 32MHz bus
  • Programmable PLL-based clock synthesizer
  • Example FPGA design code provided as VHDL
  • 8MHz bus interface
  • Digital I/O control register
  • others
  • Hardware support for DMA and memory space
  • -40 to 85°C operating temperature range

FPGA Industrial I/O Server Module JTAG-Reconfigurable Cyclone IIDigital I/O

Acromag IOS-EP204 FPGA Industrial I/O Server Module JTAG-Reconfigurable Cyclone II Digital I/O, 24 LVDS Differential I/O

MPN:

IOS-EP204

Manufacturer L3 Communications

Acromag

Description:

IOS Modules plug into the 4-slot carrier card that is integrated within the I/O Server. Different modules can mix or match in any combination to meet the I/O requirements.


The IOS-EP200 series of I/O modules provides a user-customizable Altera® Cyclone® II FPGA. The module allows users to develop and store their own instruction set in the FPGA for adaptive computing applications. Typical uses include specialized communication systems over RS422/485 networks, test fixture simulation of signals over TTL-switched lines, and analysis of acquired data using specialized mathematical formulas such as those developed with MathWorks MatLab® software.


The FPGA on Acromag's IOS-EP200 modules can control up to 48 TTL or 24 RS485 I/O signals or a mix of both types. Another model interfaces 24 LVDS I/O channels. User application programs are downloaded through the JTAG port or via the bus directly into the FPGA. A pre-programmed internal CPLD facilitates initialization by acting as the bus controller during power-up and while the program is downloading. This bus controller is limited to functions necessary for power-up and downloading. After the program downloads, the FPGA takes control of the bus and the CPLD disables.

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Features:

  • Altera Cyclone II EP2C20 FPGA
  • Four models available:
  • IOS-EP201: 48 TTL I/O lines
  • IOS-EP202: 24 differential RS485 I/O lines
  • IOS-EP203: 24 TTL and 12 RS485 I/O lines
  • IOS-EP204: 24 LVDS I/O lines
  • FPGA programmable via JTAG port or bus
  • Local static RAM (64K x 16) under FPGA control
  • LVTTL external clock connected directly to the FPGA
  • Supports 8MHz and 32MHz bus
  • Programmable PLL-based clock synthesizer
  • Example FPGA design code provided as VHDL
  • 8MHz bus interface
  • Digital I/O control register
  • others
  • Hardware support for DMA and memory space
  • -40 to 85°C operating temperature range

Analog I/O Server Output Module, Sixteen Voltage Outputs

Acromag IOS-231-16 Analog I/O Server Output Module, Sixteen Voltage Outputs

MPN:

IOS-231-16

Manufacturer L3 Communications

Acromag

Description:

IOS Modules plug into the 4-slot carrier card that is integrated within the I/O Server. Different modules can mix or match in any combination to meet the I/O requirements.


Each output channel on the IOS-231 has its own 16-bit D/A converter (DAC). Individual DACs are faster, and they eliminate glitches typically caused by the re-acquisition process of sample and holds found on multiplexed output boards.


Individual channels also have double-buffered data latches. You can select to update each output when it is written to, or to update all outputs simultaneously. Simultaneous outputs better simulate linear movements in motion processes.

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Features:

  • 8 or 16 analog voltage output channels
  • Independent 16-bit D/A converters per channel with an 13.0μS settling time
  • Bipolar voltage (non-isolated) outputs: -10 to +10 volts
  • Double-buffered DACs
  • High load capability (5mA output current)
  • Built-in calibration coefficients
  • Outputs reset to 0 volts.
  • Internally stored calibration coefficients ensure accuracy.
  • Software provides easy selection of transparent or simultaneous output modes.
  • Double-buffered DACs allow new data to be written to each channel before the simultaneous trigger updates the outputs.
  • -40 to 85°C operating temperature range

Industrial PC with Intel ATOM N270 1.6GHz processor with 1 Gbyte DDR2

Acromag IOS-7400 Industrial PC with Intel ATOM N270 1.6GHz processor with 1 Gbyte DDR2

MPN:

IOS-7400

Manufacturer L3 Communications

Acromag

Description:

Acromag's Industrial I/O Server is a rugged industrial PC with truly integrated support for user I/O. A built-in carrier card interfaces up to four plug-in I/O modules to the CPU. The embedded computer supports video, audio, Ethernet, serial, and USB devices. A wide variety of I/O modules provides mix and match flexibility, high channel density, and a clean cable interface.


The I/O Server's fanless design employs advanced thermal technology and high-performance components to accommodate a wide operating temperature range -30 to 75°C. Conduction cooling plates and thermal pads wick internal heat away to the aluminum enclosure where external cooling fins dissipate the heat.


Units are shock/vibration resistant and sealed to IP40 standards to ensure long term reliability in a variety of applications.


This combination of an industrial PC with fully integrated I/O offers a compact, yet powerful monitoring and control solution. Unlike many box PC systems that offer few I/O connection options or limit you to a single PC104 card, Acromag's I/O Server brings I/O modules inside the chassis. A tight footprint is maintained, four plug-in I/O modules of any mix are supported, and high density connectors provide clean signal wiring.

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Features:

  • Rugged, industrial PC with fanless design delivers high-reliability operation
  • 4 plug-in I/O module slots provide easy, low cost interface to instrumentation
  • High-density, interchangeable I/O modules enable mix and match flexibility
  • 20+ I/O modules available for a wide variety of analog, digital, and serial I/O functions
  • Thermally-controlled chassis meets extreme operating temperature requirements
  • Compact, shock and vibration-resistant design

Analog I/O Server Input Module 20 Differential or 40 Single-Ended Inputs

Acromag IOS-320 Analog I/O Server Input Module with 20 Differential or 40 Single-Ended Inputs with 12-Bit A/D, (200KHz Throughput)

MPN:

IOS-320

Manufacturer L3 Communications

Acromag

Description:

IOS Modules plug into the 4-slot carrier card that is integrated within the I/O Server. Different modules can mix or match in any combination to meet the I/O requirements.


The IOS-320 monitors 20 differential or 40 single-ended input channels.


A jumper offers a choice of three input voltage ranges. Using the software programmable gain, you can easily customize the input voltage on an individual channel basis. The control register provides further flexibility with the option of single-ended or differential inputs and controlled channel selection. Software or external triggers enable synchronization of data acquisition to external events.

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Features:

  • 20 differential or 40 single-ended inputs
  • 12-bit, successive approximation A/D converter (ADC) with an 4.5μS conversion time
  • 200K samples per second maximum system throughput rate
  • Three dip switch-selectable input ranges: -5 to 5V, -10 to 10V, and 0 to 10V
  • Programmable gains of 1, 2, 4, and 8
  • Built-in calibration references
  • Software or external hardware inputs can trigger A/D conversions for synchronization to external events.
  • On-board, precision voltage references enable accurate software calibration of the module without external instruments.
  • -40 to 85°C operating temperature range

Analog Industrial I/O Server Input Module with 16 Differential

Acromag IOS-330 Analog Industrial I/O Server Input Module with 16 Differential or 32 Single-Ended Inputs with 16-Bit A/D, (200KHz Throughput).

MPN:

IOS-330

Manufacturer L3 Communications

Acromag

Description:

IOS Modules plug into the 4-slot carrier card that is integrated within the I/O Server. Different modules can mix or match in any combination to meet the I/O requirements.


IOS-330 modules provide fast, high resolution A/D conversion.


The IOS-330 has many features to improve your overall system throughput rate. You can scan all channels or define a subset for more frequent sampling. Burst mode scans selected channels at the maximum conversion rate. Uniform mode performs conversions at user-defined intervals. Both modes can scan continuously, or execute a single cycle upon receiving a trigger.


'Mail box' memory allows the CPU to read the latest data in 32 storage buffer registers without interrupting the A/D converter.

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Features:

  • 16-bit A/D converter (ADC)
  • 5μS conversion time (200KHz)
  • 16 differential or 32 single-ended inputs (±5V, ±10V, 0-5V, and 0-10V input ranges)
  • Individual channel mailbox with one or two storage buffer registers per channel
  • Programmable scan control
  • Four scanning modes
  • User-programmable interval timer
  • External trigger input and output
  • Programmable gain for individual channels
  • Post-conversion interrupts
  • Mailbox memory eliminates scanning interruptions for optimum throughput.
  • Data register indicates new and missed (overwritten) data values in the mail box.
  • Programmable interrupts simplify data acquisition by providing greater control.
  • -40 to 85°C operating temperature range

Digital Input/Output Module, 32 High-Voltage Bidirectional I/O

Acromag IOS-408 Digital Input/Output Module, 32 High-Voltage Bidirectional I/O

MPN:

IOS-408

Manufacturer L3 Communications

Acromag

Description:

IOS Modules plug into the 4-slot carrier card that is integrated within the I/O Server. Different modules can mix or match in any combination to meet the I/O requirements.


The IOS-408 monitors or controls the on/off (high/low) status of up to 32 devices. Each channel can be used as an input or output.


Input channels can be configured with interrupts for a change of state or level detection of any bit on up to 8 channels. The TTL input threshold includes hysteresis for increasing noise immunity.


In order to ensure safe, reliable control under all conditions, output operation is 'fail-safe.' That is, the outputs are always off upon power-up and are automatically cleared following a software reset.


Loopback monitoring of critical control signals is easy since the input and output circuitry are connected in tandem to each channel.

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Features:

  • 32 digital input and/or output channels
  • 0 to 60V DC input range, 60V DC low-side switch outputs
  • Outputs sink up to 1A per channel
  • TTL-compatible input threshold with hysteresis
  • Change-of-state/level interrupts (up to 8)
  • Buffered inputs include hysteresis to increase noise immunity.
  • Interrupts are software-programmable for a change of state or level detection.
  • Loopback monitoring enables self-test and fault diagnostics to detect open output switches or shorts.
  • High impedance inputs prevent loading of the input source and minimize current.
  • Individual outputs sink up to 1A DC continuous. No deration of output current required at elevated temperatures.
  • -40 to 85°C operating temperature range

Digital Input/Output Module, 32 Differential Bidirectional I/O

Acromag IOS-409 Digital Input/Output Module, 32 Differential Bidirectional I/O

MPN:

IOS-409

Manufacturer L3 Communications

Acromag

Description:

IOS Modules plug into the 4-slot carrier card that is integrated within the I/O Server. Different modules can mix or match in any combination to meet the I/O requirements.


The IOS-409 provides 24 differential I/O channels with interrupts. Each channel is programmable as an input or an output on a bit basis, in any combination. All channels can generate change of-state (COS), low, or high level transition interrupts.


Each channel uses a robust RS485/422A transceiver that supports bi-directional data transfer in one direction at a time (half-duplex). Differential data transmission enables reliable, high speed communication across distances of up to 4000 feet, even through noisy environments. Differential transmission nullifies the effects of ground shifts and noise signals which appear as common-mode voltages on the line.

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Features:

  • 24 digital input and/or output channels
  • Output channels support read back monitoring
  • Socketed termination resistors
  • Ruggedized RS422A/485 transceivers
  • Interrupt support on all channels
  • change-of-state
  • high or low level transition
  • Positive and negative current limiting
  • Parallel I/O for up to 24 bits
  • All channels programmable as inputs or outputs.
  • Differential data transmission is ideal for high-speed, long distance communication in noisy environments.
  • -40 to 85°C operating temperature range

Digital Input Module, 32 Port-Isolated Channels

Acromag IOS-440-2 Digital Input Module, 32 Port-Isolated Channels

MPN:

IOS-440-2

Manufacturer L3 Communications

Acromag

Description:

IOS Modules plug into the 4-slot carrier card that is integrated within the I/O Server. Different modules can mix or match in any combination to meet the I/O requirements.


IOS-440 I/O modules provide 32 optically isolated inputs to safely monitor a wide range of digital input voltage levels.


Isolation protects your computer system from noise, transient signals, and field wiring faults. The inputs are grouped into four 8-channel ports. Ports are isolated from the logic and each other.


Change-of-state interrupts are supported using paired channels. Debounce eliminates spurious interrupts from noise and switching transients for error-free edge detection.


Closed-loop monitoring of critical control signals is easily accomplished using the IOS-440 in conjunction with Acromag's IOS-445 digital output module.

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Features:

  • 32 port-isolated input channels
  • ±16 to ±40V DC or AC peak input range
  • Interrupt support for each channel
  • High speed processing (0 wait states)
  • Programmable polarity of event interrupts (low-to-high or high-to-low transitions)
  • Programmable debounce
  • Input hysteresis
  • Reverse polarity protection
  • Software configuration (no jumpers or switches)
  • Software configuration allows on-the-fly changes without removing modules.
  • Pins are compatible with IOS-445 output module for loopback monitoring
  • Loopback monitoring enables self-test and fault diagnostics to detect open switches or shorts.
  • -40 to 85°C operating temperature range

Counter/Timer Industrial I/O Server Module with Five 16-Bit-TTL

Acromag IOS-483 Counter/Timer Industrial I/O Server Module with Five 16-Bit-TTL and Two 16-Bit-RS422 Counter/Timers

MPN:

IOS-483

Manufacturer L3 Communications

Acromag

Description:

IOS Modules plug into the 4-slot carrier card that is integrated within the I/O Server. Different modules can mix or match in any combination to meet the I/O requirements.


IOS-480 models, available in a variety of configurations, provide up to ten counter/timer channels for counting events, generating waveform control signals, measuring pulse widths or periodic rates, and monitoring operations.


Support for internal or external triggering simplifies the synchronization of operations to specific events. Counter functions can use internally generated clocks or an externally supplied clock.

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Features:

  • Up to ten 16-bit counter/timers (IOS-482)
  • Available with both TTL and RS422 driver interface (IOS-483 only)
  • 8 or 32MHz clock time base
  • Single counter/timer modes:
  • - Event counting
  • - Frequency measurement
  • - Period/pulse-width measurement
  • - Quadrature position measurement
  • - Square wave/pulse train generation
  • - Time/period interrupter
  • - Pulse width generation
  • Most configuration is handled by a single register which minimizes programming.
  • Pull-ups are socketed for easy adjustment.
  • -40 to 85°C operating temperature range

Counter/Timer Industrial I/O Server Module, Five 16-Bit-RS422 Counter/Timer

Acromag IOS-484 Counter/Timer Industrial I/O Server Module with Five 16-Bit-RS422 Counter/Timers

MPN:

IOS-484

Manufacturer L3 Communications

Acromag

Description:

IOS Modules plug into the 4-slot carrier card that is integrated within the I/O Server. Different modules can mix or match in any combination to meet the I/O requirements.


IOS-480 models, available in a variety of configurations, provide up to ten counter/timer channels for counting events, generating waveform control signals, measuring pulse widths or periodic rates, and monitoring operations.


Support for internal or external triggering simplifies the synchronization of operations to specific events. Counter functions can use internally generated clocks or an externally supplied clock.

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Features:

  • Up to ten 16-bit counter/timers (IOS-482)
  • Available with both TTL and RS422 driver interface (IOS-483 only)
  • 8 or 32MHz clock time base
  • Single counter/timer modes:
  • - Event counting
  • - Frequency measurement
  • - Period/pulse-width measurement
  • - Quadrature position measurement
  • - Square wave/pulse train generation
  • - Time/period interrupter
  • - Pulse width generation
  • Most configuration is handled by a single register which minimizes programming.
  • Pull-ups are socketed for easy adjustment.
  • -40 to 85°C operating temperature range

Single-Channel MIL-STD-1553 Bus Interface Module

Acromag IOS-571 Single-Channel MIL-STD-1553 Bus Interface Module

MPN:

IOS-571

Manufacturer L3 Communications

Acromag

Description:

IOS Modules plug into the 4-slot carrier card that is integrated within the I/O Server. Different modules can mix or match in any combination to meet the I/O requirements.


IOS-570 modules offer a choice of one or two channels to interface sensors and other devices to a 1553 bus.


MIL-STD-1553 (1553) is a digital internal time division command/response multiplex data bus. It is a military standard which has become one of the basic tools used by the U.S. Department of Defense for integration of weapon systems. MIL-STD-1553 describes the method of communication and the electrical interface requirements for subsystems connected to the data bus. Since its introduction, MIL-STD-1553 applications have extended to systems integration of flight controls, propulsion controls, and vehicle management (electrical, hydraulic, environmental control, etc.).


MIL-STD-1553 is designed for use in one of three forms: Bus Controller (BC) - There is only one Bus Controller at a time on any MIL-STD-1553 bus. It initiates all message communication over the bus.


Remote Terminal (RT) - Up to 31 remote terminals can be present in the system.


Bus Monitor (BM) - A Bus Monitor cannot transmit messages over the data bus. Its primary role is to monitor and record bus transactions, without interfering with the operation of the Bus Controller or the Remote Terminals. Bus Monitor is often configured to record a subset of the transactions, based on criteria provided by the application program.

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Features:

  • One or two complete dual-redundant MIL-STD-1553 bus interfaces
  • Supports both MIL-STD-1553 revision B and MIL-STD-1760 transceivers
  • All channels are transformer coupled
  • Data rates of up to 1Mb/s
  • Supports 8 MHz IP operation
  • DDC Micro-ACE controls 1553 interface
  • Fully integrates 1553 Rev A/B Notice 2 terminal
  • Supports transceiver power-down options
  • Supports enhanced Mini-ACE architecture
  • Supports multiple configurations with 64K RAM: bus controller, remote terminal, or bus monitor
  • Supports 1553 Rev A/B Notice 2, STANAG 3838 protocols
  • MIL-STD-1760 amplitude compliant transceiver
  • Provides highly flexible host-side interface
  • Compatible with Mini-ACE and ACE
  • Provides highly autonomous bus controller with built-in message sequence controller
  • Offers choice of single, dual, and circular remote terminal buffering options
  • Provides selective message monitor
  • Includes comprehensive built-In self-test
  • 16MHz clock
  • Software libraries and drivers available for Windows® 2000/XP/Vista/7 (32-bit), VxWorks® and Linux

Dual-Channel MIL-STD-1553 Bus Interface Module

Acromag IOS-572 Dual-Channel MIL-STD-1553 Bus Interface Module

MPN:

IOS-572

Manufacturer L3 Communications

Acromag

Description:

IOS Modules plug into the 4-slot carrier card that is integrated within the I/O Server. Different modules can mix or match in any combination to meet the I/O requirements.


IOS-570 modules offer a choice of one or two channels to interface sensors and other devices to a 1553 bus.


MIL-STD-1553 (1553) is a digital internal time division command/response multiplex data bus. It is a military standard which has become one of the basic tools used by the U.S. Department of Defense for integration of weapon systems. MIL-STD-1553 describes the method of communication and the electrical interface requirements for subsystems connected to the data bus. Since its introduction, MIL-STD-1553 applications have extended to systems integration of flight controls, propulsion controls, and vehicle management (electrical, hydraulic, environmental control, etc.).


MIL-STD-1553 is designed for use in one of three forms: Bus Controller (BC) - There is only one Bus Controller at a time on any MIL-STD-1553 bus. It initiates all message communication over the bus.


Remote Terminal (RT) - Up to 31 remote terminals can be present in the system.


Bus Monitor (BM) - A Bus Monitor cannot transmit messages over the data bus. Its primary role is to monitor and record bus transactions, without interfering with the operation of the Bus Controller or the Remote Terminals. Bus Monitor is often configured to record a subset of the transactions, based on criteria provided by the application program.

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Features:

  • One or two complete dual-redundant MIL-STD-1553 bus interfaces
  • Supports both MIL-STD-1553 revision B and MIL-STD-1760 transceivers
  • All channels are transformer coupled
  • Data rates of up to 1Mb/s
  • Supports 8 MHz IP operation
  • DDC Micro-ACE controls 1553 interface
  • Fully integrates 1553 Rev A/B Notice 2 terminal
  • Supports transceiver power-down options
  • Supports enhanced Mini-ACE architecture
  • Supports multiple configurations with 64K RAM: bus controller, remote terminal, or bus monitor
  • Supports 1553 Rev A/B Notice 2, STANAG 3838 protocols
  • MIL-STD-1760 amplitude compliant transceiver
  • Provides highly flexible host-side interface
  • Compatible with Mini-ACE and ACE
  • Provides highly autonomous bus controller with built-in message sequence controller
  • Offers choice of single, dual, and circular remote terminal buffering options
  • Provides selective message monitor
  • Includes comprehensive built-In self-test
  • 16MHz clock
  • Software libraries and drivers available for Windows® 2000/XP/Vista/7 (32-bit), VxWorks® and Linux

FPGA Industrial Server Module JTAG-Reconfigurable Cyclone II Digital I/O

Acromag IOS-EP203 FPGA Industrial I/O Server Module JTAG-Reconfigurable Cyclone II Digital I/O, 24 TTL and 12 EIA-485 Differential I/O

MPN:

IOS-EP203

Manufacturer L3 Communications

Acromag

Description:

IOS Modules plug into the 4-slot carrier card that is integrated within the I/O Server. Different modules can mix or match in any combination to meet the I/O requirements.


The IOS-EP200 series of I/O modules provides a user-customizable Altera® Cyclone® II FPGA. The module allows users to develop and store their own instruction set in the FPGA for adaptive computing applications. Typical uses include specialized communication systems over RS422/485 networks, test fixture simulation of signals over TTL-switched lines, and analysis of acquired data using specialized mathematical formulas such as those developed with MathWorks MatLab® software.


The FPGA on Acromag's IOS-EP200 modules can control up to 48 TTL or 24 RS485 I/O signals or a mix of both types. Another model interfaces 24 LVDS I/O channels. User application programs are downloaded through the JTAG port or via the bus directly into the FPGA. A pre-programmed internal CPLD facilitates initialization by acting as the bus controller during power-up and while the program is downloading. This bus controller is limited to functions necessary for power-up and downloading. After the program downloads, the FPGA takes control of the bus and the CPLD disables.

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Features:

  • Altera Cyclone II EP2C20 FPGA
  • Four models available:
  • IOS-EP201: 48 TTL I/O lines
  • IOS-EP202: 24 differential RS485 I/O lines
  • IOS-EP203: 24 TTL and 12 RS485 I/O lines
  • IOS-EP204: 24 LVDS I/O lines
  • FPGA programmable via JTAG port or bus
  • Local static RAM (64K x 16) under FPGA control
  • LVTTL external clock connected directly to the FPGA
  • Supports 8MHz and 32MHz bus
  • Programmable PLL-based clock synthesizer
  • Example FPGA design code provided as VHDL
  • 8MHz bus interface
  • Digital I/O control register
  • others
  • Hardware support for DMA and memory space
  • -40 to 85°C operating temperature range

Analog I/O Server Output Module, Eight Voltage Outputs

Acromag IOS-220-8 Analog I/O Server Output Module, Eight Voltage Outputs

MPN:

IOS-220-8

Manufacturer L3 Communications

Acromag

Description:

IOS Modules plug into the 4-slot carrier card that is integrated within the I/O Server. Different modules can mix or match in any combination to meet the I/O requirements.


The IOS-220 outputs analog voltage signals to drive up to 16 devices. Each output channel has its own 12-bit D/A converter (DAC). Individual DACs are faster, and they eliminate glitches typically caused by the re-acquisition process of sample and holds found on multiplexed output boards.


Individual channels also have double-buffered data latches. You can select to update each output when it is written to, or to update all outputs simultaneously. Simultaneous outputs better simulate linear movements in motion processes.

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Features:

  • 8 or 16 analog voltage output channels
  • Independent 12-bit D/A converters per channel with an 11.0μS settling time
  • Bipolar voltage (non-isolated) outputs: -10 to +10 volts
  • Double-buffered DACs
  • High load capability (5mA output current)
  • Built-in calibration coefficients
  • Outputs reset to 0 volts.
  • Internally stored calibration coefficients ensure accuracy.
  • Software provides easy selection of transparent or simultaneous output modes.
  • Double-buffered DACs allow new data to be written to each channel before the simultaneous trigger updates the outputs.
  • -40 to 85°C operating temperature range

Analog I/O Server Output Module, Sixteen Voltage Outputs

Acromag IOS-220-16 Analog I/O Server Output Module, Sixteen Voltage Outputs

MPN:

IOS-220-16

Manufacturer L3 Communications

Acromag

Description:

IOS Modules plug into the 4-slot carrier card that is integrated within the I/O Server. Different modules can mix or match in any combination to meet the I/O requirements.


The IOS-220 outputs analog voltage signals to drive up to 16 devices. Each output channel has its own 12-bit D/A converter (DAC). Individual DACs are faster, and they eliminate glitches typically caused by the re-acquisition process of sample and holds found on multiplexed output boards.


Individual channels also have double-buffered data latches. You can select to update each output when it is written to, or to update all outputs simultaneously. Simultaneous outputs better simulate linear movements in motion processes.

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Features:

  • 8 or 16 analog voltage output channels
  • Independent 12-bit D/A converters per channel with an 11.0μS settling time
  • Bipolar voltage (non-isolated) outputs: -10 to +10 volts
  • Double-buffered DACs
  • High load capability (5mA output current)
  • Built-in calibration coefficients
  • Outputs reset to 0 volts.
  • Internally stored calibration coefficients ensure accuracy.
  • Software provides easy selection of transparent or simultaneous output modes.
  • Double-buffered DACs allow new data to be written to each channel before the simultaneous trigger updates the outputs.
  • -40 to 85°C operating temperature range

Analog I/O Server Output Module, Eight Voltage Outputs

Acromag IOS-231-8 Analog I/O Server Output Module, Eight Voltage Outputs

MPN:

IOS-231-8

Manufacturer L3 Communications

Acromag

Description:

IOS Modules plug into the 4-slot carrier card that is integrated within the I/O Server. Different modules can mix or match in any combination to meet the I/O requirements.


Each output channel on the IOS-231 has its own 16-bit D/A converter (DAC). Individual DACs are faster, and they eliminate glitches typically caused by the re-acquisition process of sample and holds found on multiplexed output boards.


Individual channels also have double-buffered data latches. You can select to update each output when it is written to, or to update all outputs simultaneously. Simultaneous outputs better simulate linear movements in motion processes.

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Features:

  • 8 or 16 analog voltage output channels
  • Independent 16-bit D/A converters per channel with an 13.0μS settling time
  • Bipolar voltage (non-isolated) outputs: -10 to +10 volts
  • Double-buffered DACs
  • High load capability (5mA output current)
  • Built-in calibration coefficients
  • Outputs reset to 0 volts.
  • Internally stored calibration coefficients ensure accuracy.
  • Software provides easy selection of transparent or simultaneous output modes.
  • Double-buffered DACs allow new data to be written to each channel before the simultaneous trigger updates the outputs.
  • -40 to 85°C operating temperature range

Repeater, NTDS Type A/B/C/H, M81511 Connectors (85 Pin)

Sabtech AN-RE511-00 Repeater, NTDS Type A/B/C/H, M81511 Connectors (85 Pin)

MPN:

AN-RE511-00

Manufacturer L3 Communications

IXI Technology

Description:

The IXI Technology Parallel NTDS Repeater is the solution for operating a parallel NTDS channel beyond the maximum length specified in MIL-STD-1397C. It installs inline on an active channel, providing the signal conditioning and amplification needed to receive and automatically re-transmit NTDS signals up to 250 feet. Repeater operation is performed at the electrical layer so it does not require programming or any knowledge of the interface protocol. The Repeater is switch-selectable for NTDS Types A, B, C, or H and can be configured with a choice of commonly used NTDS military circular connectors.

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Features:

  • Choice of Military Connectors
  • Switch-Selectable NTDS Type A/B/C/H
  • Installs Inline on an Active Channel

Repeater, NTDS Type A/B/C/H, M28840 Connectors (92 Pin)

Sabtech AN-RE840-00 Repeater, NTDS Type A/B/C/H, M28840 Connectors (92 Pin)

MPN:

AN-RE999-00

Manufacturer L3 Communications

IXI Technology

Description:

The IXI Technology Parallel NTDS Repeater is the solution for operating a parallel NTDS channel beyond the maximum length specified in MIL-STD-1397C. It installs inline on an active channel, providing the signal conditioning and amplification needed to receive and automatically re-transmit NTDS signals up to 250 feet. Repeater operation is performed at the electrical layer so it does not require programming or any knowledge of the interface protocol. The Repeater is switch-selectable for NTDS Types A, B, C, or H and can be configured with a choice of commonly used NTDS military circular connectors.

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Features:

  • Choice of Military Connectors
  • Switch-Selectable NTDS Type A/B/C/H
  • Installs Inline on an Active Channel

NTDS Interface Analyzer™ (NIA –II) - Rackmount

NIA-II-Rackmount

MPN:

NIA II Rackmount

Manufacturer L3 Communications

IXI Technology

Description:

IXI Technology’s next generation NTDS I/O Analyzer (NIA-II) is a powerful yet easy-to-use tool that captures data exchanged between two actively communicating NTDS devices. The NIA-II provides the visibility that is essential to quickly analyze interface timing relationships, message protocols, throughput and data integrity on all types of NTDS interfaces. The NIA-II is an invaluable tool for development, maintenance and analysis of NTDS systems.


The NIA-II can be remotely controlled over a TCP/IP network, providing immediate access to data for offsite viewing and analysis. From any network computer, it is possible to remotely control a NIA-II, whether connected in the lab down the hall or anywhere in the world.


An IRIG-B reader/generator option allows the NIA-II to be synchronized with an external time source, enabling highly accurate correlation of data with other systems or NIA-IIs. Even without an external source, the IRIG-B option provides enhanced time stamp accuracy down to 62.5 nanosecond resolution.


Optional tap boxes are an easy way to connect to existing cables and provide a convenient tee connection for input to the NIA-II. A variety of tap boxes are available with standard military connectors for parallel and serial NTDS interfaces.


The NIA-II is available in a rackmount or portable system enclosure. A basic system comes with the ability to monitor 1 NTDS channel (2 cables). The portable version can be upgraded to a total of 3 channels while the rack mount version can have up to 5 channels. Either system can be configured with a variety of mass storage options including fixed and removable hard drives, magneto optical drives, CD/DVD drives, DAT drives, and more.

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Features:

  • 12.1 inch color TFT flat panel display
  • 84-key keyboard and trackball
  • One (1) internal hard drive
  • One (1) removable hard drive
  • One (1) CD/DVD-RW drive
  • One (1) 1.44 MB floppy drive
  • Choice of any one (1) MIL-STD-1397C
  • NTDS channel:
  • - Parallel Type A, B, C and H or Serial Type D and E
  • - Tap box interconnect cable *
  • One (1)
  • 10/100 Ethernet LAN
  • Parallel Printer Port
  • Serial Port
  • Software
  • - NIA-II program
  • - Windows XP
  • 19 inch rack-mountable slides
  • Replaceable air filter

NTDS Interface Analyzer™ (NIA –II) - Portable

NIA-II-Portable

MPN:

NIA II Portable

Manufacturer L3 Communications

IXI Technology

Description:

IXI Technology’s next generation NTDS I/O Analyzer (NIA-II) is a powerful yet easy-to-use tool that captures data exchanged between two actively communicating NTDS devices. The NIA-II provides the visibility that is essential to quickly analyze interface timing relationships, message protocols, throughput and data integrity on all types of NTDS interfaces. The NIA-II is an invaluable tool for development, maintenance and analysis of NTDS systems.


The NIA-II can be remotely controlled over a TCP/IP network, providing immediate access to data for offsite viewing and analysis. From any network computer, it is possible to remotely control a NIA-II, whether connected in the lab down the hall or anywhere in the world.


An IRIG-B reader/generator option allows the NIA-II to be synchronized with an external time source, enabling highly accurate correlation of data with other systems or NIA-IIs. Even without an external source, the IRIG-B option provides enhanced time stamp accuracy down to 62.5 nanosecond resolution.


Optional tap boxes are an easy way to connect to existing cables and provide a convenient tee connection for input to the NIA-II. A variety of tap boxes are available with standard military connectors for parallel and serial NTDS interfaces.


The NIA-II is available in a rackmount or portable system enclosure. A basic system comes with the ability to monitor 1 NTDS channel (2 cables). The portable version can be upgraded to a total of 3 channels while the rack mount version can have up to 5 channels. Either system can be configured with a variety of mass storage options including fixed and removable hard drives, magneto optical drives, CD/DVD drives, DAT drives, and more.

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Features:

  • 14.1 Inch color TFT flat panel display
  • Detachable 101-key keyboard and touchpad
  • Two (2) removable hard drives
  • One (1) CD/DVD-RW drive
  • One (1) 1.44 MB floppy drive
  • Choice of any one (1) MIL-STD-1397C
  • NTDS channel:
  • - Parallel Type A, B, C and H or Serial Type D and E
  • - Tap box interconnect cable *
  • 10/100 Ethernet LAN
  • Parallel Printer Port
  • 2 Serial Ports
  • 2 USB Ports
  • Software
  • - NIA-II program
  • - Windows XP

FPGA Based 48 Channel Industrial I/O Module

Acromag IOS-EP201 FPGA Industrial I/O Server Module JTAG-Reconfigurable Cyclone II Digital I/O, 48 TTL Bidirectional I/O

MPN:

IOS-EP201

Manufacturer L3 Communications

Acromag

Description:

IOS Modules plug into the 4-slot carrier card that is integrated within the I/O Server. Different modules can mix or match in any combination to meet the I/O requirements.


The IOS-EP200 series of I/O modules provides a user-customizable Altera® Cyclone® II FPGA. The module allows users to develop and store their own instruction set in the FPGA for adaptive computing applications. Typical uses include specialized communication systems over RS422/485 networks, test fixture simulation of signals over TTL-switched lines, and analysis of acquired data using specialized mathematical formulas such as those developed with MathWorks MatLab® software.


The FPGA on Acromag's IOS-EP200 modules can control up to 48 TTL or 24 RS485 I/O signals or a mix of both types. Another model interfaces 24 LVDS I/O channels. User application programs are downloaded through the JTAG port or via the bus directly into the FPGA. A pre-programmed internal CPLD facilitates initialization by acting as the bus controller during power-up and while the program is downloading. This bus controller is limited to functions necessary for power-up and downloading. After the program downloads, the FPGA takes control of the bus and the CPLD disables.

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Features:

  • Altera Cyclone II EP2C20 FPGA
  • Four models available:
  • IOS-EP201: 48 TTL I/O lines
  • IOS-EP202: 24 differential RS485 I/O lines
  • IOS-EP203: 24 TTL and 12 RS485 I/O lines
  • IOS-EP204: 24 LVDS I/O lines
  • FPGA programmable via JTAG port or bus
  • Local static RAM (64K x 16) under FPGA control
  • LVTTL external clock connected directly to the FPGA
  • Supports 8MHz and 32MHz bus
  • Programmable PLL-based clock synthesizer
  • Example FPGA design code provided as VHDL
  • 8MHz bus interface
  • Digital I/O control register
  • others
  • Hardware support for DMA and memory space
  • -40 to 85°C operating temperature range