You are currently viewing Embedded computing

Displaying 1-1000 (of 1929 products)  

Intel® Apollo Lake-I processor-based ultra compact embedded platform

Adlink MXE-210

MPN:

MXE-210

Manufacturer L3 Communications

ADLINK

Description:

Adlink is pleased to announce our newest IIoT-ready platform, the MXE-210. With dual functionality as a gateway and controller, the palm-size MXE-210 Series is industrial grade EMC-certified and fully operational in environments from -40°C to 85°C. The robust and reliable MXE-210 series supports a broad range of applications including transportation, industrial automation, agriculture, aquaculture, smart city, and more. 

The MXE-210 series provides high expansion capability, multiple wireless connectivity, and comprehensive security for IIoT use. Based on the Intel® Atom x7-E3950/x5-E3930 processor, the MXE-210 Series is compatible to AWS Greengrass, Microsoft Azure IoT Edge, PrismTech VORTEX Edge Connect to deliver edge computing capability. With rich I/O, the MXE-210 Series supports a wide range of communication protocols for data exchange and control, as well as DDS (Data Distribution Service). And hardware and software integrity are assured with TPM 2.0, Intel® Boot Guard, and Secured Boot.

Features:

  • 3-min value props overview

    Compact, robust and reliable construction

  • Minimum footprint (A6 palm size)
  • Wide temperature support from -40°C to 85°C
  • Industrial grade EMC standard EN61000-6-4/2 certified; EN 50155 EMC compliance
  • IIoT-ready

  • Compatible with a wide range of communication protocols such as Modbus, EtherCAT, DDS, MQTT, CANbus, CANOpen for data exchange by Vortex Edge Connect
  • Supports Wi-Fi, BT, LoRa, 3G and 4G LTE wireless connectivity
  • Simplify global cellular IoT deployments with eSIM (embedded SIM) for more rugged and secure design
  • Security building blocks

  • Built-in TPM 2.0 (Trusted Platform Module) provides hardware-based security
  • Intel® Boot Guard and Secure Boot features provide the protection of preventing unauthorized software and malware takeover from Boot to OS

Industrial ATX motherboard with 6th/7th Gen Intel Core® i7/i5/i3 processor

Adlink IMB-M43H

MPN:

0000008RVQ

Manufacturer L3 Communications

ADLINK

Description:

Adlink is pleased to announce that the latest ATX industrial motherboard IMB-M43H now released. 

IMB-M43H is an ATX motherboard supporting the Desktop 6th and 7th Generation Intel Core® i7/i5/i3 Processors with Intel® H110 Chipset, providing the most cost-competitive solution anywhere in embedded computing and fulfilling the specific needs of all users requiring 5 PCI add-on cards. With high-speed data transfer interfaces such as PCIe 3.0/2.0, USB 3.0, and SATA 6 Gb/s (SATA III), dual-channel DDR4 memory up to 32 GB in two DIMM slots for industrial automation applications, the ADLINK IMB-M43H carries significant competitive advantage in the market. This leading, rugged I/O design enhances user experience with robust device compatibility, durable connectivity, and extreme environment readiness.

Features:

  • 6th (Sky Lake)/7th (Kaby Lake) Gen Intel Corei CPU
  • 6th Gen Intel Corei CPU supports OS windows 7
  • Up to 32 GB Dual-channel DDR4 2133/2400 MHz
  • 5xPCI+2xPCIe for automation application
  • Rugged I/O
  • Unique power design to ensure stable USB power of 5V ±5%
  • IEC 61000-4-2~6 (Performance Criterion A), CE/FCC class B Certified D

M material, high-permability ferrite, toroid, 2152 AI, 15000 permeability, parylene

Magnetics M Material

MPN:

YM-40502-TC

Manufacturer L3 Communications

Magnetics Inc

Description:

M material is a new, high-permeability (15,000µ) material designed for optimum impedance performance across frequency ranges. High-permeability ferrite materials provide superior loss factor, frequency response, temperature performance and product consistency. M material is suitable for signal, choke, and filter applications such as common mode chokes, EMI suppression filters, signal processing and broadband transformers.

M material, high-permability ferrite, toroid, 2963 AI, 15000 permeability, parylene

Magnetics M Material

MPN:

YM-40601-TC

Manufacturer L3 Communications

Magnetics Inc

Description:

M material is a new, high-permeability (15,000µ) material designed for optimum impedance performance across frequency ranges. High-permeability ferrite materials provide superior loss factor, frequency response, temperature performance and product consistency. M material is suitable for signal, choke, and filter applications such as common mode chokes, EMI suppression filters, signal processing and broadband transformers.

M material, high-permability ferrite, toroid, 12535 AI, 15000 permeability, bare

Magnetics M Material

MPN:

0M-40705-TC

Manufacturer L3 Communications

Magnetics Inc

Description:

M material is a new, high-permeability (15,000µ) material designed for optimum impedance performance across frequency ranges. High-permeability ferrite materials provide superior loss factor, frequency response, temperature performance and product consistency. M material is suitable for signal, choke, and filter applications such as common mode chokes, EMI suppression filters, signal processing and broadband transformers.

M material, high-permability ferrite, toroid, 6199 AI, 15000 permeability, parylene

Magnetics M Material

MPN:

YM-40603-TC

Manufacturer L3 Communications

Magnetics Inc

Description:

M material is a new, high-permeability (15,000µ) material designed for optimum impedance performance across frequency ranges. High-permeability ferrite materials provide superior loss factor, frequency response, temperature performance and product consistency. M material is suitable for signal, choke, and filter applications such as common mode chokes, EMI suppression filters, signal processing and broadband transformers.

M material, high-permability ferrite, toroid, 6199 AI, 15000 permeability, bare

Magnetics M Material

MPN:

0M-40603-TC

Manufacturer L3 Communications

Magnetics Inc

Description:

M material is a new, high-permeability (15,000µ) material designed for optimum impedance performance across frequency ranges. High-permeability ferrite materials provide superior loss factor, frequency response, temperature performance and product consistency. M material is suitable for signal, choke, and filter applications such as common mode chokes, EMI suppression filters, signal processing and broadband transformers.

M material, high-permability ferrite, toroid, 6644 AI, 15000 permeability, bare

Magnetics M Material

MPN:

0M-41003-TC

Manufacturer L3 Communications

Magnetics Inc

Description:

M material is a new, high-permeability (15,000µ) material designed for optimum impedance performance across frequency ranges. High-permeability ferrite materials provide superior loss factor, frequency response, temperature performance and product consistency. M material is suitable for signal, choke, and filter applications such as common mode chokes, EMI suppression filters, signal processing and broadband transformers.

M material, high-permability ferrite, toroid, 12535 AI, 15000 permeability, parylene

Magnetics M Material

MPN:

YM-40705-TC

Manufacturer L3 Communications

Magnetics Inc

Description:

M material is a new, high-permeability (15,000µ) material designed for optimum impedance performance across frequency ranges. High-permeability ferrite materials provide superior loss factor, frequency response, temperature performance and product consistency. M material is suitable for signal, choke, and filter applications such as common mode chokes, EMI suppression filters, signal processing and broadband transformers.

M material, high-permability ferrite, toroid, 6644 AI, 15000 permeability, epoxy

Magnetics M Material

MPN:

ZM-41003-TC

Manufacturer L3 Communications

Magnetics Inc

Description:

M material is a new, high-permeability (15,000µ) material designed for optimum impedance performance across frequency ranges. High-permeability ferrite materials provide superior loss factor, frequency response, temperature performance and product consistency. M material is suitable for signal, choke, and filter applications such as common mode chokes, EMI suppression filters, signal processing and broadband transformers.

M material, high-permability ferrite, toroid, 9988 AI, 15000 permeability, epoxy

Magnetics M Material

MPN:

ZM-41005-TC

Manufacturer L3 Communications

Magnetics Inc

Description:

M material is a new, high-permeability (15,000µ) material designed for optimum impedance performance across frequency ranges. High-permeability ferrite materials provide superior loss factor, frequency response, temperature performance and product consistency. M material is suitable for signal, choke, and filter applications such as common mode chokes, EMI suppression filters, signal processing and broadband transformers.

M material, high-permability ferrite, toroid, 9988 AI, 15000 permeability, bare

Magnetics M Material

MPN:

0M-41005-TC

Manufacturer L3 Communications

Magnetics Inc

Description:

M material is a new, high-permeability (15,000µ) material designed for optimum impedance performance across frequency ranges. High-permeability ferrite materials provide superior loss factor, frequency response, temperature performance and product consistency. M material is suitable for signal, choke, and filter applications such as common mode chokes, EMI suppression filters, signal processing and broadband transformers.

M material, high-permability ferrite, toroid, 6644 AI, 15000 permeability, parylene

Magnetics M Material

MPN:

YM-41003-TC

Manufacturer L3 Communications

Magnetics Inc

Description:

M material is a new, high-permeability (15,000µ) material designed for optimum impedance performance across frequency ranges. High-permeability ferrite materials provide superior loss factor, frequency response, temperature performance and product consistency. M material is suitable for signal, choke, and filter applications such as common mode chokes, EMI suppression filters, signal processing and broadband transformers.

M material, high-permability ferrite, toroid, 17163 AI, 15000 permeability, bare

Magnetics M Material

MPN:

0M-41206-TC

Manufacturer L3 Communications

Magnetics Inc

Description:

M material is a new, high-permeability (15,000µ) material designed for optimum impedance performance across frequency ranges. High-permeability ferrite materials provide superior loss factor, frequency response, temperature performance and product consistency. M material is suitable for signal, choke, and filter applications such as common mode chokes, EMI suppression filters, signal processing and broadband transformers.

M material, high-permability ferrite, toroid, 9988 AI, 15000 permeability, parylene

Magnetics M Material

MPN:

YM-41005-TC

Manufacturer L3 Communications

Magnetics Inc

Description:

M material is a new, high-permeability (15,000µ) material designed for optimum impedance performance across frequency ranges. High-permeability ferrite materials provide superior loss factor, frequency response, temperature performance and product consistency. M material is suitable for signal, choke, and filter applications such as common mode chokes, EMI suppression filters, signal processing and broadband transformers.

M material, high-permability ferrite, toroid, 17163 AI, 15000 permeability, parylene

Magnetics M Material

MPN:

YM-41206-TC

Manufacturer L3 Communications

Magnetics Inc

Description:

M material is a new, high-permeability (15,000µ) material designed for optimum impedance performance across frequency ranges. High-permeability ferrite materials provide superior loss factor, frequency response, temperature performance and product consistency. M material is suitable for signal, choke, and filter applications such as common mode chokes, EMI suppression filters, signal processing and broadband transformers.

M material, high-permability ferrite, toroid, 8476 AI, 15000 permeability, epoxy

Magnetics M Material

MPN:

ZM-41306-TC

Manufacturer L3 Communications

Magnetics Inc

Description:

M material is a new, high-permeability (15,000µ) material designed for optimum impedance performance across frequency ranges. High-permeability ferrite materials provide superior loss factor, frequency response, temperature performance and product consistency. M material is suitable for signal, choke, and filter applications such as common mode chokes, EMI suppression filters, signal processing and broadband transformers.

M material, high-permability ferrite, toroid, 8476 AI, 15000 permeability, bare

Magnetics M Material

MPN:

0M-41306-TC

Manufacturer L3 Communications

Magnetics Inc

Description:

M material is a new, high-permeability (15,000µ) material designed for optimum impedance performance across frequency ranges. High-permeability ferrite materials provide superior loss factor, frequency response, temperature performance and product consistency. M material is suitable for signal, choke, and filter applications such as common mode chokes, EMI suppression filters, signal processing and broadband transformers.

M material, high-permability ferrite, toroid, 10974 AI, 15000 permeability, epoxy

Magnetics M Material

MPN:

ZM-41406-TC

Manufacturer L3 Communications

Magnetics Inc

Description:

M material is a new, high-permeability (15,000µ) material designed for optimum impedance performance across frequency ranges. High-permeability ferrite materials provide superior loss factor, frequency response, temperature performance and product consistency. M material is suitable for signal, choke, and filter applications such as common mode chokes, EMI suppression filters, signal processing and broadband transformers.

M material, high-permability ferrite, toroid, 8494 AI, 15000 permeability, epoxy

Magnetics M Material

MPN:

ZM-42206-TC

Manufacturer L3 Communications

Magnetics Inc

Description:

M material is a new, high-permeability (15,000µ) material designed for optimum impedance performance across frequency ranges. High-permeability ferrite materials provide superior loss factor, frequency response, temperature performance and product consistency. M material is suitable for signal, choke, and filter applications such as common mode chokes, EMI suppression filters, signal processing and broadband transformers.

M material, high-permability ferrite, toroid, 7917 AI, 15000 permeability, epoxy

Magnetics M Material

MPN:

ZM-41605-TC

Manufacturer L3 Communications

Magnetics Inc

Description:

M material is a new, high-permeability (15,000µ) material designed for optimum impedance performance across frequency ranges. High-permeability ferrite materials provide superior loss factor, frequency response, temperature performance and product consistency. M material is suitable for signal, choke, and filter applications such as common mode chokes, EMI suppression filters, signal processing and broadband transformers.

M material, high-permability ferrite, toroid, 17313 AI, 15000 permeability, epoxy

Magnetics M Material

MPN:

ZM-42212-TC

Manufacturer L3 Communications

Magnetics Inc

Description:

M material is a new, high-permeability (15,000µ) material designed for optimum impedance performance across frequency ranges. High-permeability ferrite materials provide superior loss factor, frequency response, temperature performance and product consistency. M material is suitable for signal, choke, and filter applications such as common mode chokes, EMI suppression filters, signal processing and broadband transformers.

M material, high-permability ferrite, toroid, 11072 AI, 15000 permeability, epoxy

Magnetics M Material

MPN:

ZM-42507-TC

Manufacturer L3 Communications

Magnetics Inc

Description:

M material is a new, high-permeability (15,000µ) material designed for optimum impedance performance across frequency ranges. High-permeability ferrite materials provide superior loss factor, frequency response, temperature performance and product consistency. M material is suitable for signal, choke, and filter applications such as common mode chokes, EMI suppression filters, signal processing and broadband transformers.

BX3105 Wi-Fi and Bluetooth combo module with embedded antenna

Sierra Wireless BX3105

MPN:

BX3105

Manufacturer L3 Communications

Sierra Wireless

Description:

The BX3105 Wi-Fi and Bluetooth 4.2 pre-certified module offers simple and fast integration with free unlimited FOTA and built-in cloud connectivity from AirVantage®, ideal for quickly and cost effectively adding wireless communication.

This module supports 802.11 b/g/n and dual-mode Bluetooth Classic and Bluetooth Low Energy (BLE), connecting industrial applications requiring a secure connection to Wi-Fi and Bluetooth on a single module.

Designed in an industrial-grade common flexible form factor (CF3®), BX3105 enables system integrators to build their devices on the most scalable module platform in the world.

Features:

  • Hostless – Embedded TCP/IP and Bluetooth Stacks with simple UART interface makes it easy to integrate
  • Certification – Full regulatory certifications (FCC, RED, IC, JRF, and BQB Bluetooth) for faster time to market
  • Common form factor – Compact CF3®, form factor for scalability across technologies including cellular
  • Industrial-grade – Built to stay connected in harsh environments and extreme temperatures
  • Cloud connected – Secure device-to-cloud architecture with AirVantage®
  • FOTA upgrades – Includes FREE unlimited firmware over-the-air (FOTA) upgrades for the lifetime of the module to keep your deployments optimised and easier to maintain
  • Secure boot – Prevents unauthorised code on the target and to keep the connectivity secure
  • Interfaces – Includes UART, I2C, SDIO or SPI (Multiplexed), I2S digital audio and GPIOs
  • Integrated antenna – Quickly and easily add advanced wireless communications
  • Low power – Offers best-in-class low power when not transmitting in sleep and stand-by modes

BX3100 Wi-Fi and Bluetooth combo module

Sierra Wireless BX3100

MPN:

BX3100

Manufacturer L3 Communications

Sierra Wireless

Description:

The BX3100 Wi-Fi and Bluetooth 4.2 pre-certified module offers simple and fast integration with free unlimited FOTA and built-in cloud connectivity from AirVantage®, ideal for quickly and cost effectively adding wireless communication.

This module supports 802.11 b/g/n and dual-mode Bluetooth Classic and Bluetooth Low Energy (BLE), connecting industrial applications requiring a secure connection to Wi-Fi and Bluetooth on a single module.

Designed in an industrial-grade common flexible form factor (CF3®), BX3100 enables system integrators to build their devices on the most scalable module platform in the world.

Features:

  • Hostless – Embedded TCP/IP and Bluetooth Stacks with simple UART interface makes it easy to integrate
  • Certification – Full regulatory certifications (FCC, RED, IC, JRF, and BQB Bluetooth) for faster time to market
  • Common form factor – Compact CF3®, form factor for scalability across technologies including cellular
  • Industrial-grade – Built to stay connected in harsh environments and extreme temperatures
  • Cloud connected – Secure device-to-cloud architecture with AirVantage®
  • FOTA upgrades – Includes FREE unlimited firmware over-the-air (FOTA) upgrades for the lifetime of the module to keep your deployments optimised and easier to maintain
  • Secure boot – Prevents unauthorised code on the target and to keep the connectivity secure
  • Interfaces – Includes UART, I2C, SDIO or SPI (Multiplexed), I2S digital audio, GPIOs, and LGA pad for external antenna
  • Low power – Offers best-in-class low power when not transmitting in sleep and stand-by modes

SFP transceiver for IEEE C37.94 teleprotection, 2Mb/s, single mode, 60km

Coretek CT-0155TSP series

MPN:

CT-0155TSP-MB7L-E 2M

Manufacturer L3 Communications

Coretek

Description:

The CT-0155TSP-MB7L-E 2M from Coretek Opto Corp. is the high performance and cost-effective module for serial optical data communication applications specified for 2Mb/s. It operates with +3.3V power supply. The module is intended for single mode fibre, operates at a nominal wavelength of 1310nm and complies with multi-source agreement (MSA) small form factor pluggable (SFP). Each module is integrated digital diagnostics functions via an I2C serial interface.

The module is a duplex LC connector transceiver designed to provide an IEEE C37.94 / IEC 62843 link for 2Mb/s long-reach applications. The characteristics are performed in accordance with Telcordia Specification GR-468-CORE.

Features:

  • 1310nm FP LD
  • Data rate: 2Mb/s, NRZ
  • Single +3.3V power supply
  • RoHS compliant and lead-free
  • AC/AC differential electrical interface
  • Compliant with multi-source agreement (MSA) small form factor pluggable (SFP)
  • Compliant with SFF-8472 digital diagnostic monitoring interface
  • Duplex LC connector
  • Compatible with IEEE C37.94 / IEC 62843 standard

SFP transceiver for IEEE C37.94 teleprotection, 2Mb/s, single mode, 40km

Coretek CT-0155TSP series

MPN:

CT-0155TSP-MB6L-E 2M

Manufacturer L3 Communications

Coretek

Description:

The CT-0155TSP-MB6L-E 2M from Coretek Opto Corp. is the high performance and cost-effective module for serial optical data communication applications specified for 2Mb/s. It operates with +3.3V power supply. The module is intended for single mode fibre, operates at a nominal wavelength of 1310nm and complies with multi-source agreement (MSA) small form factor pluggable (SFP). Each module is integrated digital diagnostics functions via an I2C serial interface.

The module is a duplex LC connector transceiver designed to provide an IEEE C37.94 / IEC 62843 link for 2Mb/s long-reach applications. The characteristics are performed in accordance with Telcordia Specification GR-468-CORE.

Features:

  • 1310nm FP LD
  • Data rate: 2Mb/s, NRZ
  • Single +3.3V power supply
  • RoHS compliant and lead-free
  • AC/AC differential electrical interface
  • Compliant with multi-source agreement (MSA) small form factor pluggable (SFP)
  • Compliant with SFF-8472 digital diagnostic monitoring interface
  • Duplex LC connector
  • Compatible with IEEE C37.94 / IEC 62843 standard

SFP transceiver for IEEE C37.94 teleprotection, 2Mb/s, single mode, 80km

Coretek CT-0155TSP series

MPN:

CT-0155TSP-KB8L-E 2M

Manufacturer L3 Communications

Coretek

Description:

The CT-0155TSP-KB8L-E 2M from Coretek Opto Corp. is the high performance and cost-effective module for serial optical data communication applications specified for 2Mb/s. It operates with +3.3V power supply. The module is intended for single mode fibre, operates at a nominal wavelength of 1550nm and complies with multi-source agreement (MSA) small form factor pluggable (SFP). Each module is integrated digital diagnostics functions via an I2C serial interface.

The module is a duplex LC connector transceiver designed to provide an IEEE C37.94 / IEC 62843 link for 2Mb/s intermediate reach applications. The characteristics are performed in accordance with Telcordia Specification GR-468-CORE.

Features:

  • 1550 nm DFB LD
  • Data rate: 2Mb/s, NRZ
  • Single +3.3V power supply
  • RoHS compliant and lead-free
  • AC/AC differential electrical interface
  • Compliant with multi-source agreement (MSA) small form factor pluggable (SFP)
  • Compliant with SFF-8472 digital diagnostic monitoring interface
  • Duplex LC connector
  • Compatible with IEEE C37.94 / IEC 62843 standard

SFP transceiver for IEEE C37.94 teleprotection, 2Mb/s, single mode, 120km

Coretek CT-0155TSP series

MPN:

CT-0155TSP-KBAL-E 2M

Manufacturer L3 Communications

Coretek

Description:

The CT-0155TSP-KBAL-E 2M from Coretek Opto Corp. is the high performance and cost-effective module for serial optical data communication applications specified for 2Mb/s. It operates with +3.3V power supply. The module is intended for single mode fibre, operates at a nominal wavelength of 1550nm and complies with multi-source agreement (MSA) small form factor pluggable (SFP). Each module is integrated digital diagnostics functions via an I2C serial interface.

The module is a duplex LC connector transceiver designed to provide an IEEE C37.94 / IEC 62843 link for 2Mb/s long-reach applications. The characteristics are performed in accordance with Telcordia Specification GR-468-CORE.

Features:

  • 1550 nm DFB LD
  • Data rate: 2Mb/s, NRZ
  • Single +3.3V power supply
  • RoHS compliant and lead-free
  • AC/AC differential electrical interface
  • Compliant with multi-source agreement (MSA) small form factor pluggable (SFP)
  • Compliant with SFF-8472 digital diagnostic monitoring interface
  • Duplex LC connector
  • Compatible with IEEE C37.94 / IEC 62843 standard

Six-channel, 4K60Hz video QSFP+ transceiver – Quad transmit and bi-directional channel

Coretek CT-6025VQT-CB4L

MPN:

CT-6025VQT-CB4L

Manufacturer L3 Communications

Coretek

Description:

The CT-6025VQT-CB4L QSFP+ optical transceiver from Coretek Opto. Corp., is a high performance and cost-effective solution to optically multiplex and transmit 4K60Hz video signals. It provides four transmit channels for video signal transmission and two channels (one transmit and one receive) for data signal transmission.

For video signals, this transceiver uses one TOSA, composed of four channels of CWDM DFB LD with different wavelengths to optically multiplex video signals and transmit them via a single mode fibre. Each channel supports 6Gb/s at up to 10km. For data signals, this transceiver uses a 2.5Gb/s bi-directional OSA to send and receive data signals via a second single fibre.

By adopting the standard QSFP+ LC dual core package with pin configuration adjusted for video signals, the CT-6025VQT-CB4L is a highly reliable solution optimised for 4K60Hz applications.

Features:

    • Video-dedicated transceiver
    • Hot-pluggable QSFP+ form factor
    • One quad-TOSA and BOSA:
      • 4 x 6Gb/s CWDM uncooled DFB channels (1270nm, 1290nm, 1310nm, 1330nm)
      • 1 x 2.5Gb/s Bi-Directional (1310nm Tx / 1550nm Rx)
    • Up to 10km on SMF
    • Power dissipation <4.0W
    • Duplex LC connector
    • Single +3.3V power supply
    • Commercial temperature range -10°C to 70°C
    • RoHS-6 compliant (lead-free)

Six-channel, 4K60Hz video QSFP+ transceiver – Quad receive and bi-directional channel

Coretek CT-6025VQR-CB4L

MPN:

CT-6025VQR-CB4L

Manufacturer L3 Communications

Coretek

Description:

The CT-6025VQR-CB4L QSFP+ optical transceiver from Coretek Opto. Corp., is a high performance and cost-effective solution to optically de-multiplex 4K60Hz video signals. It provides four receive channels for receiving and de-multiplexing video signals and two channels (one transmit and one receive) for data signal transmission.

For video signals, this transceiver uses one ROSA, composed of four channels of PIN detector with TIA and thin film filter for different wavelengths to optically de-multiplex video signals transmitted via a single mode fibre. Each channel supports 6Gb/s at up to 10km. For data signals, this transceiver uses a 2.5Gb/s bi-directional OSA to send and receive data signals via a second single fibre.

By adopting the standard QSFP+ LC dual core package with pin configuration adjusted for video signals, the CT-6025VQR-CB4L is a highly reliable solution optimised for 4K60Hz applications.

Features:

    • Video-dedicated transceiver
    • Hot-pluggable QSFP+ form factor
    • One quad-ROSA and BOSA:
      • 4 x 6Gb/s PIN-TIA channels (1270nm, 1290nm, 1310nm, 1330nm)
      • 1 x 2.5Gb/s Bi-Directional (1550nm Tx / 1310nm Rx)
    • Up to 10km on SMF
    • Power dissipation <4.0W
    • Duplex LC connector
    • Single +3.3V power supply
    • Commercial temperature range -10°C to 70°C
    • RoHS-6 compliant (lead-free)

PCI/104-Express Type 1 Single Board Computer with 6th Gen. Intel® Core™ Processor (formerly Skylake)

Adlink CMx-SLx

MPN:

CMx-SLx

Manufacturer L3 Communications

ADLINK

Description:

The CMx-SLx is a PCI/104-Express Type 1 Single Board Computer (SBC) featuring the 64-bit Intel® 6th Core™ i3 processor (formerly Skylake-H), supported by the Intel® CM236 Chipset. The CMx-SLx is specifically designed for customers who need high-level processing and graphics performance in a long product life solution. The CMx-SLx Intel processor supports Intel Hyper-Threading Technology (i3-6102E = 2 cores, 4 threads) and 8/16 GB of soldered ECC DDR4 memory at 1866/2133 to achieve optimum overall performance. 

Integrated Intel® Generation 9 Graphics includes features such as OpenGL 5.x, OpenCL 2.x, DirectX 2015, DirectX 12, Intel® Clear Video HD Technology, Advanced Scheduler 2.0, 1.0, XPDM support, and DirectX Video Acceleration (DXVA) support for full HEVC/VP8/VP9/AVC/MPEG2 hardware codec. Graphics outputs include single-channel 18/24-bit LVDS (eDP x4lanes optional) and three DDI ports supporting HDMI/DVI/DisplayPort. 

The CMx-SLx is specifically designed for customers with high-performance processing graphics requirements who want to outsource the custom core logic of their systems for reduced development time. The CMx-SLx features one mini DisplayPort (DDI1), one micro HDMI port (DDI2), and one single channel 18/24-bit LVDS port (eDP), two Gigabit Ethernet ports, four USB 2.0 ports, two COM ports, eight GPIOs (from BMC), two SATA 6Gb/s ports, and one onboard SATA SSD supporting SLC (up to 32GB) and MLC (up to 64GB). The module is equipped with an SPI AMI EFI BIOS with CMOS backup, supporting embedded features such as fail safe BIOS, remote console, CMOS backup, hardware monitor, and watchdog timer.

The CMx-SLx is capable of working in the temperature ranges of 0°C~60°C (standard) and -40°C~85°C (extended).

Features:

  • 6th gen. Intel® Core™ Processor (formerly codename: Skylake)
  • Up to 8GB DDR4-ECC soldered memory
  • 3x DDI channels, 1x micro HDMI, 1x mini DP and 1x 18/24 bit single channel LVDS
  • 4x PCIe x1 and 1x PCIe x 16 (PEG) configurable as 1x PCIe x16 or 2x PCIe x8 or 1x PCIe x8 + 2x PCIe x4
  • 2x GbE LAN, 2x SATA 6Gb/s, 1x USB 3.1, 6x USB 2.0, 2x COM, 8x GPIO
  • Supports Smart Embedded Management Agent (SEMA®) functions
  • Extreme rugged operating temperature -40°C to 85°C variant

COM Express Basic Size Type 7 Module with Intel® Xeon D and Pentium® D SoC (formerly Broadwell-DE)

Adlink Express-BD7

MPN:

Express-BD7

Manufacturer L3 Communications

ADLINK

Description:

The Express-BD7 is a COM Express® COM.0 R3.0 Basic Size Type 7 module supporting the 64-bit Intel® Xeon® processor D and Intel® Pentium® D processor system-on-chip (SoC) (formerly Broadwell-DE). The Express-BD7 is specifically designed for customers who need excellent computing performance with balanced power consumption 32PCIe lanes and multiple 10G Ethernet connectivity in a long product life solution. 

The Express-BD7 features Intel® Virtualization Technology (including VT-x, VT-d, EPT), Intel® Hyper-Threading Technology (up to 16 cores, 32 threads), Intel® Trusted Execution Technology, Intel® AES-NI Technology, and DDR4 ECC (or non-ECC) dual-channel memory at 1866/2133/2400 MHz (dependent on SoC SKU) to provide excellent overall performance.

An integrated Intel® 10G Ethernet controller supports two 10GBASE-KR interfaces, relevant sideband signals and NC-SI. The Express-BD7 is designed to serve customers with optimized computing capability per watt and high speed connectivity requirements who want to outsource the custom core logic of their systems for reduced development time.

The Express-BD7 has dual stacked SODIMM sockets supporting up to 32 GB of DDR4 ECC (or non-ECC) memory. Input/output features include 24 PCIe Gen3 lanes, up to 8 PCIe Gen2 lanes, a single onboard Gigabit Ethernet port, USB 3.0/2.0 ports, and SATA 6 Gb/s ports. Support is provided for SMBus and I2C. The module is equipped with SPI AMI EFI BIOS with CMOS backup, supporting embedded features such as remote console, hardware monitor, and watchdog timer.

Features:

  • Up to 16 cores Intel® Xeon D Series SoC (formerly codename: Broadwell-DE)
  • 32 GB Dual Channel DDR4 at 2133/2400 MHz
  • 2 x 10GbE+ GbE and NC-SI
  • Up to 32 PCIe lanes 
  • GbE, 2xSATA 6 Gb/s, 4x USB 3.0/2.0
  • Supports Smart Embedded Management Agent (SEMA) functions
  • Extreme Rugged operating temperature: -40°C to 85°C (for selected SKUs)

COM Express® Type 7 Reference Carrier Board in ATX Form Factor

Adlink Express Base7

MPN:

Express-Base7

Manufacturer L3 Communications

ADLINK

Description:

The new Express-BASE7 is an ATX size COM Express Type 7 reference carrier board. Together with the COM Express Type 7 module of your choice and off the shelf add-on cards, you can quickly emulate the functionality of your desired end product for software development and hardware verification. 

The Express-BASE7 offers one PCIe x16 Express slot with 10GBASE-KR signals for 10GbE Adapter card (Optical and Copper type, up to four ports) and GbE with SDP pin that can be used for communication related application development. NC-SI and Lite version IPMI BMC can be used for remote management related application development. One PCI Express x16 slot, two PCI Express x8 slots, Serial ATA, USB 3.0/2.0 can be used for the system development require many more peripherals.

Features:

  • Supports up to four 10GBASE-KR and associated sideband signals
  • Supports NC-SI interface
  • One PCI Express x16 slot, Two PCI Express x8 slots
  • Supports 10GbE adapter card via PCIe x16 slot
  • Dual BIOS (SPI bus)
  • Conforms to COM Express® Carrier Design Guide

Expandable, fanless embedded computer with 6th Gen Intel® Core™ processor, 1 PCIe x16 + 3 PCI (MVP-6010) or 2 PCIe x16 + 2 PCI (MVP-6020)

MVP-6010 / 6020 series

MPN:

MVP-6010 / 6020 series

Manufacturer L3 Communications

ADLINK

Description:

The MVP-6010/6020 series value line of fanless embedded computing platforms, incorporating the 6th Generation Intel® Core™ processor, provides one PCIex16 and three PCI or two PCIex16 and two PCI expansion slots, 1 mini PCIe slot and single-side access for I/O ports, optimizing easy maintenance in industrial automation environments. The series retains the robust design of all ADLINK MXC/MXE lines, at a new extremely cost-effective price point.

The MVP-6010/6020 series supports dual-channel DDR4 memory for more powerful computing and the Intel® HD Graphics 530 speeds graphics performance. Along with a versatile I/O array and flexible expansion capacity, the MVP-6010/6020 Series fully satisfies all the needs of industrial automation with the performance demanded by vision inspection, motion control, and surveillance applications. Fanless construction not only overcomes contaminant and noise challenges presented by harsh IA environments, the elimination of problematic structural elements that negatively affect MTBF greatly increases life cycle expectations for the platform. 

Features:

  • 6th Generation Intel® Core™ i7/i5/i3 Skylake FCLGA1151 processor + H110 (MVP-6010)/ Q170 (MVP-6020) chipset
  • Dual-channel DDR4 SO-DIMM sockets support up to 32 GB memory
  • 1 PCIex16 and 3 PCI (MVP-6010)/ 2 PCIex16 and 2 PCI (MVP-6020) expansion slots available, supporting Gen3 PCIe cards
  • Support for 2 independent displays with on-board 2x DisplayPort, 1x DVI-D, and 1x VGA ports onboard
  • 6 External USB ports (4x USB 3.0, 2x USB 2.0), 1 internal USB 2.0 port
  • 3 Intel GbE ports with teaming function
  • Built-in 8CH DI and 8CH DO, 2 software-programmable RS-232/422/485 + 2 RS-232 ports
  • Fanless operation from 0°C to 50°C (with 35W CPU), and 0°C to 40°C (with 65W CPU)

Intel® Core™ i7-6820EQ Fanless Embedded Computer

Adlink MXC-6400 Serie Fanless embedded computer

MPN:

MXC-6401D

Manufacturer L3 Communications

ADLINK

Description:

ADLINK is pleased to announce its new MXC-6401D of high-performance expandable fanless embedded computers, featuring 6th generation Intel® Core™ i7-6820EQ processor (codename Skylake) and the QM170 chipset. Featuring leading performance, high storage density from 4 x 2.5 inches SATA drives, and rugged fanless construction withstanding operating shock up to 50G and vibration to 5Grms, the MXC-6401D Series fully meets the needs of intelligent transportation systems for rolling stock, maritime operations, in-vehicle infotainment, and high-speed data processing and mission-critical industrial automation.

View our wide range of Embedded Computer

View our portfolio of Platform and systems

See all products from our supplier Adlink

Features:

  • 6th generation Intel® Core™ i7-6820EQ processor (codename Skylake) with QM170 chipset
  • Dual-channel DDR4 2133MHz SO-DIMM sockets accept up to 32GB of memory
  • Support for up to 3 independent displays, accelerated HW media codecs enabling Ultra HD 4K
  • PCI and 2 PCIe Gen3 x8 (or 1 PCIe Gen3 x16) slots
  • World-class MTBF withstanding up to 5Grm vibration and 50G shock
  • Superior -20°C to 60 (70)°C operating temperature range
  • Front-mounted I/O includes 2x DisplayPort + DVI-I, 3x GbE, 4x COM, 6x USB 3.0, and 16x isolated DI/O
  • 2x 2.5 inch hot-swappable SATA drive bays
  • Remote management from preloaded SEMA 3.0 w/ Cloud Access
  • 4x 2.5 inch SATA III installation capability with RAID 0/1/5/10 support, via 2 hot-swappable 2.5 inch SATA III trays, 2 internal 2.5 inch SATA III ports, and 1 CFast socket

Intel® Core™ i5-6440EQ Fanless Embedded Computer

Adlink MXC-6400 Serie Fanless embedded computer

MPN:

MXC-6402D

Manufacturer L3 Communications

ADLINK

Description:

ADLINK is pleased to announce its new MXC-6402D of high-performance expandable fanless embedded computers, featuring 6th generation Intel® Core™ i5-6440EQ processor (codename Skylake) and the QM170 chipset. Featuring leading performance, high storage density from 4x 2.5 inches SATA drives, and rugged fanless construction withstanding operating shock up to 50G and vibration to 5Grms, the MXC-6402D Series fully meets the needs of intelligent transportation systems for rolling stock, maritime operations, in-vehicle infotainment, and high-speed data processing and mission-critical industrial automation.

View our wide range of Embedded Computer

View our portfolio of Platform and systems

See all products from our supplier Adlink

Features:

  • 6th generation Intel® Core™ i7-6820EQ processor (codename Skylake) with QM170 chipset
  • Dual-channel DDR4 2133MHz SO-DIMM sockets accept up to 32GB of memory
  • Support for up to 3 independent displays, accelerated HW media codecs enabling Ultra HD 4K
  • PCI and 2 PCIe Gen3 x8 (or 1 PCIe Gen3 x16) slots
  • World-class MTBF withstanding up to 5Grm vibration and 50G shock
  • Superior -20°C to 60 (70)°C operating temperature range
  • Front-mounted I/O includes 2x DisplayPort + DVI-I, 3x GbE, 4x COM, 6x USB 3.0, and 16x isolated DI/O
  • 2x 2.5 inch hot-swappable SATA drive bays
  • Remote management from preloaded SEMA 3.0 w/ Cloud Access
  • 4x 2.5 inch SATA III installation capability with RAID 0/1/5/10 support, via 2 hot-swappable 2.5 inch SATA III trays, 2 internal 2.5 inch SATA III ports, and 1 CFast socket

Intel® Core™ i3-6100E Fanless Embedded Computer

Adlink MXC-6400 Serie Fanless embedded computer

MPN:

MXC-6403D

Manufacturer L3 Communications

ADLINK

Description:

ADLINK is pleased to announce its new MXC-6403D of high-performance expandable fanless embedded computers, featuring 6th generation Intel® Core™ i3-6100E processor (codename Skylake) and the QM170 chipset. Featuring leading performance, high storage density from 4x 2.5 inches SATA drives, and rugged fanless construction withstanding operating shock up to 50G and vibration to 5Grms, the MXC-6403D Series fully meets the needs of intelligent transportation systems for rolling stock, maritime operations, in-vehicle infotainment, and high-speed data processing and mission-critical industrial automation.

View our wide range of Embedded Computer

View our portfolio of Platform and systems

See all products from our supplier Adlink

Features:

  • 6th generation Intel® Core™ i7-6820EQ processor (codename Skylake) with QM170 chipset
  • Dual-channel DDR4 2133MHz SO-DIMM sockets accept up to 32GB of memory
  • Support for up to 3 independent displays, accelerated HW media codecs enabling Ultra HD 4K
  • PCI and 2 PCIe Gen3 x8 (or 1 PCIe Gen3 x16) slots
  • World-class MTBF withstanding up to 5Grm vibration and 50G shock
  • Superior -20°C to 60 (70)°C operating temperature range
  • Front-mounted I/O includes 2x DisplayPort + DVI-I, 3x GbE, 4x COM, 6x USB 3.0, and 16x isolated DI/O
  • 2x 2.5 inch hot-swappable SATA drive bays
  • Remote management from preloaded SEMA 3.0 w/ Cloud Access
  • 4x 2.5 inch SATA III installation capability with RAID 0/1/5/10 support, via 2 hot-swappable 2.5 inch SATA III trays, 2 internal 2.5 inch SATA III ports, and 1 CFast socket

6U CompactPCI 5th Generation Intel® Core™ i7 Processor Blade with ECC

Adlink cPCI-6530-BL Serie CompactPCI Processor blade

MPN:

cPCI-6530BLV/5700E/M8-0

Manufacturer L3 Communications

ADLINK

Description:

The cPCI-6530BL is a 6U CompactPCI® processor blade in single-slot (4HP) width form factor featuring enhanced graphics, computing power, energy efficiency, system manageability and data security provided by the quad-core 5th generation Intel® Core™ i7 processor, and soldered and socket type DDR3L-1067/1600 ECC memory up to 32GB. The cPCI-6530BL offers outstanding performance and is an ideal solution for defense, aviation, transportation and industrial applications. The cPCI-6530BLV, and 2x GbE and 1x USB 3.0 port and 1x USB 2.0 port and 2x PMC/XMC slots for the cPCI-6530BL. Graphics support is integrated on the CPU and supports 3 independent displays when mated with selected rear transition modules (cPCI-R6500). Storage for both cPCI-6530BLV and cPCI-6530BL versions includes an mSATA slot and a SATA 7-pin connector. The cPCI-6530BLV provides an additional SATA connector to support an onboard 2.5inches SATA drive or CFast adapter.

For expansion cPCI-6530BLV is equipped with one 64-bit/33, 66,133MHz PMC site or one PCIe x8 Gen 2 XMC site with rear I/O.

The cPCI-6530BL offers outstanding performance provided by the 5th generation Intel® Core™ processor family. For applications requiring enhanced processing power, the cPCI-6530BL can be mated with the cPCI-R65N0 RTM to provide accelerated processing using a CUDA GPGPU. The ADLINK cPCI-6530BL provides high flexibility, supporting operation in peripheral slots with CompactPCI bus communication (Universal mode) and as a standalone computer if there is no CPU blade in the host slot. Internet remote manageability includes IPMI for system health monitoring over Internet and a GbE port on the faceplate supports Intel® AMT 9.0 for remote monitoring. The cPCI-6530BL Series is an ideal solution for military, aerospace, transportation and other industrial applications that require best value per watt computing power.

View our wide range of Single Board Computers

View our portfolio of cPCI / cPCIe

See all products from our supplier Adlink

Features:

  • Quad-core 5th/4th Generation Intel® Core™ processor with ECC
  • Dual channel DDR3L ECC memory, soldered and SO-CDIMM, up to 32GB
  • Supports three independent displays
  • Dual PMC/XMC sites
  • Remote management and TPM support

6U 4HP CompactPCI® Intel® Xeon® D-1539 Processor 1.6GHz Blade with AMD Radeon™ E8860 GPU

Adlink cPCI-6940L Serie CompactPCI Processor blade

MPN:

cPCI-6940/D1539/M16-0

Manufacturer L3 Communications

ADLINK

Description:

The cPCI-6940/D1539/M16-0 is a 6U CompactPCI® processor blade featuring the latest server class 14nm Intel® Xeon® D-1539 processor 1.6GHz (formerly "Broadwell-DE") with up to 16-cores and 16GB DDR4-2133 ECC soldered memory plus 2x SODIMM supporting up to 32GB of DDR4-2133 ECC socket type memory (total of up to 48GB) that is ideal for applications requiring high performance or virtualization capabilities. With the latest 14nm processor technology, the cPCI-6940 boosts computing power and supports the most demanding server and workstation applications.

Graphics is enhanced by an onboard AMD Embedded Radeon™ E8860 GPU to provide parallel computing power and an improved graphics experience.

The cPCI-6940 Series is a 6U CompactPCI blade in single slot (4HP) width form factor. Front panel I/O for the 4HP cPCI-6940 includes 2x GbE, 1x DisplayPort and 1x VGA, 2x USB 3.0 ports and 1x DB-9 COM port. Rear I/O signals include two GbE for PICMG 2.16, 2x DVI-I, 1x VGA (switched from front), 4x USB 2.0 and 2 USB 3.0, PS/2 keyboard/mouse, 3x COM, HD Audio, and 4x SATA. ADLINK also provides a rich selection of rear transition modules (RTM) for customers to choose from according to their application needs.

Storage options include SATA 6Gb/s direct connectors to support up to two 2.5 inches SATA drives. For expansion, the cPCI-6940 is equipped with one PCIe x4 Gen2 to J5 and PCIe x16 Gen3 to J4 through optional UHM (shared with PCIe x8 XMC on layer 2).

The cPCI-6940 Series offers outstanding performance provided by the Intel® Xeon® Processor D-1500 family and is an ideal solution for military or other computing demanding applications that require better value per watt computing power as well as providing higher flexibility with support for operation in peripheral slots in satellite mode.

View our wide range of Single Board Computers

View our portfolio of cPCI / cPCIe

See all products from our supplier Adlink

Features:

  • 14nm multi-core Intel® Xeon® D-1539 processor 1.6GHz
  • 16GB DDR4-2133 ECC soldered memory with DP, VGA, 2x GbE, COM, 2x USB 3.0, onboard SATA slot
  • Integrated AMD Radeon™ E8860 GPU onboard supporting DirectX 11.1, OpenGL 4.2, OpenCL 1.2
  • PCIe x16 to J4 UHM connector for rear expansion
  • Extended temperature with Xeon® server grade processor

6U 8HP CompactPCI® Intel® Xeon® D-1577 Processor 1.3GHz Blade with AMD Radeon™ E8860 GPU

Adlink cPCI-6940L Serie CompactPCI Processor blade

MPN:

cPCI-6940DH/D1577/M16-0

Manufacturer L3 Communications

ADLINK

Description:

The cPCI-6940DH/D1577/M16-0 is a 6U CompactPCI® processor blade featuring the latest server class 14nm Intel ® Xeon® D-1577 processor 1.3GHz (formerly "Broadwell-DE") with up to 16-cores and 16GB DDR4-2133 ECC soldered memory plus 2x SODIMM supporting up to 32GB of DDR4-2133 ECC socket type memory (total of up to 48GB) that is ideal for applications requiring high performance or virtualization capabilities. With the latest 14nm processor technology, the cPCI-6940 boosts computing power and supports the most demanding server and workstation applications.

Graphics is enhanced by an onboard AMD Embedded Radeon™ E8860 GPU to provide parallel computing power and an improved graphics experience.

The cPCI-6940D Series is a 6U CompactPCI blade in dual-slot (8HP) width form factor. The 8HP cPCI-6940D provides flexibility to have two 10G SFP+ ports, additional hard drive space and XMC expansion space. Rear I/O signals include two GbE for PICMG 2.16, 2x DVI-I, 1x VGA (switched from front), 4x USB 2.0 and 2 USB 3.0, PS/2 keyboard/mouse, 3x COM, HD Audio, and 4x SATA. ADLINK also provides a rich selection of rear transition modules (RTM) for customers to choose from according to their application needs.

Storage options include SATA 6Gb/s direct connectors to support up to two 2.5 inches SATA drives. For expansion, the cPCI-6940 is equipped with one PCIe x4 Gen2 to J5 and PCIe x16 Gen3 to J4 through optional UHM (shared with PCIe x8 XMC on layer 2).

The cPCI-6940 Series offers outstanding performance provided by the Intel® Xeon® Processor D-1500 family and is an ideal solution for military or other computing demanding applications that require better value per watt computing power as well as providing higher flexibility with support for operation in peripheral slots in satellite mode.

View our wide range of Single Board Computers

View our portfolio of cPCI / cPCIe

See all products from our supplier Adlink

Features:

  • 14nm multi-core Intel® Xeon® D-1577 processor 1.3GHz
  • 16GB DDR4-2133 ECC soldered memory with DP, VGA,2x GbE, COM, 2x USB 3.0, 10G SFP+ x2, audio, 2x 2.5 inches SATA space
  • Integrated AMD Radeon™ E8860 GPU onboard supporting DirectX 11.1, OpenGL 4.2, OpenCL 1.2
  • Dual 10G SFP+ ports on front panel
  • PCIe x16 to J4 UHM connector for rear expansion
  • Extended temperature with Xeon® server grade processor

6U 8HP CompactPCI® Intel® Xeon® D-1559 Processor 1.3GHz Blade with AMD Radeon™ E8860 GPU

Adlink cPCI-6940L Serie CompactPCI Processor blade

MPN:

cPCI-6940DH/D1559/M16-0

Manufacturer L3 Communications

ADLINK

Description:

The cPCI-6940DH/D1559/M16-0 is a 6U CompactPCI® processor blade featuring the latest server class 14nm Intel® Xeon® D-1559 processor 1.3GHz (formerly "Broadwell-DE") with up to 16-cores and 16GB DDR4-2133 ECC soldered memory plus 2x SODIMM supporting up to 32GB of DDR4-2133 ECC socket type memory (total of up to 48GB) that is ideal for applications requiring high performance or virtualization capabilities. With the latest 14nm processor technology, the cPCI-6940 boosts computing power and supports the most demanding server and workstation applications.

Graphics is enhanced by an onboard AMD Embedded Radeon™ E8860 GPU to provide parallel computing power and an improved graphics experience.

The cPCI-6940D Series is a 6U CompactPCI blade in dual-slot (8HP) width form factor. The 8HP cPCI-6940D provides flexibility to have two 10G SFP+ ports, additional hard drive space and XMC expansion space. Rear I/O signals include two GbE for PICMG 2.16, 2x DVI-I, 1x VGA (switched from front), 4x USB 2.0 and 2 USB 3.0, PS/2 keyboard/mouse, 3x COM, HD Audio, and 4x SATA. ADLINK also provides a rich selection of rear transition modules (RTM) for customers to choose from according to their application needs.

Storage options include SATA 6Gb/s direct connectors to support up to two 2.5 inches SATA drives. For expansion, the cPCI-6940 is equipped with one PCIe x4 Gen2 to J5 and PCIe x16 Gen3 to J4 through optional UHM (shared with PCIe x8 XMC on layer 2).

The cPCI-6940 Series offers outstanding performance provided by the Intel® Xeon® Processor D-1500 family and is an ideal solution for military or other computing demanding applications that require better value per watt computing power as well as providing higher flexibility with support for operation in peripheral slots in satellite mode.

View our wide range of Single Board Computers

View our portfolio of cPCI / cPCIe

See all products from our supplier Adlink

Features:

  • 14nm multi-core Intel® Xeon® D-1559 processor 1.3GHz
  • 16GB DDR4-2133 ECC soldered memory with DP, VGA,2x GbE, COM, 2x USB 3.0, 10G SFP+ x2, audio, 2x 2.5inches SATA space
  • Integrated AMD Radeon™ E8860 GPU onboard supporting DirectX 11.1, OpenGL 4.2, OpenCL 1.2
  • Dual 10G SFP+ ports on front panel
  • PCIe x16 to J4 UHM connector for rear expansion
  • Extended temperature with Xeon® server grade processor

6U 8HP CompactPCI® Intel® Xeon® D-1577 Processor 1.3GHz Blade with AMD Radeon™ E8860 GPU

Adlink cPCI-6940L Serie CompactPCI Processor blade

MPN:

cPCI-6940DX/D1577/M16-0

Manufacturer L3 Communications

ADLINK

Description:

The cPCI-6940DX/D1577/M16-0 is a 6U CompactPCI® processor blade featuring the latest server class 14nm Intel® Xeon® D-1577 processor 1.3GHz (formerly "Broadwell-DE") with up to 16-cores and 16GB DDR4-2133 ECC soldered memory plus 2x SODIMM supporting up to 32GB of DDR4-2133 ECC socket type memory (total of up to 48GB) that is ideal for applications requiring high performance or virtualization capabilities. With the latest 14nm processor technology, the cPCI-6940 boosts computing power and supports the most demanding server and workstation applications.

Graphics is enhanced by an onboard AMD Embedded Radeon™ E8860 GPU to provide parallel computing power and an improved graphics experience.

The cPCI-6940D Series is a 6U CompactPCI blade in dual-slot (8HP) width form factor. The 8HP cPCI-6940D provides flexibility to have two 10G SFP+ ports, additional hard drive space and XMC expansion space. Rear I/O signals include two GbE for PICMG 2.16, 2x DVI-I, 1x VGA (switched from front), 4x USB 2.0 and 2 USB 3.0, PS/2 keyboard/mouse, 3x COM, HD Audio, and 4x SATA. ADLINK also provides a rich selection of rear transition modules (RTM) for customers to choose from according to their application needs.

Storage options include SATA 6Gb/s direct connectors to support up to two 2.5 inches SATA drives. For expansion, the cPCI-6940 is equipped with one PCIe x4 Gen2 to J5 and PCIe x16 Gen3 to J4 through optional UHM (shared with PCIe x8 XMC on layer 2).

The cPCI-6940 Series offers outstanding performance provided by the Intel® Xeon® Processor D-1500 family and is an ideal solution for military or other computing demanding applications that require better value per watt computing power as well as providing higher flexibility with support for operation in peripheral slots in satellite mode.

View our wide range of Single Board Computers

View our portfolio of cPCI / cPCIe

See all products from our supplier Adlink

Features:

  • 14nm multi-core Intel® Xeon® D-1577 processor 1.3GHz
  • 16GB DDR4-2133 ECC soldered memory with DP, VGA,2x GbE, COM, 2x USB 3.0, 10G SFP+ x2, audio, XMC slot
  • Integrated AMD Radeon™ E8860 GPU onboard supporting DirectX 11.1, OpenGL 4.2, OpenCL 1.2
  • Dual 10G SFP+ ports on front panel
  • PCIe x16 to J4 UHM connector for rear expansion
  • Extended temperature with Xeon® server grade processor

6U 8HP CompactPCI® Intel® Xeon® D-1559 Processor 1.5GHz Blade with AMD Radeon™ E8860 GPU

Adlink cPCI-6940L Serie CompactPCI Processor blade

MPN:

cPCI-6940DX/D1559/M16-0

Manufacturer L3 Communications

ADLINK

Description:

The cPCI-6940DX/D1559/M16-0 is a 6U CompactPCI® processor blade featuring the latest server class 14nm Intel® Xeon® D-1559 processor 1.5GHz (formerly "Broadwell-DE") with up to 16-cores and 16GB DDR4-2133 ECC soldered memory plus 2x SODIMM supporting up to 32GB of DDR4-2133 ECC socket type memory (total of up to 48GB) that is ideal for applications requiring high performance or virtualization capabilities. With the latest 14nm processor technology, the cPCI-6940 boosts computing power and supports the most demanding server and workstation applications.

Graphics is enhanced by an onboard AMD Embedded Radeon™ E8860 GPU to provide parallel computing power and an improved graphics experience.

The cPCI-6940D Series is a 6U CompactPCI blade in dual-slot (8HP) width form factor. The 8HP cPCI-6940D provides flexibility to have two 10G SFP+ ports, additional hard drive space and XMC expansion space. Rear I/O signals include two GbE for PICMG 2.16, 2x DVI-I, 1x VGA (switched from front), 4x USB 2.0 and 2 USB 3.0, PS/2 keyboard/mouse, 3x COM, HD Audio, and 4x SATA. ADLINK also provides a rich selection of rear transition modules (RTM) for customers to choose from according to their application needs.

Storage options include SATA 6Gb/s direct connectors to support up to two 2.5 inches SATA drives. For expansion, the cPCI-6940 is equipped with one PCIe x4 Gen2 to J5 and PCIe x16 Gen3 to J4 through optional UHM (shared with PCIe x8 XMC on layer 2).

The cPCI-6940 Series offers outstanding performance provided by the Intel® Xeon® Processor D-1500 family and is an ideal solution for military or other computing demanding applications that require better value per watt computing power as well as providing higher flexibility with support for operation in peripheral slots in satellite mode.

View our wide range of Single Board Computers

View our portfolio of cPCI / cPCIe

See all products from our supplier Adlink

Features:

  • 14nm multi-core Intel® Xeon® D-1559 processor 1.5GHz
  • 16GB DDR4-2133 ECC soldered memory with DP, VGA,2x GbE, COM, 2x USB 3.0, 2x 10G SFP+, audio, XMC slot
  • Integrated AMD Radeon™ E8860 GPU onboard supporting DirectX 11.1, OpenGL 4.2, OpenCL 1.2
  • Dual 10G SFP+ ports on front panel
  • PCIe x16 to J4 UHM connector for rear expansion
  • Extended temperature with Xeon® server grade processor

6U CompactPCI 5th Generation Intel® Core™ i7 Processor Blade with ECC

Adlink cPCI-6530-BL Serie CompactPCI Processor blade

MPN:

cPCI-6530BL/5700E/M8-0

Manufacturer L3 Communications

ADLINK

Description:

The cPCI-6530BL is a 6U CompactPCI® processor blade in single-slot (4HP) width form factor featuring enhanced graphics, computing power, energy efficiency, system manageability and data security provided by the quad-core 5th generation Intel® Core™ i7 processor, and soldered and socket type DDR3L-1067/1600 ECC memory up to 32GB. The cPCI-6530BL offers outstanding performance and is an ideal solution for defense, aviation, transportation and industrial applications. The cPCI-6530BL front panel I/O options include 1x DVI-I, 2x GbE and 2x USB 3.0 ports, 1x USB 2.0 port, 1x RJ-45 COM port, and 2x GbE and 1x USB 3.0 port and 1x USB 2.0 port and 2x PMC/XMC slots.

Graphics support is integrated on the CPU and supports 3 independent displays when mated with selected rear transition modules (cPCI-R6500). Storage for cPCI-6530BL includes a mSATA slot and a SATA 7-pin connector.

For expansion cPCI-6530BL is equipped with one 64-bit/33, 66,133MHz PMC site or one PCIe x8 Gen 2 XMC site with rear I/O. The cPCI-6530BL is equipped with an additional PMC/XMC slot supporting PCI 64-bit/133MHz PMC site or one PCIe x8 Gen 2 XMC site. Rear I/O signals to the RTM include 2x GbE, 1x DVI-I, 1x PCIe x4 (configurable to 4x PCIe x1), 3x SATA 3 Gb/s, and 6x USB 2.0., 5x GPIO, high definition audio, KB/MS, and 2x serial ports (one supports Tx/Rx only). The PMC/XMC signals on the cPCI-6530BL can also be routed to the RTM.

The cPCI-6530BL offers outstanding performance provided by the 5th generation Intel® Core™ processor family. For applications requiring enhanced processing power, the cPCI-6530BL can be mated with the cPCI-R65N0 RTM to provide accelerated processing using a CUDA GPGPU. The ADLINK cPCI-6530BL provides high flexibility, supporting operation in peripheral slots with CompactPCI bus communication (Universal mode) and as a standalone computer if there is no CPU blade in the host slot. Internet remote manageability includes IPMI for system health monitoring over Internet and a GbE port on the faceplate supports Intel® AMT 9.0 for remote monitoring. The cPCI-6530BL Series is an ideal solution for military, aerospace, transportation and other industrial applications that require best value per watt computing power.

View our wide range of Single Board Computers

View our portfolio of cPCI / cPCIe

See all products from our supplier Adlink

Features:

  • Quad-core 5th/4th Generation Intel® Core™ processor with ECC
  • Dual channel DDR3L ECC memory, soldered and SO-CDIMM, up to 32GB
  • Supports three independent displays
  • Dual PMC/XMC sites
  • Remote management and TPM support

6U 4HP CompactPCI® Intel® Xeon® D-1559 Processor 1.5GHz Blade with AMD Radeon™ E8860 GPU

Adlink cPCI-6940L Serie CompactPCI Processor blade

MPN:

cPCI-6940/D1559/M16-0

Manufacturer L3 Communications

ADLINK

Description:

The cPCI-6940/D1559/M16-0 is a 6U CompactPCI® processor blade featuring the latest server class 14nm Intel® Xeon® D-1559 processor 1.5GHz (formerly "Broadwell-DE") with up to 16-cores and 16GB DDR4-2133 ECC soldered memory plus 2x SODIMM supporting up to 32GB of DDR4-2133 ECC socket type memory (total of up to 48GB) that is ideal for applications requiring high performance or virtualization capabilities. With the latest 14nm processor technology, the cPCI-6940 boosts computing power and supports the most demanding server and workstation applications.

Graphics is enhanced by an onboard AMD Embedded Radeon™ E8860 GPU to provide parallel computing power and an improved graphics experience.

The cPCI-6940 Series is a 6U CompactPCI blade in single slot (4HP) width form factor. Front panel I/O for the 4HP cPCI-6940 includes 2x GbE, 1x DisplayPort and 1x VGA, 2x USB 3.0 ports and 1x DB-9 COM port. Rear I/O signals include two GbE for PICMG 2.16, 2x DVI-I, 1x VGA (switched from front), 4x USB 2.0 and 2 USB 3.0, PS/2 keyboard/mouse, 3x COM, HD Audio, and 4x SATA. ADLINK also provides a rich selection of rear transition modules (RTM) for customers to choose from according to their application needs.

Storage options include SATA 6Gb/s direct connectors to support up to two 2.5 inches SATA drives. For expansion, the cPCI-6940 is equipped with one PCIe x4 Gen2 to J5 and PCIe x16 Gen3 to J4 through optional UHM (shared with PCIe x8 XMC on layer 2).

The cPCI-6940 Series offers outstanding performance provided by the Intel® Xeon® Processor D-1500 family and is an ideal solution for military or other computing demanding applications that require better value per watt computing power as well as providing higher flexibility with support for operation in peripheral slots in satellite mode.

View our wide range of Single Board Computers

View our portfolio of cPCI / cPCIe

See all products from our supplier Adlink

Features:

  • 14nm multi-core Intel® Xeon® D-1559 processor 1.5GHz
  • 16GB DDR4-2133 ECC soldered memory with DP, VGA, 2x GbE, COM, 2x USB 3.0, onboard SATA slot
  • Integrated AMD Radeon™ E8860 GPU onboard supporting DirectX 11.1, OpenGL 4.2, OpenCL 1.2
  • PCIe x16 to J4 UHM connector for rear expansion
  • Extended temperature with Xeon® server grade processor

2U Rackmount MICA Network Appliance with Intel® Xeon® E5-2630 v3 Processor

Adlink CSA-7200 Serie MICA Network Appliance

MPN:

CSA-7200-0001

Manufacturer L3 Communications

ADLINK

Description:

Adlink' CSA-7200-0001 2U 19" MICA Network Appliance with Intel® Xeon® Processor E5-2630 v3/v4 and Intel® C610 Chipset. The CSA-7200 family is the first product based on Modular Industrial Cloud Architecture (MICA). The CSA-7200 features an IO intensive architecture with up to 64x SFP+ ports, high scalability with four Network Interface Module (NIM) slots, 2.5 inches SATA drive bays, additional storage interfaces (M.2 SSD), and is an ideal platform for communications infrastructure deployment.

View our wide range of Network products

View our portfolio of Platform and systems

See all products from our supplier Adlink

Features:

  • Modular Industrial Cloud Architecture (MICA) platform
  • Advanced LAN bypass features; bypass modes of each NIM can be set independently through BIOS or IPMI interface
  • 12x DDR4 memory slots for up to 192GB memory to meet the requirement of network packet processing
  • 3x 2.5" hot-swappable SATA drive bays, supports additional storage expansion via PCIe or M.2
  • Intelligent system management compatible with IPMI 2.0, supports SOL and adaptive fan speeds
  • Support for PacketManager software to provide data plane software stacks for dynamic layer 3 forwarding and flow-based forwarding, accelerating development of customer applications
  • Integrates Wind River® Titanium Server, and open source software including Intel® DPDK, Open vSwitch and nDPI, facilitating the building of packet parsing applications

2U Rackmount MICA Network Appliance with Intel® Xeon® E5-2680 v3 Processor

Adlink CSA-7200 Serie MICA Network Appliance

MPN:

CSA-7200-0002

Manufacturer L3 Communications

ADLINK

Description:

Adlink' CSA-7200-0002 2U 19" MICA Network Appliance with Intel® Xeon® Processor E5-2680 v3/v4 and Intel® C610 Chipset. The CSA-7200 family is the first product based on Modular Industrial Cloud Architecture (MICA). The CSA-7200 features an IO intensive architecture with up to 64x SFP+ ports, high scalability with four Network Interface Module (NIM) slots, 2.5 inches’ SATA drive bays, additional storage interfaces (M.2 SSD), and is an ideal platform for communications infrastructure deployment.

View our wide range of Network products

View our portfolio of Platform and systems

See all products from our supplier Adlink

Features:

  • Modular Industrial Cloud Architecture (MICA) platform
  • Advanced LAN bypass features; bypass modes of each NIM can be set independently through BIOS or IPMI interface
  • 12x DDR4 memory slots for up to 192GB memory to meet the requirement of network packet processing
  • 3x 2.5" hot-swappable SATA drive bays, supports additional storage expansion via PCIe or M.2
  • Intelligent system management compatible with IPMI 2.0, supports SOL and adaptive fan speeds
  • Support for PacketManager software to provide data plane software stacks for dynamic layer 3 forwarding and flow-based forwarding, accelerating development of customer applications
  • Integrates Wind River® Titanium Server, and open source software including Intel® DPDK, Open vSwitch and nDPI, facilitating the building of packet parsing applications

Qseven module with Intel® Celeron N3060, Dual core,2 GB DDR3L, 8 GB eMMC, 0°C to 60°C

Adlink Q7-BW Series Series Computer on-module

MPN:

Q7-BW21-2G-8G-CT

Manufacturer L3 Communications

ADLINK

Description:

The Q7-BW21-2G-8G-CT Qseven is a 70 mm x 70 mm Qseven module with Intel® Celeron™ Processor N3060 Serie System-on-Chip which supports multiple displays with ultra HD graphics resolution. The low power envelope of the N3000 Series System-on-Chip (from 4W to 6W CPU TDP) enables smaller, quieter and cleaner systems.

Although small in size, the Q7-BW provides a wide variety of I/O interfaces to enable development of new and innovative applications, including high-speed interfaces such as 3x PCIe x1 Gen 2, 2x SATA3 6Gb/s, GbE, 1x USB 3.0 host, 6x USB 2.0 host and modern interfaces such as 1x SPI, 1x I2C, HDA, 2x MIPI CSI camera interface, dual channel LVDS (18/24-bit), 1x SDIO 3.0, and 1x UART (incl. RTS/CTS) serial port, 1x SMBus, 1x LPC and 1x DB40.

ADLINK´s Q7-BW provides enhanced Intel® Gen8 graphics support of DirectX 11.1, OpenGL 4.2 and OpenCL 1.2 and high-performance, hardware-accelerated video decoding of H.265/HEVC. Up to 4K (3840 x 2160 pixels) resolution is supported by either DisplayPort or HDMI interfaces. The Q7-BW includes an optional pinout which replaces the LVDS interface by two sets of Embedded DisplayPort signals. This separate configuration allows to operate three independent displays.

View our wide range of Computer-on-Module

View our portfolio of Embedded computing

See all products from our supplier Adlink

Features:

  • Intel® Celeron™ Processor N3060 Series SoC (codename: Braswell)
  • 2x 64bit memory channel with up to 8GB DDR3L at 1600 MHz
  • Dual channel LVDS, HDMI/DP
  • 2x MIPI CSI camera interface, 3x PCIe, GbE
  • 2x SATA3 or 1x SATA and 1x SATA-SSD (optional)
  • 1x USB 3.0 host, 6x USB 2.0 host, SPI, I2C, HDA, UART, LPC, SMBus
  • Accessories: Q7-BW-HS Heatspreader for Q7-BW / Q7-BW-HS2 Passive heatsink for Q7-BW, 0°C to 60°C

SMARC Short Size Module with Intel® Pentium N3710, Quad Core, 4 GB DDR3L, 0°C to 60°C

Adlink LEC-BW SMARC Series Computer on-module

MPN:

LEC-BW42-4G-CT

Manufacturer L3 Communications

ADLINK

Description:

The LEC-BW42-4G-CT is a SMARC Short Size Module with Intel® Pentium N3710, Quad Core, 4 GB DDR3L operating from 0°C to 60°C. The SMARC (Smart Mobility ARChitecture) is a versatile small form factor computer Module definition targeting applications that require low power, low costs, and high performance. The ADLINK LEC-BW (Braswell) computer-on-module with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications.

View our wide range of Computer-on-Module

View our portfolio of Embedded computing

See all products from our supplier Adlink

Features:

  • Quad-core Intel® Pentium™ N3710 SoC (codename: Braswell)
  • Up to 8 GB DDR3L at 1333/1600 MT/s
  • Single channel LVDS, HDMI/DP
  • 2x MIPI CSI camera interfaces, GbE, 3x PCIe
  • 1x SDIO, 2x SATA3, 1x USB 3.0 host, 4x USB 2.0 host, 12x GPIO, 2x SPI, 4x I2C, 1x eMMC
  • Accessories available: LEC-BW-HS Heatspreader /LEC-BW-HS2 Passive Heatsink

SMARC Short Size Module with Intel® Celeron N3060, Dual core, 2 GB DDR3L, 0°C to 60°C

Adlink LEC-BW SMARC Series Computer on-module

MPN:

LEC-BW22-2G-CT

Manufacturer L3 Communications

ADLINK

Description:

The LEC-BW22-2G-CT is a SMARC Short Size Module with Intel® Celeron N3060, Dual Core, 2 GB DDR3L operating from 0°C to 60°C. The SMARC (Smart Mobility ARChitecture) is a versatile small form factor computer Module definition targeting applications that require low power, low costs, and high performance. The ADLINK LEC-BW (Braswell) computer-on-module with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications.

View our wide range of Computer-on-Module

View our portfolio of Embedded computing

See all products from our supplier Adlink

Features:

  • Dual or quad-core Intel® Celeron™ Processor N3060 Series SoC (codename: Braswell)
  • Up to 8 GB DDR3L at 1333/1600 MT/s
  • Single channel LVDS, HDMI/DP
  • 2x MIPI CSI camera interfaces, GbE, 3x PCIe
  • 1x SDIO, 2x SATA3, 1x USB 3.0 host, 4x USB 2.0 host, 12x GPIO, 2x SPI, 4x I2C, 1x eMMC
  • Accessories available: LEC-BW-HS Heatspreader /LEC-BW-HS2 Passive Heatsink

SMARC Short Size Module with Intel® Celeron N3160, Quad core, 4 GB DDR3L, 0°C to 60°C

Adlink LEC-BW SMARC Series Computer on-module

MPN:

LEC-BW41-4G-CT

Manufacturer L3 Communications

ADLINK

Description:

The LEC-BW41-4G-CT is a SMARC Short Size Module with Intel® Celeron N3160, Quad Core, 4 GB DDR3L operating from 0°C to 60°C. The SMARC (Smart Mobility ARChitecture) is a versatile small form factor computer Module definition targeting applications that require low power, low costs, and high performance. The ADLINK LEC-BW (Braswell) computer-on-module with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications.

View our wide range of Computer-on-Module

View our portfolio of Embedded computing

See all products from our supplier Adlink

Features:

  • Quad-core Intel® Celeron™ Processor N3160 Series SoC (codename: Braswell)
  • Up to 8 GB DDR3L at 1333/1600 MT/s
  • Single channel LVDS, HDMI/DP
  • 2x MIPI CSI camera interfaces, GbE, 3x PCIe
  • 1x SDIO, 2x SATA3, 1x USB 3.0 host, 4x USB 2.0 host, 12x GPIO, 2x SPI, 4x I2C, 1x eMMC
  • Accessories available: LEC-BW-HS Heatspreader /LEC-BW-HS2 Passive Heatsink

SMARC Short Size Module with Intel® Celeron N3010, Dual core, 2 GB DDR3L, 0°C to 60°C

Adlink LEC-BW SMARC Series Computer on-module

MPN:

LEC-BW21-2G-CT

Manufacturer L3 Communications

ADLINK

Description:

The LEC-BW21-2G-CT is a SMARC Short Size Module with Intel® Celeron N3010, Dual Core, 2 GB DDR3L operating from 0°C to 60°C. The SMARC (Smart Mobility ARChitecture) is a versatile small form factor computer Module definition targeting applications that require low power, low costs, and high performance. The ADLINK LEC-BW (Braswell) computer-on-module with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications.

View our wide range of Computer-on-Module

View our portfolio of Embedded computing

See all products from our supplier Adlink

Features:

  • Dual or quad-core Intel® Celeron™ Processor N3010 Series SoC (codename: Braswell)
  • Up to 8 GB DDR3L at 1333/1600 MT/s
  • Single channel LVDS, HDMI/DP
  • 2x MIPI CSI camera interfaces, GbE, 3x PCIe
  • 1x SDIO, 2x SATA3, 1x USB 3.0 host, 4x USB 2.0 host, 12x GPIO, 2x SPI, 4x I2C, 1x eMMC
  • Accessories available: LEC-BW-HS Heatspreader /LEC-BW-HS2 Passive Heatsink

Qseven module with Intel® Celeron N3160, Quad core,4 GB DDR3L, 8 GB SATA SSD, 0°C to 60°C

Adlink Q7-BW Series Series Computer on-module

MPN:

Q7-BW42-4G-8GS-CT

Manufacturer L3 Communications

ADLINK

Description:

The Q7-BW42-4G-8GS-CT Qseven is a 70 mm x 70 mm Qseven module with Intel® Celeron™ Processor N3160 Serie System-on-Chip which supports multiple displays with ultra HD graphics resolution. The low power envelope of the N3000 Series System-on-Chip (from 4W to 6W CPU TDP) enables smaller, quieter and cleaner systems.

Although small in size, the Q7-BW provides a wide variety of I/O interfaces to enable development of new and innovative applications, including high-speed interfaces such as 3x PCIe x1 Gen 2, 2x SATA3 6Gb/s, GbE, 1x USB 3.0 host, 6x USB 2.0 host and modern interfaces such as 1x SPI, 1x I2C, HDA, 2x MIPI CSI camera interface, dual channel LVDS (18/24-bit), 1x SDIO 3.0, and 1x UART (incl. RTS/CTS) serial port, 1x SMBus, 1x LPC and 1x DB40.

ADLINK´s Q7-BW provides enhanced Intel® Gen8 graphics support of DirectX 11.1, OpenGL 4.2 and OpenCL 1.2 and high-performance, hardware-accelerated video decoding of H.265/HEVC. Up to 4K (3840 x 2160 pixels) resolution is supported by either DisplayPort or HDMI interfaces. The Q7-BW includes an optional pinout which replaces the LVDS interface by two sets of Embedded DisplayPort signals. This separate configuration allows to operate three independent displays.

View our wide range of Computer-on-Module

View our portfolio of Embedded computing

See all products from our supplier Adlink

Features:

  • Intel® Celeron™ Processor N3160 Series SoC (codename: Braswell)
  • 2x 64bit memory channel with up to 8GB DDR3L at 1600 MHz
  • Dual channel LVDS, HDMI/DP
  • 2x MIPI CSI camera interface, 3x PCIe, GbE
  • 2x SATA3 or 1x SATA and 1x SATA-SSD (optional)
  • 1x USB 3.0 host, 6x USB 2.0 host, SPI, I2C, HDA, UART, LPC, SMBus
  • Accessories: Q7-BW-HS Heatspreader for Q7-BW / Q7-BW-HS2 Passive heatsink for Q7-BW, 0°C to 60°C

Qseven module with Intel® Pentium N3710, Quad core,4 GB DDR3L, 8 GB eMMC, 0°C to 60°C

Adlink Q7-BW Series Series Computer on-module

MPN:

Q7-BW41-4G-8G-CT

Manufacturer L3 Communications

ADLINK

Description:

The Q7-BW41-4G-8G-CT Qseven is a 70 mm x 70 mm Qseven module with Intel® Pentium™ Processor N3710 Serie System-on-Chip which supports multiple displays with ultra HD graphics resolution. The low power envelope of the N3000 Series System-on-Chip (from 4W to 6W CPU TDP) enables smaller, quieter and cleaner systems.

Although small in size, the Q7-BW provides a wide variety of I/O interfaces to enable development of new and innovative applications, including high-speed interfaces such as 3x PCIe x1 Gen 2, 2x SATA3 6Gb/s, GbE, 1x USB 3.0 host, 6x USB 2.0 host and modern interfaces such as 1x SPI, 1x I2C, HDA, 2x MIPI CSI camera interface, dual channel LVDS (18/24-bit), 1x SDIO 3.0, and 1x UART (incl. RTS/CTS) serial port, 1x SMBus, 1x LPC and 1x DB40.

ADLINK´s Q7-BW provides enhanced Intel® Gen8 graphics support of DirectX 11.1, OpenGL 4.2 and OpenCL 1.2 and high-performance, hardware-accelerated video decoding of H.265/HEVC. Up to 4K (3840 x 2160 pixels) resolution is supported by either DisplayPort or HDMI interfaces. The Q7-BW includes an optional pinout which replaces the LVDS interface by two sets of Embedded DisplayPort signals. This separate configuration allows to operate three independent displays.

View our wide range of Computer-on-Module

View our portfolio of Embedded computing

See all products from our supplier Adlink

Features:

  • Intel® Pentium™ Processor N3710 Serie SoC (codename: Braswell)
  • 2x 64bit memory channel with up to 8GB DDR3L at 1600 MHz
  • Dual channel LVDS, HDMI/DP
  • 2x MIPI CSI camera interface, 3x PCIe, GbE
  • 2x SATA3 or 1x SATA and 1x SATA-SSD (optional)
  • 1x USB 3.0 host, 6x USB 2.0 host, SPI, I2C, HDA, UART, LPC, SMBus
  • Accessories: Q7-BW-HS Heatspreader for Q7-BW / Q7-BW-HS2 Passive heatsink for Q7-BW, 0°C to 60°C

Qseven module with Intel® Celeron N3160, Quad core,4 GB DDR3L, 8 GB eMMC, 0°C to 60°C

Adlink Q7-BW Series Series Computer on-module

MPN:

Q7-BW42-4G-8G-CT

Manufacturer L3 Communications

ADLINK

Description:

The Q7-BW42-4G-8G-CT Qseven is a 70 mm x 70 mm Qseven module with Intel® Celeron™ Processor N3160 Serie System-on-Chip which supports multiple displays with ultra HD graphics resolution. The low power envelope of the N3000 Series System-on-Chip (from 4W to 6W CPU TDP) enables smaller, quieter and cleaner systems.

Although small in size, the Q7-BW provides a wide variety of I/O interfaces to enable development of new and innovative applications, including high-speed interfaces such as 3x PCIe x1 Gen 2, 2x SATA3 6Gb/s, GbE, 1x USB 3.0 host, 6x USB 2.0 host and modern interfaces such as 1x SPI, 1x I2C, HDA, 2x MIPI CSI camera interface, dual channel LVDS (18/24-bit), 1x SDIO 3.0, and 1x UART (incl. RTS/CTS) serial port, 1x SMBus, 1x LPC and 1x DB40.

ADLINK´s Q7-BW provides enhanced Intel® Gen8 graphics support of DirectX 11.1, OpenGL 4.2 and OpenCL 1.2 and high-performance, hardware-accelerated video decoding of H.265/HEVC. Up to 4K (3840 x 2160 pixels) resolution is supported by either DisplayPort or HDMI interfaces. The Q7-BW includes an optional pinout which replaces the LVDS interface by two sets of Embedded DisplayPort signals. This separate configuration allows to operate three independent displays.

View our wide range of Computer-on-Module

View our portfolio of Embedded computing

See all products from our supplier Adlink

Features:

  • Intel® Celeron™ Processor N3160 Serie SoC (codename: Braswell)
  • 2x 64bit memory channel with up to 8GB DDR3L at 1600 MHz
  • Dual channel LVDS, HDMI/DP
  • 2x MIPI CSI camera interface, 3x PCIe, GbE
  • 2x SATA3 or 1x SATA and 1x SATA-SSD (optional)
  • 1x USB 3.0 host, 6x USB 2.0 host, SPI, I2C, HDA, UART, LPC, SMBus
  • Accessories: Q7-BW-HS Heatspreader for Q7-BW / Q7-BW-HS2 Passive heatsink for Q7-BW, 0°C to 60°C

Qseven module with Intel® Celeron N3010, Dual core,2 GB DDR3L, 8 GB eMMC, 0°C to 60°C

Adlink Q7-BW Series Series Computer on-module

MPN:

Q7-BW22-2G-8G-CT

Manufacturer L3 Communications

ADLINK

Description:

The Q7-BW22-2G-8G-CT Qseven is a 70 mm x 70 mm Qseven module with Intel® Celeron™ Processor N3010 Serie System-on-Chip which supports multiple displays with ultra HD graphics resolution. The low power envelope of the N3000 Series System-on-Chip (from 4W to 6W CPU TDP) enables smaller, quieter and cleaner systems.

Although small in size, the Q7-BW provides a wide variety of I/O interfaces to enable development of new and innovative applications, including high-speed interfaces such as 3x PCIe x1 Gen 2, 2x SATA3 6Gb/s, GbE, 1x USB 3.0 host, 6x USB 2.0 host and modern interfaces such as 1x SPI, 1x I2C, HDA, 2x MIPI CSI camera interface, dual channel LVDS (18/24-bit), 1x SDIO 3.0, and 1x UART (incl. RTS/CTS) serial port, 1x SMBus, 1x LPC and 1x DB40.

ADLINK´s Q7-BW provides enhanced Intel® Gen8 graphics support of DirectX 11.1, OpenGL 4.2 and OpenCL 1.2 and high-performance, hardware-accelerated video decoding of H.265/HEVC. Up to 4K (3840 x 2160 pixels) resolution is supported by either DisplayPort or HDMI interfaces. The Q7-BW includes an optional pinout which replaces the LVDS interface by two sets of Embedded DisplayPort signals. This separate configuration allows to operate three independent displays.

View our wide range of Computer-on-Module

View our portfolio of Embedded computing

See all products from our supplier Adlink

Features:

  • Intel® Celeron™ Processor N3010 Series SoC (codename: Braswell)
  • 2x 64bit memory channel with up to 8GB DDR3L at 1600 MHz
  • Dual channel LVDS, HDMI/DP
  • 2x MIPI CSI camera interface, 3x PCIe, GbE
  • 2x SATA3 or 1x SATA and 1x SATA-SSD (optional)
  • 1x USB 3.0 host, 6x USB 2.0 host, SPI, I2C, HDA, UART, LPC, SMBus
  • Accessories: Q7-BW-HS Heatspreader for Q7-BW / Q7-BW-HS2 Passive heatsink for Q7-BW, 0°C to 60°C

21/23 inches Medical Panel PC with 5th gen Core i7 CPU

Adlink MLC5-Series Medical Pane Computer

MPN:

MLC 5-21/23

Manufacturer L3 Communications

ADLINK

Description:

The MLC 5-21/23 medical panel computer offers a 21.5 and 23.8 projected capacitive touchscreen with anti-glare coating for accurate image viewing and optical bonding to prevent condensation, reduce the reflection of light and increase the durability. Using multi touch gesture control is supported, even when wearing protective gloves. The MLC 5-21/23 medical panel computer is with IP65 rated fully sealed aluminum housing protects against dust and liquid intrusion to enable patient monitoring in operating theaters, ICUs or surgical intervention rooms, as well as allowing the use of all common disinfectants and cleaning agents.

View our wide range of Flat Panel Computers

View our portfolio of Embedded computing

See all products from our supplier Adlink

Features:

  • All-in-one high-performance medical panel computer with 5th generation Intel® Core™ i7 processor
  • 21.5" or 23.8" Full HD display with optically bonded PCAP multi-touch touchscreen and anti-glare coated safety glass for unsurpassed visualization capabilities
  • Fully sealed aluminium housing and fanless design for high hygienic standards with IP65 rated fluid protection
  • Versatile I/O interfaces including galvanically isolated options

23 inches Ultra HD Medical Panel PC with 5th gen Core i7 CPU

Adlink MLC5-Series Medical Pane Computer

MPN:

MLC 5-23UHE

Manufacturer L3 Communications

ADLINK

Description:

The MLC 5-23 UHE is Ultra HD display with optical bonded PCAP touchscreen for applications requiring extreme display resolutions. MLC5-23UHE equipped with an 4K Ultra HD display enabling further enhanced displaying capabilities for the most demanding endoscopi capplications. The fully-sealed aluminium housing protects against dust and liquid intrusion for critical patient monitoring in operating theatres, ICUs or surgical intervention rooms, and also allows the use of all commonly used disinfectants and cleaning agents.

View our wide range of Flat Panel Computers

View our portfolio of Embedded computing

See all products from our supplier Adlink

Features:

  • All-in-one high-performance medical panel computer with 5th generation Intel® Core™ i7 processor
  • Ultra HD display with optical bonded PCAP touchscreen for applications requiring extreme display resolutions
  • 23.8" Full HD display with optically bonded PCAP multi-touch touchscreen and anti-glare coated safety glass for unsurpassed visualization capabilities
  • Function keys on the front bezel with reading light / keyboard illumination providing easy functional control with high user comfort
  • Fully sealed aluminium housing and fanless design for high hygienic standards with IP65 rated fluid protection
  • Versatile I/O interfaces including galvanically isolated options

21/23 inches Medical Panel PC with 5th gen Core i7 CPU with function Keys

Adlink MLC5-Series Medical Pane Computer

MPN:

MLC 5-21/23HE

Manufacturer L3 Communications

ADLINK

Description:

The MLC 5-21/23 HE offers a 21.5 and 23.8 inches projected capacitive touchscreen with anti-glare coating for accurate image viewing and optical bonding to prevent condensation, reduce the reflection of light and increase the durability. The MLC 5-21/23 HE medical panel computer is with IP65 rated fully sealed aluminum housing protects against dust and liquid intrusion to enable patient monitoring in operating theaters, ICUs or surgical intervention rooms, as well as allowing the use of all common disinfectants and cleaning agents.

 

View our wide range of Flat Panel Computers

View our portfolio of Embedded computing

See all products from our supplier Adlink

Features:

  • All-in-one high-performance medical panel computer with 5th generation Intel® Core™ i7 processor
  • 21.5" or 23.8" Full HD display with optically bonded PCAP multi-touch touchscreen and anti-glare coated safety glass for unsurpassed visualization capabilities
  • Function keys on the front bezel with reading light / keyboard illumination providing easy functional control with high user comfort
  • Fully sealed aluminium housing and fanless design for high hygienic standards with IP65 rated fluid protection
  • Versatile I/O interfaces including galvanically isolated options

Fanless Embedded Computer, Intel® Core™ i7-6820EQ

Adlink MXE-5500 Series Fanless Embedded computer

MPN:

MXE-5501

Manufacturer L3 Communications

ADLINK

Description:

ADLINK is pleased to announce the release of the new Matrix MXE-5501 fanless embedded computer, featuring 6th generation Intel® Core™ i7 processor (Skylake), delivering outstanding performance with robust construction, rich I/O, user-friendly access in a compact package.

The MXE-5500 sustains reliable performance while at -20°C to 70°C, shock up to 50G, and vibration up to 5Grms, making it is the optimal solution for ITS, surveillance, industrial automation and logistic automation applications. Moreover, MXE-5500’s AFM (adaptive function module) capability offers fast application-specific access for medium volume operations, reducing development time and cost by up to 50%.

View our wide range of Embedded Computer

View our portfolio of Platform and systems

See all products from our supplier Adlink

Features:

  • Powerful yet Compact
  • 6th Generation Intel® Core™ i7 processors (Skylake) in a compact enclosure
  • DDR4 memory support up to 32GB
  • Excellent MTBF, outstanding vibration (5G)/shock (100G) sustainability
  • Superior -20 to 60 (70)°C operating temperature range
  • Easy Maintenance, Easy Management
  • Single side access rich I/O, includes 2x DisplayPort + DVI-I, 4x GbE, 6x COM, 4x USB 3.0+4x USB 2.0, 8x isolated DI/O
  • Dual 2.5 inch hot-swappable SATA drive bays for easy storage maintenance
  • Varied storage options, 2x 2.5" swappable SATA III (6.0 Gb/s), 1x M.2 2280, 1x CFast
  • Remote management with preloaded SEMA 3.0 w/ Cloud Access
  • Scalable & Fast-Customization Speeds Time to Market
  • AFM design provides fast access for application-specific operations
  • Reusable cross-platform I/O simplifies development, reducing Time to Market and TCO

Fanless Embedded Computer, Intel® Core™ i5-6440EQ

Adlink MXE-5500 Series Fanless Embedded computer

MPN:

MXE-5502

Manufacturer L3 Communications

ADLINK

Description:

ADLINK is pleased to announce the release of the new Matrix MXE-5502 fanless embedded computer, featuring 6th generation Intel® Core™ i5 processor (Skylake), delivering outstanding performance with robust construction, rich I/O, user-friendly access in a compact package.

The MXE-5500 sustains reliable performance while at -20°C to 70°C, shock up to 50G, and vibration up to 5Grms, making it is the optimal solution for ITS, surveillance, industrial automation and logistic automation applications. Moreover, MXE-5500’s AFM (adaptive function module) capability offers fast application-specific access for medium volume operations, reducing development time and cost by up to 50%.

View our wide range of Embedded Computer

View our portfolio of Platform and systems

See all products from our supplier Adlink

Features:

  • Powerful yet Compact
  • 6th Generation Intel® Core™ i5 processors (Skylake) in a compact enclosure
  • DDR4 memory support up to 32GB
  • Excellent MTBF, outstanding vibration (5G)/shock (100G) sustainability
  • Superior -20 to 60 (70)°C operating temperature range
  • Easy Maintenance, Easy Management
  • Single side access rich I/O, includes 2x DisplayPort + DVI-I, 4x GbE, 6x COM, 4x USB 3.0+4x USB 2.0, 8x isolated DI/O
  • Dual 2.5 inch hot-swappable SATA drive bays for easy storage maintenance
  • Varied storage options, 2x 2.5" swappable SATA III (6.0 Gb/s), 1x M.2 2280, 1x CFast
  • Remote management with preloaded SEMA 3.0 w/ Cloud Access
  • Scalable & Fast-Customization Speeds Time to Market
  • AFM design provides fast access for application-specific operations
  • Reusable cross-platform I/O simplifies development, reducing Time to Market and TCO

Fanless Embedded Computer, Intel® Core™ i3-6100E

Adlink MXE-5500 Series Fanless Embedded computer

MPN:

MXE-5503

Manufacturer L3 Communications

ADLINK

Description:

ADLINK is pleased to announce the release of the new Matrix MXE-5503 fanless embedded computer, featuring 6th generation Intel® Core™ i3 processor (Skylake), delivering outstanding performance with robust construction, rich I/O, user-friendly access in a compact package.

The MXE-5500 sustains reliable performance while at -20°C to 70°C, shock up to 50G, and vibration up to 5Grms, making it is the optimal solution for ITS, surveillance, industrial automation and logistic automation applications. Moreover, MXE-5500’s AFM (adaptive function module) capability offers fast application-specific access for medium volume operations, reducing development time and cost by up to 50%.

View our wide range of Embedded Computer

View our portfolio of Platform and systems

See all products from our supplier Adlink

Features:

  • Powerful yet Compact
  • 6th Generation Intel® Core™ i3 processors (Skylake) in a compact enclosure
  • DDR4 memory support up to 32GB
  • Excellent MTBF, outstanding vibration (5G)/shock (100G) sustainability
  • Superior -20 to 60 (70)°C operating temperature range
  • Easy Maintenance, Easy Management
  • Single side access rich I/O, includes 2x DisplayPort + DVI-I, 4x GbE, 6x COM, 4x USB 3.0+4x USB 2.0, 8x isolated DI/O
  • Dual 2.5 inch hot-swappable SATA drive bays for easy storage maintenance
  • Varied storage options, 2x 2.5" swappable SATA III (6.0 Gb/s), 1x M.2 2280, 1x CFast
  • Remote management with preloaded SEMA 3.0 w/ Cloud Access
  • Scalable & Fast-Customization Speeds Time to Market
  • AFM design provides fast access for application-specific operations
  • Reusable cross-platform I/O simplifies development, reducing Time to Market and TCO

COM Express Basic Size Type 6 Module with 6th Gen Intel Core, Xeon and Celeron Processors

Adlink Express-SL/SLE Computer on module

MPN:

Express-SL/SLE

Manufacturer L3 Communications

ADLINK

Description:

The ADLINK Express-SL/SLE computer-on-module with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. The Express-SL/SLE is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, determine which data to save locally and which to send to the cloud for further analysis. The results these analyses can provide valuable information for policy decision making and generate innovative business opportunities.

ADLINK's Express-SL conforms to PICMG COM.0 Type 6 Basic Size form factor. It is available with 6th generation Intel® Core™ i7, i5 or i3 processors and accompanying Intel® QM170 and HM170 Chipset. ECC memory is supported by utilizing the Intel® Xeon® processor E3-15XX v5 family and Intel® CM236 chipset. DDR4 memory is supported up to a total of 32GB, with a lower voltage compared to DDR3 resulting in a reduction in overall power consumption and heat dissipation. These new COMs also provide support for three independent UHD/4K displays and are well-suited for applications in automation, medical, and infotainment, with extended operating temperature range optionally available for transportation and defense applications.

View our wide range of Computer-On-Module

View our portfolio of COM boards, starter kits and accessories

See all products from our supplier Adlink

Features:

  • 6th Gen Intel Core, Xeon and Celeron Processor with Intel QM170/HM170/CM236 Chipset (codename: Skylake)
  • Up to 32GB dual channel ECC or non-ECC DDR4 at 2133 MHz
  • 3x DDI channels, 1x LVDS (or 4 lanes eDP), supports up to 3 independent displays
  • 8 PCIe x1 and 1 PCIe x16
  • GbE, 4x SATA 6 Gb/s, 4x USB 3.0 and 4x USB 2.0
  • Supports Smart Embedded Management Agent (SEMA) functions
  • Extreme Rugged operating temperature: -40°C to +85°C (opt.)

COM Express Compact Size Type 6 Module with 6th Gen Intel Core i7/i5/i3 and Celeron 3955U Processors

Adlink cExpress-SL Computer on module

MPN:

cExpress-SL

Manufacturer L3 Communications

ADLINK

Description:

The ADLINK cExpress-SL computer-on-module with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. The cExpress-SL is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, determine which data to save locally and which to send to the cloud for further analysis. The results these analyses can provide valuable information for policy decision making and generate innovative business opportunities.

The cExpress-SL coforms to the PICMG COM.0 Type 6 Compact form factor. The module is available with 6th generation Intel® Core™ i7, i5 or i3 processors and accompanying Intel® QM170 and HM170 Chipset. ECC memory is supported by utilizing the Intel® Xeon® processor E3-15XX v5 family and Intel® CM236 chipset. DDR4 memory is supported up to a total of 32GB, with a lower voltage compared to DDR3 resulting in a reduction in overall power consumption and heat dissipation. These new COMs also provide support for three independent UHD/4K displays and are well-suited for applications in automation, medical, and infotainment, with extended operating temperature range optionally available for transportation and defense applications.

View our wide range of Computer-On-Module

View our portfolio of COM boards, starter kits and accessories

See all products from our supplier Adlink

Features:

  • 6th Generation Intel Core i7/i5/i3 and Celeron 3955U Processors (codename: Skylake)
  • Up to 32GB non-ECC Dual channel DDR4 at 2133/1867 MHz
  • Two DDI channels, one LVDS (or 4 lanes eDP), support up to 3 independent displays
  • Up to 6 PCIe x1 (by build option, up to Gen3 dependent on SKU)
  • GbE, up to 3x SATA 6 Gb/s, 4x USB 3.0 and 4x USB 2.0
  • Supports Smart Embedded Management Agent (SEMA) functions
  • Extreme Rugged operating temperature: -40°C to +85°C (build option)
  • cTDP support on specific SKUs

Robust Fanless Embedded Computer, 6th Generation Intel Core i7-i5-i3

Adlink MVP-6000 Series Fanless Embedded computer

MPN:

MVP-6000 Series

Manufacturer L3 Communications

ADLINK

Description:

ADLINK is pleased to announce the release of the MVP-6000 Series, first in a new value line of fanless embedded computing platforms. Incorporating the 6th Generation Intel® Core™ processor, the MVP-6000’s price point suits practically any industrial automation operation, with its perfect combination of features and performance making it an ideal solution.

The MVP-6000 supports DDR4 memory for more powerful computing, the Intel® HD Graphics 530 enhances graphic performance, and one PCIe x16 slot, one PCI slot, one mPCIe slot and single-side access for I/O ports, resulting in complete satisfaction of industrial automation requirements with the performance demanded by vision inspection and motion control environments.

View our wide range of Embedded Computer

View our portfolio of Platform and systems

See all products from our supplier Adlink

Features:

  • Optimised Fit for Industrial Automation
  • Best combination of price/spec/size
  • Fully compatible with ADLINK’s full spectrum of motion and I/O cards
  • Robust and Reliable
  • Fanless
  • Maximized thermal efficiency for desktop CPU
  • Front I/O access for easy maintenance
  • Superior Computing Performance
  • 30% boost in performance from 6th Generation Intel® Core™ i7/i5/i3 processors
  • Dual-channel DDR4 2133 MHz support
  • 100% increase in graphics performance with the Intel® HD Graphic 530
  • Finally, the MVP-6000 retains the proven robust reliability of ADLINK’s Matrix MXC/MXE lines, overcoming the environmental challenges presented by demanding IA operational fields.

PICMG 1.3, SBC, 6th Gen Intel Core i7-i5-i3, Ultra HD

Adlink NuPRO-E43 PCIMGR

MPN:

NuPRO-E43

Manufacturer L3 Communications

ADLINK

Description:

ADLINK is pleased to announce the release of its new PICMG 1.3 SHB, the NuPRO-E43, supporting the 6th Gen Intel® Core i7/i5/i3 processor and equipped with the Intel® Q170 Express chipset. The ADLINK NuPRO-E43 supports high-speed transfer interfaces such as PCIe3.0, USB 3.0, and SATA 6 Gb/s (SATA III), with dual-channel DDR4 2133 MHz memory up to 32 GB.

Combined dedicated high-bandwidth PCIe x16 Gen3 (can be configured to 2x PCIe x8 or 1x PCIe x8 + 2x PCIex4 to backplane), PCIe x4 and conventional PCI slots enable compatibility with high-speed frame grabbers and motion controllers, delivering an optimum solution for machine vision and automation applications. The NuPRO-E43 also provides enhanced asset protection with leading rugged I/O and SEMA 3.0 eAPI-based software protection key, resulting in a significant competitive advantage in the IA field.

The NuPRO-E43’s seamless integration with ADLINK’s full spectrum of frame grabbers, motion controllers, and data acquisition cards combines with the proven benefits of ADLINK’s comprehensive expertise and experience for maximized performance and industry-leading application-specific platforms for industry-leading support of automation applications.

View our wide range of Single Board Computers

View our portfolio of PCIe/PCi

See all products from our supplier Adlink

Features:

  • Optimised Platform for Industrial Automation& Machine Vision

  • Flexible backplane options for PCIe configuration with dedicated bandwidth to accommodate vision intensive applications
  • Fully compatible with ADLINK’s motion and I/O cards
  • Boosted Computing Performance
  • Support for 6th Gen Intel® Core™ i7/i5/i3 processor family
  • Up to 30% faster graphics performance with accelerated HW Media Codecs with Ultra HD 4K display support
  • Enhanced Asset Protection
  • Unique USB power maximizes stability
  • Gold/Metal plated connectors and rugged EMI protection assure long term reliability
  • SEMA 3.0 eAPI enables users to generate their own AP protection keys

Mini-ITX Embedded Board with 6th generation Intel® Core™ i7/i5/i3 Desktop Processor with Q170 Chipset

Adlink AmITX-SL-G-Serie MiniITX Motherboard

MPN:

AmITX-SL-G Series

Manufacturer L3 Communications

ADLINK

Description:

The AmITX-SL-G is a Mini-ITX motherboard supporting the Desktop 6th Generation Intel® Core™ i7/i5/i3 and Pentium® and Celeron® Processor with Intel® Q170/H110 Chipset. The AmITX-SL-G is specifically designed for customers who need high-level processing and graphics performance with a long product life solution.

Integrated Intel® Generation 9 Graphics supporting DirectX 11/12, OGL4.3/4.4, 3 independent, simultaneous displays Graphics outputs include three DisplayPort outputs and optional eDP or dual-channel 18/24-bit LVDS. In addition, support Ultra HD 4K up to 4096 x 2160 @ 60Hz.

The AmITX-SL-G features three DisplayPorts, dual Gigabit Ethernet ports, USB 3.0 ports, USB 2.0 ports, SATA 6 Gb/s ports, and High Definition Audio with 7.1 channels. Expansion is provided by one PCIe x16, one PCIe x1, and two mini-PCIe slots. The onboard feature connector provides GPIO, SMBus, and I2C support. The board is equipped with SPI AMI EFI BIOS, supporting embedded features such as hardware monitor and watchdog timer.

View our wide range of Embedded motherboard

View our portfolio of PCI / PCIe

See all products from our supplier Adlink

Features:

  • 6th Gen Intel Core i7/i5/i3 Desktop Processor (Skylake-S) with Intel® Q170/H110 Chipset
  • Dual SODIMM non-ECC 1866/2133 MHz DDR4 memory sockets supporting up to 32 GB
  • PCIe x16, PCIe x1 and Mini PCIe expansions
  • Rich I/O (2x LAN, 11x USB, 4x COM)
  • 3x DisplayPort outputs, optional eDP or dual-channel 18/24-bit LVDS
  • Vertical onboard USB port with keep out-space for security dongle

10.4 inch smart touch computer with uBuntu Linux OS

Adlink STC-1006-1206-1506 Touchscreen Panel

MPN:

STC-1006-2P

Manufacturer L3 Communications

ADLINK

Description:

Adlink are pleased to launch a new addition to the STC 'Smart Touch Computer' product line. The STC-1006 industrial panel computers is available with 10.4 inch touchscreen displays. These panel PCs run uBuntu Linux OS and feature projected capacitive touchscreens with an IP65-rated front bezel to withstand harsh automation environments.

View our wide range of Flat Panel Computers

View our portfolio of Embedded computing

See all products from our supplier Adlink

Features:

  • Freescale i.MX6 Dual ARM® Cortex® A9 Core SoC
  • 10.4 inches 4:3 TFT-LCD display with 1024 x 768 resolution
  • Durable projected capacitive touch sensor
  • IP65 rated front bezel for water and dust protection

15 inch smart touch computer with uBuntu Linux OS

Adlink STC-1006-1206-1506 Touchscreen Panel

MPN:

STC-1506-2P

Manufacturer L3 Communications

ADLINK

Description:

Adlink are pleased to launch a new addition to the STC  'Smart Touch Computer' product line. The STC-1506 industrial panel computers is available with 15 inch touchscreen displays. These panel PCs run uBuntu Linux OS and feature projected capacitive touchscreens with an IP65-rated front bezel to withstand harsh automation environments.

View our wide range of Flat Panel Computers

View our portfolio of Embedded computing

See all products from our supplier Adlink

Features:

  • Freescale i.MX6 Dual ARM® Cortex® A9 Core SoC
  • 15 inches 4:3 TFT-LCD display with 1024 x 768 resolution
  • Durable projected capacitive touch sensor
  • IP65 rated front bezel for water and dust protection

12.1 inch smart touch computer with uBuntu Linux OS

Adlink STC-1006-1206-1506 Touchscreen Panel

MPN:

STC-1206-2P

Manufacturer L3 Communications

ADLINK

Description:

Adlink are pleased to launch a new addition to the STC 'Smart Touch Computer' product line. The STC-1206 industrial panel computers is available with 12.1 and 15 inch touchscreen displays. These panel PCs run uBuntu Linux OS and feature projected capacitive touchscreens with an IP65-rated front bezel to withstand harsh automation environments.

View our wide range of Flat Panel Computers

View our portfolio of Embedded computing

See all products from our supplier Adlink

Features:

  • Freescale i.MX6 Dual ARM® Cortex® A9 Core SoC
  • 12.1 inches 4:3 TFT-LCD display with 1024 x 768 resolution
  • Durable projected capacitive touch sensor
  • IP65 rated front bezel for water and dust protection

Industrial ATX Motherboard with 6th Gen Intel® Core™ i7/i5/i3 Processor

Adlink IMB-M43 ATX-Motherboard

MPN:

IMB-M43

Manufacturer L3 Communications

ADLINK

Description:

ADLINK is pleased to introduce the industry’s first 6th Gen Intel® Core™ i7/i5/i3 Processor (Skylake) –based industrial ATX motherboard in the LGA1151 package with Intel® Q170 Express chipset. The ADLINK IMB-M43 supports high-speed data transfer interfaces such as PCIe3.0, USB 3.0, and SATA 6 Gb/s (SATA III), with dual-channel DDR4 2133 MHz memory up to 64 GB in four DIMM slots.

The IMB-M43 provides the most cost-competitive solution anywhere in embedded computing, fulfilling the specific needs of all users requiring 5 PCIe add-on cards. Featuring flexible PCIe configuration and optimal placement for industrial automation applications, the ADLINK IMB-M43 carries significant competitive advantage in the market. Leading rugged I/O design enhances user experience with robust device compatibility, durable connectivity, and extreme environment readiness.

The ADLINK IMB-M43, integrated with ADLINK’s full spectrum of frame grabbers, motion controllers, and data acquisition cards, is the ideal way to tackle the challenges of the machine automation application field.

View our wide range of Embedded Motherboard

View our portfolio of Embedded computing

See all products from our supplier Adlink

10.1 inch Industrial/Medical mobile tablet, Intel® Celeron® N2807, BT/Wi-Fi, RFID, GPS

Adlink IMT-BT Serie Flat Panel Computer

MPN:

IMT-BT-W

Manufacturer L3 Communications

ADLINK

Description:

We are pleased to launch the IMT-BT (Android) Medical Mobile Tablet. The IMT-BT (Android) medical tablet is designed to enable healthcare professionals to easily access electronic health records (EHRs), allowing them to check patient history, diagnosis, treatment and medication dispensation.

Our latest medical tablet is equipped with the Intel® Celeron® Processor N2807 and has a rugged design to withstand repeated sanitization and provide better infection control. With optional vehicle dock, our medical tablets can be installed in ambulances to allow emergency staff to access vital patient data en route to the hospital and provide timely emergency care. In addition to the IMT-BT Medical Mobile Tablet, ADLINK offers a complete range of healthcare IT solutions to our target customers, including the MLC 5-21/23 21.5”/23.8” large screen size medical computer and the MLC-101/121-156-BT 10.1”/12.1”/15.6” medical computer, allowing us to fulfill the needs of a wide range of healthcare environments.

The IMT-BT is an industrial mobile tablet integrating the dual-core Intel® Celeron® processor N2807 (formerly 'Bay Trail-M') for high performance computing power and low power consumption. Built-in WLAN and optional WWAN connectivity enables the IMT-BT to easily access information in a wide variety of industrial and commercial settings.

View our wide range of Flat Panel Computers

View our portfolio of Embedded computing

See all products from our supplier Adlink

Features:

  • EN-60601-1 certified to meet medical standards for safety and effectiveness
  • Easy disinfection with IP65 ingress protection
  • High speed wireless connectivity for real-time patient information
    • WLAN: IEEE 802.11 a/b/g/n/ac
    • WPAN: Bluetooth 4.0
    • WWAN (optional): 3.5G HSPA+, 4G LTE
  • Data Capture: HF 13.56MHz NFC RFID, SAM encryption supported
  • 1.5m drop resistance (with optional protective rubber housing)

10.1 inch Industrial/Medical mobile tablet, Intel® Celeron® N2807, BT/Wi-Fi, RFID, GPS, 3G/LTE Module and antenna

Adlink IMT-BT Serie Flat Panel Computer

MPN:

IMT-BT-L

Manufacturer L3 Communications

ADLINK

Description:

The IMT-BT (Android) medical tablet is designed to enable healthcare professionals to easily access electronic health records (EHRs), allowing them to check patient history, diagnosis, treatment and medication dispensation.

Our latest medical tablet is equipped with the Intel® Celeron® Processor N2807 and has a rugged design to withstand repeated sanitization and provide better infection control. With optional vehicle dock, our medical tablets can be installed in ambulances to allow emergency staff to access vital patient data en route to the hospital and provide timely emergency care. In addition to the IMT-BT Medical Mobile Tablet, ADLINK offers a complete range of healthcare IT solutions to our target customers, including the MLC 5-21/23 21.5”/23.8” large screen size medical computer and the MLC-101/121-156-BT 10.1”/12.1”/15.6” medical computer, allowing us to fulfill the needs of a wide range of healthcare environments.

The IMT-BT is also an industrial mobile tablet integrating the dual-core Intel® Celeron® processor N2807 (formerly 'Bay Trail-M') for high performance computing power and low power consumption. Built-in WLAN and optional WWAN connectivity enables the IMT-BT to easily access information in a wide variety of industrial and commercial settings.

View our wide range of Flat Panel Computers

View our portfolio of Embedded computing

See all products from our supplier Adlink

Features:

  • EN-60601-1 certified to meet medical standards for safety and effectiveness
  • Easy disinfection with IP65 ingress protection
  • High speed wireless connectivity for real-time patient information
    • WLAN: IEEE 802.11 a/b/g/n/ac
    • WPAN: Bluetooth 4.0
    • WWAN (optional): 3.5G HSPA+, 4G LTE
  • Data Capture: HF 13.56MHz NFC RFID, SAM encryption supported
  • 1.5m drop resistance (with optional protective rubber housing)
  • 6300mAh battery with 3G/LTE Module and antenna

3U CompactPCI blade with Intel® Core™ i7-5700EQ processor, 1 Slot 4HP, 2x GbE, 1xUSB3.0, onboard 32GB SSD

Adlink cPCI-3510BL Series 3U Blades

MPN:

cPCI-3510BL/5700E/M16/S32

Manufacturer L3 Communications

ADLINK

Description:

The cPCI-3510BL is a 3U CompactPCI blade available in single-slot (4HP) width form factors with various daughter boards to provide a broad range of I/O requirements. Faceplate I/O on the single-slot (4HP) version includes 1x DVI-I, 2x GbE and 1x USB 3.0 port.

The ADLINK cPCI-3510 Series is a 3U CompactPCI® processor blade with soldered DDR3L memory up to 16GB. The original cPCI-3510 models feature a 4th generation Intel® Core™ i7 processor with Mobile Intel® QM87 Express Chipset. The new cPCI-3510BL SKUs support the 5th generation Intel® Core™ i7 processor.

The ADLINK cPCI-3510BL serie is ideal for the communication segment requiring compact size and high density blade computing for applications such as video transcoding. It is also a high performance solution for mission critical applications such as defense and transportation that require superior data transfer capability and advanced computing power. The cPCI-3510BL provides high manageability, supports Satellite mode operation as a standalone blade in peripheral slots, and IPMI for system health monitoring. A GbE port on the faceplate supports Intel® AMT 9.0 for remote monitoring capability.

View our wide range of Single Board Computers

View our portfolio of cPCI / cPCIe

See all products from our supplier Adlink

Features:

  • Quad-core 5th Generation Intel® Core™ i7 processor
  • Up to 16GB DDR3L ECC soldered memory onboard
  • Up to three independent displays
  • System/Peripheral slot operation

3U CompactPCI blade with Intel® Core™ i7-5700EQ processor, 2 Slot 8HP, 2x GbE, 1xUSB3.0, COM, 2xUSB2.0

Adlink cPCI-3510BL Series 3U Blades

MPN:

cPCI-3510BLD/5700E/M16

Manufacturer L3 Communications

ADLINK

Description:

The cPCI-3510BLD is a 3U CompactPCI blade available in dual-slot (8HP) width form factors with various daughter boards to provide a broad range of I/O requirements. Faceplate I/O on the single-slot (4HP) version includes 1x DVI-I, 2x GbE and 1x USB 3.0 port (these I/O are common to all versions). Faceplate I/O on the dual-slot (8HP) version includes additional 2x USB 2.0, 1x COM, 1x KB/MS and Line-in/Line-out. Storage includes a CFast slot or a 32GB SSD (optional) and 2.5inch SATA HDD on the layer 2 riser card.

The ADLINK cPCI-3510 Series is a 3U CompactPCI® processor blade with soldered DDR3L memory up to 16GB. The original cPCI-3510 models feature a 4th generation Intel® Core™ i7 processor with Mobile Intel® QM87 Express Chipset. The new cPCI-3510BL SKUs support the 5th generation Intel® Core™ i7 processor.

The ADLINK cPCI-3510BL serie is ideal for the communication segment requiring compact size and high density blade computing for applications such as video transcoding. It is also a high performance solution for mission critical applications such as defense and transportation that require superior data transfer capability and advanced computing power. The cPCI-3510BL provides high manageability, supports Satellite mode operation as a standalone blade in peripheral slots, and IPMI for system health monitoring. A GbE port on the faceplate supports Intel® AMT 9.0 for remote monitoring capability.

View our wide range of Single Board Computers

View our portfolio of cPCI / cPCIe

See all products from our supplier Adlink

Features:

  • Quad-core 5th Generation Intel® Core™ i7 processor
  • Up to 16GB DDR3L ECC soldered memory onboard
  • Up to three independent displays
  • System/Peripheral slot operation

3U CompactPCI blade with Intel® Core™ i7-5700EQ processor, 2 Slot 8HP, RJ-45 COM, 2x DisplayPort, PS/2 KB/MS, 1xUSB2.0

Adlink cPCI-3510BL Series 3U Blades

MPN:

cPCI-3510BLG/5700E/M16

Manufacturer L3 Communications

ADLINK

Description:

The cPCI-3510BLG is a 3U CompactPCI blade available in dual-slot (8HP) width form factors with various daughter boards to provide a broad range of I/O requirements. Faceplate I/O on the single-slot (4HP) version includes 1x DVI-I, 2x GbE and 1x USB 3.0 port (these I/O are common to all versions). Faceplate I/O on the dual-slot (8HP) version includes additional 2x DisplayPorts, 1x COM in RJ-45 connector, 1x KB/MS and 1x additional USB2.0 port. Graphics support is integrated on the CPU and allows 3 independent displays on the front panel by selecting the cPCI-3510BLG with additional 2x DisplayPorts.

The ADLINK cPCI-3510 Series is a 3U CompactPCI® processor blade with soldered DDR3L memory up to 16GB. The original cPCI-3510 models feature a 4th generation Intel® Core™ i7 processor with Mobile Intel® QM87 Express Chipset. The new cPCI-3510BL SKUs support the 5th generation Intel® Core™ i7 processor.

The ADLINK cPCI-3510BL serie is ideal for the communication segment requiring compact size and high density blade computing for applications such as video transcoding. It is also a high performance solution for mission critical applications such as defense and transportation that require superior data transfer capability and advanced computing power. The cPCI-3510BL provides high manageability, supports Satellite mode operation as a standalone blade in peripheral slots, and IPMI for system health monitoring. A GbE port on the faceplate supports Intel® AMT 9.0 for remote monitoring capability.

View our wide range of Single Board Computers

View our portfolio of cPCI / cPCIe

See all products from our supplier Adlink

Features:

  • Quad-core 5th Generation Intel® Core™ i7 processor
  • Up to 16GB DDR3L ECC soldered memory onboard
  • Up to three independent displays
  • System/Peripheral slot operation

3U CompactPCI PlusIO blade with Intel® Core™ i7-5700EQ processor, 1 Slot 4HP, 2x GbE, 1xUSB3.0, onboard 32GB SSD

Adlink cPCI-3510BL Series 3U Blades

MPN:

cPCI-3511BL/5700E/M16/S32

Manufacturer L3 Communications

ADLINK

Description:

The cPCI-3511BL is a 3U CompactPCI PlusIO blade available in single-slot (4HP) width form factors with various daughter boards to provide a broad range of I/O requirements. Faceplate I/O on the single-slot (4HP) version includes 1x DVI-I, 2x GbE and 1x USB 3.0 port.

The ADLINK cPCI-3510BL serie is ideal for the communication segment requiring compact size and high density blade computing for applications such as video transcoding. It is also a high performance solution for mission critical applications such as defense and transportation that require superior data transfer capability and advanced computing power. The cPCI-3510BL provides high manageability, supports Satellite mode operation as a standalone blade in peripheral slots, and IPMI for system health monitoring. A GbE port on the faceplate supports Intel® AMT 9.0 for remote monitoring capability.

View our wide range of Single Board Computers

View our portfolio of cPCI / cPCIe

See all products from our supplier Adlink

Features:

  • Quad-core 5th Generation Intel® Core™ i7 processor
  • Up to 16GB DDR3L ECC soldered memory onboard
  • Up to three independent displays
  • System/Peripheral slot operation
  • PICMG 2.30 CompactPCI PlusIO compliant

3U CompactPCI PlusIO blade with Intel® Core™ i7-5700EQ processor, 2 Slot 8HP, 2x GbE, 1xUSB3.0, COM, 2xUSB2.0

Adlink cPCI-3510BL Series 3U Blades

MPN:

cPCI-3511BLD/5700E/M16

Manufacturer L3 Communications

ADLINK

Description:

The cPCI-3511BLD is a 3U CompactPCI PlusIO blade available in dual-slot (8HP) width form factors with various daughter boards to provide a broad range of I/O requirements. Faceplate I/O on the single-slot (4HP) version includes 1x DVI-I, 2x GbE and 1x USB 3.0 port (these I/O are common to all versions). Faceplate I/O on the dual-slot (8HP) version includes additional 2x USB 2.0, 1x COM, 1x KB/MS and Line-in/Line-out.

Storage includes a CFast slot or a 32GB SSD (optional) and 2.5inch SATA HDD on the layer 2 riser card.

The ADLINK cPCI-3510BL serie is ideal for the communication segment requiring compact size and high density blade computing for applications such as video transcoding. It is also a high performance solution for mission critical applications such as defense and transportation that require superior data transfer capability and advanced computing power. The cPCI-3510BL provides high manageability, supports Satellite mode operation as a standalone blade in peripheral slots, and IPMI for system health monitoring. A GbE port on the faceplate supports Intel® AMT 9.0 for remote monitoring capability.

View our wide range of Single Board Computers

View our portfolio of cPCI / cPCIe

See all products from our supplier Adlink

Features:

  • Quad-core 5th Generation Intel® Core™ i7 processor
  • Up to 16GB DDR3L ECC soldered memory onboard
  • Up to three independent displays
  • System/Peripheral slot operation
  • PICMG 2.30 CompactPCI PlusIO compliant

3U CompactPCI PlusIO blade with Intel® Core™ i7-5700EQ processor, 2 Slot 8HP, RJ-45 COM, 2x DisplayPort, PS/2 KB/MS, 1xUSB2.0

Adlink cPCI-3510BL Series 3U Blades

MPN:

cPCI-3511BLG/5700E/M16

Manufacturer L3 Communications

ADLINK

Description:

The cPCI-3511BLG is a 3U CompactPCI PlusIO blade available in dual-slot (8HP) width form factors with various daughter boards to provide a broad range of I/O requirements. Faceplate I/O on the single-slot (4HP) version includes 1x DVI-I, 2x GbE and 1x USB 3.0 port (these I/O are common to all versions). Faceplate I/O on the dual-slot (8HP) version includes additional 2x DisplayPorts, 1x COM in RJ-45 connector, 1x KB/MS and 1x additional USB2.0 port.

Graphics support is integrated on the CPU and allows 3 independent displays on the front panel by selecting the cPCI-3510BLG with additional 2x DisplayPorts.

The ADLINK cPCI-3510BL serie is ideal for the communication segment requiring compact size and high density blade computing for applications such as video transcoding. It is also a high performance solution for mission critical applications such as defense and transportation that require superior data transfer capability and advanced computing power. The cPCI-3510BL provides high manageability, supports Satellite mode operation as a standalone blade in peripheral slots, and IPMI for system health monitoring. A GbE port on the faceplate supports Intel® AMT 9.0 for remote monitoring capability.

View our wide range of Single Board Computers

View our portfolio of cPCI / cPCIe

See all products from our supplier Adlink

Features:

  • Quad-core 5th Generation Intel® Core™ i7 processor
  • Up to 16GB DDR3L ECC soldered memory onboard
  • Up to three independent displays
  • System/Peripheral slot operation
  • PICMG 2.30 CompactPCI PlusIO compliant

QSeven Module with Intel® Atom™ SOC E3800 Serie, Single or Dual /Quad core CPU and I/O controller

HECTRONIC H6065 Qseven Module

MPN:

H6065

Manufacturer L3 Communications

Hectronic

Description:

Hectronic's H6065 is a COM module based on the Intel® Atom™ Baytrail SOC with 7th generation Intel® HD Graphics along with a single, dual or quad core CPU and I/O controller. The Qseven form factor makes H6065 a legacy free module with a full range of contemporary low voltage differential serial interfaces such as PCI Express, USB 3.0 and display interfaces such as DisplayPort, HDMI, DVI and Dual 24-bit LVDS.

View our wide range of Computer-on-Module

View our portfolio of Embedded computing

See all products from our supplier Hectronic

Features:

  • Single, Dual or Quad core Intel® Atom™ SOC
  • 7th generation Intel® HD Graphics Engine
  • Industrial temperature range (-40°C to +85°C)
  • Optional on-board eMMC Flash storage (MLC/pSLC)
  • Soldered DDR3 RAM memory
  • Dual 24-bit LVDS and DisplayPort or DVI or HDMI

Qseven Module with AMD Embedded G-series SOC, Quad/dual core CPU

HECTRONIC H6071 Qseven Module

MPN:

H6071

Manufacturer L3 Communications

Hectronic

Description:

Hectronic's H6071 is a COM module based on second generation (Steppe Eagle) AMD Embedded G-series System-on-Chip, SOC, with the powerful Radeon 8000 GPU built in. he Qseven form factor makes H6071 a legacy free module with a full range of contemporary low voltage differential serial interfaces such as PCI Express, USB 3.0 and display interfaces such as DisplayPort, HDMI, DVI and Dual 24-bit LVDS.

View our wide range of Computer-on-Module

View our portfolio of Embedded computing

See all products from our supplier Hectronic

Features:

  • Dual and Quad core AMD Embedded G-Series SOC
  • Dynamic Boost functionality between CPU and GPU
  • Improved graphics performance (Radeon 8000)
  • Configurable TDP (CTDP)
  • Optional onboard SSD storage
  • Industrial temperature range (-40°C to +85°C)
  • Soldered DDR3 RAM memory
  • Dual 24-bit LVDS and DisplayPort or DVI or HDMI

COM Express® Module, Type 6, AMD Embedded G-series SOC, Dual core CPU

HECTRONIC H6068 COM Express Module

MPN:

H6068

Manufacturer L3 Communications

Hectronic

Description:

Hectronic's H6068 is a COM Express module Pinout type 6 with second generation (Steppe Eagle) AMD Embedded G-Series SOC. H6068 is based on the second and third generation AMD Embedded G-series SOC which is both Dual and Quad-Core single-chip processor with integrated AMD Radeon HD 8000E graphics.

View our wide range of Computer-on-Module

View our portfolio of Embedded computing

See all products from our supplier Hectronic

Features:

  • AMD G-series SoC (eKabini, Steppe Eagle)
  • CompactCOMexpress, type 6
  • Industrial temperature (optional)
  • Up to 4GB soldered system memory
  • AMD Radeon HD8000 Graphics
  • Optional on-board soldered SATA SSD

COM Express® Module, Type 6, AMD Embedded G-series SOC, Quad/dual core CPU

HECTRONIC H6066 COM Express Module

MPN:

H6066

Manufacturer L3 Communications

Hectronic

Description:

Hectronic's H6066 is a COM Express module Pinout type 6 with AMD Embedded G-Series SOC. The module is equipped with soldered RAM, soldered SSD Flash (optional) and it is specified for an industrial operating temperature range (-40°C to +85°C). The form factor is Compact COM Express and the pinout is type 6.

H6066 is equipped with either processors GX-411GA (15 Watt) for an industrial operating temperature range (-40°C to +85°C) or GX-420CA (25 Watt) for a standard operating temperature range (0°C to +60°C).

View our wide range of Computer-on-Module

View our portfolio of Embedded computing

See all products from our supplier Hectronic

Features:

  • AMD G-series SoC (eKabini, Steppe Eagle)
  • CompactCOMexpress, type 6
  • Industrial temperature (optional)
  • Up to 4GB soldered system memory
  • AMD Radeon HD8000 Graphics
  • Optional on-board soldered SATA SSD

Extreme Rugged™ PC/104 Single Board Computer, with Vortex86DX3 System-on-Chip

Adlink CM1-86DX3 PC/104 form factor Single board computer

MPN:

CM1-86DX3

Manufacturer L3 Communications

ADLINK

Description:

ADLINK is pleased to announce the new PC/104 form factor Single Board Computer (SBC) featuring the Vortext86DX3 SoC, running at 1.0 GHz and support 2GB soldered DDR3L. The new ADLINK CM1-86DX3 delivers ruggedness by design and longevity by extended lifecycles. It targets industrial automation (IA), transportation, energy and military applications requiring industrial-grade stability.

The ADLINK CM1-86DX3 offers full ISA bus support. It features one SATA, one CFast and supports VGA and 18/24 bit single channel TTL/TFT display. The CM1-86DX3 also features one Gigabit Ethernet and one Fast Ethernet port, two USB 2.0 ports, eight GPIOs, two RS-232/422/485 serial ports and two RS232 serial ports.

The CM1-86DX3 is also suitable for harsh environments and is designed to withstand 50G shock and 12G vibration per MIL-STD-202F and supports the extended temperature range.

View our wide range of Single Board Computer

View our portfolio of PC104 / PC104 Plus

See all products from our supplier Adlink

Features:

  • Ultra low power, DM&P Vortex86DX3 SoC
  • Full ISA bus support
  • 2GB soldered DDR3L
  • SATA, CFast, GbE, Fast Ethernet
  • VGA and 18/24-bit single channel TTL/TFT
  • Supports Smart Embedded Management Agent (SEMA)
  • Standard OS support: WES2009, WES7, Linux, QNX
  • Extended Support: WEC7, WinCE 6.0 (on request)

COM Express® Module, Type 6, Intel Core i7-5850EQ, 2.7/3.4GHz, GT3 level graphics

Adlink Express-BL Series COM Express

MPN:

Express-BL-i7-5850EQ

Manufacturer L3 Communications

ADLINK

Description:

The Express-BL-i7-5850EQ is a COM Express® COM.0 R2.1 Basic Size Type 6 module supporting the 64-bit 5th Generation Intel® Core™ i7 processors (codename "Broadwell-H”) with Intel® QM87 Chipset. The Express-BL is specifically designed for customers who need excellent graphics performance and high-level processing performance in a long product life solution. The Express-BL features Intel® Hyper-Threading Technology (up to 4 cores, 8 threads) and DDR3L non-ECC dual-channel memory at 1333/1600 MHz to provide excellent overall performance. Intel® Flexible Display Interface and Direct Media Interface provide high speed connectivity from the CPU to the Intel® QM87 Chipset. Integrated Intel® Generation 8 Graphics includes features such as OpenGL 4.0, DirectX 11, Intel® Clear Video HD Technology, Advanced Scheduler 2.0, 1.0, XPDM support, and DirectX Video Acceleration (DXVA) support for full AVC/VC1/MPEG2 hardware decode. Graphics outputs include VGA, LVDS and three DDI ports supporting HDMI/DVI/DisplayPort and eDP as a build option. The Express-BL is specifically designed for customers with high-performance processing graphics requirements who want to outsource the custom core logic of their systems for reduced development time.

The Express-BL has dual stacked SODIMM sockets for up to 32GB non-ECC type DDR3L memory. In addition to the onboard integrated graphics, a multiplexed PCIe x16 graphics bus is available for discrete graphics expansion. Input/output features include a single onboard Gigabit Ethernet port, USB 3.0 ports and USB 2.0 ports, and SATA 6 Gb/s ports. Support is provided for SMBus and I2C. The module is equipped with SPI AMI EFI BIOS with CMOS backup, supporting embedded features such as remote console, hardware monitor, and watchdog timer.

The ADLINK Express-BL computer-on-module with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. The Express-BL is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, determine which data to save locally and which to send to the cloud for further analysis. The results these analyses can provide valuable information for policy decision making and generate innovative business opportunities.

View our wide range of Computer-on-Module

View our portfolio of Embedded computing

See all products from our supplier Adlink

Features:

  • 5th Generation Intel® Core™ and Xeon® Processor with Intel® QM87 Express Chipset
  • Up to 32GB Dual Channel DDR3L at 1600MHz
  • Three DDI channels, one LVDS and VGA, support up to 3 independent displays
  • Seven PCIe x1, one PCIe x16
  • GbE, 4x SATA 6 Gb/s, 4x USB 3.0 and 4x USB 2.0
  • Supports Smart Embedded Management Agent (SEMA) functions
  • Extreme Rugged operating temperature: -40°C to +85°C (optional)

COM Express® Module, Type 6, Intel Core i7-5700EQ, 2.7/3.4GHz, GT2 level graphics

Adlink Express-BL Series COM Express

MPN:

Express-BL-i7-5700EQ

Manufacturer L3 Communications

ADLINK

Description:

The Express-BL-i7-5700EQ is a COM Express® COM.0 R2.1 Basic Size Type 6 module supporting the 64-bit 5th Generation Intel® Core™ i7 processors (codename "Broadwell-H”) with Intel® QM87 Chipset. The Express-BL is specifically designed for customers who need excellent graphics performance and high-level processing performance in a long product life solution. The Express-BL features Intel® Hyper-Threading Technology (up to 4 cores, 8 threads) and DDR3L non-ECC dual-channel memory at 1333/1600 MHz to provide excellent overall performance. Intel® Flexible Display Interface and Direct Media Interface provide high speed connectivity from the CPU to the Intel® QM87 Chipset. Integrated Intel® Generation 8 Graphics includes features such as OpenGL 4.0, DirectX 11, Intel® Clear Video HD Technology, Advanced Scheduler 2.0, 1.0, XPDM support, and DirectX Video Acceleration (DXVA) support for full AVC/VC1/MPEG2 hardware decode. Graphics outputs include VGA, LVDS and three DDI ports supporting HDMI/DVI/DisplayPort and eDP as a build option. The Express-BL is specifically designed for customers with high-performance processing graphics requirements who want to outsource the custom core logic of their systems for reduced development time.

The Express-BL has dual stacked SODIMM sockets for up to 32GB non-ECC type DDR3L memory. In addition to the onboard integrated graphics, a multiplexed PCIe x16 graphics bus is available for discrete graphics expansion. Input/output features include a single onboard Gigabit Ethernet port, USB 3.0 ports and USB 2.0 ports, and SATA 6 Gb/s ports. Support is provided for SMBus and I2C. The module is equipped with SPI AMI EFI BIOS with CMOS backup, supporting embedded features such as remote console, hardware monitor, and watchdog timer.

The ADLINK Express-BL computer-on-module with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. The Express-BL is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, determine which data to save locally and which to send to the cloud for further analysis. The results these analyses can provide valuable information for policy decision making and generate innovative business opportunities.

View our wide range of Computer-on-Module

View our portfolio of Embedded computing

See all products from our supplier Adlink

Features:

  • 5th Generation Intel® Core™ and Xeon® Processor with Intel® QM87 Express Chipset
  • Up to 32GB Dual Channel DDR3L at 1600MHz
  • Three DDI channels, one LVDS and VGA, support up to 3 independent displays
  • Seven PCIe x1, one PCIe x16
  • GbE, 4x SATA 6 Gb/s, 4x USB 3.0 and 4x USB 2.0
  • Supports Smart Embedded Management Agent (SEMA) functions
  • Extreme Rugged operating temperature: -40°C to +85°C (optional)

COM Express® Module, Type 6, Intel Xeon E3-1278L, 2.0/3.3GHz, GT3 level graphics

Adlink Express-BL Series COM Express

MPN:

Express-BL-E3-1278

Manufacturer L3 Communications

ADLINK

Description:

The Express-BL-E3-1278 is a COM Express® COM.0 R2.1 Basic Size Type 6 module supporting the 64-bit 5th Generation Intel® Core™ Xeon® processors (codename "Broadwell-H”) with Intel® QM87 Chipset. The Express-BL is specifically designed for customers who need excellent graphics performance and high-level processing performance in a long product life solution. The Express-BL features Intel® Hyper-Threading Technology (up to 4 cores, 8 threads) and DDR3L non-ECC dual-channel memory at 1333/1600 MHz to provide excellent overall performance. Intel® Flexible Display Interface and Direct Media Interface provide high speed connectivity from the CPU to the Intel® QM87 Chipset. Integrated Intel® Generation 8 Graphics includes features such as OpenGL 4.0, DirectX 11, Intel® Clear Video HD Technology, Advanced Scheduler 2.0, 1.0, XPDM support, and DirectX Video Acceleration (DXVA) support for full AVC/VC1/MPEG2 hardware decode. Graphics outputs include VGA, LVDS and three DDI ports supporting HDMI/DVI/DisplayPort and eDP as a build option. The Express-BL is specifically designed for customers with high-performance processing graphics requirements who want to outsource the custom core logic of their systems for reduced development time.

The Express-BL has dual stacked SODIMM sockets for up to 32GB non-ECC type DDR3L memory. In addition to the onboard integrated graphics, a multiplexed PCIe x16 graphics bus is available for discrete graphics expansion. Input/output features include a single onboard Gigabit Ethernet port, USB 3.0 ports and USB 2.0 ports, and SATA 6 Gb/s ports. Support is provided for SMBus and I2C. The module is equipped with SPI AMI EFI BIOS with CMOS backup, supporting embedded features such as remote console, hardware monitor, and watchdog timer.

The ADLINK Express-BL computer-on-module with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. The Express-BL is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, determine which data to save locally and which to send to the cloud for further analysis. The results these analyses can provide valuable information for policy decision making and generate innovative business opportunities.

View our wide range of Computer-on-Module

View our portfolio of Embedded computing

See all products from our supplier Adlink

Features:

  • 5th Generation Intel® Xeon® Processor with Intel® QM87 Express Chipset
  • Up to 32GB Dual Channel DDR3L at 1600MHz
  • Three DDI channels, one LVDS and VGA, support up to 3 independent displays
  • Seven PCIe x1, one PCIe x16
  • GbE, 4x SATA 6 Gb/s, 4x USB 3.0 and 4x USB 2.0
  • Supports Smart Embedded Management Agent (SEMA) functions
  • Extreme Rugged operating temperature: -40°C to +85°C (optional)

COM Express® Module, Type 6, Intel Xeon E3-1258L, 1.8/3.2GHz, GT2 level graphics

Adlink Express-BL Series COM Express

MPN:

Express-BL-E3-1258

Manufacturer L3 Communications

ADLINK

Description:

The Express-BL-E3-1258 is a COM Express® COM.0 R2.1 Basic Size Type 6 module supporting the 64-bit 5th Generation Intel® Core™ Xeon® processors (codename "Broadwell-H”) with Intel® QM87 Chipset. The Express-BL is specifically designed for customers who need excellent graphics performance and high-level processing performance in a long product life solution. The Express-BL features Intel® Hyper-Threading Technology (up to 4 cores, 8 threads) and DDR3L non-ECC dual-channel memory at 1333/1600 MHz to provide excellent overall performance. Intel® Flexible Display Interface and Direct Media Interface provide high speed connectivity from the CPU to the Intel® QM87 Chipset. Integrated Intel® Generation 8 Graphics includes features such as OpenGL 4.0, DirectX 11, Intel® Clear Video HD Technology, Advanced Scheduler 2.0, 1.0, XPDM support, and DirectX Video Acceleration (DXVA) support for full AVC/VC1/MPEG2 hardware decode. Graphics outputs include VGA, LVDS and three DDI ports supporting HDMI/DVI/DisplayPort and eDP as a build option. The Express-BL is specifically designed for customers with high-performance processing graphics requirements who want to outsource the custom core logic of their systems for reduced development time.

The Express-BL has dual stacked SODIMM sockets for up to 32GB non-ECC type DDR3L memory. In addition to the onboard integrated graphics, a multiplexed PCIe x16 graphics bus is available for discrete graphics expansion. Input/output features include a single onboard Gigabit Ethernet port, USB 3.0 ports and USB 2.0 ports, and SATA 6 Gb/s ports. Support is provided for SMBus and I2C. The module is equipped with SPI AMI EFI BIOS with CMOS backup, supporting embedded features such as remote console, hardware monitor, and watchdog timer.

The ADLINK Express-BL computer-on-module with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. The Express-BL is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, determine which data to save locally and which to send to the cloud for further analysis. The results these analyses can provide valuable information for policy decision making and generate innovative business opportunities.

View our wide range of Computer-on-Module

View our portfolio of Embedded computing

See all products from our supplier Adlink

Features:

  • 5th Generation Intel® Xeon® Processor with Intel® QM87 Express Chipset
  • Up to 32GB Dual Channel DDR3L at 1600MHz
  • Three DDI channels, one LVDS and VGA, support up to 3 independent displays
  • Seven PCIe x1, one PCIe x16
  • GbE, 4x SATA 6 Gb/s, 4x USB 3.0 and 4x USB 2.0
  • Supports Smart Embedded Management Agent (SEMA) functions
  • Extreme Rugged operating temperature: -40°C to +85°C (optional)

Fanless Embedded Computer, Intel® Atom™ E3845 Quad Core

AdlinkMXE-1401 Fanless Embedded Computer

MPN:

MXE-1401

Manufacturer L3 Communications

ADLINK

Description:

ADLINK is pleased to announce the release of our new Matrix MXE-1401 series of rugged quad-core fanless computers, featuring the latest generation of Intel® Atom™ E3845 processors with adaptive features including a wide variety of application-specific capabilities, maximized customization, and environmental standard. As a standard product, MXE-1401 provides powerful function with an integrated quad-core Intel® Atom™ E3845 processor, and the most I/O ports in its class. Its excellent MTBF, outstanding vibration (5G)/shock (100G) sustainability and superior -40 to 70°C operating temperature range make it an ideal choice for mission critical applications.

In additional to optimal functionality, the MXE-1401 stands out with the new AFM (adaptive function module) design. AFM provides fast access to application-specific customers, while the reusable cross-platform I/O simplifies development, reducing time to market and TCO. ADLINK’s AFM meets and exceeds the requirements of customers requiring customization for medium volume projects, with competitive pricing and speed to market.

Combining powerful features, user-friendly design, rich I/O, and wireless capability in a compact and robust package, the ADLINK MXE-1401 is an ideal choice for a wide range of applications supporting intelligent transportation, in-vehicle multimedia, and surveillance and factory automation applications.

View our wide range of Embedded Computers

View our portfolio of Platform systems

See all products from our supplier Adlink

Mini-ITX Embedded Board with AMD Embedded RX427BB APU

Adlink AmITX-BE-G Embedded motherboard

MPN:

AmITX-BE-G-RX427BB

Manufacturer L3 Communications

ADLINK

Description:

The AmITX-BE-G-RX427BB is a Mini-ITX motherboard supporting the 2nd Generation AMD R-Series APU (codename: Bald Eagle) with A77E Fusion Controller Hub. The AmITX-BE-G-RX427BB is specifically designed for gaming, infotainment, and customers who need high-level processing and excellent graphics performance with low power consumption in a long product life solution. The AmITX-BE-G AMD R-Series APU features a Heterogeneous System Architecture (HSA) and non-ECC type DDR3L dual-channel memory at 1333/1600 MHz to provide excellent overall performance.

The AmITX-BE-G features four DisplayPorts, dual Gigabit Ethernet ports, USB 3.0 ports, USB 2.0 ports, SATA 6 Gb/s ports, and High Definition Audio with 7.1 channels. Support is provided for one PCIe x16, one PCIe x1, and two Mini PCIe slots. A feature connector provides access to GPIO, SMBus, and I2C signals. The board is equipped with SPI AMI EFI BIOS, supporting embedded features such as hardware monitor and watchdog timer.

Integrated AMD Radeon HD 9000 Graphics includes features such as OpenGL 4.2, DirectX 11.1, OpenCL 1.2, OpenGLES 2.0, OpenCV support for H.264, MPEG2, VC1, MPEG4, WMV9, and MVC hardware decode. Graphics outputs include four DisplayPort outputs and optional dual-channel 18/24-bit LVDS. In addition, up to four independent displays are supported.

View our wide range of Embedded motherboard

View our portfolio of PCi / PCIe

See all products from our supplier Adlink

Features:

  • AMD® Embedded R-Series APU with A77E Fusion Controller Hub
  • Dual SODIMM socket DDR3L-1600 memory (up to 16 GB)
  • Rich I/O (2x LAN, 13x USB, 4x COM, 2x Mini-PCIe, mSATA, PCIe x16 & x1)
  • 4 DisplayPort outputs
  • Vertical onboard USB port with keep out-space for security dongle
  • SPI pin-header and optional socketed SPI BIOS chip

Mini-ITX Embedded Board with AMD Embedded RX425BB APU

Adlink AmITX-BE-G Embedded motherboard

MPN:

AmITX-BE-G-RX425BB

Manufacturer L3 Communications

ADLINK

Description:

The AmITX-BE-G-RX425BB is a Mini-ITX motherboard supporting the 2nd Generation AMD R-Series APU (codename: Bald Eagle) with A77E Fusion Controller Hub. The AmITX-BE-G-RX425BB is specifically designed for gaming, infotainment, and customers who need high-level processing and excellent graphics performance with low power consumption in a long product life solution. The AmITX-BE-G AMD R-Series APU features a Heterogeneous System Architecture (HSA) and non-ECC type DDR3L dual-channel memory at 1333/1600 MHz to provide excellent overall performance.

The AmITX-BE-G features four DisplayPorts, dual Gigabit Ethernet ports, USB 3.0 ports, USB 2.0 ports, SATA 6 Gb/s ports, and High Definition Audio with 7.1 channels. Support is provided for one PCIe x16, one PCIe x1, and two Mini PCIe slots. A feature connector provides access to GPIO, SMBus, and I2C signals. The board is equipped with SPI AMI EFI BIOS, supporting embedded features such as hardware monitor and watchdog timer.

Integrated AMD Radeon HD 9000 Graphics includes features such as OpenGL 4.2, DirectX 11.1, OpenCL 1.2, OpenGLES 2.0, OpenCV support for H.264, MPEG2, VC1, MPEG4, WMV9, and MVC hardware decode. Graphics outputs include four DisplayPort outputs and optional dual-channel 18/24-bit LVDS. In addition, up to four independent displays are supported.

View our wide range of Embedded motherboard

View our portfolio of PCi / PCIe

See all products from our supplier Adlink

Features:

  • AMD® Embedded R-Series APU with A77E Fusion Controller Hub
  • Dual SODIMM socket DDR3L-1600 memory (up to 16 GB)
  • Rich I/O (2x LAN, 13x USB, 4x COM, 2x Mini-PCIe, mSATA, PCIe x16 & x1)
  • 4 DisplayPort outputs
  • Vertical onboard USB port with keep out-space for security dongle
  • SPI pin-header and optional socketed SPI BIOS chip

Mini-ITX Embedded Board with AMD Embedded RX225FB APU

Adlink AmITX-BE-G Embedded motherboard

MPN:

AmITX-BE-G-RX225FB

Manufacturer L3 Communications

ADLINK

Description:

The AmITX-BE-G-RX225FB is a Mini-ITX motherboard supporting the 2nd Generation AMD R-Series APU (codename: Bald Eagle) with A77E Fusion Controller Hub. The AmITX-BE-G-RX225FB is specifically designed for gaming, infotainment, and customers who need high-level processing and excellent graphics performance with low power consumption in a long product life solution. The AmITX-BE-G AMD R-Series APU features a Heterogeneous System Architecture (HSA) and non-ECC type DDR3L dual-channel memory at 1333/1600 MHz to provide excellent overall performance.

The AmITX-BE-G features four DisplayPorts, dual Gigabit Ethernet ports, USB 3.0 ports, USB 2.0 ports, SATA 6 Gb/s ports, and High Definition Audio with 7.1 channels. Support is provided for one PCIe x16, one PCIe x1, and two Mini PCIe slots. A feature connector provides access to GPIO, SMBus, and I2C signals. The board is equipped with SPI AMI EFI BIOS, supporting embedded features such as hardware monitor and watchdog timer.

Integrated AMD Radeon HD 9000 Graphics includes features such as OpenGL 4.2, DirectX 11.1, OpenCL 1.2, OpenGLES 2.0, OpenCV support for H.264, MPEG2, VC1, MPEG4, WMV9, and MVC hardware decode. Graphics outputs include four DisplayPort outputs and optional dual-channel 18/24-bit LVDS. In addition, up to four independent displays are supported.

View our wide range of Embedded motherboard

View our portfolio of PCi / PCIe

See all products from our supplier Adlink

Features:

  • AMD® Embedded R-Series APU with A77E Fusion Controller Hub
  • Dual SODIMM socket DDR3L-1600 memory (up to 16 GB)
  • Rich I/O (2x LAN, 13x USB, 4x COM, 2x Mini-PCIe, mSATA, PCIe x16 & x1)
  • 4 DisplayPort outputs
  • Vertical onboard USB port with keep out-space for security dongle
  • SPI pin-header and optional socketed SPI BIOS chip

Mini-ITX Embedded Board with AMD Embedded RX427BB APU, LVDS+x3 display port

Adlink AmITX-BE-G Embedded motherboard

MPN:

AmITX-BE-G-RX427BBLVDS

Manufacturer L3 Communications

ADLINK

Description:

The AmITX-BE-G-RX427BBLVDS is a Mini-ITX motherboard supporting the 2nd Generation AMD R-Series APU (codename: Bald Eagle) with A77E Fusion Controller Hub. The AmITX-BE-G-RX427BBLVDS is specifically designed for gaming, infotainment, and customers who need high-level processing and excellent graphics performance with low power consumption in a long product life solution. The AmITX-BE-G AMD R-Series APU features a Heterogeneous System Architecture (HSA) and non-ECC type DDR3L dual-channel memory at 1333/1600 MHz to provide excellent overall performance.

The AmITX-BE-G features four DisplayPorts, dual Gigabit Ethernet ports, USB 3.0 ports, USB 2.0 ports, SATA 6 Gb/s ports, and High Definition Audio with 7.1 channels. Support is provided for one PCIe x16, one PCIe x1, and two Mini PCIe slots. A feature connector provides access to GPIO, SMBus, and I2C signals. The board is equipped with SPI AMI EFI BIOS, supporting embedded features such as hardware monitor and watchdog timer.

Integrated AMD Radeon HD 9000 Graphics includes features such as OpenGL 4.2, DirectX 11.1, OpenCL 1.2, OpenGLES 2.0, OpenCV support for H.264, MPEG2, VC1, MPEG4, WMV9, and MVC hardware decode. Graphics outputs include four DisplayPort outputs and optional dual-channel 18/24-bit LVDS. In addition, up to four independent displays are supported.

View our wide range of Embedded motherboard

View our portfolio of PCi / PCIe

See all products from our supplier Adlink

Features:

  • AMD® Embedded R-Series APU with A77E Fusion Controller Hub
  • Dual SODIMM socket DDR3L-1600 memory (up to 16 GB)
  • Rich I/O (2x LAN, 13x USB, 4x COM, 2x Mini-PCIe, mSATA, PCIe x16 & x1)
  • 4 DisplayPort outputs
  • Vertical onboard USB port with keep out-space for security dongle
  • SPI pin-header and optional socketed SPI BIOS chip

Mini-ITX Embedded Board with AMD Embedded RX425BB APU, LVDS+x3 display port

Adlink AmITX-BE-G Embedded motherboard

MPN:

AmITX-BE-G-RX425BBLVDS

Manufacturer L3 Communications

ADLINK

Description:

The AmITX-BE-G-RX425BBLVDS is a Mini-ITX motherboard supporting the 2nd Generation AMD R-Series APU (codename: Bald Eagle) with A77E Fusion Controller Hub. The AmITX-BE-G-RX425BBLVDS is specifically designed for gaming, infotainment, and customers who need high-level processing and excellent graphics performance with low power consumption in a long product life solution. The AmITX-BE-G AMD R-Series APU features a Heterogeneous System Architecture (HSA) and non-ECC type DDR3L dual-channel memory at 1333/1600 MHz to provide excellent overall performance.

The AmITX-BE-G features four DisplayPorts, dual Gigabit Ethernet ports, USB 3.0 ports, USB 2.0 ports, SATA 6 Gb/s ports, and High Definition Audio with 7.1 channels. Support is provided for one PCIe x16, one PCIe x1, and two Mini PCIe slots. A feature connector provides access to GPIO, SMBus, and I2C signals. The board is equipped with SPI AMI EFI BIOS, supporting embedded features such as hardware monitor and watchdog timer.

Integrated AMD Radeon HD 9000 Graphics includes features such as OpenGL 4.2, DirectX 11.1, OpenCL 1.2, OpenGLES 2.0, OpenCV support for H.264, MPEG2, VC1, MPEG4, WMV9, and MVC hardware decode. Graphics outputs include four DisplayPort outputs and optional dual-channel 18/24-bit LVDS. In addition, up to four independent displays are supported.

View our wide range of Embedded motherboard

View our portfolio of PCi / PCIe

See all products from our supplier Adlink

Features:

  • AMD® Embedded R-Series APU with A77E Fusion Controller Hub
  • Dual SODIMM socket DDR3L-1600 memory (up to 16 GB)
  • Rich I/O (2x LAN, 13x USB, 4x COM, 2x Mini-PCIe, mSATA, PCIe x16 & x1)
  • 4 DisplayPort outputs
  • Vertical onboard USB port with keep out-space for security dongle
  • SPI pin-header and optional socketed SPI BIOS chip

Mini-ITX Embedded Board with AMD Embedded RX225FB APU, LVDS+x3 display port

Adlink AmITX-BE-G Embedded motherboard

MPN:

AmITX-BE-G-RX225BBLVDS

Manufacturer L3 Communications

ADLINK

Description:

The AmITX-BE-G-RX225BBLVDS is a Mini-ITX motherboard supporting the 2nd Generation AMD R-Series APU (codename: Bald Eagle) with A77E Fusion Controller Hub. The AmITX-BE-G-RX225BBLVDS is specifically designed for gaming, infotainment, and customers who need high-level processing and excellent graphics performance with low power consumption in a long product life solution. The AmITX-BE-G AMD R-Series APU features a Heterogeneous System Architecture (HSA) and non-ECC type DDR3L dual-channel memory at 1333/1600 MHz to provide excellent overall performance.

The AmITX-BE-G features four DisplayPorts, dual Gigabit Ethernet ports, USB 3.0 ports, USB 2.0 ports, SATA 6 Gb/s ports, and High Definition Audio with 7.1 channels. Support is provided for one PCIe x16, one PCIe x1, and two Mini PCIe slots. A feature connector provides access to GPIO, SMBus, and I2C signals. The board is equipped with SPI AMI EFI BIOS, supporting embedded features such as hardware monitor and watchdog timer.

Integrated AMD Radeon HD 9000 Graphics includes features such as OpenGL 4.2, DirectX 11.1, OpenCL 1.2, OpenGLES 2.0, OpenCV support for H.264, MPEG2, VC1, MPEG4, WMV9, and MVC hardware decode. Graphics outputs include four DisplayPort outputs and optional dual-channel 18/24-bit LVDS. In addition, up to four independent displays are supported.

View our wide range of Embedded motherboard

View our portfolio of PCi / PCIe

See all products from our supplier Adlink

Features:

  • AMD® Embedded R-Series APU with A77E Fusion Controller Hub
  • Dual SODIMM socket DDR3L-1600 memory (up to 16 GB)
  • Rich I/O (2x LAN, 13x USB, 4x COM, 2x Mini-PCIe, mSATA, PCIe x16 & x1)
  • 4 DisplayPort outputs
  • Vertical onboard USB port with keep out-space for security dongle
  • SPI pin-header and optional socketed SPI BIOS chip

Extreme Rugged™ PC/104 Single Board Computer, with Intel® Atom™ E3815 (1C), 1.46GHz, 5W

Adlink CM1-BT1 PC/104 Single board computer

MPN:

CM1-BT1-E3815

Manufacturer L3 Communications

ADLINK

Description:

ADLINK is pleased to announce the new PC/104 Single Board Computer CM1-BT1-E3815. With a single processor running at 1.46 GHz with up to 4GB DDR3L at 1066/1333 MHz SO-DIMM. The ADLINK CM1-BT1-E3815 delivers top-of-the-line performance with efficient power consumption that targets Industrial Automation, Digital Signage, Transportation, Energy and Military applications requiring industrial-grade stability.

The ADLINK CMx-BTx family offers various bus type options. PC/104, PC/104-Plus and PCI-104 variants are available. Each SBC supports VGA and 18/24 bit single/dual channel LVDS. ADLINK´s CMx-BTx is suitable for harsh environments. It is designed to withstand 50G shock and 12G vibration per MIL-STD-202F. Most variants support the extended temperature range from -40°C to +85°C.

The CM1-BT1-E3815 features up to two Gigabit Ethernet ports, up to two SATA or one SATA and one mSATA, one USB 3.0/2.0, two USB 2.0, up to four RS232/485 COM ports, 8 GPIOs and HD Audio.

Paired with ADLINK’s SEMA Cloud (Smart Embedded Management Agent) device-to-cloud platform that enables remote monitoring, control and management, the CMx-BTx is an ideal building block for developing IoT devices with a secure connection to the cloud.

View our wide range of Single Board Computers

View our portfolio of PC104 / PC104 plus

See all products from our supplier Adlink

Features:

  • Single core Intel® Atom™ E3815 Series Processor System-on-Chip
  • Up to 4GB DDR3L SO-DIMM at 1066/1333MHz (Non-ECC)
  • Supports VGA and LVDS
  • 1x mini-PCIe with mSATA and USB capability
  • Up to 2x GbE, 2x SATA 3Gb/s, 1x USB 3.0/2.0, 2x USB 2.0, 4x RS232/485/422, 5.1 channel HD-Audio, 8x GPIO
  • Supports Smart Embedded Management Agent (SEMA)
  • Standard OS support: WES7, WEC7, WES8, Linux Yocto, VxWorks
  • Available BSPs: WES7, WEC7, Linux Yocto, VxWorks

Extreme Rugged™ PC/104-plus Single Board Computer, with Intel® Atom™ E3825 (2C), 1.33GHz, 6W

Adlink CM2-BT2 PC/104 Dual board computer

MPN:

CM2-BT2-E3825

Manufacturer L3 Communications

ADLINK

Description:

ADLINK is pleased to announce the new PC/104-plus Single Board Computer CM2-BT2-E3825. With Dual-core processors running at 1.33 GHz with up to 4GB DDR3L at 1066/1333 MHz SO-DIMM. The ADLINK CM2-BT2-E3825 delivers top-of-the-line performance with efficient power consumption that targets Industrial Automation, Digital Signage, Transportation, Energy and Military applications requiring industrial-grade stability.

The ADLINK CMx-BTx family offers various bus type options. PC/104, PC/104-Plus and PCI-104 variants are available. Each SBC supports VGA and 18/24 bit single/dual channel LVDS. ADLINK´s CMx-BTx is suitable for harsh environments. It is designed to withstand 50G shock and 12G vibration per MIL-STD-202F. Most variants support the extended temperature range from -40°C to +85°C.

The CM2-BT2-E3825 features up to two Gigabit Ethernet ports, up to two SATA or one SATA and one mSATA, one USB 3.0/2.0, two USB 2.0, up to four RS232/485 COM ports, 8 GPIOs and HD Audio.

Paired with ADLINK’s SEMA Cloud (Smart Embedded Management Agent) device-to-cloud platform that enables remote monitoring, control and management, the CMx-BTx is an ideal building block for developing IoT devices with a secure connection to the cloud.

View our wide range of Single Board Computers

View our portfolio of PC104 / PC104 plus

See all products from our supplier Adlink

Features:

  • Dual core Intel® Atom™ E3825 Series Processor System-on-Chip
  • Up to 4GB DDR3L SO-DIMM at 1066/1333MHz (Non-ECC)
  • Supports VGA and LVDS
  • 1x mini-PCIe with mSATA and USB capability
  • Up to 2x GbE, 2x SATA 3Gb/s, 1x USB 3.0/2.0, 2x USB 2.0, 4x RS232/485/422, 5.1 channel HD-Audio, 8x GPIO
  • Supports Smart Embedded Management Agent (SEMA)
  • Standard OS support: WES7, WEC7, WES8, Linux Yocto, VxWorks
  • Available BSPs: WES7, WEC7, Linux Yocto, VxWorks

Extreme Rugged™ PCI-104 Single Board Computer, with Intel® Atom™ E3815 (1C), 1.46GHZ, 5W

Adlink CM3-BT1 PCI-104 Single board computer

MPN:

CM3-BT1-E3815

Manufacturer L3 Communications

ADLINK

Description:

ADLINK is pleased to announce the new PCI-104 Single Board Computer CM3-BT1-E3815. With a single processor running from 1.46 GHz with up to 4GB DDR3L at 1066/1333 MHz SO-DIMM. The ADLINK CM3-BT1-E3815 delivers top-of-the-line performance with efficient power consumption that targets Industrial Automation, Digital Signage, Transportation, Energy and Military applications requiring industrial-grade stability.

The ADLINK CMx-BTx family offers various bus type options. PC/104, PC/104-Plus and PCI-104 variants are available. Each SBC supports VGA and 18/24 bit single/dual channel LVDS. ADLINK´s CMx-BTx is suitable for harsh environments. It is designed to withstand 50G shock and 12G vibration per MIL-STD-202F. Most variants support the extended temperature range from -40°C to +85°C.

The CM3-BT1-E3815 features up to two Gigabit Ethernet ports, up to two SATA or one SATA and one mSATA, one USB 3.0/2.0, two USB 2.0, up to four RS232/485 COM ports, 8 GPIOs and HD Audio.

Paired with ADLINK’s SEMA Cloud (Smart Embedded Management Agent) device-to-cloud platform that enables remote monitoring, control and management, the CMx-BTx is an ideal building block for developing IoT devices with a secure connection to the cloud.

View our wide range of Single Board Computers

View our portfolio of PC104 / PC104 plus

See all products from our supplier Adlink

Features:

  • Single core Intel® Atom™ E3815 Series Processor System-on-Chip
  • Up to 4GB DDR3L SO-DIMM at 1066/1333MHz (Non-ECC)
  • Supports VGA and LVDS
  • 1x mini-PCIe with mSATA and USB capability
  • Up to 2x GbE, 2x SATA 3Gb/s, 1x USB 3.0/2.0, 2x USB 2.0, 4x RS232/485/422, 5.1 channel HD-Audio, 8x GPIO
  • Supports Smart Embedded Management Agent (SEMA)
  • Standard OS support: WES7, WEC7, WES8, Linux Yocto, VxWorks
  • Available BSPs: WES7, WEC7, Linux Yocto, VxWorks

Extreme Rugged™ PCI-104 Single Board Computer, with Intel® Atom™ E3845 (4C), 1.91GHz, 10W

Adlink CM3-BT4 Quad  board computer

MPN:

CM3-BT4-E3845

Manufacturer L3 Communications

ADLINK

Description:

ADLINK is pleased to announce the new PCI-104 Single Board Computer CM3-BT4-E3845. With a quad-core processors running at 1.91 GHz with up to 4GB DDR3L at 1066/1333 MHz SO-DIMM. The ADLINK CM3-BT4-E3845 delivers top-of-the-line performance with efficient power consumption that targets Industrial Automation, Digital Signage, Transportation, Energy and Military applications requiring industrial-grade stability.

The ADLINK CMx-BTx family offers various bus type options. PC/104, PC/104-Plus and PCI-104 variants are available. Each SBC supports VGA and 18/24 bit single/dual channel LVDS. ADLINK´s CMx-BTx is suitable for harsh environments. It is designed to withstand 50G shock and 12G vibration per MIL-STD-202F. Most variants support the extended temperature range from -40°C to +85°C.

The CM3-BT4-E3845 features up to two Gigabit Ethernet ports, up to two SATA or one SATA and one mSATA, one USB 3.0/2.0, two USB 2.0, up to four RS232/485 COM ports, 8 GPIOs and HD Audio.

Paired with ADLINK’s SEMA Cloud (Smart Embedded Management Agent) device-to-cloud platform that enables remote monitoring, control and management, the CMx-BTx is an ideal building block for developing IoT devices with a secure connection to the cloud.

View our wide range of Single Board Computers

View our portfolio of PC104 / PC104 plus

See all products from our supplier Adlink

Features:

  • Quad-core Intel® Atom™ E3845 Series Processor System-on-Chip
  • Up to 4GB DDR3L SO-DIMM at 1066/1333MHz (Non-ECC)
  • Supports VGA and LVDS
  • 1x mini-PCIe with mSATA and USB capability
  • Up to 2x GbE, 2x SATA 3Gb/s, 1x USB 3.0/2.0, 2x USB 2.0, 4x RS232/485/422, 5.1 channel HD-Audio, 8x GPIO
  • Supports Smart Embedded Management Agent (SEMA)
  • Standard OS support: WES7, WEC7, WES8, Linux Yocto, VxWorks
  • Available BSPs: WES7, WEC7, Linux Yocto, VxWorks

XMC Module with NVIDIA GeForce GT 745M GPU

Adlink XMC-G745 XMC Module

MPN:

XMC-G745

Manufacturer L3 Communications

ADLINK

Description:

The ADLINK XMC-G745M is a rugged XMC module equipped with the CUDA-enabled 384-core NVIDIA GeForce GT 745M GPU, utilizing the NVIDIA “Kepler” architecture and yielding the unprecedented levels of graphics processing performance for defense and aerospace applications. The GeForce GT 745M features 2048MB of GDDR5 memory, ensuring high-capacity and high-bandwidth access to data during “massively parallel” GPGPU algorithm processing. ADLINK recognizes the trend towards implementing General Purpose computing on Graphics Processing Units (GPGPU) for parallel computing for increased processing performance and the XMC-G745M is targeted at a variety of high-performance computing application that can take advantage of this technology.

View our wide range of Graphic and video processing

View our portfolio of PMC / XMC

See all products from our supplier Adlink

Features:

  • NVIDIA GeForce GT 745M GPU with “Kepler” architecture
  • CUDA Compute Capability 3.0 for parallel computation and graphics processing
  • High-resolution, high-performance platform for rugged video
  • I/O and GPGPU applications

Smart touch computer, 10.4 inch, resistive touch screen, 1024 x 768 resolution

Adlink STC-1005-1205-1505 Series touch computer

MPN:

STC-1005-4R

Manufacturer L3 Communications

ADLINK

Description:

Adlink are pleased to officially launch the STC Smart Touch Computer product line. The STC-1005-4R industrial panel computer is available in three sizes with 10.4 inch touchscreen displays and designed for industrial automation and other applications in harsh environments requiring an IP65 compliant front bezel with projected capacitive multi-touch display.

View our wide range of Flat panel computers

View our portfolio of Embedded computing

See all products from our supplier Adlink

Features:

  • Multiple touch options with IP65-rated front bezel
  • Easy installation and maintenance
  • Designed with SMARC concept for optimum flexibility
  • Flexible I/O expansion to meet different requirements

Smart touch computer, 10.4 inch, projected capacitive touch screen, 1024 x 768 resolution

Adlink STC-1005-1205-1505 Series touch computer

MPN:

STC-1005-4P

Manufacturer L3 Communications

ADLINK

Description:

Adlink are pleased to officially launch the STC Smart Touch Computer product line. The STC-1005-4P industrial panel computer is available in three sizes with 10.4 inch touchscreen displays and designed for industrial automation and other applications in harsh environments requiring an IP65 compliant front bezel with projected capacitive multi-touch display.

View our wide range of Flat panel computers

View our portfolio of Embedded computing

See all products from our supplier Adlink

Features:

  • Multiple touch options with IP65-rated front bezel
  • Easy installation and maintenance
  • Designed with SMARC concept for optimum flexibility
  • Flexible I/O expansion to meet different requirements

Smart touch computer, 12.1 inch, resistive touch screen, 1024 x 768 resolution

Adlink STC-1005-1205-1505 Series touch computer

MPN:

STC-1205-4R

Manufacturer L3 Communications

ADLINK

Description:

Adlink are pleased to officially launch the STC Smart Touch Computer product line. The STC-1205-4R industrial panel computer is available in three sizes with 12.1 inch touchscreen displays and designed for industrial automation and other applications in harsh environments requiring an IP65 compliant front bezel with projected capacitive multi-touch display.

View our wide range of Flat panel computers

View our portfolio of Embedded computing

See all products from our supplier Adlink

Features:

  • Multiple touch options with IP65-rated front bezel
  • Easy installation and maintenance
  • Designed with SMARC concept for optimum flexibility
  • Flexible I/O expansion to meet different requirements

Smart touch computer, 12.1 inch, projected capacitive touch screen, 1024 x 768 resolution

Adlink STC-1005-1205-1505 Series touch computer

MPN:

STC-1205-4P

Manufacturer L3 Communications

ADLINK

Description:

Adlink are pleased to officially launch the STC Smart Touch Computer product line. The STC-1205-4P industrial panel computer is available in three sizes with 12.1 inch touchscreen displays and designed for industrial automation and other applications in harsh environments requiring an IP65 compliant front bezel with projected capacitive multi-touch display.

View our wide range of Flat panel computers

View our portfolio of Embedded computing

See all products from our supplier Adlink

Features:

  • Multiple touch options with IP65-rated front bezel
  • Easy installation and maintenance
  • Designed with SMARC concept for optimum flexibility
  • Flexible I/O expansion to meet different requirements

Smart touch computer, 15 inch, resistive touch screen, 1024 x 768 resolution

Adlink STC-1005-1205-1505 Series touch computer

MPN:

STC-1505-4R

Manufacturer L3 Communications

ADLINK

Description:

Adlink are pleased to officially launch the STC Smart Touch Computer product line. The STC-1505-4R industrial panel computer is available in three sizes with 15 inch touchscreen displays and designed for industrial automation and other applications in harsh environments requiring an IP65 compliant front bezel with projected capacitive multi-touch display.

View our wide range of Flat panel computers

View our portfolio of Embedded computing

See all products from our supplier Adlink

Features:

  • Multiple touch options with IP65-rated front bezel
  • Easy installation and maintenance
  • Designed with SMARC concept for optimum flexibility
  • Flexible I/O expansion to meet different requirements

Smart touch computer, 15 inch, projected capacitive touch screen, 1024 x 768 resolution

Adlink STC-1005-1205-1505 Series touch computer

MPN:

STC-1505-4P

Manufacturer L3 Communications

ADLINK

Description:

Adlink are pleased to officially launch the STC Smart Touch Computer product line. The STC-1505-4P industrial panel computer is available in three sizes with 15 inch touchscreen displays and designed for industrial automation and other applications in harsh environments requiring an IP65 compliant front bezel with projected capacitive multi-touch display.

View our wide range of Flat panel computers

View our portfolio of Embedded computing

See all products from our supplier Adlink

Features:

  • Multiple touch options with IP65-rated front bezel
  • Easy installation and maintenance
  • Designed with SMARC concept for optimum flexibility
  • Flexible I/O expansion to meet different requirements

Mini-ITX Embedded Board with Intel® 4th Gen Core™ i7/i5/i3 Desktop Processor

Adlink AmITX-HL-G Embedded Board

MPN:

AmITX-HL-G

Manufacturer L3 Communications

ADLINK

Description:

The AmITX-HL-G is a Mini-ITX embedded board supporting the Desktop 4th Generation Intel® Core™ i7/i5/i3 and Pentium®/Celeron® Processor with Intel® Q87/H81 Chipset. The AmITX-HL-G is specifically designed for customers who need high-level processing and graphics performance with a long product life solution.

The AmITX-HL-G features three DisplayPorts, dual Gigabit Ethernet ports, USB 3.0 ports, USB 2.0 ports, SATA 6 Gb/s ports, and High Definition Audio with 7.1 channels. Expansion is provided by one PCIe x16, one PCIe x1, and two mini-PCIe slots. The onboard feature connector provides GPIO, SMBus, and I2C support. The board is equipped with SPI AMI EFI BIOS, supporting embedded features such as hardware monitor and watchdog timer.

View our wide range of Embedded Motherboard

View our portfolio of PCI/PCie

See all products from our supplier Adlink

Features:

  • 4th gen Intel Core i7/i5/i3 Desktop Processor (Haswell and Haswell refresh)
  • Dual SODIMM DDR3L-1600 memory sockets supporting up to 16 GB
  • PCIe x16, PCIe x1 and Mini PCIe expansions
  • 3 DisplayPort outputs on rear IO

Extreme Outdoor Server, Single/Dual Intel® Xeon® E5-2418L v2, 2.0GHz

Adlink ETOS-1000 Serie

MPN:

ETOS-1000/D2418L v2/M16GB/mSATA 32GB

Manufacturer L3 Communications

ADLINK

Description:

ADLINK’s new ETOS-1000 is the first high-performance mobile edge computing (MEC) platform specifically designed for extreme environments and outdoor telecom/networking applications. Based on the dual Intel® Xeon® E5-2400 v2 family of processors, the ETOS-1000 MEC platform enables Telecom Equipment Manufacturers (TEMs) and application providers to deliver data center performance at the edge of the network. The ETOS-1000 provides IT and cloud-computing capabilities within the Radio Access Network (RAN) in close proximity to mobile subscribers. This offers a service environment characterized by proximity, ultra-low latency, and high-bandwidth that allows content, services, and applications to be accelerated, maintaining a customer’s high-level Quality of Experience (QoE).

The ETOS-1000 mobile edge computing platform provides computing resources, storage capacity, connectivity and access to user traffic and real-time radio and network information. This allows operators to offer context-related services that can differentiate and monetize the user experience. In addition, since the data is processed at the edge in the RAN environment, the ETOS-1000 reduces backhaul costs and improves the infrastructure’s efficiency with more intelligent and optimized networks. And with the onset of network functions virtualization (NFV) infrastructure, having data center performance at the edge of networks can enable specific virtualized network functions (VNFs) closer to the consumer, improving QoE. Attributes such as shock and vibration resistance, -40˚C to +55˚C operating temperature range, and IP65 water and dust ingress rating make the ETOS-1000 an ideal solution for outdoor and extreme environments. The ETOS-1000 can also utilize ADLINK’s application ready intelligent platform (ARiP) software, which includes PacketManager, remote management functions, and system management APIs for application developers. ARiPs enable customers to focus primarily on their application instead of the IoT platform building blocks required for cloud computing. The ETOS-1000 reduces maintenance costs by eliminating fans and filters and offering worry-free, weather-resistant, high-speed connections for copper or fiber options.

View our wide range of Embedded computer

View our portfolio of Platforms and systems

See all products from our supplier Adlink

Features:

  • Single/Dual Intel® Xeon® E5-2418L v2 (6C/12T) 2.0GHz
  • Six memory sockets support VLP RDIMM DDR3-1333/1600 REG/ECC up to 96 GB
  • Intel® C604 Chipset
  • Dual 10G SFP+ ports
  • Dual 10/100/1000 BASE-T ports
  • IP65 water and dust proof
  • Fanless, conduction cooled, aluminum chassis
  • Wide temperature range capability

Extreme Outdoor Server, Single/Dual Intel® Xeon® E5-2428L v2, 1.8GHz

Adlink ETOS-1000 Serie

MPN:

ETOS-1000/D2428L v2/M16GB/mSATA 32GB

Manufacturer L3 Communications

ADLINK

Description:

ADLINK’s new ETOS-1000 is the first high-performance mobile edge computing (MEC) platform specifically designed for extreme environments and outdoor telecom/networking applications. Based on the dual Intel® Xeon® E5-2400 v2 family of processors, the ETOS-1000 MEC platform enables Telecom Equipment Manufacturers (TEMs) and application providers to deliver data center performance at the edge of the network. The ETOS-1000 provides IT and cloud-computing capabilities within the Radio Access Network (RAN) in close proximity to mobile subscribers. This offers a service environment characterized by proximity, ultra-low latency, and high-bandwidth that allows content, services, and applications to be accelerated, maintaining a customer’s high-level Quality of Experience (QoE).

The ETOS-1000 mobile edge computing platform provides computing resources, storage capacity, connectivity and access to user traffic and real-time radio and network information. This allows operators to offer context-related services that can differentiate and monetize the user experience. In addition, since the data is processed at the edge in the RAN environment, the ETOS-1000 reduces backhaul costs and improves the infrastructure’s efficiency with more intelligent and optimized networks. And with the onset of network functions virtualization (NFV) infrastructure, having data center performance at the edge of networks can enable specific virtualized network functions (VNFs) closer to the consumer, improving QoE. Attributes such as shock and vibration resistance, -40˚C to +55˚C operating temperature range, and IP65 water and dust ingress rating make the ETOS-1000 an ideal solution for outdoor and extreme environments. The ETOS-1000 can also utilize ADLINK’s application ready intelligent platform (ARiP) software, which includes PacketManager, remote management functions, and system management APIs for application developers. ARiPs enable customers to focus primarily on their application instead of the IoT platform building blocks required for cloud computing. The ETOS-1000 reduces maintenance costs by eliminating fans and filters and offering worry-free, weather-resistant, high-speed connections for copper or fiber options.

View our wide range of Embedded computer

View our portfolio of Platforms and systems

See all products from our supplier Adlink

Features:

  • Single/Dual Intel® Xeon® E5-2428L v2 (8C/16T) 1.8GHz
  • Six memory sockets support VLP RDIMM DDR3-1333/1600 REG/ECC up to 96 GB
  • Intel® C604 Chipset
  • Dual 10G SFP+ ports
  • Dual 10/100/1000 BASE-T ports
  • IP65 water and dust proof
  • Fanless, conduction cooled, aluminum chassis
  • Wide temperature range capability

Extreme Outdoor Server, Single/Dual Intel® Xeon® E5-2448L v2, 1.8GHz

Adlink ETOS-1000 Serie

MPN:

ETOS-1000/D2448L v2/M16GB/mSATA 32GB

Manufacturer L3 Communications

ADLINK

Description:

ADLINK’s new ETOS-1000 is the first high-performance mobile edge computing (MEC) platform specifically designed for extreme environments and outdoor telecom/networking applications. Based on the dual Intel® Xeon® E5-2400 v2 family of processors, the ETOS-1000 MEC platform enables Telecom Equipment Manufacturers (TEMs) and application providers to deliver data center performance at the edge of the network. The ETOS-1000 provides IT and cloud-computing capabilities within the Radio Access Network (RAN) in close proximity to mobile subscribers. This offers a service environment characterized by proximity, ultra-low latency, and high-bandwidth that allows content, services, and applications to be accelerated, maintaining a customer’s high-level Quality of Experience (QoE).

The ETOS-1000 mobile edge computing platform provides computing resources, storage capacity, connectivity and access to user traffic and real-time radio and network information. This allows operators to offer context-related services that can differentiate and monetize the user experience. In addition, since the data is processed at the edge in the RAN environment, the ETOS-1000 reduces backhaul costs and improves the infrastructure’s efficiency with more intelligent and optimized networks. And with the onset of network functions virtualization (NFV) infrastructure, having data center performance at the edge of networks can enable specific virtualized network functions (VNFs) closer to the consumer, improving QoE. Attributes such as shock and vibration resistance, -40˚C to +55˚C operating temperature range, and IP65 water and dust ingress rating make the ETOS-1000 an ideal solution for outdoor and extreme environments. The ETOS-1000 can also utilize ADLINK’s application ready intelligent platform (ARiP) software, which includes PacketManager, remote management functions, and system management APIs for application developers. ARiPs enable customers to focus primarily on their application instead of the IoT platform building blocks required for cloud computing. The ETOS-1000 reduces maintenance costs by eliminating fans and filters and offering worry-free, weather-resistant, high-speed connections for copper or fiber options.

View our wide range of Embedded computer

View our portfolio of Platforms and systems

See all products from our supplier Adlink

Features:

  • Single/Dual Intel® Xeon® E5-2448L v2 (10C/20T) 1.8GHz
  • Six memory sockets support VLP RDIMM DDR3-1333/1600 REG/ECC up to 96 GB
  • Intel® C604 Chipset
  • Dual 10G SFP+ ports
  • Dual 10/100/1000 BASE-T ports
  • IP65 water and dust proof
  • Fanless, conduction cooled, aluminum chassis
  • Wide temperature range capability

Databus simulation and analysis software

Ballard COPilot6 Software

MPN:

CoPilot 6

Manufacturer L3 Communications

Astronics Ballard Technology

Description:

CoPilot is the quick and easy way to interact with avionics databuses. It handles virtually any task, so you won't need to write your own software. CoPilot will support multiple hardware devices and protocols simultaneously.

View our wide range of Embedded computer

View our portfolio of Platforms and systems

See all products from our supplier Astronics Ballard Technology

Features:

  • Auto discovery of hardware and bus activity
  • Simultaneous operation of multiple protocols
  • Flexible data representation
  • View and manipulate data in engineering units
  • Automated test environment (ATE)
  • Powerful scripting environment
  • Comprehensive program security
  • Sophisticated graphical displays
  • Hardware and software playback
  • Error injection

Portable ARINC 615/603 Data Loader

Ballard DL615 DataLoader

MPN:

DL-615

Manufacturer L3 Communications

Astronics Ballard Technology

Description:

The DL 615 turns any Microsoft Windows PC into an ARINC 615-3 and ARINC 603 data loader. The DL 615 is the modern replacement for outmoded 3½-inch floppy disk only ARINC 615 portable data loaders (PDL). Any PC running Microsoft® Windows® can perform data loads using the USB to ARINC 429 interface, cables, and software included with the DL 615. While being as simple to use as older floppy disk PDLs, the DL 615 provides record keeping, flexibility in data management, and powerful features for troubleshooting and enabling data loads into difficult LRUs.

View our wide range of ATDS / NTDS interface

View our portfolio of Platforms and systems

See all products from our supplier Astronics Ballard Technology

Features:

  • Replaces old 3½-inch floppy disk only PDLs
  • Use with any MS Windows® compatible PC
  • ARINC 615-3 and 603 protocols
  • Load from floppy, HD, USB, CD, DVD, or network
  • Clear indicators for load progress and status
  • Efficient multi-file, multi-disk and extra-large loads
  • Numerous logging options
  • Protocol recording and diagnostic tools
  • Configurable for problematic LRUs

ARINC 717 Test Set

Ballard TS717 Test SET

MPN:

TS-717

Manufacturer L3 Communications

Astronics Ballard Technology

Description:

The TS 717 Test Set for ARINC 717 is a convenient, easy-to-use tool for test and maintenance of aircraft systems that are tied to the Digital Flight Data Recorder (DFDR). The compact interface/cable hardware is conveniently stored in a rugged carrying case for easy transport and quick deployment. To use, simply connect one end to the aircraft test plug, the other to the USB port on any Windows® computer, and the accompanying CoPilot software displays the user-specified data received from a Digital Flight Data Acquisition Unit (DFDAU) or DFDR output databus.

View our wide range of ATDS / NTDS interface

View our portfolio of Platforms and systems

See all products from our supplier Astronics Ballard Technology

Features:

  • Easy to use
  • Receives, displays and transmits ARINC 573 and 717 data
  • Displays data in multiple radices
  • Shows bus speed and position status
  • Auto speed and sync detection
  • Selectable word, subframe, and superframe
  • Also available with ARINC 429 support
  • Applications:
  • 717 (and optional 429) analysis, test, and simulation
  • Flightline and AOG support
  • Data recording
  • Avionics validation/testing

USB 1553 to MIL-STD-1553 Interfaces

Ballard USB1553 Adapter

MPN:

USB 1553

Manufacturer L3 Communications

Astronics Ballard Technology

Description:

The USB 1553 family of pocket-sized USB adapters enable computers to communicate with, simulate, test, and monitor 1553 equipment and systems. These rugged USB 2.0 peripherals feature extensive MIL-STD-1553 functionality and are compatible with virtually all modern PC laptop, desktop, tablet, and netbook computers. They support maximum data throughput on all 1553 channels and have a large 32 MB built-in memory. All power necessary for operation is provided via the single USB port. Plug and Play and Hot Swap features make it easy to install and move between computers.

View our wide range of ATDS / NTDS interface

View our portfolio of Platforms and systems

See all products from our supplier Astronics Ballard Technology

Features:

  • Up to 2 Dual Redundant MIL-STD-1553 Channels
  • 8 Avionics Discrete I/O
  • IRIG A/B PWM and AM
  • USB 2.0 Bus Powered—No External Power Supply Needed
  • 32 MB Data Memory
  • RoHS Compliant Design
  • Standard Black or Flight Test Orange Case
  • Small, Portable, and Rugged
  • Boards also available without enclosure for embedded use

USB 429 to ARINC 429/717 Interfaces

Ballard USB429 Adapter

MPN:

USB 429

Manufacturer L3 Communications

Astronics Ballard Technology

Description:

The USB 429 family of pocket-sized USB adapters enable computers to communicate with, simulate, test, and monitor ARINC 429 and 717 equipment and systems. These rugged USB 2.0 peripherals feature extensive 429/717 functionality and are compatible with virtually all modern PC laptop, desktop, tablet, and netbook computers. They support maximum data throughput on all ARINC channels and have a large 32 MB built-in memory. All power necessary for operation is provided via the single USB port. Plug and Play and Hot Swap features make it easy to install and move between computers.

View our wide range of ATDS / NTDS interface

View our portfolio of Platforms and systems

See all products from our supplier Astronics Ballard Technology

Features:

  • Up to 16 ARINC 429 Channels
  • Up to 4 ARINC 717 Channels
  • 8 Avionics Discrete I/O
  • IRIG A/B PWM and AM
  • USB 2.0 Bus Powered—No External Power Supply Needed
  • 32 MB Data Memory
  • RoHS Compliant Design
  • Standard Black or Flight Test Orange Case
  • Small, Portable, and Rugged
  • Boards also available without enclosure for embedded use

USB 708 to ARINC 708 Interfaces

Ballard USB708 Adapter

MPN:

USB 708

Manufacturer L3 Communications

Astronics Ballard Technology

Description:

The USB 708 series of products are pocket-sized USB adapters that enable computers to interface with ARINC 708 and similar weather radar display databuses. They have extensive functionality for testing weather radar CDUs (Control-Display Units) and T-R (Transmit-Receive) units for monitoring, recording, and playing back data, and for simulating weather radar systems. The ARINC 708 display databus is sometimes referred to as ARINC 453. The USB 708 is compatible with virtually all modern PC laptop, desktop, tablet, and netbook computers, and all power necessary for operation is provided via the single USB port. Plug and Play and Hot Swap features make it easy to install and move between computers.

View our wide range of ATDS / NTDS interface

View our portfolio of Platforms and systems

See all products from our supplier Astronics Ballard Technology

Features:

  • Up to 4 ARINC 708 Channels
  • 8 Avionics Discrete I/O
  • IRIG A/B PWM and AM
  • USB 2.0 Bus Powered—No External Power Supply Needed
  • 32 MB Data Memory
  • RoHS Compliant Design
  • Standard Black or Flight Test Orange Case
  • Small, Portable, and Rugged

USB Multi-Protocol Avionics Interface

Ballard USBMulti Adapter

MPN:

USBMulti

Manufacturer L3 Communications

Astronics Ballard Technology

Description:

These pocket-sized USB adapters are the easy and portable way to interface your computer to multiple avionics databuses including: MIL-STD-1553, EBR 1553, ARINC 429, ARINC 708, ARINC 717, Serial, and Discrete I/O.

View our wide range of ATDS / NTDS interface

View our portfolio of Platforms and systems

See all products from our supplier Astronics Ballard Technology

Features:

  • Interface USB to Multiple Avionics Databus Protocols with a Single Unit
  • 8 Avionics Discrete I/O
  • IRIG A/B PWM and AM
  • USB 2.0 Bus Powered-No External Power Supply Needed
  • 32 MB Data Memory
  • RoHS Compliant Design
  • Standard Black or Flight Test Orange Case
  • Small, Portable, and Rugged
  • Boards also available without enclosure for embedded use

PC/104-Plus Interface for MIL-STD-1553

Ballard PM1553-5 PC/104-Plus Interface

MPN:

PM1553-5

Manufacturer L3 Communications

Astronics Ballard Technology

Description:

The rugged PM1553-5 family of PC/104-Plus cards provide reliable MIL-STD-1553 functionality for communicating with, and monitoring 1553 equipment and systems. The family includes single or multi-function models with a choice of 1 to 4 dual-redundant 1553 channels.

View our wide range of Avionics interfaces

View our portfolio of PC104 / PC104+

See all products from our supplier Astronics Ballard Technology

Features:

  • Powerful protocol engine
  • Easy installation
  • 32 MB Data Memory
  • PC/104-Plus Compliant
  • Rugged Extended Temperature Design
  • RoHS compliant
  • Protocols & I/O:

  • Up to 4 MIL-STD-1553 Channels
  • 16 Avionics Discrete I/O
  • IRIG A/B PWM and AM

PC/104 Interface for MIL-STD-1553

Ballard PM1553-1 PC/104-Plus Interface

MPN:

PM1553-1

Manufacturer L3 Communications

Astronics Ballard Technology

Description:

The PM1553-1 is a low-cost dual-redundant MIL-STD-1553 interface for PC/104-embedded computers. It can be programmed to function as a 1553 Bus Controller (BC), Remote Terminal (RT), or Monitor. In addition to 1553 capability, the PM1553-1 has configurable input (4) and output (2) discretes. The PM1553-1 has many features that minimize the load on the host processor and can even eliminate the need for additional cards.

View our wide range of Avionics interfaces

View our portfolio of PC104 / PC104+

See all products from our supplier Astronics Ballard Technology

Features:

  • BC, RT, and Monitor modes
  • 32K x 16 memory
  • Powerful SµMMIT® protocol processor
  • MIL-STD-1760 support
  • Configurable discretes (4 in/2 out)
  • Custom versions available
  • PC/104 compliant

ARINC 429 Interface for PC/104

Ballard PM429-1 ARINC 429 Interface

MPN:

PM429-1

Manufacturer L3 Communications

Astronics Ballard Technology

Description:

The PM429-1 is a low-cost ARINC 429 interface for PC/104 embedded computers. In addition to the four receive and two transmit ARINC 429 channels, the PM429-1 has configurable input (8) and output (4) discretes and a programmable timer. The PM429-1 has many features that are not available on simpler ARINC 429 interfaces. These features minimize the load on the host processor and can even eliminate the need for additional cards.

View our wide range of Avionics interfaces

View our portfolio of PC104 / PC104+

See all products from our supplier Astronics Ballard Technology

Features:

  • PC/104 compliant
  • Six ARINC 429 channels (4R/2T)
  • Twelve configurable discretes (8 in/4 out)
  • General-purpose timer
  • Commercial, industrial, and military temperature grades
  • Transient voltage protection
  • Custom versions available

ARINC 429 Interface for PC/104+

Ballard PM429-2 ARINC 429 Interface

MPN:

PM429-2

Manufacturer L3 Communications

Astronics Ballard Technology

Description:

Astronics Ballard Technology's PM429-2 product is a PC/104-Plus compliant interface card for communicating over ARINC 429 and ARINC 717 avionics databuses for both simulation and embedded applications. This interface provides current value registers and 32MB of SDRAM for list and monitor buffering. PM429-2 models offer up to 16 ARINC 429 channels, 4 ARINC 717 channels, IRIG time synchronization and 16 input /output avionics discretes. The discrete I/O can be used as general purpose I/O or for trigger or sync activities in coordination with protocol functions.

View our wide range of Avionics interfaces

View our portfolio of PC104 / PC104+

See all products from our supplier Astronics Ballard Technology

Features:

  • PC/104-Plus compliant
  • Up to 16 ARINC 429 channels
  • Up to 4 ARINC 717 channels
  • Large 32MB memory for Tx/Rx/Mon buffering
  • 16 Avionics discrete I/O signals
  • 48 bit, 1 usec hardware time-tagging
  • IRIG A/B PWM and AM synchronisation
  • Rugged extended temperature design
  • Easy to use software interface

Multi-Protocol Interface Cards, PCIe/104 and PCI/104-Express

Ballard PE1000 Multi Protocol Interface

MPN:

PE1000

Manufacturer L3 Communications

Astronics Ballard Technology

Description:

The PE1000 family of PCIe/104™ and PCI/104-Express™ cards enable embedded computers to interface with a variety of avionics databuses.

View our wide range of Multi Function I/O

View our portfolio of PC104 / PC104+

See all products from our supplier Astronics Ballard Technology

Features:

  • Multiple protocol support
  • Rugged Extended Temperature Design
  • Single- or Multi-function 1553 models
  • Powerful protocol engine
  • Easy-to-use software interface

Aircraft Interface Device

Ballard AB2-AID Aircraft Interface Device

MPN:

AB2-AID

Manufacturer L3 Communications

Astronics Ballard Technology

Description:

The AB2-AID is ready to go with high-performance avionics I/O combined with valuable built-in features such as a 9-port Ethernet switch, Ethernet to serial bridge, and 8GB flash memory. All in a compact, rugged package for easier integration and longer life.

View our wide range of Multi Function I/O

View our portfolio of Platforms and systems

See all products from our supplier Astronics Ballard Technology

Features:

  • Optimal combination of avionics I/O and operational features
  • Certified device with FAA Parts Manufacturer Approval (PMA)
  • Based on proven AB2000 design deployed on over 30 aircraft platforms
  • Lightweight and low power
  • Integrated 9-port Ethernet switch
  • multiple AID models available
  • Numerous expansion options

PCI MIL-STD-1553 Avionics Interfaces

Ballard Lx1553 PCI/PCIe MIL-STD-1553 Avionics Interfaces

MPN:

Lx1553-5

Manufacturer L3 Communications

Astronics Ballard Technology

Description:

The LP1553-5 PCI are personal computer expansion cards for communicating with MIL-STD-1553 systems. These feature-rich interfaces provide programmable data buffers and deep built-in memory. Models offer 1 to 4 dual redundant MIL-STD-1553 channels, 16 input/output avionics level discretes, and IRIG time synchronization/generation. MIL-STD-1553 capability includes BC, RT, and/or Monitor. The Lx1553-5 model line supports maximum data throughput on all 1553 interfaces.

View our wide range of Avionics interfaces

View our portfolio of PCI/PCIe

See all products from our supplier Astronics Ballard Technology

Features:

  • 1 to 4 dual-redundant MIL-STD-1553 channels
  • Single-function: BC or RT(s) or monitor
  • Multi-function: BC and RT(s) and monitor
  • IRIG & 16 Avionics discrete I/O
  • Large 32 MB on-board memory
  • 48 bit, 1 uSec hardware time-tagging
  • All power drawn from backplane (no auxiliary cabling required)
  • RoHS compliant design
  • Translation DLL for application conversion
  • CoPilot® databus analyzer software available

PCI Express MIL-STD-1553 Avionics Interfaces

Ballard Lx1553 PCI/PCIe MIL-STD-1553 Avionics Interfaces

MPN:

Lx1553-3

Manufacturer L3 Communications

Astronics Ballard Technology

Description:

The LE1553-5 PCIe are personal computer expansion cards for communicating with MIL-STD-1553 systems. These feature-rich interfaces provide programmable data buffers and deep built-in memory. Models offer 1 to 4 dual redundant MIL-STD-1553 channels, 16 input/output avionics level discretes, and IRIG time synchronization/generation. MIL-STD-1553 capability includes BC, RT, and/or Monitor.

View our wide range of Avionics interfaces

View our portfolio of PCI/PCIe

See all products from our supplier Astronics Ballard Technology

Features:

  • 1 to 4 dual-redundant MIL-STD-1553 channels
  • Single-function: BC or RT(s) or monitor
  • Multi-function: BC and RT(s) and monitor
  • IRIG & 16 Avionics discrete I/O
  • Large 32 MB on-board memory
  • 48 bit, 1 uSec hardware time-tagging
  • All power drawn from backplane (no auxiliary cabling required)
  • RoHS compliant design
  • Translation DLL for application conversion
  • CoPilot® databus analyzer software available

PCI and PCI Express ARINC 429/717 Avionics Interfaces

Ballard Lx429-5 PCI and PCI Express ARINC 429/717 Avionics Interfaces

MPN:

Lx429-5

Manufacturer L3 Communications

Astronics Ballard Technology

Description:

The LP429-5 (PCI) and LE429-5 (PCIe) are personal computer expansion cards for communicating with ARINC 429 and ARINC 717 systems. These feature-rich interfaces provide programmable dual redundant data buffers and deep built-in memory. Models offer 4 to 32 ARINC 429 channels, and up to 4 ARINC 717 channels, 16 input/output avionics level discretes, and IRIG time synchronization/generation. Avionics discretes can be used as general purpose I/O or linked in hardware to databus activity as triggers or syncs. The Lx429-5 products support maximum data throughput on all avionics interfaces.

View our wide range of Avionics interfaces

View our portfolio of PCI/PCIe

See all products from our supplier Astronics Ballard Technology

Features:

  • 4 to 32 ARINC 429 channels
  • ARINC 717 (4 channels optional)
  • IRIG & 16 Avionics discrete I/O
  • Large 32 MB on-board memory
  • 48 bit, 1 uSec hardware time-tagging
  • All power drawn from backplane (no auxiliary cabling required)
  • RoHS compliant design
  • Translation DLL for application conversion
  • CoPilot® databus analyzer software available

OmniBus® II PCIe Databus Interface Cards

Ballard Tech OmniBusII PCIe Interface

MPN:

OmniBus® II PCIe

Manufacturer L3 Communications

Astronics Ballard Technology

Description:

The OmniBus II PCIe card enables computers and networks to interface with multiple avionics databuses for testing, validating and simulating commercial and military avionics equipment and systems. It is highly configurable and includes two internal Cores that can be populated with a variety of databus protocols and discrete I/O modules. The OmniBus II PCIe is the next-generation of Astronics Ballard Technology's popular OmniBus product with faster I/O and processing capabilities. With the newest advanced set of MIL-STD-1553 and ARINC 429 modules, users can verify wave form compatibilities, test functions of bus shorts and opens, and—when combined with our CoPilot® software—perform lab, production and flight test verification and simulation right out of the box. Readily available as Commercial Off-The-Shelf (COTS) products, the PCIe interface is perfect for challenging simulation, test, interface, and data recording applications.

Hardware - OmniBus II modules used on this card feature the latest 6th generation protocol engines and bus mastering to yield high performance. Power is obtained from the backplane bus—no supplemental power is needed. All cards are standard half size and include sixteen TTL level input/output discrete and IRIG time synchronization/generation. User software can indicate status by controlling the two LEDs.

View our wide range of Avionic interfaces

View our portfolio of PCI/PCIe/PXIe interfaces

See all products from our supplier Astronics Ballard Technology Tech

Features:

  • Supports multiple protocols in one card
  • 3 syncs and 3 triggers per core
  • Advanced timing: IRIG, 10 MHz, and PPS
  • Built-in test: PBIT, IBIT and CBIT

OmniBus® II PXI Express Databus Interface Cards

Ballard Tech OmniBusII PXIe Interface

MPN:

OmniBus® II PXIe

Manufacturer L3 Communications

Astronics Ballard Technology

Description:

The OmniBus II PXI Express (PXIe) card is designed for use in multi-slot PXIe and CompactPCI Express test systems. It enables these systems to interface with multiple avionics databuses for testing, validating and simulating commercial and military avionics equipment and systems. The card is highly configurable and includes two internal Cores that can be populated with a variety of databus protocols and discrete I/O modules. The OmniBus II PXIe is the next-generation of Astronics Ballard Technology's popular OmniBus product with faster I/O and processing capabilities. With the newest advanced set of MIL-STD-1553 and ARINC 429 modules, users can verify wave form compatibilities, test functions of bus shorts and opens, and—when combined with our CoPilot® software—perform lab, production and flight test verification and simulation right out of the box. Readily available as Commercial Off-The-Shelf (COTS) products, the PCIe interface is perfect for challenging simulation, test, interface, and data recording applications.

Hardware - OmniBus II modules used on this card feature the latest 6th generation protocol engines and bus mastering to yield high performance. Power is obtained from the backplane bus—no supplemental power is needed. All cards are standard 3U size and include sixteen TTL level input/output discretes and IRIG time synchronization/generation. User software can indicate status by controlling the two LEDs.

View our wide range of Avionic interfaces

View our portfolio of PCI/PCIe/PXIe interfaces

See all products from our supplier Astronics Ballard Technology Tech

Features:

  • Compatible with both PXIe and CompactPCI Express (cPCIe) test systems
  • PXI triggers/syncs/clocks
  • Advanced timing: IRIG, 10 MHz, and PPS
  • Built-in test: PBIT, IBIT and CBIT

OmnibusBox™ II Databus to Network interfaces

Ballard TechOmniBoxII Interface

MPN:

OmniBusBox™ II

Manufacturer L3 Communications

Astronics Ballard Technology

Description:

The OmniBusBox II (OBB2) enables computers and networks to interface with multiple avionics databuses for testing, validating and simulating commercial and military avionics equipment and systems. These versatile units can be controlled through Ethernet or USB, or can be programmed to operate standalone. Readily available as Commercial Off-The-Shelf (COTS) products, the OBB2 is perfect for challenging simulation, test, interface, bridging, control, simulation and data recording applications. The OmniBusBox II is the next-generation of Astronics Ballard Technology's popular OmniBusBox product with faster I/O and processing capabilities. The OBB2 is highly configurable and includes built-in standard peripherals (Ethernet, serial, USB and high quality audio lines), along with four internal Cores that can be populated with a variety of databus protocols and discrete I/O modules. With the newest advanced set of MIL-STD-1553 and ARINC 429 modules, users can verify wave form compatibilities, test functions of bus shorts and opens, and—when combined with our CoPilot® software—perform lab, production and flight test verification and simulation right out of the box.

Architecture - At the heart of the OmniBusBox II is a P1022 Freescale PowerPC processor and Astronics Ballard Technology's FPGA protocol engines. In addition to the built-in standard peripherals and core I/O functions, PMC/XMC and Mini-PCIe sites provide additional I/O expansion, including ARINC 664, CAN, IEEE 1394 and wireless protocols. The OBB2 includes extensive timing synchronization with multiple sources including 10MHz, PPS, IEEE 1588 and IRIG A/B. The 1U high case is easily placed on a desk or rack mountable. Though designed primarily as a lab product, the OBB2 has potential for use in large fixed-wing aircraft and light vehicle applications.

View our wide range of Embedded computer

View our portfolio of Platform and Systems

See all products from our supplier Astronics Ballard Technology Tech

Features:

  • Dual Core PPC Embedded Processor
  • Ethernet, serial and USB
  • Multiple protocols
  • Extensive timing features
  • GSM, WiFi and GPS (optional)
  • Return to factory settings feature
  • Accepts lab and aircraft power
  • Two- and four-I/O module versions are available. Each has different built-in expansion capabilities.

Gateway platform, Intel® Quark™ Processor-Based IoT

MXE-101i

MPN:

MXE-101i

Manufacturer L3 Communications

ADLINK

Description:

ADLINK's new Matrix MXE-100i IoT gateway platform, supporting Intel® Gateway Solutions for the Internet of Things (IoT), provides an extremely compact IoT gateway platform. Based on the Intel® Quark™ SoC X1021, and integrating Wind River® Intelligent Device Platform XT and McAfee Embedded Control, the MXE-100i, combined with ADLINK's embedded SEMA cloud solution, delivers the manageability and security critical to IoT-based operation.

With the implementation of ADLINK's proprietary SEMA Cloud solution, the MXE-100i maximises manageability and security for a world of applications, delivering efficient remote monitoring of system activity and health in real time, system control over a robust secured channel, and complete, fully manageable utilisation of system resources.

2 High-Speed LAN, two COM, three USB 2.0 host and SDIO, dual mini PCIe slots and USIM socket supporting communication with connections such as, WiFi, BT and 3G optimises connectivity and saves system power as well. The MXE-100i enables seamless interconnection, ensuring interoperability between systems. Matrix's proven rugged construction assures operation in harsh environments with operating vibration up to 5Grms, shock tolerance up to 100 G and an extended operating temperature range of -20°C to 70°C option. All told, the MXE-100i presents an intelligent, robust embedded system supporting wide application development and easy service deployment, presenting outstanding performance in Internet of Things, Intelligent Transportation, Facility Management, and Industrial Automation applications.

Features:

  • Intel® Quark™ SoC X1021
  • Extremely compact: 120 mm (W) x 100 mm (D) x 55 mm (H)
  • 3x USB 2.0, 2x 10/100 LAN ports, 2x COM ports, 1x SDIO
  • 2x mPCIe slots, 1x USIM slot
  • 3x user defined LED
  • Built-in ADLINK SEMA Cloud solution
  • Optional DIN-rail / wall mounting, onboard WiFi and TPM
  • Full support for Intel® Gateway Solutions for the Internet of Things (IoT)

Mini-ITX motherboard, Intel® Celeron® N2930 processor, 1.83 GHz

AmITX-BT-I-N2930

MPN:

AmITX-BT-I-N2930

Manufacturer L3 Communications

ADLINK

Description:

The AmITX-BT-I is a Mini-ITX motherboard supporting the Intel® Atom™ processor E3800 Series and Intel® Celeron® processor system-on-chip (SoC). The AmITX-BT-I is specifically designed for customers who need high-level processing and graphics performance with low power consumption in a long product life solution.

The Intel® Atom™ processor E3800 and Intel® Celeron® processor support non-ECC type DDR3L dual-channel memory at 1066/1333 MHz to provide excellent overall performance. Integrated Intel® Gen7 HD Graphics includes features such as OpenGL 3.1, DirectX 11, OpenCL 1.1 and support for H.264, MPEG2, VC1, VP8 hardware decode. Graphics outputs include VGA, DDI ports supporting HDMI and optional dual-channel 18/24-bit LVDS. The AmITX-BT-I has dual stacked SODIMM sockets for up to 8 GB non-ECC type DDR3L memory. In addition, an onboard miniSD card slot is supported (Only for E38XX SKU).

The AmITX-BT-I features dual Gigabit Ethernet port, USB 3.0 ports and USB 2.0 ports, and SATA 3 Gb/s ports. Support is provided for SMBus and I2C. The module is equipped with SPI AMI EFI BIOS, supporting embedded features such as hardware monitor and watchdog timer.

The ADLINK AmITX-BT-I with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. AmITX-BT-I is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, determine which data to save locally and which to send to the cloud for further analysis. The results these analyses can provide valuable information for policy decision making and generate innovative business opportunities.

Features:

  • Intel® Atom™ Processor E38xx System-on-Chip (single, dual or quad core)
  • Dual SODIMM socket DDR3L-1333 memory (up to 8GB)
  • 24-bit dual channel LVDS and HDMI OpenGL 3.0, OpenCL 1.2, DX11, H.264, MPEG2, MCV, VC-1, VP8 support
  • Extreme Rugged Operating Temperature: -40°C to +85°C

Mini-ITX motherboard, Intel® Celeron® J1900 processor, 2.00 GHz

AmITX-BT-I-J1900

MPN:

AmITX-BT-I-J1900

Manufacturer L3 Communications

ADLINK

Description:

The AmITX-BT-I is a Mini-ITX motherboard supporting the Intel® Atom™ processor E3800 Series and Intel® Celeron® processor system-on-chip (SoC). The AmITX-BT-I is specifically designed for customers who need high-level processing and graphics performance with low power consumption in a long product life solution.

The Intel® Atom™ processor E3800 and Intel® Celeron® processor support non-ECC type DDR3L dual-channel memory at 1066/1333 MHz to provide excellent overall performance. Integrated Intel® Gen7 HD Graphics includes features such as OpenGL 3.1, DirectX 11, OpenCL 1.1 and support for H.264, MPEG2, VC1, VP8 hardware decode. Graphics outputs include VGA, DDI ports supporting HDMI and optional dual-channel 18/24-bit LVDS. The AmITX-BT-I has dual stacked SODIMM sockets for up to 8 GB non-ECC type DDR3L memory. In addition, an onboard miniSD card slot is supported (Only for E38XX SKU).

The AmITX-BT-I features dual Gigabit Ethernet port, USB 3.0 ports and USB 2.0 ports, and SATA 3 Gb/s ports. Support is provided for SMBus and I2C. The module is equipped with SPI AMI EFI BIOS, supporting embedded features such as hardware monitor and watchdog timer.

The ADLINK AmITX-BT-I with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. AmITX-BT-I is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, determine which data to save locally and which to send to the cloud for further analysis. The results these analyses can provide valuable information for policy decision making and generate innovative business opportunities.

Features:

  • Intel® Atom™ Processor E38xx System-on-Chip (single, dual or quad core)
  • Dual SODIMM socket DDR3L-1333 memory (up to 8GB)
  • 24-bit dual channel LVDS and HDMI OpenGL 3.0, OpenCL 1.2, DX11, H.264, MPEG2, MCV, VC-1, VP8 support
  • Extreme Rugged Operating Temperature: -40°C to +85°C

Mini-ITX motherboard, Intel® Atom™ E3845 processor, 1.91 GHz

AmITX-BT-I-E3845

MPN:

AmITX-BT-I-E3845

Manufacturer L3 Communications

ADLINK

Description:

The AmITX-BT-I is a Mini-ITX motherboard supporting the Intel® Atom™ processor E3800 Series and Intel® Celeron® processor system-on-chip (SoC). The AmITX-BT-I is specifically designed for customers who need high-level processing and graphics performance with low power consumption in a long product life solution.

The Intel® Atom™ processor E3800 and Intel® Celeron® processor support non-ECC type DDR3L dual-channel memory at 1066/1333 MHz to provide excellent overall performance. Integrated Intel® Gen7 HD Graphics includes features such as OpenGL 3.1, DirectX 11, OpenCL 1.1 and support for H.264, MPEG2, VC1, VP8 hardware decode. Graphics outputs include VGA, DDI ports supporting HDMI and optional dual-channel 18/24-bit LVDS. The AmITX-BT-I has dual stacked SODIMM sockets for up to 8 GB non-ECC type DDR3L memory. In addition, an onboard miniSD card slot is supported (Only for E38XX SKU).

The AmITX-BT-I features dual Gigabit Ethernet port, USB 3.0 ports and USB 2.0 ports, and SATA 3 Gb/s ports. Support is provided for SMBus and I2C. The module is equipped with SPI AMI EFI BIOS, supporting embedded features such as hardware monitor and watchdog timer.

The ADLINK AmITX-BT-I with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. AmITX-BT-I is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, determine which data to save locally and which to send to the cloud for further analysis. The results these analyses can provide valuable information for policy decision making and generate innovative business opportunities.

Features:

  • Intel® Atom™ Processor E38xx System-on-Chip (single, dual or quad core)
  • Dual SODIMM socket DDR3L-1333 memory (up to 8GB)
  • 24-bit dual channel LVDS and HDMI OpenGL 3.0, OpenCL 1.2, DX11, H.264, MPEG2, MCV, VC-1, VP8 support
  • Extreme Rugged Operating Temperature: -40°C to +85°C

Mini-ITX motherboard, Intel® Atom™ E3827 processor, 1.75 GHz

AmITX-BT-I-E3827

MPN:

AmITX-BT-I-E3827

Manufacturer L3 Communications

ADLINK

Description:

The AmITX-BT-I is a Mini-ITX motherboard supporting the Intel® Atom™ processor E3800 Series and Intel® Celeron® processor system-on-chip (SoC). The AmITX-BT-I is specifically designed for customers who need high-level processing and graphics performance with low power consumption in a long product life solution.

The Intel® Atom™ processor E3800 and Intel® Celeron® processor support non-ECC type DDR3L dual-channel memory at 1066/1333 MHz to provide excellent overall performance. Integrated Intel® Gen7 HD Graphics includes features such as OpenGL 3.1, DirectX 11, OpenCL 1.1 and support for H.264, MPEG2, VC1, VP8 hardware decode. Graphics outputs include VGA, DDI ports supporting HDMI and optional dual-channel 18/24-bit LVDS. The AmITX-BT-I has dual stacked SODIMM sockets for up to 8 GB non-ECC type DDR3L memory. In addition, an onboard miniSD card slot is supported (Only for E38XX SKU).

The AmITX-BT-I features dual Gigabit Ethernet port, USB 3.0 ports and USB 2.0 ports, and SATA 3 Gb/s ports. Support is provided for SMBus and I2C. The module is equipped with SPI AMI EFI BIOS, supporting embedded features such as hardware monitor and watchdog timer.

The ADLINK AmITX-BT-I with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. AmITX-BT-I is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, determine which data to save locally and which to send to the cloud for further analysis. The results these analyses can provide valuable information for policy decision making and generate innovative business opportunities.

Features:

  • Intel® Atom™ Processor E38xx System-on-Chip (single, dual or quad core)
  • Dual SODIMM socket DDR3L-1333 memory (up to 8GB)
  • 24-bit dual channel LVDS and HDMI OpenGL 3.0, OpenCL 1.2, DX11, H.264, MPEG2, MCV, VC-1, VP8 support
  • Extreme Rugged Operating Temperature: -40°C to +85°C

Mini-ITX motherboard, Intel® Atom™ E3826 processor, 1.46 GHz

AmITX-BT-I-E3826

MPN:

AmITX-BT-I-E3826

Manufacturer L3 Communications

ADLINK

Description:

The AmITX-BT-I is a Mini-ITX motherboard supporting the Intel® Atom™ processor E3800 Series and Intel® Celeron® processor system-on-chip (SoC). The AmITX-BT-I is specifically designed for customers who need high-level processing and graphics performance with low power consumption in a long product life solution.

The Intel® Atom™ processor E3800 and Intel® Celeron® processor support non-ECC type DDR3L dual-channel memory at 1066/1333 MHz to provide excellent overall performance. Integrated Intel® Gen7 HD Graphics includes features such as OpenGL 3.1, DirectX 11, OpenCL 1.1 and support for H.264, MPEG2, VC1, VP8 hardware decode. Graphics outputs include VGA, DDI ports supporting HDMI and optional dual-channel 18/24-bit LVDS. The AmITX-BT-I has dual stacked SODIMM sockets for up to 8 GB non-ECC type DDR3L memory. In addition, an onboard miniSD card slot is supported (Only for E38XX SKU).

The AmITX-BT-I features dual Gigabit Ethernet port, USB 3.0 ports and USB 2.0 ports, and SATA 3 Gb/s ports. Support is provided for SMBus and I2C. The module is equipped with SPI AMI EFI BIOS, supporting embedded features such as hardware monitor and watchdog timer.

The ADLINK AmITX-BT-I with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. AmITX-BT-I is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, determine which data to save locally and which to send to the cloud for further analysis. The results these analyses can provide valuable information for policy decision making and generate innovative business opportunities.

Features:

  • Intel® Atom™ Processor E38xx System-on-Chip (single, dual or quad core)
  • Dual SODIMM socket DDR3L-1333 memory (up to 8GB)
  • 24-bit dual channel LVDS and HDMI OpenGL 3.0, OpenCL 1.2, DX11, H.264, MPEG2, MCV, VC-1, VP8 support
  • Extreme Rugged Operating Temperature: -40°C to +85°C

Mini-ITX motherboard, Intel® Atom™ E3825 processor, 1.33 GHz

AmITX-BT-I-E3825

MPN:

AmITX-BT-I-E3825

Manufacturer L3 Communications

ADLINK

Description:

The AmITX-BT-I is a Mini-ITX motherboard supporting the Intel® Atom™ processor E3800 Series and Intel® Celeron® processor system-on-chip (SoC). The AmITX-BT-I is specifically designed for customers who need high-level processing and graphics performance with low power consumption in a long product life solution.

The Intel® Atom™ processor E3800 and Intel® Celeron® processor support non-ECC type DDR3L dual-channel memory at 1066/1333 MHz to provide excellent overall performance. Integrated Intel® Gen7 HD Graphics includes features such as OpenGL 3.1, DirectX 11, OpenCL 1.1 and support for H.264, MPEG2, VC1, VP8 hardware decode. Graphics outputs include VGA, DDI ports supporting HDMI and optional dual-channel 18/24-bit LVDS. The AmITX-BT-I has dual stacked SODIMM sockets for up to 8 GB non-ECC type DDR3L memory. In addition, an onboard miniSD card slot is supported (Only for E38XX SKU).

The AmITX-BT-I features dual Gigabit Ethernet port, USB 3.0 ports and USB 2.0 ports, and SATA 3 Gb/s ports. Support is provided for SMBus and I2C. The module is equipped with SPI AMI EFI BIOS, supporting embedded features such as hardware monitor and watchdog timer.

The ADLINK AmITX-BT-I with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. AmITX-BT-I is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, determine which data to save locally and which to send to the cloud for further analysis. The results these analyses can provide valuable information for policy decision making and generate innovative business opportunities.

Features:

  • Intel® Atom™ Processor E38xx System-on-Chip (single, dual or quad core)
  • Dual SODIMM socket DDR3L-1333 memory (up to 8GB)
  • 24-bit dual channel LVDS and HDMI OpenGL 3.0, OpenCL 1.2, DX11, H.264, MPEG2, MCV, VC-1, VP8 support
  • Extreme Rugged Operating Temperature: -40°C to +85°C

Mini-ITX motherboard, Intel® Atom™ E3815 processor, 1.46 GHz

AmITX-BT-I-E3815

MPN:

AmITX-BT-I-E3815

Manufacturer L3 Communications

ADLINK

Description:

The AmITX-BT-I is a Mini-ITX motherboard supporting the Intel® Atom™ processor E3800 Series and Intel® Celeron® processor system-on-chip (SoC). The AmITX-BT-I is specifically designed for customers who need high-level processing and graphics performance with low power consumption in a long product life solution.

The Intel® Atom™ processor E3800 and Intel® Celeron® processor support non-ECC type DDR3L dual-channel memory at 1066/1333 MHz to provide excellent overall performance. Integrated Intel® Gen7 HD Graphics includes features such as OpenGL 3.1, DirectX 11, OpenCL 1.1 and support for H.264, MPEG2, VC1, VP8 hardware decode. Graphics outputs include VGA, DDI ports supporting HDMI and optional dual-channel 18/24-bit LVDS. The AmITX-BT-I has dual stacked SODIMM sockets for up to 8 GB non-ECC type DDR3L memory. In addition, an onboard miniSD card slot is supported (Only for E38XX SKU).

The AmITX-BT-I features dual Gigabit Ethernet port, USB 3.0 ports and USB 2.0 ports, and SATA 3 Gb/s ports. Support is provided for SMBus and I2C. The module is equipped with SPI AMI EFI BIOS, supporting embedded features such as hardware monitor and watchdog timer.

The ADLINK AmITX-BT-I with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. AmITX-BT-I is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, determine which data to save locally and which to send to the cloud for further analysis. The results these analyses can provide valuable information for policy decision making and generate innovative business opportunities.

Features:

  • Intel® Atom™ Processor E38xx System-on-Chip (single, dual or quad core)
  • Dual SODIMM socket DDR3L-1333 memory (up to 8GB)
  • 24-bit dual channel LVDS and HDMI OpenGL 3.0, OpenCL 1.2, DX11, H.264, MPEG2, MCV, VC-1, VP8 support
  • Extreme Rugged Operating Temperature: -40°C to +85°C

6U CompactPCI 3rd Gen Intel Core i7 Processor Blade, PCIe x16 to Rear IO

Adlink cPCI6525 cPCI processor blade

MPN:

cPCI-6525/3615Q/M8-0

Manufacturer L3 Communications

ADLINK

Description:

Adlink is pleased to announce 6U CompactPCI 3rd Gen Intel® Core™ i7 Processor Blade with PCIe x16 to Rear IO: cPCI-6525. The cPCI-6525 is the derived model from the cPCI-6520 offering Gen2 PCIex16 to rear to maximize GPGPU parallel computing performance. The cPCI-6525 is a 6U CompactPCI® processor blade in single-slot (4HP) width form factor featuring a single 22nm FC-BGA 3rd generation Intel® Core™ i7 Processor with quad-cores mated with the Mobile Intel® QM77 Express Chipset. The cPCI-6525 supports dual channel DDR3-1333/1600 ECC SDRAM with one channel in a SO-CDIMM socket and one channel of soldered onboard memory (total memory capacity up to 16GB). Graphics is integrated in the Intel processor with one DVI-I port on the front panel switchable to rear IO. The cPCI-6525 has two GbE controllers (Intel® 82574IT) providing two GbE ports on the front panel (switchable to rear) and two Intel® 82574IT GbE controllers providing two ports to rear IO. For expansion flexibility, the cPCI-6525 routes one PCIe x16 Gen2 (convertible to two PCIe x8 Gen2) and one PCIe x4 to rear IO.

Additional IO functionality of the cPCI-6525 includes three USB 3.0 ports and one RS-232/422/485 serial port via RJ-45 connector on the front panel. Onboard storage capabilities include a SATA 6 Gb/s direct connector for a 2.5 inches drive and CFast slot via adapter board. The cPCI-6525 is also equipped with an Atmel AT97SC3204 Trusted Platform Module (TPM) to meet security requirements.

Rear I/O functionality includes two GbE ports via two Intel® 82574IT GbE controllers for PICMG 2.16 support, two GbE ports (switchable from front panel), six USB 2.0, PS/2 keyboard/mouse, three serial ports, two DVI interfaces, and HD Audio. Available rear I/O for storage includes three SATA ports (dependent on selected RTM) and eight SAS ports supporting hardware RAID via two mini-SAS x4 connectors when mated with the cPCI-R66S0 RTM. By selecting cPCI-R66G0 or cPCI-R66N0 RTM, thecPCI-6525 can utilize an MXM PCIe x16 graphics card to perform high speed calculations.

View our wide range of Single Board Computers (SBC)

View our portfolio of cPCI / cPCIe

See all products from our supplier Adlink

Features:

  • Supports PCIe x16 to rear IO through optional UHM connector for expansion
  • Legacy OS support
  • Up to 4 Ethernet GbE ports to rear
  • Rich storage options supporting RAID 0, 1, 10
  • Low power 22nm 3rd generation Intel® Core™ i7 processor
  • Max. 16GB DDR3 ECC memory in dual channel

ControlSafe™ Platform, SIL4 COTS Fail-Safe System

Aretsyn ControlSafe Platform

MPN:

CSP-CSC-CORE-AC-01

Manufacturer L3 Communications

Artesyn Embedded Technologies

Description:

Artesyn's ControlSafe™ Platform SIL4 COTS Fail-Safe System for Train Control and Rail Signaling. Leveraging over 30 years of expertise in developing highly reliable and available embedded computer systems, Artesyn Embedded Technologies is a premier supplier of commercial off-the-shelf (COTS) fail-safe computer systems to rail system integrators and rail application providers. With all reliability, availability, maintainability and safety (RAMS) processes designed to be certified to EN50126, all safety-related software to EN50128, and hardware to EN50129, Artesyn’s ControlSafe Platform (CSP) can be deployed in SIL4 safety application environments. Based on open standards, Artesyn’s ControlSafe Platform is a cost-effective solution that enables application developers and system integrators to substantially accelerate time-to-market without being deterred by the potentially high costs and risks associated with the stringent SIL4 system development and certification process. Artesyn is committed to building long-term partnerships with our customers, based on proven and reliable systems with consistent performance. The ControlSafe Platform further strengthens this commitment by providing rail industry customers with an unmatched, highly reliable platform with 15 years of planned product life and 25 years of extended support and service.

Artesyn’s ControlSafe Platform is designed to deliver best-in-class system availability as high as 99.9999%, which means that system downtime is limited to less than a few seconds per year. Artesyn has successfully completed extensive modeling and analysis by its team of highly qualified staff to confirm that the ControlSafe Platform meets all the functional safety, reliability and availability requirements mandated by rail standards and specifications.

Adhering to Artesyn’s future-proof development philosophy, the ControlSafe Platform is modular, scalable and designed to seamlessly accommodate additional I/O interfaces as well as upgraded processors throughout the product life cycle. Artesyn is focused on continued platform development to build a comprehensive product line. A new initiative is the development of a discrete I/O expansion box which enables customers to seamlessly integrate our ControlSafe Platform in a variety of rail signaling applications. Our ultimate goal is to enhance customers’ competitive position by allowing them to focus their development efforts on differentiating end applications.

View our wide range of Embedded Computing

View our portfolio of Platform systems

See all products from our supplier Artesyn

Features:

  • Highly integrated COTS solution designed to be certified to SIL4 safety standards
  • Designed to deliver system availability as high as six nines (99.9999%)
  • Modular and scalable for deployment in many rail applications
  • Innovative data lock-step architecture allows seamless technology upgrades
  • Hardware-based voting mechanism maximizes application software transparency
  • 15 years planned product life and 25 years of extended support and service
  • Backed up by a global service organization
  • Rugged design compliant with EN 50155
  • Growing product portfolio to enable future rolling stock and trackside deployment

Rugged 3U VPX GPGPU Blade, NVIDIA, Conduction cooled

Adlink VPX3G10-R

MPN:

VPX3G10-R

Manufacturer L3 Communications

ADLINK

Description:

ADLINK is proud to launch the Rugged 3U VPX GPGPU Blade: VPX3G10-R conduction cooled. The VPX3G10-R is a 3U VPX general-purpose computing on graphics processing unit (GPGPU) blade in single-slot (0.8inches) form factor featuring the 384 core NVIDIA GeForce GT 745M GPU with high resolution and high performance graphics capabilities for defense and aerospace applications. The VPX3G10-R features 2GB of GDDR5 memory, providing high-bandwidth access to data during ''massively parallel'' GPGPU algorithm processing. The VPX3G10-R is rugged conduction cooled with conformal coating, making it ideal for mission critical applications such as military and aerospace platforms.

View our wide range of Graphic & Video processing

View our portfolio of VPX / OpenVPX

See all products from our supplier Adlink

Features:

  • NVIDIA GeForce GT 745M GPU (Kepler architecture)
  • CUDA compute capability 3.0 for parallel computation and graphics processing
  • High-resolution, high-performance platform for rugged video I/O and GPGPU applications
  • Conduction cooled version

Rugged 3U VPX GPGPU Blade, NVIDIA, Air cooling

Adlink VPX3G10-A

MPN:

VPX3G10-A

Manufacturer L3 Communications

ADLINK

Description:

ADLINK is proud to launch the Rugged 3U VPX GPGPU Blade: VPX3G10-A air cooled. The VPX3G10-R is a 3U VPX general-purpose computing on graphics processing unit (GPGPU) blade in single-slot (0.8inches) form factor featuring the 384 core NVIDIA GeForce GT 745M GPU with high resolution and high performance graphics capabilities for defense and aerospace applications. The VPX3G10-R features 2GB of GDDR5 memory, providing high-bandwidth access to data during ''massively parallel'' GPGPU algorithm processing. The VPX3G10-R is rugged conduction cooled with conformal coating, making it ideal for mission critical applications such as military and aerospace platforms.

View our wide range of Graphic & Video processing

View our portfolio of VPX / OpenVPX

See all products from our supplier Adlink

Features:

  • NVIDIA GeForce GT 745M GPU (Kepler architecture)
  • CUDA compute capability 3.0 for parallel computation and graphics processing
  • High-resolution, high-performance platform for rugged video I/O and GPGPU applications
  • Air cooled version

Switch blade, 6U 4HP CompactPCI 10 Gigabit Ethernet, PICMG 2.16

cPCI-6S10

MPN:

cPCI-6S10

Manufacturer L3 Communications

ADLINK

Description:

Conforming to the PICMG 2.16 specification, the ADLINK cPCI-6S10 is a fully-managed CompactPCI Gigabit Ethernet switch blade supporting up to 24 1GbE ports and two 10GbE SPF+ uplink ports. On the front panel are three GbE ports, two 10GbE SFP+ uplink ports, one COM port and one 10/100 RJ-45 management port. Twenty GbE ports are routed to rear I/O and an IPMI interface is provided to monitor and control system health.

The ADLINK cPCI-6S10 integrates Broadcom BCM56150 switch silicon with built-in ARM Cortex-A9 processor and one Broadcom BCM54685 Octal port 1000BASE-T PHY. The cPCI-6S10 is ideal for CompactPCI platform adopters who require high-speed and high-bandwidth data transport interconnects for packet switching management.

The ADLINK cPCI-6S10 supports ADLINK PacketManager, a software suite with an extensive feature set and integration capabilities that enables powerful networking functionality for the Base Interface. It supports friendly CLI(Command Line Interface) for customer easy management and provides comprehensive device management capabilities for network administrators. The cPCI-6S10 bundled PacketManager supports port management, LACP(IEEE802.3ad Link Aggregation Control Protocal), STP (IEEE802.1D Spanning Tree Protocal), VLAN management, ACL (Access Control List) and QoS (Quality of Service).

Designed to meet the needs of various challenging applications in industrial and military systems, the ADLINK cPCI-6S10 facilitates communications within a chassis and outside of chassis. It supports redundancy based on PICMG 2.16 specification to be used for mission critical environment supporting IPMI v1.5 and extended temperature configuration on request.

Features:

  • 24-port fully managed Gigabit Ethernet switch
  • Layer 2/3 switching with advanced support for
  • VLANs, QoS and IPv6
  • Two 10 Gigabit Ethernet SFP+ uplink ports
  • Supports IPMI (Intelligent Platform
  • Management Interface)
  • ADLINK PacketManager bundled

Media Cloud Server with 8 Intel® Xeon® Processor E3-1200 v3 Series, 2U Rackmount

MCS-2040

MPN:

MCS-2040

Manufacturer L3 Communications

ADLINK

Description:

The increasing prevalence of high-bandwidth multimedia applications in use over the network, such as video streaming and conferencing, remote education, remote medical services and real-time video analytics, requires providers to upgrade media server performance in order to deliver a high quality user experience. However, general purpose rack servers currently available on the market were not specifically designed for media applications, lacking the required levels of performance and compute density.

In contrast to general purpose rack servers which usually have at most two CPUs and perform software video transcoding, the Adlink Media Cloud Server is an Application Ready Intelligent Platform (ARIP) for advanced video applications with high density computing performance that is designed from the ground up to meet the technical considerations specific to media servers while being cost-effective and easy to maintain.

Features:

  • Four hot-pluggable compute nodes
  • Features (per node)
  • Two independent systems communicate via GbE
  • Dual sockets support 4th Gen Intel® Core™ i7/i5/i3 and Xeon® Processor E3-1200 v3 (LGA 1150)
  • 4 DIMMs, up to 32GB DDR3 memory (16GB/system)
  • Quad GbE via RJ-45 (2 per system)
  • 4x hot -swappable 2.5 inch SATA drive bays
  • 2x 1600W redundant power supply
  • Adlink MediaManager

ETX Module with Intel® Atom™ Processor E3800 Series SoC

ETX-BT

MPN:

ETX-BT

Manufacturer L3 Communications

ADLINK

Description:

The ETX computer-on-module specification includes the standard functions required for almost any application, such as graphics, Ethernet, audio, IDE, floppy, keyboard/mouse, parallel, serial and USB ports, and PCI and ISA system busses.

A custom designed carrier board complements the ETX core module with additional functionality that is required for a specific application. The carrier board provides the interface to connect the module to peripherals such as hard disk, mouse, and display. Connectors on the carrier board can be placed exactly where needed to optimize the final package and minimize cabling. This results in a more reliable product and simplifies system integration. A single carrier board can be used with different ETX modules when the same functionality is required at different performance levels, allowing great ease in end product diversification.

The ADLINK ETX-BT computer-on-module with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. The ETX-BT is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, determine which data to save locally and which to send to the cloud for further analysis. The results these analyses can provide valuable information for policy decision making and generate innovative business opportunities.

Features:

  • Single, dual or quad-core Intel® Atom™ SOC or Celeron® Processor
  • Single SODIMM for up to 4GB DDR3L
  • Dual channel 24-bit LVDS, VGA
  • 2 SATA and 2 PATA (M/S), 4x USB 2.0, 10/100 Mbps LAN (GbE via onboard connector)
  • Extreme Rugged operating temperature: -40° to +85° (optional)
  • Supports Smart Embedded Management Agent (SEMA) functions

COM Express®, Type 6, Intel Core i7-5650U, 2.2/3.2 GHz, GT3 level graphics

Adlink cExpress BL COM-Express

MPN:

cExpress-BL-i7-5650U

Manufacturer L3 Communications

ADLINK

Description:

The cExpress-BL-i7-5650U is a COM Express® COM.0 R2.1 Type 6 Compact size module supporting the 64-bit 5th Generation Intel® Core™ i7 ULT Processors and Intel® Celeron™ Processors with CPU, memory controller, graphics processor and I/O hub on the same chip. Leveraging the benefits provided by the Intel® Core™ i7 ULT and Intel® Celeron™ System-on-Chip, the cExpress-BL is specifically designed for customers who need optimum processing and graphics performance with low power consumption in a long product life solution.

The cExpress-BL-i7-5650U features the Intel® Core™ i7 processor and Intel® Celeron™ processor supporting Intel® Hyper-Threading Technology (up to 2 cores, 4 threads) and up to 16 GB of non-ECC DDR3L dual-channel memory at 1333/1600 MHz in dual stacked SODIMM sockets to provide excellent overall performance.

Integrated Intel Generation 8 Graphics includes features such as OpenGL 4.2, DirectX 11.1, Intel® Clear Video HD Technology, Advanced Scheduler 2.0, 1.0, XPDM support, and DirectX Video Acceleration (DXVA) support for full AVC/VC1/MPEG2 hardware decode. Graphics outputs include dual-channel 18/24-bit LVDS (eDP as option) and two DDI ports supporting HDMI / DVI / DisplayPort. The cExpress-BL-i7-5650U is specifically designed for customers with high-performance processing graphics requirements who want to outsource the custom core logic of their systems for reduced development time.

The cExpress-BL-i7-5650U features a single onboard Gigabit Ethernet port, two USB 3.0 ports and six USB 2.0 ports, and 4 SATA 6 Gb/s ports. Support is provided for SMBus and I2C. The module is equipped with SPI AMI EFI BIOS with CMOS backup, supporting embedded features such as remote console, CMOS backup, hardware monitor, and watchdog timer.

View our wide range of Computer-on-module

View our portfolio of Embedded Computing

See all products from our supplier Adlink

Features:

  • 5th Generation Low Power Intel® Core™ i7/i5/i3 Processor System-on-Chip
  • Extreme Rugged™ operating temperature: -40°C to +85°C (optional)
  • Up to 16 GB DDR3L SDRAM at 1600MHz
  • Two DDI channels, one LVDS supporting 3 independent displays
  • Dual channel 18/24-bit LVDS (or optional eDP)
  • Four PCIe x1 or 1 PCIe x4, Gigabit Ethernet
  • Four SATA 6 Gb/s, two USB 3.0, six USB 2.0
  • Supports Smart Embedded Management Agent (SEMA) functions

COM Express®, Type 6, Intel Core i5-5350U, 1.8/2.9 GHz, GT3 level graphics

Adlink cExpress BL COM-Express

MPN:

cExpress-BL-i5-5350U

Manufacturer L3 Communications

ADLINK

Description:

The cExpress-BL-i5-5350U is a COM Express® COM.0 R2.1 Type 6 Compact size module supporting the 64-bit 5th Generation Intel® Core™ i5 ULT Processors and Intel® Celeron™ Processors with CPU, memory controller, graphics processor and I/O hub on the same chip. Leveraging the benefits provided by the Intel® Core™ i5 ULT and Intel® Celeron™ System-on-Chip, the cExpress-BL-i5-5350U is specifically designed for customers who need optimum processing and graphics performance with low power consumption in a long product life solution.

The cExpress-BL-i5-5350U features the Intel® Core™ i5 processor and Intel® Celeron™ processor supporting Intel® Hyper-Threading Technology (up to 2 cores, 4 threads) and up to 16 GB of non-ECC DDR3L dual-channel memory at 1333/1600 MHz in dual stacked SODIMM sockets to provide excellent overall performance.

Integrated Intel Generation 8 Graphics includes features such as OpenGL 4.2, DirectX 11.1, Intel® Clear Video HD Technology, Advanced Scheduler 2.0, 1.0, XPDM support, and DirectX Video Acceleration (DXVA) support for full AVC/VC1/MPEG2 hardware decode. Graphics outputs include dual-channel 18/24-bit LVDS (eDP as option) and two DDI ports supporting HDMI / DVI / DisplayPort. The cExpress-BL-i5-5350U is specifically designed for customers with high-performance processing graphics requirements who want to outsource the custom core logic of their systems for reduced development time.

The cExpress-BL-i5-5350U features a single onboard Gigabit Ethernet port, two USB 3.0 ports and six USB 2.0 ports, and 4 SATA 6 Gb/s ports. Support is provided for SMBus and I2C. The module is equipped with SPI AMI EFI BIOS with CMOS backup, supporting embedded features such as remote console, CMOS backup, hardware monitor, and watchdog timer.

View our wide range of Computer-on-module

View our portfolio of Embedded Computing

See all products from our supplier Adlink

Features:

  • 5th Generation Low Power Intel® Core™ i5 Processor System-on-Chip
  • Up to 16 GB DDR3L SDRAM at 1600MHz
  • Two DDI channels, one LVDS supporting 3 independent displays
  • Dual channel 18/24-bit LVDS (or optional eDP)
  • Four PCIe x1 or 1 PCIe x4, Gigabit Ethernet
  • Four SATA 6 Gb/s, two USB 3.0, six USB 2.0
  • Supports Smart Embedded Management Agent (SEMA) functions
  • Extreme Rugged™ operating temperature: -40°C to +85°C (optional)

COM Express®, Type 6, Intel Core i3-5010U, 2.1 GHz, GT2 level graphics

Adlink cExpress BL COM-Express

MPN:

cExpress-BL-i3-5010U

Manufacturer L3 Communications

ADLINK

Description:

The cExpress-BL-i3-5010U is a COM Express® COM.0 R2.1 Type 6 Compact size module supporting the 64-bit 5th Generation Intel® Core™ i3 ULT Processors and Intel® Celeron™ Processors with CPU, memory controller, graphics processor and I/O hub on the same chip. Leveraging the benefits provided by the Intel® Core™ i3 ULT and Intel® Celeron™ System-on-Chip, the cExpress-BL-i3-5010U is specifically designed for customers who need optimum processing and graphics performance with low power consumption in a long product life solution.

The cExpress-BL-i3-5010U features the Intel® Core™ i3 processor and Intel® Celeron™ processor supporting Intel® Hyper-Threading Technology (up to 2 cores, 4 threads) and up to 16 GB of non-ECC DDR3L dual-channel memory at 1333/1600 MHz in dual stacked SODIMM sockets to provide excellent overall performance.

Integrated Intel Generation 8 Graphics includes features such as OpenGL 4.2, DirectX 11.1, Intel® Clear Video HD Technology, Advanced Scheduler 2.0, 1.0, XPDM support, and DirectX Video Acceleration (DXVA) support for full AVC/VC1/MPEG2 hardware decode. Graphics outputs include dual-channel 18/24-bit LVDS (eDP as option) and two DDI ports supporting HDMI / DVI / DisplayPort. The cExpress-BL-i3-5010U is specifically designed for customers with high-performance processing graphics requirements who want to outsource the custom core logic of their systems for reduced development time.

The cExpress-BL-i3-5010U features a single onboard Gigabit Ethernet port, two USB 3.0 ports and six USB 2.0 ports, and 4 SATA 6 Gb/s ports. Support is provided for SMBus and I2C. The module is equipped with SPI AMI EFI BIOS with CMOS backup, supporting embedded features such as remote console, CMOS backup, hardware monitor, and watchdog timer.

View our wide range of Computer-on-module

View our portfolio of Embedded Computing

See all products from our supplier Adlink

Features:

  • 5th Generation Low Power Intel® Core™ i3 Processor System-on-Chip
  • Up to 16 GB DDR3L SDRAM at 1600MHz
  • Two DDI channels, one LVDS supporting 3 independent displays
  • Dual channel 18/24-bit LVDS (or optional eDP)
  • Four PCIe x1 or 1 PCIe x4, Gigabit Ethernet
  • Four SATA 6 Gb/s, two USB 3.0, six USB 2.0
  • Supports Smart Embedded Management Agent (SEMA) functions
  • Extreme Rugged™ operating temperature: -40°C to +85°C (optional)

Ethernet AdvancedTCA® Processor Blade, 40G, Dual 12-core Intel® Xeon® E5-2658

Adlink aTCA-9710 4G Processor Blade

MPN:

aTCA-9710/DIPoM

Manufacturer L3 Communications

ADLINK

Description:

The ADLINK aTCA-9710 is a high performance AdvancedTCA® (ATCA) processor blade featuring dual 12-core Intel® Xeon® Processor E5-2658 v3, Intel® C612 Chipset, eight channel memory up to 256GB of DDR4 memory and 400W power supply subsystem. Versatile connectivity includes four 40GbE Fabric Interfaces, dual GbE Base Interfaces, dual front panel 10GbE egress ports, front panel dual COM and USB 2.0 ports and front panel VGA connector. An onboard SATA connector supports a mSATA up to 256GB and the optional RTM (aTCA-R9700) supports six 10GbE SFP+ ports and one hot-swappable SATA bay providing additional network throughput and storage capacities. The aTCA-9710's thermal solution (including VRM heat sink) ensures stable operation under extreme operating environments and allows for compliance to the NEBS Level 3 standard (design only). The robust computing power and reliability of the aTCA-9710 meets the requirements of telecom equipment manufacturers (TEMs) and network equipment providers (NEPs), allowing them to build the next-generation telecom networks and communication infrastructures.

View our wide range of Processor blade

View our portfolio of AdvancedTCA

See all products from our supplier Adlink

Features:

  • Two Intel® Xeon® processor E5-2600 v3 family (12C/24T)
  • 16 memory sockets support DDR4-2133 REG/ECC VLP RDIMM up to 256GB
  • Intel® C612 PCH
  • Dual Intel® XL710-AM2 40GBASE-KR4 Fabric Interface channels
  • Single Intel® Communications chipset 8950
  • Support Intel® DPDK and ADLINK PacketManager
  • Support Intel® Node Manager 3.0 and ADLINK EPMA
  • Intel® Hyper-Threading Technology
  • Intel® QuickPath Interconnect

COM Express® Basic Size Type 2 Module, Intel®Core™ i5-4400E, 2.7 GHz, GT2 level graphics

Express-HL2-i5-4400E

MPN:

Express-HL2-i5-4400E

Manufacturer L3 Communications

ADLINK

Description:

Adlink's Express-HL and Express-HL2 COM Express modules with 4th generation Intel® i7/i5 processor - up to 3.1GHZ quad core - and mobile Intel® QM87 Express chipset offer up to 16GB dual channel DDR3L SDRAM at 1600MHz. The Express-HL is a COM Express Type 6 module offering three independent displays via DDI interface, as well as seven PCIe x1, one PCIe x16 (Gen3) for graphics (or general purpose x8/4/1), four SATA III (6 Gb/s), Gigabit Ethernet, four USB 2.0, and four USB 3.0 interfaces. The Express-HL2 features the COM Express Type 2 pinout and offers 18/24-bit single/dual channel LVDS, Analog CRT, and a legacy 32 bit PCI bus, as well as PATA IDE interface.

The Adlink Express-HL2 computer-on-module with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. The Express-HL2 is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, determine which data to save locally and which to send to the cloud for further analysis. The results these analyses can provide valuable information for policy decision making and generate innovative business opportunities.

Features:

  • 4th Generation Intel® i7/i5/i3 Processor with Mobile Intel® QM87 Express Chipset
  • Up to 16GB Dual Channel DDR3L at 1600MHz
  • Dual Channel LVDS and VGA supporting 2 independent displays
  • Six PCIe x1, one PCIe x16 and 32-bit PCI-bus
  • GbE, four SATA 6 Gb/s, one PATA,IDE, eight USB 2.0
  • Supports Smart Embedded Management Agent (SEMA) functions
  • Extreme Rugged™ operating temperature: -40°C to +85°C (optional)

System host board, PICMG® 1.3 Full-Size LGA1150 Intel® Xeon® E3-1200 v3 Processor-based

NuPRO-E72

MPN:

NuPRO-E72

Manufacturer L3 Communications

ADLINK

Description:

Adlink is pleased to announce the release of its first workstation grade PICMG 1.3 system host board, the NuPRO-E72, fully supporting the 4th Gen Intel® Xeon E3-1200 v3 processor and Intel® C226 chipset with ECC support. Combined high-bandwidth PCIe x16 (can be configured to 2x PCIe x8 or 1x PCIe x8 + 2x PCIe x4), PCIe x4 and conventional PCI slots ensure compatibility with high-speed frame grabbers and motion controllers, making it an optimum solution for machine vision and automation applications. The NuPRO-E72 also delivers superior connectivity with 6 COM ports (5 RS232 and 1 RS232/RS422/485 with RS-485 auto-flow control) and 10x USB ports (6 USB 3.0). With an optional WBP-13E4 backplane, the NuPRO-E72 is the best solution available for automation applications requiring multiple native PCIe gen 3 in 4U rackmounts, maximizing the flexibility and configuration of PCI/PCI Express systems.

Features:

  • PICMG 1.3 form factor
  • Workstation grade computing power from 4th Gen Intel® Xeon E3-1200 v3 Processor, and Intel® C226 chipset with ECC support
  • Multiple native PCIe Gen3 expansion from 1x PCIe x8, 2x PCIe x4 with Gen3 speed
  • A variety of expansion slots mean flexible function enhancement and easier system integration, better empowering industrial automation applications.
  • 6 COM ports (5x RS-232, 1x RS-232/422/485 with auto flow control)
  • 6x USB 3.0 ports, 4x USB 2.0 ports, 4 SATA 6Gb/s supported RAID 0, 1, 5, 1+0 by Intel Rapid Storage Technology
  • Full compatibility with ADLINK' s best selling motion/vision cards such as PCIe-HDV62A, PCIe-GIE64+, PCIe-RTV24 makes the system ideal for vision Inspection applications

Industrial ATX Motherboard with 4th Gen Intel® Core™ i7/i5/i3/Pentium® Processor

IMB-M42H

MPN:

IMB-M42H

Manufacturer L3 Communications

ADLINK

Description:

The ADLINK IMB-M42H is an ATX industrial motherboard supporting the 4th Generation Intel® Core™ i7/i5/i3 and Pentium®/Celeron® processors in LGA1150 package to deliver a scalable high performance platform for a wide array of industrial applications. The IMB-M42H supports 22nm process CPUs at up to 3.2 GHz with integrated graphics and memory controllers, Direct Media Interface (DMI) and Flexible Display Interface (FDI) connectivity to the Intel® H81 Express Chipset. Dual-channel DDR3 1600 MHz memory is supported up to a maximum of 16 GB in two DIMM slots.

The ADLINK IMB-M42H is equipped with the latest 4th Generation Intel® Core™ i7/i5/i3/Pentium®/Celeron®:
- Intel® Core™ i7-4790S, 3.2 GHz, 8MB Cache, 22nm, 65W TDP, LGA1150(4C/8T)
- Intel® Core™ i7-4770S, 3.1 GHz, 8MB Cache, 22nm, 65W TDP, LGA1150(4C/8T)
- Intel® Core™ i5-4590S, 3.0 GHz, 6MB Cache, 22nm, 65W TDP, LGA1150(4C/4T)
- Intel® Core™ i5-4570S, 2.9 GHz, 6MB Cache, 22nm, 65W TDP, LGA1150(4C/4T)
- Intel® Core™ i3-4360, 3.7 GHz, 4MB Cache, 22nm, 54W TDP, LGA1150(2C/4T)
- Intel® Core™ i3-4330, 3.5 GHz, 4MB Cache, 22nm, 54W TDP, LGA1150(2C/4T)
- Intel® Core™ G3420, 3.2 GHz, 3MB Cache, 22nm, 53W TDP, LGA1150(2C/2T)
- Intel® Core™ G1820, 2.7 GHz, 2MB Cache, 22nm, 53W TDP, LGA1150(2C/2T).

These advanced features, coupled with latest Intel integrated graphics, one PCI Express Gen2 x16 slot, one PCI Express Gen2 x4 slots, four PCI slots, dual USB3.0 port and dual SATA III port, and one Intel I-217V Ethernet make the IMB-M42H ideal for a machine automation systems, machine vision systems, and testing and measurement applications requiring a high-performance, easy-to-deploy and reliable main-board.

Features:

  • Supports the 4th Gen Intel® Core™ i7/i5/i3/Pentium®/Celeron® Processor family
  • Dual-Channel DDR3 1600MHz, 2x 240-pin DIMM sockets, up to 16GB non-ECC unbuffered DIMMs support
  • The Intel® HD Graphics 4600 provides high-end media and graphics capabilities for devices that display videos, 2-D/3-D graphics, and interactive content.
  • PCIe x16 Gen2 slot for graphics card combines with PCIe x4 Gen2 slot for frame grabbers, and 4x PCI for Motion and I/O cards, to ideally suit industrial automation applications
  • Full compatibility with ADLINK's best selling motion/vision cards delivers high computing and bandwidth support with no image data loss.
  • Each USB ports provides up to 1A voltage power consumption, enabling connectivity for cameras or other devices, via stable and reliable connection
  • 6 COM ports/pin header (COM1/2 support RS232/422/485, COM1 support RS-485 auto flow control)
  • 2x USB 3.0 ports (faceplate), 8x USB 2.0 ports (4x faceplate, 4x onboard pin headers)

COM Express® Basic Size Type 2 Module, Intel®Core™ i3-4400E, 2.4 GHz, GT2 level graphics

Express-HL2-i3-4400E

MPN:

Express-HL2-i3-4400E

Manufacturer L3 Communications

ADLINK

Description:

Adlink's Express-HL and Express-HL2 COM Express modules with 4th generation Intel® i7/i5 processor - up to 3.1GHZ quad core - and mobile Intel® QM87 Express chipset offer up to 16GB dual channel DDR3L SDRAM at 1600MHz. The Express-HL is a COM Express Type 6 module offering three independent displays via DDI interface, as well as seven PCIe x1, one PCIe x16 (Gen3) for graphics (or general purpose x8/4/1), four SATA III (6 Gb/s), Gigabit Ethernet, four USB 2.0, and four USB 3.0 interfaces. The Express-HL2 features the COM Express Type 2 pinout and offers 18/24-bit single/dual channel LVDS, Analog CRT, and a legacy 32 bit PCI bus, as well as PATA IDE interface.

The Adlink Express-HL2 computer-on-module with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. The Express-HL2 is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, determine which data to save locally and which to send to the cloud for further analysis. The results these analyses can provide valuable information for policy decision making and generate innovative business opportunities.

Features:

  • 4th Generation Intel® i7/i5/i3 Processor with Mobile Intel® QM87 Express Chipset
  • Up to 16GB Dual Channel DDR3L at 1600MHz
  • Dual Channel LVDS and VGA supporting 2 independent displays
  • Six PCIe x1, one PCIe x16 and 32-bit PCI-bus
  • GbE, four SATA 6 Gb/s, one PATA,IDE, eight USB 2.0
  • Supports Smart Embedded Management Agent (SEMA) functions
  • Extreme Rugged™ operating temperature: -40°C to +85°C (optional)

COM Express® Basic Size Type 2 Module, Intel®Core™ i3-4402E, 1.6 GHz, GT2 level graphics

Express-HL2-i3-4402E

MPN:

Express-HL2-i3-4402E

Manufacturer L3 Communications

ADLINK

Description:

Adlink's Express-HL and Express-HL2 COM Express modules with 4th generation Intel® i7/i5 processor - up to 3.1GHZ quad core - and mobile Intel® QM87 Express chipset offer up to 16GB dual channel DDR3L SDRAM at 1600MHz. The Express-HL is a COM Express Type 6 module offering three independent displays via DDI interface, as well as seven PCIe x1, one PCIe x16 (Gen3) for graphics (or general purpose x8/4/1), four SATA III (6 Gb/s), Gigabit Ethernet, four USB 2.0, and four USB 3.0 interfaces. The Express-HL2 features the COM Express Type 2 pinout and offers 18/24-bit single/dual channel LVDS, Analog CRT, and a legacy 32 bit PCI bus, as well as PATA IDE interface.

The Adlink Express-HL2 computer-on-module with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. The Express-HL2 is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, determine which data to save locally and which to send to the cloud for further analysis. The results these analyses can provide valuable information for policy decision making and generate innovative business opportunities.

Features:

  • 4th Generation Intel® i7/i5/i3 Processor with Mobile Intel® QM87 Express Chipset
  • Up to 16GB Dual Channel DDR3L at 1600MHz
  • Dual Channel LVDS and VGA supporting 2 independent displays
  • Six PCIe x1, one PCIe x16 and 32-bit PCI-bus
  • GbE, four SATA 6 Gb/s, one PATA,IDE, eight USB 2.0
  • Supports Smart Embedded Management Agent (SEMA) functions
  • Extreme Rugged™ operating temperature: -40°C to +85°C (optional)

COM Express® Basic Size Type 2 Module, Intel®Core™ i5-4402E, 1.6 GHz, GT2 level graphics

Express-HL2-i5-4402E

MPN:

Express-HL2-i5-4402E

Manufacturer L3 Communications

ADLINK

Description:

Adlink's Express-HL and Express-HL2 COM Express modules with 4th generation Intel® i7/i5 processor - up to 3.1GHZ quad core - and mobile Intel® QM87 Express chipset offer up to 16GB dual channel DDR3L SDRAM at 1600MHz. The Express-HL is a COM Express Type 6 module offering three independent displays via DDI interface, as well as seven PCIe x1, one PCIe x16 (Gen3) for graphics (or general purpose x8/4/1), four SATA III (6 Gb/s), Gigabit Ethernet, four USB 2.0, and four USB 3.0 interfaces. The Express-HL2 features the COM Express Type 2 pinout and offers 18/24-bit single/dual channel LVDS, Analog CRT, and a legacy 32 bit PCI bus, as well as PATA IDE interface.

The Adlink Express-HL2 computer-on-module with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. The Express-HL2 is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, determine which data to save locally and which to send to the cloud for further analysis. The results these analyses can provide valuable information for policy decision making and generate innovative business opportunities.

Features:

  • 4th Generation Intel® i7/i5/i3 Processor with Mobile Intel® QM87 Express Chipset
  • Up to 16GB Dual Channel DDR3L at 1600MHz
  • Dual Channel LVDS and VGA supporting 2 independent displays
  • Six PCIe x1, one PCIe x16 and 32-bit PCI-bus
  • GbE, four SATA 6 Gb/s, one PATA,IDE, eight USB 2.0
  • Supports Smart Embedded Management Agent (SEMA) functions
  • Extreme Rugged™ operating temperature: -40°C to +85°C (optional)

COM Express® Basic Size Type 2 Module, Intel®Core™ i7-4700EQ, 2.4/1.7 GHz, GT2 level graphics

Express-HL2-i7-4700EQ

MPN:

Express-HL2-i7-4700EQ

Manufacturer L3 Communications

ADLINK

Description:

Adlink's Express-HL and Express-HL2 COM Express modules with 4th generation Intel® i7/i5 processor - up to 3.1GHZ quad core - and mobile Intel® QM87 Express chipset offer up to 16GB dual channel DDR3L SDRAM at 1600MHz. The Express-HL is a COM Express Type 6 module offering three independent displays via DDI interface, as well as seven PCIe x1, one PCIe x16 (Gen3) for graphics (or general purpose x8/4/1), four SATA III (6 Gb/s), Gigabit Ethernet, four USB 2.0, and four USB 3.0 interfaces. The Express-HL2 features the COM Express Type 2 pinout and offers 18/24-bit single/dual channel LVDS, Analog CRT, and a legacy 32 bit PCI bus, as well as PATA IDE interface.

The Adlink Express-HL2 computer-on-module with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. The Express-HL2 is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, determine which data to save locally and which to send to the cloud for further analysis. The results these analyses can provide valuable information for policy decision making and generate innovative business opportunities.

Features:

  • 4th Generation Intel® i7/i5/i3 Processor with Mobile Intel® QM87 Express Chipset
  • Up to 16GB Dual Channel DDR3L at 1600MHz
  • Dual Channel LVDS and VGA supporting 2 independent displays
  • Six PCIe x1, one PCIe x16 and 32-bit PCI-bus
  • GbE, four SATA 6 Gb/s, one PATA,IDE, eight USB 2.0
  • Supports Smart Embedded Management Agent (SEMA) functions
  • Extreme Rugged™ operating temperature: -40°C to +85°C (optional)

COM Express® Basic Size Type 2 Module, Intel®Core™ i7-4860EQ, 2.18GHz, GT3 level graphics

Express-HL2-i7-4860EQ

MPN:

Express-HL2-i7-4860EQ

Manufacturer L3 Communications

ADLINK

Description:

Adlink's Express-HL and Express-HL2 COM Express modules with 4th generation Intel® i7/i5 processor - up to 3.1GHZ quad core - and mobile Intel® QM87 Express chipset offer up to 16GB dual channel DDR3L SDRAM at 1600MHz. The Express-HL is a COM Express Type 6 module offering three independent displays via DDI interface, as well as seven PCIe x1, one PCIe x16 (Gen3) for graphics (or general purpose x8/4/1), four SATA III (6 Gb/s), Gigabit Ethernet, four USB 2.0, and four USB 3.0 interfaces. The Express-HL2 features the COM Express Type 2 pinout and offers 18/24-bit single/dual channel LVDS, Analog CRT, and a legacy 32 bit PCI bus, as well as PATA IDE interface.

The Adlink Express-HL2 computer-on-module with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. The Express-HL2 is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, determine which data to save locally and which to send to the cloud for further analysis. The results these analyses can provide valuable information for policy decision making and generate innovative business opportunities.

Features:

  • 4th Generation Intel® i7/i5/i3 Processor with Mobile Intel® QM87 Express Chipset
  • Up to 16GB Dual Channel DDR3L at 1600MHz
  • Dual Channel LVDS and VGA supporting 2 independent displays
  • Six PCIe x1, one PCIe x16 and 32-bit PCI-bus
  • GbE, four SATA 6 Gb/s, one PATA,IDE, eight USB 2.0
  • Supports Smart Embedded Management Agent (SEMA) functions
  • Extreme Rugged™ operating temperature: -40°C to +85°C (optional)

COM Express® Basic Size Type 2 Module, Intel®Celeron® 2000E 2.2 GHz (no Turbo) 35W (2C/GT1)

Express-HL2-Celeron2000E

MPN:

Express-HL2-Celeron
2000E

Manufacturer L3 Communications

ADLINK

Description:

Adlink's Express-HL and Express-HL2 COM Express modules with 4th generation Intel® i7/i5 processor - up to 3.1GHZ quad core - and mobile Intel® QM87 Express chipset offer up to 16GB dual channel DDR3L SDRAM at 1600MHz. The Express-HL is a COM Express Type 6 module offering three independent displays via DDI interface, as well as seven PCIe x1, one PCIe x16 (Gen3) for graphics (or general purpose x8/4/1), four SATA III (6 Gb/s), Gigabit Ethernet, four USB 2.0, and four USB 3.0 interfaces. The Express-HL2 features the COM Express Type 2 pinout and offers 18/24-bit single/dual channel LVDS, Analog CRT, and a legacy 32 bit PCI bus, as well as PATA IDE interface.

The Adlink Express-HL2 computer-on-module with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. The Express-HL2 is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, determine which data to save locally and which to send to the cloud for further analysis. The results these analyses can provide valuable information for policy decision making and generate innovative business opportunities.

Features:

  • 4th Generation Intel® i7/i5/i3 Processor with Mobile Intel® QM87 Express Chipset
  • Up to 16GB Dual Channel DDR3L at 1600MHz
  • Dual Channel LVDS and VGA supporting 2 independent displays
  • Six PCIe x1, one PCIe x16 and 32-bit PCI-bus
  • GbE, four SATA 6 Gb/s, one PATA,IDE, eight USB 2.0
  • Supports Smart Embedded Management Agent (SEMA) functions
  • Extreme Rugged™ operating temperature: -40°C to +85°C (optional)

COM Express® Basic Size Type 2 Module, Intel®Celeron® 2002E 1.5 GHz (no Turbo) 25W (2C/GT1)

Express-HL2-Celeron2002E

MPN:

Express-HL2-Celeron
2002E

Manufacturer L3 Communications

ADLINK

Description:

Adlink's Express-HL and Express-HL2 COM Express modules with 4th generation Intel® i7/i5 processor - up to 3.1GHZ quad core - and mobile Intel® QM87 Express chipset offer up to 16GB dual channel DDR3L SDRAM at 1600MHz. The Express-HL is a COM Express Type 6 module offering three independent displays via DDI interface, as well as seven PCIe x1, one PCIe x16 (Gen3) for graphics (or general purpose x8/4/1), four SATA III (6 Gb/s), Gigabit Ethernet, four USB 2.0, and four USB 3.0 interfaces. The Express-HL2 features the COM Express Type 2 pinout and offers 18/24-bit single/dual channel LVDS, Analog CRT, and a legacy 32 bit PCI bus, as well as PATA IDE interface.

The Adlink Express-HL2 computer-on-module with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. The Express-HL2 is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, determine which data to save locally and which to send to the cloud for further analysis. The results these analyses can provide valuable information for policy decision making and generate innovative business opportunities.

Features:

  • 4th Generation Intel® i7/i5/i3 Processor with Mobile Intel® QM87 Express Chipset
  • Up to 16GB Dual Channel DDR3L at 1600MHz
  • Dual Channel LVDS and VGA supporting 2 independent displays
  • Six PCIe x1, one PCIe x16 and 32-bit PCI-bus
  • GbE, four SATA 6 Gb/s, one PATA,IDE, eight USB 2.0
  • Supports Smart Embedded Management Agent (SEMA) functions
  • Extreme Rugged™ operating temperature: -40°C to +85°C (optional)

Industrial mobile tablet TI OMAP5, 2G/32G, Android 4.2, BT/Wi-Fi, RFID, GPS, 7.4V/ 4200mAh

IMT-10T-W

MPN:

IMT-10T-W

Manufacturer L3 Communications

ADLINK

Description:

IMT-1 is an Android 4.2 tablet, integrating the TI OMAP5432 1.5GHz dual-core ARM A15 processor for high performance computing power. Built-in WLAN or WWAN connectivity enables the IMT-1 to easily access information from a wide variety of industrial and commercial settings. An IP54 rating and 1.2 meter (with optional protective housing) drop resistance support significantly ruggedised construction to withstand the most demanding environments.

Features:

  • TI OMAP5432 system-on-chip with 1.5GHz dual-core ARM Cortex A15 processor
  • Android 4.2 operating system
  • 10.1 inch sunlight readable display, capacitive touchscreen
  • Wireless Connectivity:- WLAN: IEEE 802.11 a/b/g/n - WPAN: Bluetooth 4.0 - WWAN (optional): 3.5G HSPA+, 4G LTE
  • GPS, E-compass, G-sensor
  • Data Capture: HF 13.56MHz NFC RFID, SAM encryption supported
  • IP54 rating and 1.2m drop resistance (with optional protective housing)

Industrial mobile tablet TI OMAP5, 2G/32G, Android 4.2, BT/Wi-Fi, RFID, GPS, 7.4V/ 4200mAh, LTE/3G

IMT-10T-L

MPN:

IMT-10T-L

Manufacturer L3 Communications

ADLINK

Description:

IMT-1 is an Android 4.2 tablet, integrating the TI OMAP5432 1.5GHz dual-core ARM A15 processor for high performance computing power. Built-in WLAN or WWAN connectivity enables the IMT-1 to easily access information from a wide variety of industrial and commercial settings. An IP54 rating and 1.2 meter (with optional protective housing) drop resistance support significantly ruggedised construction to withstand the most demanding environments.

Features:

  • TI OMAP5432 system-on-chip with 1.5GHz dual-core ARM Cortex A15 processor
  • Android 4.2 operating system
  • 10.1 inch sunlight readable display, capacitive touchscreen
  • Wireless Connectivity:- WLAN: IEEE 802.11 a/b/g/n - WPAN: Bluetooth 4.0 - WWAN (optional): 3.5G HSPA+, 4G LTE
  • GPS, E-compass, G-sensor
  • Data Capture: HF 13.56MHz NFC RFID, SAM encryption supported
  • IP54 rating and 1.2m drop resistance (with optional protective housing)

Heat sinks heatspreader for SMARC module LEC-BTS

LEC-BTS-HS

MPN:

LEC-BTS-HS

Manufacturer L3 Communications

ADLINK

Description:

Headspreader for LEC-BTS.

Computer-on-module, COM Express®, basic size type 6 module with AMD® embedded R-Series APU at 2.7 GHz

Express-BE-RX-427BB

MPN:

Express-BE-RX-427BB

Manufacturer L3 Communications

ADLINK

Description:

The Express-BE is a COM Express® COM.0 R2.1 Type 6 module supporting AMD R-Series APU (codename : Bald Eagle) with A77E Fusion Controller Hub. The Express-BE is specifically designed for customers who need excellent graphics performance and high-level processing performance with low power consumption in a long product life solution. The Express-BE features AMD Bald Eagle APU supporting Heterogeneous System Architecture (HSA) and non-ECC type DDR3L dual-channel memory at 1333/1600 MHz to provide excellent overall performance.

Integrated AMD RadeonTM HD 9000 Graphics includes features such as OpenGL 4.2, DirectX 11.1, OpenCL 1.2, OpenGLES 2.0, OpenCV support for H.264, MPEG2, VC1, MPEG4, WMV9, MVC hardware decode. Graphics outputs include dual-channel 18/24-bit LVDS, DDI ports supporting HDMI / DVI / DisplayPort. In addition, up to four independent displays are supported. The Express-BE is specifically designed for customers with high-performance processing and excellent graphics requirements who want to outsource the custom core logic of their systems for reduced development time.

The Express-BE has dual stacked SODIMM sockets for up to 16 GB non-ECC type DDR3L memory. In addition to the onboard integrated graphics, a multiplexed PCI Express® x16 Graphics bus is available for discrete graphics expansion.

The Express-BE features a single onboard Gigabit Ethernet port, USB 3.0 ports and USB 2.0 ports, and SATA 6 Gb/s ports. Support is provided for SMBus and I2C. The module is equipped with SPI AMI EFI BIOS with CMOS backup, supporting embedded features such as remote console, CMOS backup, hardware monitor, and watchdog timer.

Features:

  • AMD® Embedded R-Series APU with A77E Fusion Controller Hub
  • Up to 16GB Dual Channel DDR3L at 1600/1333 MHz
  • Three DDI ports and one LVDS port supporting 4 independent displays
  • Seven PCIe x1, one PCIe x16
  • GbE, four SATA 6 Gb/s, four USB 3.0 and four USB 2.0
  • Supports Smart Embedded Management Agent (SEMA) functions

Computer-on-module, COM Express®, basic size type 6 module with AMD® embedded R-Series APU at 2.5 GHz

Express-BE-RX-425BB

MPN:

Express-BE-RX-425BB

Manufacturer L3 Communications

ADLINK

Description:

The Express-BE is a COM Express® COM.0 R2.1 Type 6 module supporting AMD R-Series APU (codename : Bald Eagle) with A77E Fusion Controller Hub. The Express-BE is specifically designed for customers who need excellent graphics performance and high-level processing performance with low power consumption in a long product life solution. The Express-BE features AMD Bald Eagle APU supporting Heterogeneous System Architecture (HSA) and non-ECC type DDR3L dual-channel memory at 1333/1600 MHz to provide excellent overall performance.

Integrated AMD RadeonTM HD 9000 Graphics includes features such as OpenGL 4.2, DirectX 11.1, OpenCL 1.2, OpenGLES 2.0, OpenCV support for H.264, MPEG2, VC1, MPEG4, WMV9, MVC hardware decode. Graphics outputs include dual-channel 18/24-bit LVDS, DDI ports supporting HDMI / DVI / DisplayPort. In addition, up to four independent displays are supported. The Express-BE is specifically designed for customers with high-performance processing and excellent graphics requirements who want to outsource the custom core logic of their systems for reduced development time.

The Express-BE has dual stacked SODIMM sockets for up to 16 GB non-ECC type DDR3L memory. In addition to the onboard integrated graphics, a multiplexed PCI Express® x16 Graphics bus is available for discrete graphics expansion.

The Express-BE features a single onboard Gigabit Ethernet port, USB 3.0 ports and USB 2.0 ports, and SATA 6 Gb/s ports. Support is provided for SMBus and I2C. The module is equipped with SPI AMI EFI BIOS with CMOS backup, supporting embedded features such as remote console, CMOS backup, hardware monitor, and watchdog timer.

Features:

  • AMD® Embedded R-Series APU with A77E Fusion Controller Hub
  • Up to 16GB Dual Channel DDR3L at 1600/1333 MHz
  • Three DDI ports and one LVDS port supporting 4 independent displays
  • Seven PCIe x1, one PCIe x16
  • GbE, four SATA 6 Gb/s, four USB 3.0 and four USB 2.0
  • Supports Smart Embedded Management Agent (SEMA) functions

Computer-on-module, COM Express®, basic size type 6 module with AMD® embedded R-Series APU at 2.2 GHz

Express-BE-RX-225FB

MPN:

Express-BE-RX-225FB

Manufacturer L3 Communications

ADLINK

Description:

The Express-BE is a COM Express® COM.0 R2.1 Type 6 module supporting AMD R-Series APU (codename : Bald Eagle) with A77E Fusion Controller Hub. The Express-BE is specifically designed for customers who need excellent graphics performance and high-level processing performance with low power consumption in a long product life solution. The Express-BE features AMD Bald Eagle APU supporting Heterogeneous System Architecture (HSA) and non-ECC type DDR3L dual-channel memory at 1333/1600 MHz to provide excellent overall performance.

Integrated AMD RadeonTM HD 9000 Graphics includes features such as OpenGL 4.2, DirectX 11.1, OpenCL 1.2, OpenGLES 2.0, OpenCV support for H.264, MPEG2, VC1, MPEG4, WMV9, MVC hardware decode. Graphics outputs include dual-channel 18/24-bit LVDS, DDI ports supporting HDMI / DVI / DisplayPort. In addition, up to four independent displays are supported. The Express-BE is specifically designed for customers with high-performance processing and excellent graphics requirements who want to outsource the custom core logic of their systems for reduced development time.

The Express-BE has dual stacked SODIMM sockets for up to 16 GB non-ECC type DDR3L memory. In addition to the onboard integrated graphics, a multiplexed PCI Express® x16 Graphics bus is available for discrete graphics expansion.

The Express-BE features a single onboard Gigabit Ethernet port, USB 3.0 ports and USB 2.0 ports, and SATA 6 Gb/s ports. Support is provided for SMBus and I2C. The module is equipped with SPI AMI EFI BIOS with CMOS backup, supporting embedded features such as remote console, CMOS backup, hardware monitor, and watchdog timer.

Features:

  • AMD® Embedded R-Series APU with A77E Fusion Controller Hub
  • Up to 16GB Dual Channel DDR3L at 1600/1333 MHz
  • Three DDI ports and one LVDS port supporting 4 independent displays
  • Seven PCIe x1, one PCIe x16
  • GbE, four SATA 6 Gb/s, four USB 3.0 and four USB 2.0
  • Supports Smart Embedded Management Agent (SEMA) functions

Embedded platform, quad-core Intel® Atom™ processor E3845, ultra compact

MXE-201

MPN:

MXE-201

Manufacturer L3 Communications

ADLINK

Description:

Matrix MXE-200/200i ultra-compact embedded platform, based on the Intel® Atom™ SoC processor E3845/E3826, delivers the most reliable I/O design for maximum connectivity, housing full aluminum alloy enclosure with industry-class construction make it the best embedded system of choice for industrial automation and applications demanding reliability in harsh environment. Combined with ADLINK's embedded SEMA Cloud solution, MXE-200/200i delivers the manageability and robustness required by mission critical operations. In addition, MXE-200i fully support Intel® IoT Gateway , integrated Wind River® Intelligent Device Platform XT, and McAfee Embedded Control all together guarantee the essential cornerstone manageability and security critical to IoT-ready platforms.

With its two GbE LAN, two COM, two USB 2.0 and one USB 3.0 host ports, optional four isolated DI and four isolated DO w/ interrupt support, dual mini PCIe slots with one mSATA support and USIM socket support communication with connections such as WiFi, BT, 3G, and LTE, the MXE-200/200i enables seamless interconnection, ensuring inter operability between systems. Matrix's proven rugged construction assures operation in harsh environments with operating shock tolerance up to 100 G and an extended operating temperature range up to -20°C to 70°C option.

Implementation of ADLINK's proprietary SEMA Cloud tool, the MXE-200/200i maximizes manageability and security for a world of applications, delivering efficient remote monitoring of system activity and health in real time, system control over a robust secured channel, and complete, fully manageable utilization of system resources.

All told, the MXE-200/200i presents an intelligent, robust embedded system supporting wide application development and easy service deployment, presenting outstanding performance in Intelligent Transportation, Facility Management, Industrial Automation and Internet of Things (IoT).

Features:

  • Intel® Atom™ SoC processor E3845/E3826
  • Extremely compact: 120 (W) x 100 (D) x 55 (H) mm
  • 1x HDMI, 2x USB 2.0 + 1x USB 3.0, 2x GbE ports, optional 4 isolated DI/O
  • 2x mPCIe slots (one supporting mSATA), 1x USIM socket, 1x SDIO
  • Optional DIN-Rail / Wall mounting
  • Built-in ADLINK SEMA Cloud solution
  • Full support Intel® IoT Gateway

Embedded platform, duo-core Intel® Atom™ processor E3826, ultra compact

MXE-202

MPN:

MXE-202

Manufacturer L3 Communications

ADLINK

Description:

Matrix MXE-200/200i ultra-compact embedded platform, based on the Intel® Atom™ SoC processor E3845/E3826, delivers the most reliable I/O design for maximum connectivity, housing full aluminum alloy enclosure with industry-class construction make it the best embedded system of choice for industrial automation and applications demanding reliability in harsh environment. Combined with ADLINK's embedded SEMA Cloud solution, MXE-200/200i delivers the manageability and robustness required by mission critical operations. In addition, MXE-200i fully support Intel® IoT Gateway , integrated Wind River® Intelligent Device Platform XT, and McAfee Embedded Control all together guarantee the essential cornerstone manageability and security critical to IoT-ready platforms.

With its two GbE LAN, two COM, two USB 2.0 and one USB 3.0 host ports, optional four isolated DI and four isolated DO w/ interrupt support, dual mini PCIe slots with one mSATA support and USIM socket support communication with connections such as WiFi, BT, 3G, and LTE, the MXE-200/200i enables seamless interconnection, ensuring inter operability between systems. Matrix's proven rugged construction assures operation in harsh environments with operating shock tolerance up to 100 G and an extended operating temperature range up to -20°C to 70°C option.

Implementation of ADLINK's proprietary SEMA Cloud tool, the MXE-200/200i maximizes manageability and security for a world of applications, delivering efficient remote monitoring of system activity and health in real time, system control over a robust secured channel, and complete, fully manageable utilization of system resources.

All told, the MXE-200/200i presents an intelligent, robust embedded system supporting wide application development and easy service deployment, presenting outstanding performance in Intelligent Transportation, Facility Management, Industrial Automation and Internet of Things (IoT).

Features:

  • Intel® Atom™ SoC processor E3845/E3826
  • Extremely compact: 120 (W) x 100 (D) x 55 (H) mm
  • 1x HDMI, 2x USB 2.0 + 1x USB 3.0, 2x GbE ports, optional 4 isolated DI/O
  • 2x mPCIe slots (one supporting mSATA), 1x USIM socket, 1x SDIO
  • Optional DIN-Rail / Wall mounting
  • Built-in ADLINK SEMA Cloud solution
  • Full support Intel® IoT Gateway

Embedded IoT gateway platform, duo-core Intel® Atom™ processor E3826

MXE-202i

MPN:

MXE-202i

Manufacturer L3 Communications

ADLINK

Description:

Matrix MXE-200/200i ultra-compact embedded platform, based on the Intel® Atom™ SoC processor E3845/E3826, delivers the most reliable I/O design for maximum connectivity, housing full aluminum alloy enclosure with industry-class construction make it the best embedded system of choice for industrial automation and applications demanding reliability in harsh environment. Combined with ADLINK's embedded SEMA Cloud solution, MXE-200/200i delivers the manageability and robustness required by mission critical operations. In addition, MXE-200i fully support Intel® IoT Gateway , integrated Wind River® Intelligent Device Platform XT, and McAfee Embedded Control all together guarantee the essential cornerstone manageability and security critical to IoT-ready platforms.

With its two GbE LAN, two COM, two USB 2.0 and one USB 3.0 host ports, optional four isolated DI and four isolated DO w/ interrupt support, dual mini PCIe slots with one mSATA support and USIM socket support communication with connections such as WiFi, BT, 3G, and LTE, the MXE-200/200i enables seamless interconnection, ensuring inter operability between systems. Matrix's proven rugged construction assures operation in harsh environments with operating shock tolerance up to 100 G and an extended operating temperature range up to -20°C to 70°C option.

Implementation of ADLINK's proprietary SEMA Cloud tool, the MXE-200/200i maximizes manageability and security for a world of applications, delivering efficient remote monitoring of system activity and health in real time, system control over a robust secured channel, and complete, fully manageable utilization of system resources.

All told, the MXE-200/200i presents an intelligent, robust embedded system supporting wide application development and easy service deployment, presenting outstanding performance in Intelligent Transportation, Facility Management, Industrial Automation and Internet of Things (IoT).

Features:

  • Intel® Atom™ SoC processor E3845/E3826
  • Extremely compact: 120 (W) x 100 (D) x 55 (H) mm
  • 1x HDMI, 2x USB 2.0 + 1x USB 3.0, 2x GbE ports, optional 4 isolated DI/O
  • 2x mPCIe slots (one supporting mSATA), 1x USIM socket, 1x SDIO
  • Optional DIN-Rail / Wall mounting
  • Built-in ADLINK SEMA Cloud solution
  • Full support Intel® IoT Gateway

Industrial touchscreen panel computer 15.6 inch with Intel® Atom™ D2550 processor

STC-15W04

MPN:

STC-15W04

Manufacturer L3 Communications

ADLINK

Description:

The STC-15W04 is specifically designed for hazardous industrial environments. The STC-15W04 is compliant with UL Class 1 Division 2, ATEX Zone 2, and IECEx hazardous locations standards, meaning that it won't cause ignition in the presence of flammable gases, vapours or liquids, and is suitable for use in food, beverage, chemical and pharmaceutical environments.

Applications include oil and gas drilling control platform, and chemical processing control and monitoring.

Features:

  • 15.6 inch projected capacitive full-flat multi-touch screen
  • Low power consumption and fanless system
  • C1D2, IECEx, ATEX Zone 2 compliance for hazardous environments
  • Rugged IP65 front panel design
  • Reliable operation for hazardous environments
  • Fanless, streamlined enclosure for highly efficient heat dissipation.
  • User-friendly interface

Switch blade, fabric interface, 10 Gigabit Ethernet, AdvancedTCA®

aTCA-3430

MPN:

aTCA-3430

Manufacturer L3 Communications

ADLINK

Description:

The aTCA-3430 is a high-performance 10G fabric switch blade for AdvancedTCA® platforms. This product is ideal for bandwidth intensive telecom applications such as wireless access controllers, DPI/security network, IPTV, IP multimedia subsystems, RNC/BSC, broadband access/bearer networks, data centres, and LTE/4G network applications. The aTCA-3430 provides 10GbE hub-to-node connectivity and integrated switch silicon that supports load balancing, priority queues, packet classification, and flow control to enable strict bandwidth management for implemented applications.

In addition to a fabric switch, the aTCA-3430 also incorporates a base switch to provide PICMG 3.0 Gigabit Ethernet backplane connectivity. The base switch provides up to 13 ports of node slot connectivity to support both 6 and 14-slot chassis in addition to 8 ports of front I/O, with 6 ports supporting 1GbE and 2 ports supporting 10GbE. Other ports are used to provide connectivity to other components on the board such as the Local Management Processor (LMP) and Intelligent Platform Management Controller (IPMC), and a redundant switch slot supports connectivity with the redundant base switch and shelf management.

A powerful quad-core LMP executes all switch functions, blade setup and hardware platform management functions. Dual boot flash memory is provided for redundancy and a microSD card is provided for OS storage. The ADLINK aTCA-3430 is equipped with the ADLINK PacketManager software package, which combines all the essential features required for a fully functional switch infrastructure on ATCA platforms. This complete package allows customers to focus on revenue-generating software development projects and provides the flexibility to develop specific functions according to customer requirements.

Features:

  • 10 Gigabit Ethernet AdvancedTCA® Fabric
  • 320G Fabric switch capacity for 14/6 slot 10GbE chassis
  • Freescale QorIQ P2040 (quad core) @ 1.0GHz Control Plane Processor
  • 12-port 10-Gigabit Ethernet SFP+ on front panel
  • Broadcom BCM56842 High-Capacity StrataXGS® Trident Ethernet Switch
  • ADLINK PacketManager with full L2/L3 functions

Short computer-on-module with Intel® Atom™ Processor E3845 System-on-Chip, 2 GB DDR3L

LEC-BTS4-2G-ER

MPN:

LEC-BTS4-2G-ER

Manufacturer L3 Communications

ADLINK

Description:

The SMARC ("Smart Mobility ARChitecture") is a versatile small form factor computer Module definition targeting applications that require low power, low costs, and high performance. The Modules will typically use ARM SOCs similar or the same as those used in many familiar devices such as tablet computers and smart phones. Alternative low power SOCs and CPUs, such as tablet oriented X86 devices and other RISC CPUs may be used as well. The Module power envelope is typically under 6W.

The Modules are used as building blocks for portable and stationary embedded systems. The core CPU and support circuits, including DRAM, boot flash, power sequencing, CPU power supplies, GBE and a single channel LVDS display transmitter are concentrated on the Module. The Modules are used with application specific Carrier Boards that implement other features such as audio CODECs, touch controllers, wireless devices, etc. The modular approach allows scalability, fast time to market and upgradability while still maintaining low costs, low power and small physical size.

The ADLINK LEC-BTS computer-on-module with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. The LEC-BTS is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, determine which data to save locally and which to send to the cloud for further analysis. The results these analyses can provide valuable information for policy decision making and generate innovative business opportunities.

To stress on its low power consumption feature, ADLINK has named SMARC products as LEC (Low Energy Computer on module) series.

Features:

  • Single, dual or quad-core Intel® Atom™ Processor E3800 Series System-on-Chip
  • Up to 4 GB DDR3L at 1066/1333 MHz (non-ECC)
  • HDMI and LVDS
  • GbE, camera interface
  • 1x SATA 3Gb/s, 1x USB 3.0, 3x USB 2.0, max. 12x GPIO
  • Extreme Rugged™ operating temperature: -40°C to +85°C

Short computer-on-module with Intel® Atom™ Processor E3826 System-on-Chip, 2 GB DDR3L

LEC-BTS2-2G-BR

MPN:

LEC-BTS2-2G-BR

Manufacturer L3 Communications

ADLINK

Description:

The SMARC ("Smart Mobility ARChitecture") is a versatile small form factor computer Module definition targeting applications that require low power, low costs, and high performance. The Modules will typically use ARM SOCs similar or the same as those used in many familiar devices such as tablet computers and smart phones. Alternative low power SOCs and CPUs, such as tablet oriented X86 devices and other RISC CPUs may be used as well. The Module power envelope is typically under 6W.

The Modules are used as building blocks for portable and stationary embedded systems. The core CPU and support circuits, including DRAM, boot flash, power sequencing, CPU power supplies, GBE and a single channel LVDS display transmitter are concentrated on the Module. The Modules are used with application specific Carrier Boards that implement other features such as audio CODECs, touch controllers, wireless devices, etc. The modular approach allows scalability, fast time to market and upgradability while still maintaining low costs, low power and small physical size.

The ADLINK LEC-BTS computer-on-module with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. The LEC-BTS is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, determine which data to save locally and which to send to the cloud for further analysis. The results these analyses can provide valuable information for policy decision making and generate innovative business opportunities.

To stress on its low power consumption feature, ADLINK has named SMARC products as LEC (Low Energy Computer on module) series.

Features:

  • Single, dual or quad-core Intel® Atom™ Processor E3800 Series System-on-Chip
  • Up to 4 GB DDR3L at 1066/1333 MHz (non-ECC)
  • HDMI and LVDS
  • GbE, camera interface
  • 1x SATA 3Gb/s, 1x USB 3.0, 3x USB 2.0, max. 12x GPIO
  • Extreme Rugged™ operating temperature: -40°C to +85°C

Short computer-on-module with Intel® Atom™ Processor E3815 System-on-Chip, 2 GB DDR3L

LEC-BTS1-2G-ER

MPN:

LEC-BTS1-2G-ER

Manufacturer L3 Communications

ADLINK

Description:

The SMARC ("Smart Mobility ARChitecture") is a versatile small form factor computer Module definition targeting applications that require low power, low costs, and high performance. The Modules will typically use ARM SOCs similar or the same as those used in many familiar devices such as tablet computers and smart phones. Alternative low power SOCs and CPUs, such as tablet oriented X86 devices and other RISC CPUs may be used as well. The Module power envelope is typically under 6W.

The Modules are used as building blocks for portable and stationary embedded systems. The core CPU and support circuits, including DRAM, boot flash, power sequencing, CPU power supplies, GBE and a single channel LVDS display transmitter are concentrated on the Module. The Modules are used with application specific Carrier Boards that implement other features such as audio CODECs, touch controllers, wireless devices, etc. The modular approach allows scalability, fast time to market and upgradability while still maintaining low costs, low power and small physical size.

The ADLINK LEC-BTS computer-on-module with built-in SEMA Cloud functionality is ready-made for Internet of Things (IoT) applications. The LEC-BTS is able to connect legacy industrial devices and other IoT systems to the cloud, extract raw data from these devices, determine which data to save locally and which to send to the cloud for further analysis. The results these analyses can provide valuable information for policy decision making and generate innovative business opportunities.

To stress on its low power consumption feature, ADLINK has named SMARC products as LEC (Low Energy Computer on module) series.

Features:

  • Single, dual or quad-core Intel® Atom™ Processor E3800 Series System-on-Chip
  • Up to 4 GB DDR3L at 1066/1333 MHz (non-ECC)
  • HDMI and LVDS
  • GbE, camera interface
  • 1x SATA 3Gb/s, 1x USB 3.0, 3x USB 2.0, max. 12x GPIO
  • Extreme Rugged™ operating temperature: -40°C to +85°C

Short computer-on-module with Freescale i.MX6 Solo, DualLite, Dual or Quad Core, 8 GB eMMC

LEC-iMX64-2G-8G-ER

MPN:

LEC-iMX64-2G-8G-ER

Manufacturer L3 Communications

ADLINK

Description:

The SMARC ("Smart Mobility ARChitecture") is a versatile small form factor computer Module definition targeting applications that require low power, low costs, and high performance. The Modules will typically use ARM SOCs similar or the same as those used in many familiar devices such as tablet computers and smart phones. Alternative low power SOCs and CPUs, such as tablet oriented X86 devices and other RISC CPUs may be used as well. The Module power envelope is typically under 6W. 

The Modules are used as building blocks for portable and stationary embedded systems. The core CPU and support circuits, including DRAM, boot flash, power sequencing, CPU power supplies, GBE and a single channel LVDS display transmitter are concentrated on the Module. The Modules are used with application specific Carrier Boards that implement other features such as audio CODECs, touch controllers, wireless devices, etc. The modular approach allows scalability, fast time to market and upgradability while still maintaining low costs, low power and small physical size. 

To stress on its low power consumption feature, ADLINK has named SMARC products as LEC (Low Energy Computer on module) series.

Features:

  • Freescale SoC i.MX6 ARM Cortex A9 Solo, DualLite, Dual or Quad processor
  • Integrated 2D/3D graphics processors, 3D 1080p video processing, power management
  • Onboard DDR3L/1067 system memory from 512 MB to 2 GB
  • Supports up to 64 GB eMMC, 1x SD/MMC, 1x SATA 3Gb/s
  • Extreme Rugged™ operating temperature: -40°C to +85°C

Short computer-on-module with Freescale i.MX6, Dual, 2 GB RAM, 8 GB eMMC

LEC-iMX62-2G-8G-ER

MPN:

LEC-iMX62-2G-8G-ER

Manufacturer L3 Communications

ADLINK

Description:

The SMARC ("Smart Mobility ARChitecture") is a versatile small form factor computer Module definition targeting applications that require low power, low costs, and high performance. The Modules will typically use ARM SOCs similar or the same as those used in many familiar devices such as tablet computers and smart phones. Alternative low power SOCs and CPUs, such as tablet oriented X86 devices and other RISC CPUs may be used as well. The Module power envelope is typically under 6W. 

The Modules are used as building blocks for portable and stationary embedded systems. The core CPU and support circuits, including DRAM, boot flash, power sequencing, CPU power supplies, GBE and a single channel LVDS display transmitter are concentrated on the Module. The Modules are used with application specific Carrier Boards that implement other features such as audio CODECs, touch controllers, wireless devices, etc. The modular approach allows scalability, fast time to market and upgradability while still maintaining low costs, low power and small physical size. 

To stress on its low power consumption feature, ADLINK has named SMARC products as LEC (Low Energy Computer on module) series.

Features:

  • Freescale SoC i.MX6 ARM Cortex A9 Solo, DualLite, Dual or Quad processor
  • Integrated 2D/3D graphics processors, 3D 1080p video processing, power management
  • Onboard DDR3L/1067 system memory from 512 MB to 2 GB
  • Supports up to 64 GB eMMC, 1x SD/MMC, 1x SATA 3Gb/s
  • Extreme Rugged™ operating temperature: -40°C to +85°C

Short computer-on-module with Freescale i.MX6, Solo, 1 GB RAM, 8 GB eMMC

LEC-iMX61-1G-8G-ER

MPN:

LEC-iMX61-1G-8G-ER

Manufacturer L3 Communications

ADLINK

Description:

The SMARC ("Smart Mobility ARChitecture") is a versatile small form factor computer Module definition targeting applications that require low power, low costs, and high performance. The Modules will typically use ARM SOCs similar or the same as those used in many familiar devices such as tablet computers and smart phones. Alternative low power SOCs and CPUs, such as tablet oriented X86 devices and other RISC CPUs may be used as well. The Module power envelope is typically under 6W. 

The Modules are used as building blocks for portable and stationary embedded systems. The core CPU and support circuits, including DRAM, boot flash, power sequencing, CPU power supplies, GBE and a single channel LVDS display transmitter are concentrated on the Module. The Modules are used with application specific Carrier Boards that implement other features such as audio CODECs, touch controllers, wireless devices, etc. The modular approach allows scalability, fast time to market and upgradability while still maintaining low costs, low power and small physical size. 

To stress on its low power consumption feature, ADLINK has named SMARC products as LEC (Low Energy Computer on module) series.

Features:

  • Freescale SoC i.MX6 ARM Cortex A9 Solo, DualLite, Dual or Quad processor
  • Integrated 2D/3D graphics processors, 3D 1080p video processing, power management
  • Onboard DDR3L/1067 system memory from 512 MB to 2 GB
  • Supports up to 64 GB eMMC, 1x SD/MMC, 1x SATA 3Gb/s
  • Extreme Rugged™ operating temperature: -40°C to +85°C

Heatspreader for SMARC module LEC-iMX6

LEC-iMX6-HS

MPN:

LEC-iMX6-HS

Manufacturer L3 Communications

ADLINK

Description:

Heatspreader for LEC-iMX6.

Computer-on-module, COM Express®, Intel® Atom™ or Celeron® processor system-on-Chip, type 2

cExpress-BT2

MPN:

cExpress-BT2

Manufacturer L3 Communications

ADLINK

Description:

The cExpress-BT2 is a COM Express® COM.0 R2.1 Type 2 module supporting the Intel® Atom™ E3800 processor and Intel® Celeron® processor, memory controller, and graphics processor on a single-chip design. The cExpress-BT2 is specifically designed for customers who need high-level processing and graphics performance with low power consumption in a long product life solution.

The cExpress-BT2 features the Intel® Atom™ E3800 processor and Intel® Celeron® processor supporting non-ECC type DDR3L dual-channel memory at 1066/1333 MHz to provide excellent overall performance.

Integrated Intel® 7th Generation HD Graphics includes features such as OpenGL 3.1, DirectX 11, OpenCL 1.1 support for H.264, MPEG2, VC1, VP8 hardware decode. Graphics outputs include VGA and dual-channel 18/24-bit LVDS. The cExpress-BT2 is specifically designed for customers with high-performance graphics processing requirements who want to outsource the custom core logic of their systems for reduced development time.

The cExpress-BT2 has dual stacked SODIMM sockets for up to 8 GB non-ECC type DDR3L memory. In addition, an onboard eMCC memory is supported (optional, 8GB/16GB/32GB).

The cExpress-BT2 features a single onboard Gigabit Ethernet port, USB 2.0 ports, PATA and SATA 3 Gb/s ports, and PCI 2.3. Support is provided for SMBus and I2C. The module is equipped with SPI AMI EFI BIOS with CMOS backup, supporting embedded features such as remote console, CMOS backup, hardware monitor, and watchdog timer.

Features:

  • Single, dual, quad-core Intel® Atom™ or Celeron® Processor System-on-Chip
  • Up to 8GB Dual Channel DDR3L at 1333MHz
  • VGA and dual channel 18/24-bit LVDS
  • Two PCIe x1, and 32-bit PCI bus
  • GbE, one SATA 3Gb/s, one PATA IDE, eight USB 2.0
  • Supports Smart Embedded Management Agent (SEMA) functions
  • Extreme Rugged™ operating temperature: -40°C to +85°C (optional)

Coldplate mount system, HPERC series, i7 processor, high-performance, extreme rugged

HPERC-IBR-HC

MPN:

HPERC-IBR-HC

Manufacturer L3 Communications

ADLINK

Description:

Inside the tiny footprint of HPERC™ lives the power of 3rd generation Intel® Core™ i7 processor and optional GPGPU parallel processing engine. Dual removable secure erase RAID-0 SSDs provide 12Gb/s throughput and security for deployment in hostile environments. Easy configuration and expansion allows for fast integration of custom rugged embedded applications. HPERC™ reserves connector pins for expansion interfaces. The GPGPU sits on a 16-lane 3rd generation PCI Express interface. Uniquely-keyed MIL-DTL-38999 connectors provide a wide array of fast IO. Built with proven Ampro reliability, the rugged capabilities of HPERC™ are ideal for ground, air and sea deployments. HPERC™ systems survive shock, resist corrosion and galvanic oxidation, and perform in the humid jungle, the heat of the desert, and the bitter cold of frozen mountain passes.

Features:

  • SWaP efficient sealed SFF System
  • VITA 75 coldplate mounting
  • Soldered DDR3L-1333 8GB - Up to 16GB RAM
  • Quad Gigabit Ethernet
  • Ultra-Fast Solid-State-RAID
  • Available GPGPU on 16-lane 3rd Generation PCI Express
  • Triple Display (DP/HDMI/DVI)
  • Extreme Rugged™ operating temperature: -40?XC to +85?XC

Finned-convection system, HPERC series, i7 processor, high-performance, extreme rugged

HPERC-IBR-HH

MPN:

HPERC-IBR-HH

Manufacturer L3 Communications

ADLINK

Description:

Inside the tiny footprint of HPERC™ lives the power of 3rd generation Intel® Core™ i7 processor and optional GPGPU parallel processing engine. Dual removable secure erase RAID-0 SSDs provide 12Gb/s throughput and security for deployment in hostile environments. Easy configuration and expansion allows for fast integration of custom rugged embedded applications. HPERC™ reserves connector pins for expansion interfaces. The GPGPU sits on a 16-lane 3rd generation PCI Express interface. Uniquely-keyed MIL-DTL-38999 connectors provide a wide array of fast IO. Built with proven Ampro reliability, the rugged capabilities of HPERC™ are ideal for ground, air and sea deployments. HPERC™ systems survive shock, resist corrosion and galvanic oxidation, and perform in the humid jungle, the heat of the desert, and the bitter cold of frozen mountain passes.

Features:

  • SWaP efficient sealed SFF System
  • Intel® Core™ i7 dual or quad core Processor
  • Soldered DDR3L-1333 8GB, up to 16GB RAM
  • Quad Gigabit Ethernet
  • Ultra-Fast Solid-State-RAID
  • Available GPGPU on 16-lane 3rd Generation PCI Express
  • Triple Display (DP/HDMI/DVI)
  • VITA 75 mount with passive cooling

Fanless computer, Intel® Core™ i7-3610QE, 1 PCI + 1 PCIe x16

MXC-6311D

MPN:

MXC-6311D

Manufacturer L3 Communications

ADLINK

Description:

The Matrix MXC-6300 series is a high-performance fanless embedded computer integrating a 3rd generation Intel® Core™ i7/ i5/i3 processor and QM77 chipset to provide powerful computing and excellent graphic performance. Graphic-intensive and computing-oriented applications including image and vision measurement, machine automation, maritime automation, surveillance and high-resolution medical imaging can all benefit.

Increased PCI & PCI express (Gen2) expansion slots allow installation of a variety of PCI, PCIex8 or PCIex16 add-on cards, meeting the needs of application platform development environments. In addition, the MXC-6300 series offers 2 x DisplayPort and 1 x DVI-I port for three independent display support connections, 4 x USB3.0 and 2 x USB2.0 ports, and 2 GbE LAN ports with teaming function. The two 2.5" onboard SATA III ports with high speed SATA 6 Gb/s and RAID 0, 1 ensure all data in the RAID array is fully backed up. Built-in 16CH isolated DIO provides overall industrial control.

Delivering high quality, durability and compact construction, the MXC-6300 leverages a reliable fanless and cable-free configuration, optimal thermal dissipation, and easy installation for flexible and user-friendly system development and application implementation in harsh environments.

Features:

  • Supports 3rd generation Intel® Core™ i7/i5/i3 processor + QM77 chipset
  • 2 x DDR3 SO-DIMM socket, support up to 16GB memory
  • 2 PCIe x8 + 1 PCI slots or 1 PCIe x16 + 1 PCI expansion slots, supporting PCIe Gen2
  • 3 independent display with onboard 2 Display Port + 1 DVI-I
  • 2 Intel® GbE ports with teaming function, Intel® iAMT 8.0
  • 6 external USB ports (4 USB 3.0 + 2 USB 2.0) + 1 internal USB 2.0, 2 CFast sockets, onboard SATA III for 2x2.5 inch HDD/SSD installation, SATA 6Gb/s and RAID 0,1 support
  • Built-in 9 VDC to 32 VDC wide-range DC power input
  • Rugged, up to -20°C to 60°C (-4°F to 140°F) fanless operation (w/ industrial SSD)

Fanless computer, Intel® Core™ i5-3610ME, 1 PCI + 1 PCIe x16

MXC-6312D

MPN:

MXC-6312D

Manufacturer L3 Communications

ADLINK

Description:

The Matrix MXC-6300 series is a high-performance fanless embedded computer integrating a 3rd generation Intel® Core™ i7/ i5/i3 processor and QM77 chipset to provide powerful computing and excellent graphic performance. Graphic-intensive and computing-oriented applications including image and vision measurement, machine automation, maritime automation, surveillance and high-resolution medical imaging can all benefit.

Increased PCI & PCI express (Gen2) expansion slots allow installation of a variety of PCI, PCIex8 or PCIex16 add-on cards, meeting the needs of application platform development environments. In addition, the MXC-6300 series offers 2 x DisplayPort and 1 x DVI-I port for three independent display support connections, 4 x USB3.0 and 2 x USB2.0 ports, and 2 GbE LAN ports with teaming function. The two 2.5" onboard SATA III ports with high speed SATA 6 Gb/s and RAID 0, 1 ensure all data in the RAID array is fully backed up. Built-in 16CH isolated DIO provides overall industrial control.

Delivering high quality, durability and compact construction, the MXC-6300 leverages a reliable fanless and cable-free configuration, optimal thermal dissipation, and easy installation for flexible and user-friendly system development and application implementation in harsh environments.

Features:

  • Supports 3rd generation Intel® Core™ i7/i5/i3 processor + QM77 chipset
  • 2 x DDR3 SO-DIMM socket, support up to 16GB memory
  • 2 PCIe x8 + 1 PCI slots or 1 PCIe x16 + 1 PCI expansion slots, supporting PCIe Gen2
  • 3 independent display with onboard 2 Display Port + 1 DVI-I
  • 2 Intel® GbE ports with teaming function, Intel® iAMT 8.0
  • 6 external USB ports (4 USB 3.0 + 2 USB 2.0) + 1 internal USB 2.0, 2 CFast sockets, onboard SATA III for 2x2.5 inch HDD/SSD installation, SATA 6Gb/s and RAID 0,1 support
  • Built-in 9 VDC to 32 VDC wide-range DC power input
  • Rugged, up to -20°C to 60°C (-4°F to 140°F) fanless operation (w/ industrial SSD)

Fanless computer, Intel® Core™ i3-3120ME, 1 PCI + 1 PCIe x16

MXC-6313D

MPN:

MXC-6313D

Manufacturer L3 Communications

ADLINK

Description:

The Matrix MXC-6300 series is a high-performance fanless embedded computer integrating a 3rd generation Intel® Core™ i7/ i5/i3 processor and QM77 chipset to provide powerful computing and excellent graphic performance. Graphic-intensive and computing-oriented applications including image and vision measurement, machine automation, maritime automation, surveillance and high-resolution medical imaging can all benefit.

Increased PCI & PCI express (Gen2) expansion slots allow installation of a variety of PCI, PCIex8 or PCIex16 add-on cards, meeting the needs of application platform development environments. In addition, the MXC-6300 series offers 2 x DisplayPort and 1 x DVI-I port for three independent display support connections, 4 x USB3.0 and 2 x USB2.0 ports, and 2 GbE LAN ports with teaming function. The two 2.5" onboard SATA III ports with high speed SATA 6 Gb/s and RAID 0, 1 ensure all data in the RAID array is fully backed up. Built-in 16CH isolated DIO provides overall industrial control.

Delivering high quality, durability and compact construction, the MXC-6300 leverages a reliable fanless and cable-free configuration, optimal thermal dissipation, and easy installation for flexible and user-friendly system development and application implementation in harsh environments.

Features:

  • Supports 3rd generation Intel® Core™ i7/i5/i3 processor + QM77 chipset
  • 2 x DDR3 SO-DIMM socket, support up to 16GB memory
  • 2 PCIe x8 + 1 PCI slots or 1 PCIe x16 + 1 PCI expansion slots, supporting PCIe Gen2
  • 3 independent display with onboard 2 Display Port + 1 DVI-I
  • 2 Intel® GbE ports with teaming function, Intel® iAMT 8.0
  • 6 external USB ports (4 USB 3.0 + 2 USB 2.0) + 1 internal USB 2.0, 2 CFast sockets, onboard SATA III for 2x2.5 inch HDD/SSD installation, SATA 6Gb/s and RAID 0,1 support
  • Built-in 9 VDC to 32 VDC wide-range DC power input
  • Rugged, up to -20°C to 60°C (-4°F to 140°F) fanless operation (w/ industrial SSD)

Fanless computer, Intel® Core™ i7-3610QE, 3 PCI + 1 PCIe x16

MXC-6321D

MPN:

MXC-6321D

Manufacturer L3 Communications

ADLINK

Description:

The Matrix MXC-6300 series is a high-performance fanless embedded computer integrating a 3rd generation Intel® Core™ i7/ i5/i3 processor and QM77 chipset to provide powerful computing and excellent graphic performance. Graphic-intensive and computing-oriented applications including image and vision measurement, machine automation, maritime automation, surveillance and high-resolution medical imaging can all benefit.

Increased PCI & PCI express (Gen2) expansion slots allow installation of a variety of PCI, PCIex8 or PCIex16 add-on cards, meeting the needs of application platform development environments. In addition, the MXC-6300 series offers 2 x DisplayPort and 1 x DVI-I port for three independent display support connections, 4 x USB3.0 and 2 x USB2.0 ports, and 2 GbE LAN ports with teaming function. The two 2.5" onboard SATA III ports with high speed SATA 6 Gb/s and RAID 0, 1 ensure all data in the RAID array is fully backed up. Built-in 16CH isolated DIO provides overall industrial control.

Delivering high quality, durability and compact construction, the MXC-6300 leverages a reliable fanless and cable-free configuration, optimal thermal dissipation, and easy installation for flexible and user-friendly system development and application implementation in harsh environments.

Features:

  • Supports 3rd generation Intel® Core™ i7/i5/i3 processor + QM77 chipset
  • 2 x DDR3 SO-DIMM socket, support up to 16GB memory
  • 2 PCIe x8 + 1 PCI slots or 1 PCIe x16 + 1 PCI expansion slots, supporting PCIe Gen2
  • 3 independent display with onboard 2 Display Port + 1 DVI-I
  • 2 Intel® GbE ports with teaming function, Intel® iAMT 8.0
  • 6 external USB ports (4 USB 3.0 + 2 USB 2.0) + 1 internal USB 2.0, 2 CFast sockets, onboard SATA III for 2x2.5 inch HDD/SSD installation, SATA 6Gb/s and RAID 0,1 support
  • Built-in 9 VDC to 32 VDC wide-range DC power input
  • Rugged, up to -20°C to 60°C (-4°F to 140°F) fanless operation (w/ industrial SSD)

Fanless computer, Intel® Core™ i5-3610ME, 3 PCI + 1 PCIe x16

MXC-6322D

MPN:

MXC-6322D

Manufacturer L3 Communications

ADLINK

Description:

The Matrix MXC-6300 series is a high-performance fanless embedded computer integrating a 3rd generation Intel® Core™ i7/ i5/i3 processor and QM77 chipset to provide powerful computing and excellent graphic performance. Graphic-intensive and computing-oriented applications including image and vision measurement, machine automation, maritime automation, surveillance and high-resolution medical imaging can all benefit.

Increased PCI & PCI express (Gen2) expansion slots allow installation of a variety of PCI, PCIex8 or PCIex16 add-on cards, meeting the needs of application platform development environments. In addition, the MXC-6300 series offers 2 x DisplayPort and 1 x DVI-I port for three independent display support connections, 4 x USB3.0 and 2 x USB2.0 ports, and 2 GbE LAN ports with teaming function. The two 2.5" onboard SATA III ports with high speed SATA 6 Gb/s and RAID 0, 1 ensure all data in the RAID array is fully backed up. Built-in 16CH isolated DIO provides overall industrial control.

Delivering high quality, durability and compact construction, the MXC-6300 leverages a reliable fanless and cable-free configuration, optimal thermal dissipation, and easy installation for flexible and user-friendly system development and application implementation in harsh environments.

Features:

  • Supports 3rd generation Intel® Core™ i7/i5/i3 processor + QM77 chipset
  • 2 x DDR3 SO-DIMM socket, support up to 16GB memory
  • 2 PCIe x8 + 1 PCI slots or 1 PCIe x16 + 1 PCI expansion slots, supporting PCIe Gen2
  • 3 independent display with onboard 2 Display Port + 1 DVI-I
  • 2 Intel® GbE ports with teaming function, Intel® iAMT 8.0
  • 6 external USB ports (4 USB 3.0 + 2 USB 2.0) + 1 internal USB 2.0, 2 CFast sockets, onboard SATA III for 2x2.5 inch HDD/SSD installation, SATA 6Gb/s and RAID 0,1 support
  • Built-in 9 VDC to 32 VDC wide-range DC power input
  • Rugged, up to -20°C to 60°C (-4°F to 140°F) fanless operation (w/ industrial SSD)

Fanless computer, Intel® Core™ i3-3120ME, 3 PCI + 1 PCIe x16

MXC-6323D

MPN:

MXC-6323D

Manufacturer L3 Communications

ADLINK

Description:

The Matrix MXC-6300 series is a high-performance fanless embedded computer integrating a 3rd generation Intel® Core™ i7/ i5/i3 processor and QM77 chipset to provide powerful computing and excellent graphic performance. Graphic-intensive and computing-oriented applications including image and vision measurement, machine automation, maritime automation, surveillance and high-resolution medical imaging can all benefit.

Increased PCI & PCI express (Gen2) expansion slots allow installation of a variety of PCI, PCIex8 or PCIex16 add-on cards, meeting the needs of application platform development environments. In addition, the MXC-6300 series offers 2 x DisplayPort and 1 x DVI-I port for three independent display support connections, 4 x USB3.0 and 2 x USB2.0 ports, and 2 GbE LAN ports with teaming function. The two 2.5" onboard SATA III ports with high speed SATA 6 Gb/s and RAID 0, 1 ensure all data in the RAID array is fully backed up. Built-in 16CH isolated DIO provides overall industrial control.

Delivering high quality, durability and compact construction, the MXC-6300 leverages a reliable fanless and cable-free configuration, optimal thermal dissipation, and easy installation for flexible and user-friendly system development and application implementation in harsh environments.

Features:

  • Supports 3rd generation Intel® Core™ i7/i5/i3 processor + QM77 chipset
  • 2 x DDR3 SO-DIMM socket, support up to 16GB memory
  • 2 PCIe x8 + 1 PCI slots or 1 PCIe x16 + 1 PCI expansion slots, supporting PCIe Gen2
  • 3 independent display with onboard 2 Display Port + 1 DVI-I
  • 2 Intel® GbE ports with teaming function, Intel® iAMT 8.0
  • 6 external USB ports (4 USB 3.0 + 2 USB 2.0) + 1 internal USB 2.0, 2 CFast sockets, onboard SATA III for 2x2.5 inch HDD/SSD installation, SATA 6Gb/s and RAID 0,1 support
  • Built-in 9 VDC to 32 VDC wide-range DC power input
  • Rugged, up to -20°C to 60°C (-4°F to 140°F) fanless operation (w/ industrial SSD)

Industrial PC, Giant series, 15 inch, complete closed housing

Penta-Control-D15

MPN:

Penta-Control-D15

Manufacturer L3 Communications

ADLINK

Description:

Giant Series panel PCs are designed with maximum reliability in mind. The fanless, 15-inch Giant Series panel PCs offer fully enclosed, IP65 rated protection against water and dust. These rugged systems also feature optional solid state flash drives (SSD) instead of hard drives with rotating disks (HDD) for additional shock and vibration resistance, and their fanless design allows them to function reliably in a temperature range from 0°C to 40°C.

The 15-inch Giant Series panel PCs can be mounted in a flexible and convenient way in almost any location thanks to a VESA-compatible mounting interface. The Giant Series also uses a modular system design, providing hassle-free upgrade and field maintenance.

PCle socket, PCIe x1 slot and additional PCl slot for further expandability. WLAN cards for wireless communication can be integrated in advance upon request.

Features:

  • Modular high-end Industrial-PC with complete closed housing (IP65)
  • Durable and error-free even under critical environmental conditions
  • Fast data input via Touchscreen
  • Various input and reader devices (Legic , RFID etc.) and scanner are connectable
  • Wireless-LAN integrable
  • Legic / Mifare Reader integrable
  • Expandable with two PCIe-Slots (1 x PCIe (1x) ; 1 x Mini PCIe)
  • Industrial-PC with Passive cooling concept without ventilation-slot and without fan

Industrial PC, Giant series, 17 inch, complete closed housing

Penta-Control-D17

MPN:

Penta-Control-D17

Manufacturer L3 Communications

ADLINK

Description:

Giant Series panel PCs are designed with maximum reliability in mind. The fanless, 17-inch Giant Series panel PCs offer fully enclosed, IP65 rated protection against water and dust. These rugged systems also feature optional solid state flash drives (SSD) instead of hard drives with rotating disks (HDD) for additional shock and vibration resistance, and their fanless design allows them to function reliably in a temperature range from 0°C to 40°C.

The 17-inch Giant Series panel PCs can be mounted in a flexible and convenient way in almost any location thanks to a VESA-compatible mounting interface. The Giant Series also uses a modular system design, providing hassle-free upgrade and field maintenance.

PCle socket, PCIe x1 slot and additional PCl slot for further expandability. WLAN cards for wireless communication can be integrated in advance upon request.

Features:

  • Modular high-end Industrial-PC with complete closed housing (IP65)
  • Durable and error-free even under critical environmental conditions
  • Fast data input via Touchscreen
  • Various input and reader devices (Legic , RFID etc.) and scanner are connectable
  • Wireless-LAN integrable
  • Legic / Mifare Reader integrable
  • Expandable with two PCIe-Slots (1 x PCIe (1x) ; 1 x Mini PCIe)
  • Industrial-PC with Passive cooling concept without ventilation-slot and without fan

Industrial PC, Giant series, 19 inch, complete closed housing

Penta-Control-D19

MPN:

Penta-Control-D19

Manufacturer L3 Communications

ADLINK

Description:

Giant Series panel PCs are designed with maximum reliability in mind. The fanless, 19-inch Giant Series panel PCs offer fully enclosed, IP65 rated protection against water and dust. These rugged systems also feature optional solid state flash drives (SSD) instead of hard drives with rotating disks (HDD) for additional shock and vibration resistance, and their fanless design allows them to function reliably in a temperature range from 0°C to 40°C.

The 19-inch Giant Series panel PCs can be mounted in a flexible and convenient way in almost any location thanks to a VESA-compatible mounting interface. The Giant Series also uses a modular system design, providing hassle-free upgrade and field maintenance.

PCle socket, PCIe x1 slot and additional PCl slot for further expandability. WLAN cards for wireless communication can be integrated in advance upon request.

Features:

  • Modular high-end Industrial-PC with complete closed housing (IP65)
  • Durable and error-free even under critical environmental conditions
  • Fast data input via Touchscreen
  • Various input and reader devices (Legic , RFID etc.) and scanner are connectable
  • Wireless-LAN integrable
  • Legic / Mifare Reader integrable
  • Expandable with two PCIe-Slots (1 x PCIe (1x) ; 1 x Mini PCIe)
  • Industrial-PC with Passive cooling concept without ventilation-slot and without fan

Fanless computer, Intel® Celeron 1020E

MXC-6305D

MPN:

MXC-6305D

Manufacturer L3 Communications

ADLINK

Description:

The Matrix MXC-6300 series is a high-performance fanless embedded computer integrating a 3rd generation Intel® Core™ i7/ i5/i3 processor and QM77 chipset to provide powerful computing and excellent graphic performance. Graphic-intensive and computing-oriented applications including image and vision measurement, machine automation, maritime automation, surveillance and high-resolution medical imaging can all benefit.

Increased PCI & PCI express (Gen2) expansion slots allow installation of a variety of PCI, PCIex8 or PCIex16 add-on cards, meeting the needs of application platform development environments. In addition, the MXC-6300 series offers 2 x DisplayPort and 1 x DVI-I port for three independent display support connections, 4 x USB3.0 and 2 x USB2.0 ports, and 2 GbE LAN ports with teaming function. The two 2.5" onboard SATA III ports with high speed SATA 6 Gb/s and RAID 0, 1 ensure all data in the RAID array is fully backed up. Built-in 16CH isolated DIO provides overall industrial control.

Delivering high quality, durability and compact construction, the MXC-6300 leverages a reliable fanless and cable-free configuration, optimal thermal dissipation, and easy installation for flexible and user-friendly system development and application implementation in harsh environments.

Features:

  • Supports 3rd generation Intel® Core™ i7/i5/i3 processor + QM77 chipset
  • 2 x DDR3 SO-DIMM socket, support up to 16GB memory
  • 2 PCIe x8 + 1 PCI slots or 1 PCIe x16 + 1 PCI expansion slots, supporting PCIe Gen2
  • 3 independent display with onboard 2 Display Port + 1 DVI-I
  • 2 Intel® GbE ports with teaming function, Intel® iAMT 8.0
  • 6 external USB ports (4 USB 3.0 + 2 USB 2.0) + 1 internal USB 2.0, 2 CFast sockets, onboard SATA III for 2x2.5 inch HDD/SSD installation, SATA 6Gb/s and RAID 0,1 support
  • Built-in 9 VDC to 32 VDC wide-range DC power input
  • Rugged, up to -20°C to 60°C (-4°F to 140°F) fanless operation (w/ industrial SSD)

2U Rackmount Network Appliance with Intel® Xeon® Processor

AdLink CSA-5200 2U Rack mount with Intel processor

MPN:

CSA-5200

Manufacturer L3 Communications

ADLINK

Description:

The ADLINK CSA-5200 is a 2U 19 inch Rackmount Network Appliance with 4th Generation Intel® processor Xeon® E3-1200 v3 and Intel® C226 Chipset. The CSA-5200 features up to 32x GbE ports or 8x SFP+ with an I/O intensive architecture, high scalability with four Network Interface Module (NIM) slots, 2.5 inch/3.5 icnch SATA drive bays, additional storage interfaces (SATADOM, CFast), and is an ideal platform for communications infrastructure deployment.

View our wide range of Platforms and Systems

View our portfolio of Embedded Computing

See all products from our supplier Adlink

Features:

  • 4th Gen Intel® processor Xeon® E3-1200 v3 with Intel® C226 Chipset
  • High scalability with four Network Interface Module (NIM) slots and four 2.5inch/3.5 inch SATA drive bays
  • Maximum 32x GbE/SEP ports or 8x SFP+ with I/O intensive architecture
  • Flexible storage options: SATA drive, SATADOM, CFast
  • ADLINK ARIP (Application Ready Intelligent Platform) designed for network communications

3U CompactPCI Quad-Core Intel® Atom™ Processor Blade, 1 Slot

AdLink cPCI-3620 3U Single Board Computer

MPN:

cPCI-3620/E3845/M4G

Manufacturer L3 Communications

ADLINK

Description:

The ADLINK cPCI-3620/E3845/M4G is 1-slot (4HP) 3U CompactPCI blade with Intel® Atom™ processor E3845 and 4GB DDR3L-1333 soldered memory, supports VGA, USB 3.0, 2x GbE. The ADLINK cPCI-3620 provides high manageability, supports Satellite mode operation as a standalone blade in peripheral slots, and features ADLINK's Smart Embedded Management Agent (SEMA) for system health monitoring.

View our wide range of Single Board Computer

View our portfolio of Embedded Computing

See all products from our supplier AdLink

Features:

  • 1-slot (4HP) 3U CompactPCI blade
  • Low power quad-core Intel® Atom™ SOC
  • Supports up to 4GB DDR3L-1333 ECC soldered memory
  • Onboard 32GB SSD support
  • Supports Smart Embedded Management Agent (SEMA) for system health monitoing
  • Optional additional GbE ports with MIL-STD M12 connectors
  • M12 connectors

3U CompactPCI Quad-Core Intel® Atom™ Processor Blade, 2 Slots

AdLink cPCI-3620 3U Single Board Computer

MPN:

cPCI-3620D/E3845/M4G

Manufacturer L3 Communications

ADLINK

Description:

The ADLINK cPCI-3620D/E3845/M4G is 2-slot (8HP) 3U CompactPCI blade with Intel® Atom™ processor E3845 and 4GB DDR3L-1333 soldered memory, supports VGA, USB 3.0, 2x GbE, COM(RS-232/422/485), 2x USB 2.0, PS/2 keyboard mouse, audio. The ADLINK cPCI-3620 provides high manageability, supports Satellite mode operation as a standalone blade in peripheral slots, and features ADLINK's Smart Embedded Management Agent (SEMA) for system health monitoring.

View our wide range of Single Board Computer

View our portfolio of Embedded Computing

See all products from our supplier AdLink

Features:

  • 2-slot (8HP) 3U CompactPCI blade
  • Low power quad-core Intel® Atom™ SOC
  • Supports up to 4GB DDR3L-1333 ECC soldered memory
  • Onboard 32GB SSD support
  • Supports Smart Embedded Management Agent (SEMA) for system health monitoing
  • Optional additional GbE ports with MIL-STD M12 connectors
  • M12 connectors

3U CompactPCI Quad-Core Intel® Atom™ Processor Blade, 2 Slots

AdLink cPCI-3620 3U Single Board Computer

MPN:

cPCI-3620T/E3845/M4G

Manufacturer L3 Communications

ADLINK

Description:

The ADLINK cPCI-3620T/E3845/M4G is 2-slot (8HP) 3U CompactPCI blade with Intel® Atom™ processor E3845 and 4GB DDR3L-1333 soldered memory, supports VGA, USB 3.0, 2x GbE, COM(RS-232/422/485), 2x GbE in MIL-STD M12 connectors. The ADLINK cPCI-3620 provides high manageability, supports Satellite mode operation as a standalone blade in peripheral slots, and features ADLINK's Smart Embedded Management Agent (SEMA) for system health monitoring.

View our wide range of Single Board Computer

View our portfolio of Embedded Computing

See all products from our supplier AdLink

Features:

  • 2-slot (8HP) 3U CompactPCI blade
  • Low power quad-core Intel® Atom™ SOC
  • Supports up to 4GB DDR3L-1333 ECC soldered memory
  • Onboard 32GB SSD support
  • Supports Smart Embedded Management Agent (SEMA) for system health monitoing
  • Optional additional GbE ports with MIL-STD M12 connectors
  • M12 connectors

3U CompactPCI Quad-Core Intel® Atom™ Processor Blade, 2 Slots

AdLink cPCI-3620 3U Single Board Computer

MPN:

cPCI-3620S/E3845/M4G

Manufacturer L3 Communications

ADLINK

Description:

The ADLINK cPCI-3620S/E3845/M4G is 2-slot (8HP) 3U CompactPCI blade with Intel® Atom™ processor E3827 and 4GB DDR3L-1333 soldered memory, supports VGA, USB 3.0, 2x GbE, XMC site on 2nd layer. The ADLINK cPCI-3620 provides high manageability, supports Satellite mode operation as a standalone blade in peripheral slots, and features ADLINK's Smart Embedded Management Agent (SEMA) for system health monitoring.

View our wide range of Single Board Computer

View our portfolio of Embedded Computing

See all products from our supplier AdLink

Features:

  • 2-slot (8HP) 3U CompactPCI blade
  • Low power quad-core Intel® Atom™ SOC
  • Supports up to 4GB DDR3L-1333 ECC soldered memory
  • Onboard 32GB SSD support
  • Supports Smart Embedded Management Agent (SEMA) for system health monitoing
  • Optional additional GbE ports with MIL-STD M12 connectors
  • M12 connectors

3U CompactPCI Quad-Core Intel® Atom™ Processor Blade, 1 Slot

AdLink cPCI-3620 3U Single Board Computer

MPN:

cPCI-3620N/E3845/M4G

Manufacturer L3 Communications

ADLINK

Description:

The ADLINK cPCI-3620N/E3845/M4G is 1-slot (4HP) 3U CompactPCI blade with Intel® Atom™ processor E3827 and 4GB DDR3L-1333 soldered memory, no I/O only LED (Power, HDD, WDT, GP, GbE LEDs. The ADLINK cPCI-3620 provides high manageability, supports Satellite mode operation as a standalone blade in peripheral slots, and features ADLINK's Smart Embedded Management Agent (SEMA) for system health monitoring.

View our wide range of Single Board Computer

View our portfolio of Embedded Computing

See all products from our supplier AdLink

Features:

  • 1-slot (4HP) 3U CompactPCI blade
  • Low power quad-core Intel® Atom™ SOC
  • Supports up to 4GB DDR3L-1333 ECC soldered memory
  • Onboard 32GB SSD support
  • Supports Smart Embedded Management Agent (SEMA) for system health monitoing
  • Optional additional GbE ports with MIL-STD M12 connectors
  • M12 connectors

IP65 rated full HD medical monitor, 24 inch

AdLink EndoVisHD 24 Inch Medical Monitor

MPN:

EndoVisHD-24

Manufacturer L3 Communications

ADLINK

Description:

EndoVisHD-24 is high-end medical monitor in 24 inch full-HD with complete closed housing, IP65 rated.

View our wide range of Embedded Computing Flat Computer

View our portfolio of Embedded computing

See all products from our supplier Adlink

Features:

  • Medical monitor that not only matches the high requirements of Endoscopic-Surgery but exceeds them by far.
  • Full-HD resolution (up to 1080p) as well as in digital and analog area.
  • Active-TFT display with 1920 x 1200 Pixel resolution, fast response time, high contrast and brightness with high viewing angle durable and error-free even under critical environmental conditions
  • Easy and intuitive handling with the integrated PENTA control panel
  • Easy choice oft he wanted video signals by direct keys (Illuminated)
  • Various input-devices are connectable, integrated USB2.0-HUB
  • Ports: DVI, VGA, S-Video, component Video, RGB-S/YPbPr and USB, Option: SDI

42 inch full HD medical rated panel PC

AdLink EndoVisHD 42 Inch Medical Monitor

MPN:

EndoVisHD-42

Manufacturer L3 Communications

ADLINK

Description:

EndoVisHD-42 is 42 inch medical monitor with full HD resolution.

View our wide range of Embedded Computing Flat Computer

View our portfolio of Embedded computing

See all products from our supplier Adlink

Features:

  • Clear pictures in 1080p High-Definition (2 MP), Full HD
  • Impressive design as well as highest quality and reliability
  • Perfect use for presentations
  • The High-End-Controller offers a complete repertoire of analog and digital inputs.
  • Split-screen Function
  • Certificates : EN60601-1 and DICOM 3.14 compatible. (AFS/CFS calibration)
  • IPX1 protection

IP69k Rated Industrial PC in Stainless Steel Chassis

AdLink Food-D15/D17/D19 Industrial PC

MPN:

Food-D15/D17/D19 IP69k

Manufacturer L3 Communications

ADLINK

Description:

Food-D15/D17/D19 IP69k is a modular high-end industrial computer with complete closed stainless steel housing (IP69k). The stainless steel housing (IP69k) is made to meet requirements for the chemical and food Industries as well as the high hygienic sensitive production areas of eg. pharmaceutical industry.

View our wide range of Embedded Computing Flat Computer

View our portfolio of Embedded computing

See all products from our supplier Adlink

Features:

  • Display screen size available in 15 inch, 17 inch, 19 inch
  • Modular high-end Industrial PC with complete closed stainless steel housing (IP69k)
  • Durable and error-free even under critical environmental conditions
  • Fast data input via Touchscreen
  • Various input ¡V and reader devices (Legic , RFID etc.) and Scanner are connectable
  • Wireless-LAN integrable
  • Passive cooling concept without ventilation-slot and without fan
  • Stainless steel housing with especially surface, protected all around
  • Connectors via industrial grade cable feed through (IP69k)

Modular industrial PC with complete IP65 rated enclosure, up to 19 inch

AdLink Giant Modular industrial PC

MPN:

Giant-D15/D17/D19 series

Manufacturer L3 Communications

ADLINK

Description:

Giant-D15/D17/D19 series is a modular high-end industrial PC with complete closed housing (IP65) with fast data input via touch screen.

View our wide range of Embedded Computing Flat Computer

View our portfolio of Embedded computing

See all products from our supplier Adlink