You are currently viewing IoT and Wireless

BX3105 Wi-Fi and Bluetooth combo module with embedded antenna

Sierra Wireless BX3105

MPN:

BX3105

Manufacturer L3 Communications

Sierra Wireless

Description:

The BX3105 Wi-Fi and Bluetooth 4.2 pre-certified module offers simple and fast integration with free unlimited FOTA and built-in cloud connectivity from AirVantage®, ideal for quickly and cost effectively adding wireless communication.

This module supports 802.11 b/g/n and dual-mode Bluetooth Classic and Bluetooth Low Energy (BLE), connecting industrial applications requiring a secure connection to Wi-Fi and Bluetooth on a single module.

Designed in an industrial-grade common flexible form factor (CF3®), BX3105 enables system integrators to build their devices on the most scalable module platform in the world.

Features:

  • Hostless – Embedded TCP/IP and Bluetooth Stacks with simple UART interface makes it easy to integrate
  • Certification – Full regulatory certifications (FCC, RED, IC, JRF, and BQB Bluetooth) for faster time to market
  • Common form factor – Compact CF3®, form factor for scalability across technologies including cellular
  • Industrial-grade – Built to stay connected in harsh environments and extreme temperatures
  • Cloud connected – Secure device-to-cloud architecture with AirVantage®
  • FOTA upgrades – Includes FREE unlimited firmware over-the-air (FOTA) upgrades for the lifetime of the module to keep your deployments optimised and easier to maintain
  • Secure boot – Prevents unauthorised code on the target and to keep the connectivity secure
  • Interfaces – Includes UART, I2C, SDIO or SPI (Multiplexed), I2S digital audio and GPIOs
  • Integrated antenna – Quickly and easily add advanced wireless communications
  • Low power – Offers best-in-class low power when not transmitting in sleep and stand-by modes

BX3100 Wi-Fi and Bluetooth combo module

Sierra Wireless BX3100

MPN:

BX3100

Manufacturer L3 Communications

Sierra Wireless

Description:

The BX3100 Wi-Fi and Bluetooth 4.2 pre-certified module offers simple and fast integration with free unlimited FOTA and built-in cloud connectivity from AirVantage®, ideal for quickly and cost effectively adding wireless communication.

This module supports 802.11 b/g/n and dual-mode Bluetooth Classic and Bluetooth Low Energy (BLE), connecting industrial applications requiring a secure connection to Wi-Fi and Bluetooth on a single module.

Designed in an industrial-grade common flexible form factor (CF3®), BX3100 enables system integrators to build their devices on the most scalable module platform in the world.

Features:

  • Hostless – Embedded TCP/IP and Bluetooth Stacks with simple UART interface makes it easy to integrate
  • Certification – Full regulatory certifications (FCC, RED, IC, JRF, and BQB Bluetooth) for faster time to market
  • Common form factor – Compact CF3®, form factor for scalability across technologies including cellular
  • Industrial-grade – Built to stay connected in harsh environments and extreme temperatures
  • Cloud connected – Secure device-to-cloud architecture with AirVantage®
  • FOTA upgrades – Includes FREE unlimited firmware over-the-air (FOTA) upgrades for the lifetime of the module to keep your deployments optimised and easier to maintain
  • Secure boot – Prevents unauthorised code on the target and to keep the connectivity secure
  • Interfaces – Includes UART, I2C, SDIO or SPI (Multiplexed), I2S digital audio, GPIOs, and LGA pad for external antenna
  • Low power – Offers best-in-class low power when not transmitting in sleep and stand-by modes

Intel® Apollo Lake-I processor-based ultra compact embedded platform

Adlink MXE-210

MPN:

MXE-210

Manufacturer L3 Communications

ADLINK

Description:

Adlink is pleased to announce our newest IIoT-ready platform, the MXE-210. With dual functionality as a gateway and controller, the palm-size MXE-210 Series is industrial grade EMC-certified and fully operational in environments from -40°C to 85°C. The robust and reliable MXE-210 series supports a broad range of applications including transportation, industrial automation, agriculture, aquaculture, smart city, and more. 

The MXE-210 series provides high expansion capability, multiple wireless connectivity, and comprehensive security for IIoT use. Based on the Intel® Atom x7-E3950/x5-E3930 processor, the MXE-210 Series is compatible to AWS Greengrass, Microsoft Azure IoT Edge, PrismTech VORTEX Edge Connect to deliver edge computing capability. With rich I/O, the MXE-210 Series supports a wide range of communication protocols for data exchange and control, as well as DDS (Data Distribution Service). And hardware and software integrity are assured with TPM 2.0, Intel® Boot Guard, and Secured Boot.

Features:

  • 3-min value props overview

    Compact, robust and reliable construction

  • Minimum footprint (A6 palm size)
  • Wide temperature support from -40°C to 85°C
  • Industrial grade EMC standard EN61000-6-4/2 certified; EN 50155 EMC compliance
  • IIoT-ready

  • Compatible with a wide range of communication protocols such as Modbus, EtherCAT, DDS, MQTT, CANbus, CANOpen for data exchange by Vortex Edge Connect
  • Supports Wi-Fi, BT, LoRa, 3G and 4G LTE wireless connectivity
  • Simplify global cellular IoT deployments with eSIM (embedded SIM) for more rugged and secure design
  • Security building blocks

  • Built-in TPM 2.0 (Trusted Platform Module) provides hardware-based security
  • Intel® Boot Guard and Secure Boot features provide the protection of preventing unauthorized software and malware takeover from Boot to OS

Industrial ATX motherboard with 6th/7th Gen Intel Core® i7/i5/i3 processor

Adlink IMB-M43H

MPN:

0000008RVQ

Manufacturer L3 Communications

ADLINK

Description:

Adlink is pleased to announce that the latest ATX industrial motherboard IMB-M43H now released. 

IMB-M43H is an ATX motherboard supporting the Desktop 6th and 7th Generation Intel Core® i7/i5/i3 Processors with Intel® H110 Chipset, providing the most cost-competitive solution anywhere in embedded computing and fulfilling the specific needs of all users requiring 5 PCI add-on cards. With high-speed data transfer interfaces such as PCIe 3.0/2.0, USB 3.0, and SATA 6 Gb/s (SATA III), dual-channel DDR4 memory up to 32 GB in two DIMM slots for industrial automation applications, the ADLINK IMB-M43H carries significant competitive advantage in the market. This leading, rugged I/O design enhances user experience with robust device compatibility, durable connectivity, and extreme environment readiness.

Features:

  • 6th (Sky Lake)/7th (Kaby Lake) Gen Intel Corei CPU
  • 6th Gen Intel Corei CPU supports OS windows 7
  • Up to 32 GB Dual-channel DDR4 2133/2400 MHz
  • 5xPCI+2xPCIe for automation application
  • Rugged I/O
  • Unique power design to ensure stable USB power of 5V ±5%
  • IEC 61000-4-2~6 (Performance Criterion A), CE/FCC class B Certified D

M material, high-permability ferrite, toroid, 2152 AI, 15000 permeability, parylene

Magnetics M Material

MPN:

YM-40502-TC

Manufacturer L3 Communications

Magnetics Inc

Description:

M material is a new, high-permeability (15,000µ) material designed for optimum impedance performance across frequency ranges. High-permeability ferrite materials provide superior loss factor, frequency response, temperature performance and product consistency. M material is suitable for signal, choke, and filter applications such as common mode chokes, EMI suppression filters, signal processing and broadband transformers.

M material, high-permability ferrite, toroid, 2963 AI, 15000 permeability, parylene

Magnetics M Material

MPN:

YM-40601-TC

Manufacturer L3 Communications

Magnetics Inc

Description:

M material is a new, high-permeability (15,000µ) material designed for optimum impedance performance across frequency ranges. High-permeability ferrite materials provide superior loss factor, frequency response, temperature performance and product consistency. M material is suitable for signal, choke, and filter applications such as common mode chokes, EMI suppression filters, signal processing and broadband transformers.

M material, high-permability ferrite, toroid, 12535 AI, 15000 permeability, bare

Magnetics M Material

MPN:

0M-40705-TC

Manufacturer L3 Communications

Magnetics Inc

Description:

M material is a new, high-permeability (15,000µ) material designed for optimum impedance performance across frequency ranges. High-permeability ferrite materials provide superior loss factor, frequency response, temperature performance and product consistency. M material is suitable for signal, choke, and filter applications such as common mode chokes, EMI suppression filters, signal processing and broadband transformers.

M material, high-permability ferrite, toroid, 6199 AI, 15000 permeability, parylene

Magnetics M Material

MPN:

YM-40603-TC

Manufacturer L3 Communications

Magnetics Inc

Description:

M material is a new, high-permeability (15,000µ) material designed for optimum impedance performance across frequency ranges. High-permeability ferrite materials provide superior loss factor, frequency response, temperature performance and product consistency. M material is suitable for signal, choke, and filter applications such as common mode chokes, EMI suppression filters, signal processing and broadband transformers.

M material, high-permability ferrite, toroid, 6199 AI, 15000 permeability, bare

Magnetics M Material

MPN:

0M-40603-TC

Manufacturer L3 Communications

Magnetics Inc

Description:

M material is a new, high-permeability (15,000µ) material designed for optimum impedance performance across frequency ranges. High-permeability ferrite materials provide superior loss factor, frequency response, temperature performance and product consistency. M material is suitable for signal, choke, and filter applications such as common mode chokes, EMI suppression filters, signal processing and broadband transformers.

M material, high-permability ferrite, toroid, 6644 AI, 15000 permeability, bare

Magnetics M Material

MPN:

0M-41003-TC

Manufacturer L3 Communications

Magnetics Inc

Description:

M material is a new, high-permeability (15,000µ) material designed for optimum impedance performance across frequency ranges. High-permeability ferrite materials provide superior loss factor, frequency response, temperature performance and product consistency. M material is suitable for signal, choke, and filter applications such as common mode chokes, EMI suppression filters, signal processing and broadband transformers.

M material, high-permability ferrite, toroid, 12535 AI, 15000 permeability, parylene

Magnetics M Material

MPN:

YM-40705-TC

Manufacturer L3 Communications

Magnetics Inc

Description:

M material is a new, high-permeability (15,000µ) material designed for optimum impedance performance across frequency ranges. High-permeability ferrite materials provide superior loss factor, frequency response, temperature performance and product consistency. M material is suitable for signal, choke, and filter applications such as common mode chokes, EMI suppression filters, signal processing and broadband transformers.

M material, high-permability ferrite, toroid, 6644 AI, 15000 permeability, epoxy

Magnetics M Material

MPN:

ZM-41003-TC

Manufacturer L3 Communications

Magnetics Inc

Description:

M material is a new, high-permeability (15,000µ) material designed for optimum impedance performance across frequency ranges. High-permeability ferrite materials provide superior loss factor, frequency response, temperature performance and product consistency. M material is suitable for signal, choke, and filter applications such as common mode chokes, EMI suppression filters, signal processing and broadband transformers.

M material, high-permability ferrite, toroid, 9988 AI, 15000 permeability, epoxy

Magnetics M Material

MPN:

ZM-41005-TC

Manufacturer L3 Communications

Magnetics Inc

Description:

M material is a new, high-permeability (15,000µ) material designed for optimum impedance performance across frequency ranges. High-permeability ferrite materials provide superior loss factor, frequency response, temperature performance and product consistency. M material is suitable for signal, choke, and filter applications such as common mode chokes, EMI suppression filters, signal processing and broadband transformers.

M material, high-permability ferrite, toroid, 9988 AI, 15000 permeability, bare

Magnetics M Material

MPN:

0M-41005-TC

Manufacturer L3 Communications

Magnetics Inc

Description:

M material is a new, high-permeability (15,000µ) material designed for optimum impedance performance across frequency ranges. High-permeability ferrite materials provide superior loss factor, frequency response, temperature performance and product consistency. M material is suitable for signal, choke, and filter applications such as common mode chokes, EMI suppression filters, signal processing and broadband transformers.

M material, high-permability ferrite, toroid, 6644 AI, 15000 permeability, parylene

Magnetics M Material

MPN:

YM-41003-TC

Manufacturer L3 Communications

Magnetics Inc

Description:

M material is a new, high-permeability (15,000µ) material designed for optimum impedance performance across frequency ranges. High-permeability ferrite materials provide superior loss factor, frequency response, temperature performance and product consistency. M material is suitable for signal, choke, and filter applications such as common mode chokes, EMI suppression filters, signal processing and broadband transformers.

M material, high-permability ferrite, toroid, 17163 AI, 15000 permeability, bare

Magnetics M Material

MPN:

0M-41206-TC

Manufacturer L3 Communications

Magnetics Inc

Description:

M material is a new, high-permeability (15,000µ) material designed for optimum impedance performance across frequency ranges. High-permeability ferrite materials provide superior loss factor, frequency response, temperature performance and product consistency. M material is suitable for signal, choke, and filter applications such as common mode chokes, EMI suppression filters, signal processing and broadband transformers.

M material, high-permability ferrite, toroid, 9988 AI, 15000 permeability, parylene

Magnetics M Material

MPN:

YM-41005-TC

Manufacturer L3 Communications

Magnetics Inc

Description:

M material is a new, high-permeability (15,000µ) material designed for optimum impedance performance across frequency ranges. High-permeability ferrite materials provide superior loss factor, frequency response, temperature performance and product consistency. M material is suitable for signal, choke, and filter applications such as common mode chokes, EMI suppression filters, signal processing and broadband transformers.

M material, high-permability ferrite, toroid, 17163 AI, 15000 permeability, parylene

Magnetics M Material

MPN:

YM-41206-TC

Manufacturer L3 Communications

Magnetics Inc

Description:

M material is a new, high-permeability (15,000µ) material designed for optimum impedance performance across frequency ranges. High-permeability ferrite materials provide superior loss factor, frequency response, temperature performance and product consistency. M material is suitable for signal, choke, and filter applications such as common mode chokes, EMI suppression filters, signal processing and broadband transformers.

M material, high-permability ferrite, toroid, 8476 AI, 15000 permeability, epoxy

Magnetics M Material

MPN:

ZM-41306-TC

Manufacturer L3 Communications

Magnetics Inc

Description:

M material is a new, high-permeability (15,000µ) material designed for optimum impedance performance across frequency ranges. High-permeability ferrite materials provide superior loss factor, frequency response, temperature performance and product consistency. M material is suitable for signal, choke, and filter applications such as common mode chokes, EMI suppression filters, signal processing and broadband transformers.

M material, high-permability ferrite, toroid, 8476 AI, 15000 permeability, bare

Magnetics M Material

MPN:

0M-41306-TC

Manufacturer L3 Communications

Magnetics Inc

Description:

M material is a new, high-permeability (15,000µ) material designed for optimum impedance performance across frequency ranges. High-permeability ferrite materials provide superior loss factor, frequency response, temperature performance and product consistency. M material is suitable for signal, choke, and filter applications such as common mode chokes, EMI suppression filters, signal processing and broadband transformers.

M material, high-permability ferrite, toroid, 10974 AI, 15000 permeability, epoxy

Magnetics M Material

MPN:

ZM-41406-TC

Manufacturer L3 Communications

Magnetics Inc

Description:

M material is a new, high-permeability (15,000µ) material designed for optimum impedance performance across frequency ranges. High-permeability ferrite materials provide superior loss factor, frequency response, temperature performance and product consistency. M material is suitable for signal, choke, and filter applications such as common mode chokes, EMI suppression filters, signal processing and broadband transformers.

M material, high-permability ferrite, toroid, 8494 AI, 15000 permeability, epoxy

Magnetics M Material

MPN:

ZM-42206-TC

Manufacturer L3 Communications

Magnetics Inc

Description:

M material is a new, high-permeability (15,000µ) material designed for optimum impedance performance across frequency ranges. High-permeability ferrite materials provide superior loss factor, frequency response, temperature performance and product consistency. M material is suitable for signal, choke, and filter applications such as common mode chokes, EMI suppression filters, signal processing and broadband transformers.

M material, high-permability ferrite, toroid, 7917 AI, 15000 permeability, epoxy

Magnetics M Material

MPN:

ZM-41605-TC

Manufacturer L3 Communications

Magnetics Inc

Description:

M material is a new, high-permeability (15,000µ) material designed for optimum impedance performance across frequency ranges. High-permeability ferrite materials provide superior loss factor, frequency response, temperature performance and product consistency. M material is suitable for signal, choke, and filter applications such as common mode chokes, EMI suppression filters, signal processing and broadband transformers.

M material, high-permability ferrite, toroid, 17313 AI, 15000 permeability, epoxy

Magnetics M Material

MPN:

ZM-42212-TC

Manufacturer L3 Communications

Magnetics Inc

Description:

M material is a new, high-permeability (15,000µ) material designed for optimum impedance performance across frequency ranges. High-permeability ferrite materials provide superior loss factor, frequency response, temperature performance and product consistency. M material is suitable for signal, choke, and filter applications such as common mode chokes, EMI suppression filters, signal processing and broadband transformers.

M material, high-permability ferrite, toroid, 11072 AI, 15000 permeability, epoxy

Magnetics M Material

MPN:

ZM-42507-TC

Manufacturer L3 Communications

Magnetics Inc

Description:

M material is a new, high-permeability (15,000µ) material designed for optimum impedance performance across frequency ranges. High-permeability ferrite materials provide superior loss factor, frequency response, temperature performance and product consistency. M material is suitable for signal, choke, and filter applications such as common mode chokes, EMI suppression filters, signal processing and broadband transformers.

SFP transceiver for IEEE C37.94 teleprotection, 2Mb/s, single mode, 60km

Coretek CT-0155TSP series

MPN:

CT-0155TSP-MB7L-E 2M

Manufacturer L3 Communications

Coretek

Description:

The CT-0155TSP-MB7L-E 2M from Coretek Opto Corp. is the high performance and cost-effective module for serial optical data communication applications specified for 2Mb/s. It operates with +3.3V power supply. The module is intended for single mode fibre, operates at a nominal wavelength of 1310nm and complies with multi-source agreement (MSA) small form factor pluggable (SFP). Each module is integrated digital diagnostics functions via an I2C serial interface.

The module is a duplex LC connector transceiver designed to provide an IEEE C37.94 / IEC 62843 link for 2Mb/s long-reach applications. The characteristics are performed in accordance with Telcordia Specification GR-468-CORE.

Features:

  • 1310nm FP LD
  • Data rate: 2Mb/s, NRZ
  • Single +3.3V power supply
  • RoHS compliant and lead-free
  • AC/AC differential electrical interface
  • Compliant with multi-source agreement (MSA) small form factor pluggable (SFP)
  • Compliant with SFF-8472 digital diagnostic monitoring interface
  • Duplex LC connector
  • Compatible with IEEE C37.94 / IEC 62843 standard

SFP transceiver for IEEE C37.94 teleprotection, 2Mb/s, single mode, 40km

Coretek CT-0155TSP series

MPN:

CT-0155TSP-MB6L-E 2M

Manufacturer L3 Communications

Coretek

Description:

The CT-0155TSP-MB6L-E 2M from Coretek Opto Corp. is the high performance and cost-effective module for serial optical data communication applications specified for 2Mb/s. It operates with +3.3V power supply. The module is intended for single mode fibre, operates at a nominal wavelength of 1310nm and complies with multi-source agreement (MSA) small form factor pluggable (SFP). Each module is integrated digital diagnostics functions via an I2C serial interface.

The module is a duplex LC connector transceiver designed to provide an IEEE C37.94 / IEC 62843 link for 2Mb/s long-reach applications. The characteristics are performed in accordance with Telcordia Specification GR-468-CORE.

Features:

  • 1310nm FP LD
  • Data rate: 2Mb/s, NRZ
  • Single +3.3V power supply
  • RoHS compliant and lead-free
  • AC/AC differential electrical interface
  • Compliant with multi-source agreement (MSA) small form factor pluggable (SFP)
  • Compliant with SFF-8472 digital diagnostic monitoring interface
  • Duplex LC connector
  • Compatible with IEEE C37.94 / IEC 62843 standard

SFP transceiver for IEEE C37.94 teleprotection, 2Mb/s, single mode, 80km

Coretek CT-0155TSP series

MPN:

CT-0155TSP-KB8L-E 2M

Manufacturer L3 Communications

Coretek

Description:

The CT-0155TSP-KB8L-E 2M from Coretek Opto Corp. is the high performance and cost-effective module for serial optical data communication applications specified for 2Mb/s. It operates with +3.3V power supply. The module is intended for single mode fibre, operates at a nominal wavelength of 1550nm and complies with multi-source agreement (MSA) small form factor pluggable (SFP). Each module is integrated digital diagnostics functions via an I2C serial interface.

The module is a duplex LC connector transceiver designed to provide an IEEE C37.94 / IEC 62843 link for 2Mb/s intermediate reach applications. The characteristics are performed in accordance with Telcordia Specification GR-468-CORE.

Features:

  • 1550 nm DFB LD
  • Data rate: 2Mb/s, NRZ
  • Single +3.3V power supply
  • RoHS compliant and lead-free
  • AC/AC differential electrical interface
  • Compliant with multi-source agreement (MSA) small form factor pluggable (SFP)
  • Compliant with SFF-8472 digital diagnostic monitoring interface
  • Duplex LC connector
  • Compatible with IEEE C37.94 / IEC 62843 standard

SFP transceiver for IEEE C37.94 teleprotection, 2Mb/s, single mode, 120km

Coretek CT-0155TSP series

MPN:

CT-0155TSP-KBAL-E 2M

Manufacturer L3 Communications

Coretek

Description:

The CT-0155TSP-KBAL-E 2M from Coretek Opto Corp. is the high performance and cost-effective module for serial optical data communication applications specified for 2Mb/s. It operates with +3.3V power supply. The module is intended for single mode fibre, operates at a nominal wavelength of 1550nm and complies with multi-source agreement (MSA) small form factor pluggable (SFP). Each module is integrated digital diagnostics functions via an I2C serial interface.

The module is a duplex LC connector transceiver designed to provide an IEEE C37.94 / IEC 62843 link for 2Mb/s long-reach applications. The characteristics are performed in accordance with Telcordia Specification GR-468-CORE.

Features:

  • 1550 nm DFB LD
  • Data rate: 2Mb/s, NRZ
  • Single +3.3V power supply
  • RoHS compliant and lead-free
  • AC/AC differential electrical interface
  • Compliant with multi-source agreement (MSA) small form factor pluggable (SFP)
  • Compliant with SFF-8472 digital diagnostic monitoring interface
  • Duplex LC connector
  • Compatible with IEEE C37.94 / IEC 62843 standard

Six-channel, 4K60Hz video QSFP+ transceiver – Quad transmit and bi-directional channel

Coretek CT-6025VQT-CB4L

MPN:

CT-6025VQT-CB4L

Manufacturer L3 Communications

Coretek

Description:

The CT-6025VQT-CB4L QSFP+ optical transceiver from Coretek Opto. Corp., is a high performance and cost-effective solution to optically multiplex and transmit 4K60Hz video signals. It provides four transmit channels for video signal transmission and two channels (one transmit and one receive) for data signal transmission.

For video signals, this transceiver uses one TOSA, composed of four channels of CWDM DFB LD with different wavelengths to optically multiplex video signals and transmit them via a single mode fibre. Each channel supports 6Gb/s at up to 10km. For data signals, this transceiver uses a 2.5Gb/s bi-directional OSA to send and receive data signals via a second single fibre.

By adopting the standard QSFP+ LC dual core package with pin configuration adjusted for video signals, the CT-6025VQT-CB4L is a highly reliable solution optimised for 4K60Hz applications.

Features:

    • Video-dedicated transceiver
    • Hot-pluggable QSFP+ form factor
    • One quad-TOSA and BOSA:
      • 4 x 6Gb/s CWDM uncooled DFB channels (1270nm, 1290nm, 1310nm, 1330nm)
      • 1 x 2.5Gb/s Bi-Directional (1310nm Tx / 1550nm Rx)
    • Up to 10km on SMF
    • Power dissipation <4.0W
    • Duplex LC connector
    • Single +3.3V power supply
    • Commercial temperature range -10°C to 70°C
    • RoHS-6 compliant (lead-free)

Six-channel, 4K60Hz video QSFP+ transceiver – Quad receive and bi-directional channel

Coretek CT-6025VQR-CB4L

MPN:

CT-6025VQR-CB4L

Manufacturer L3 Communications

Coretek

Description:

The CT-6025VQR-CB4L QSFP+ optical transceiver from Coretek Opto. Corp., is a high performance and cost-effective solution to optically de-multiplex 4K60Hz video signals. It provides four receive channels for receiving and de-multiplexing video signals and two channels (one transmit and one receive) for data signal transmission.

For video signals, this transceiver uses one ROSA, composed of four channels of PIN detector with TIA and thin film filter for different wavelengths to optically de-multiplex video signals transmitted via a single mode fibre. Each channel supports 6Gb/s at up to 10km. For data signals, this transceiver uses a 2.5Gb/s bi-directional OSA to send and receive data signals via a second single fibre.

By adopting the standard QSFP+ LC dual core package with pin configuration adjusted for video signals, the CT-6025VQR-CB4L is a highly reliable solution optimised for 4K60Hz applications.

Features:

    • Video-dedicated transceiver
    • Hot-pluggable QSFP+ form factor
    • One quad-ROSA and BOSA:
      • 4 x 6Gb/s PIN-TIA channels (1270nm, 1290nm, 1310nm, 1330nm)
      • 1 x 2.5Gb/s Bi-Directional (1550nm Tx / 1310nm Rx)
    • Up to 10km on SMF
    • Power dissipation <4.0W
    • Duplex LC connector
    • Single +3.3V power supply
    • Commercial temperature range -10°C to 70°C
    • RoHS-6 compliant (lead-free)

Industrial-grade, sensor-to-cloud platform, for cellular-enabled applications

Sierra Wireless mangOH Red

MPN:

mangOH Red

Manufacturer L3 Communications

Sierra Wireless

Description:

Designed specifically for cellular-enabled IoT applications, mangOH reference designs provide a sensor-to-cloud platform for rapidly prototyping ideas and getting them to production quickly. This new category of open hardware makes it easy to develop industrial-grade products with vetted components, open source software, and a business-friendly open license enabling users to modify and reproduce the design.

Partnering with the open source Legato platform on the WP Series of embedded modules from Sierra Wireless, mangOH delivers 90% of an IoT prototype out-of-the-box so users can begin creating their software and web applications immediately.

In addition to reference designs, the mangOH project released IoT Expansion Cards to provide plug-and-play wireless, wired, and sensor technologies that can be used in final product designs. Integrated seamlessly with Legato, mangOH reference designs automatically detect the IoT expansion cards to load drivers and applications (no integration required, just plug in and start building your apps), as well as providing a data management service that builds local intelligence on the edge as well as pushes data to the big data servers.

Features:

    • 61 x 69mm form factor
    • 1 IoT expansion card connector
    • CF3 socket for WP and HL modules
    • Raspberry Pi shield connector: 26 pin
    • Built in Wi-Fi and Bluetooth
      • WiFi : Dual band 1x1 a/b/g/n with STA and AP
      • Bluetooth: Bluetooth 2.1+ EDR, BLE 4.2
    • Built-in sensors:
      • Accelerometer
      • Gyroscope
      • Light
      • Altimeter
    • ARM Cortex-M4 with floating point MCU (192MHz)
    • USB 2.0 OTG and USB 2.0 host
    • Audio jack with receive and transmit
    • Micro SD card slot
    • Micro SIM slot
    • Power:
      • Single Li-ion Battery powered with battery charger
      • DC powered at 5V
    • 3D-printable case designs available

AirPrime® Bluetooth 4.2 dual-mode module for transmitting high-quality audio and data

BC127

MPN:

BC127

Manufacturer L3 Communications

Sierra Wireless

Description:

The BC127 Certified Bluetooth 4.2 module with integrated antenna is ideal for easily adding high-quality audio and data communication.

The dual-mode Bluetooth Classic and Bluetooth Low Energy (BLE) module connects prosumer and industrial devices requiring multiple connection and/or high-end audio applications.

It is ideal for any development that requires high quality Bluetooth audio streaming or a dual-mode solution to connect both to BLE enabled smart phones and classic Bluetooth smart phones.

Features:

  • Dual-mode: Bluetooth and Bluetooth Low Energy (BLE) transmits high-quality audio and data
  • Embedded Bluetooth Protocol Stack with simple UART and GPIO interface for command and control
  • Hostless module with regulatory certifications and integrated antenna for easy integration
  • Supports multiple connections to external Codecs with I2S, PCM and SPDIF interfaces
  • Input and output can be digital or analog audio
  • Typical applications

  • Smart phone controlled accessories
  • Wireless speakers and headsets
  • Intercom push to talk gateways
  • Wireless docks and sound bars
  • Dual-mode wireless gateways
  • General Bluetooth controllers
  • Remote controls and smart TVs

AirPrime® Bluetooth 4.1 low-energy, data-only module

BC118

MPN:

BC118

Manufacturer L3 Communications

Sierra Wireless

Description:

The BC118 certified Bluetooth Low Energy (BLE) 4.1 module with integrated antenna is ideal for quickly and cost effectively adding simple, reliable low-energy data communication.

It connects prosumer and industrial applications requiring data only connections for simple sensor to phone or cable replacement applications.

It is ideal for any development that requires the most power efficient smart Bluetooth Low Energy solution to connect to other modules or any smart phone or tablet.

Features:

  • Single mode Bluetooth Low Energy (BLE) 4.1 transmits simple data only
  • Embedded Bluetooth protocol stack with simple UART interface for command and control
  • Hostless module with regulatory certifications and integrated antenna for easy integration
  • Supports single connections with UART, I2C, analog and GPIO Interfaces
  • Transparent and command mode for I2C and UART
  • Can run as standalone or controlled by a host
  • Over the air secure firmware upgrade
  • Typical applications

  • Industrial: lightening, pipe, actuators, sensors
  • Health and fitness
  • Smart Bluetooth bridges
  • Automotive application
  • Remote controls
  • Cable replacement

AirPrime® 802.11 b/g/n 2.4Ghz Wi-Fi module

BC188

MPN:

BC188

Manufacturer L3 Communications

Sierra Wireless

Description:

See how we solve customer design challenges with our technical expertise and the latest technology

The BC188 is a highly flexible, low power Wi-Fi module with integrated antenna is ideal for quickly and cost effectively adding wireless communication.

It supports 802.11 b/g/n and offers preloaded Melody Wi-Fi software including a TCP/IP stack and a simple UART interface. BC188 can be easily configured and controlled from the UART interface or by simply connecting to it from a Smartphone and controlling it from any browser. This module connects prosumer and industrial applications requiring simultaneous AP/station communication.

It is ideal for any development that requires high-quality Wi-Fi connection and streaming.

Features:

  • Single band 2.4Ghz IEEE 802.11 b/g/n, 1x1 SISO, 2.4GHz and HT20 for secure WPA and SSL data transmission
  • Simultaneous hotspot/client and low power modes
  • Embedded TCP/IP Stack with simple UART interface for command and control
  • Hostless module with FCC regulatory certification and integrated antenna for easy integration
  • Cortex-M4F CPU with integrated 512KB RAM, 128KB ROM
  • Over the air secure firmware upgrade
  • Typical applications

  • White goods/appliances
  • Consumer devices and accessories
  • Home automation
  • Personal health devices
  • IoT and wearable devices
  • Commercial and industrial application

LoRa SiP Module

USI WM-SG-SM-42 LoRa SIP Module

MPN:

WM-SG-SM-42

Manufacturer L3 Communications

USI

Description:

See how we solve customer design challenges with our technical expertise and the latest technology

This low-cost, low-power wide area network (LPWAN) wireless module supports the LoRaWAN long-range wireless protocol and AT-master command stack. This stand-alone compact module measures just 12 x 13 x 2mm, and comprises a Semtech SX1272 ultra-long-range wireless transceiver and STMicro STM32L0 series ARM Cortex M0+ 32 bit microcontroller (MCU).

This module provides a variety of interfaces, such as LPUART, SPI, or I2C for peripheral. 3ch ADC and up to 20 GPIOs provide plenty of flexibility for connecting sensors, switches and status LEDs, and the module is powered from a 2.0 to 3.6 VDC supply.

It has certified radio regulatory approvals for operating in the 868(CE) and 915(FCC) MHz industrial, scientific and medical (ISM) spectrum in most geographical regions of the world. The LoRaWAN certification also makes it compatible with standard LoRa networks.

View our wide range of ISM Modules

View our portfolio of IoT and Wireless

See all products from our supplier USI

Features:

  • 868 ~ 915 MHz
  • Certifications: FCC/CE/IC
  • Temperature range: -40 ~ 85°C
  • High sensitivity: down to -137 dBm
  • Embedded 8K SDRAM and 64K Flash
  • 81 pins LGA package with metal lid shielding
  • Dimension: 12 x 13 x 2mm

Programmable IoT Gateway with Ethernet

Sierra Wireless FX30-Serie IoT Gateway

MPN:

FX30

Manufacturer L3 Communications

Sierra Wireless

Description:

The FX30 is the industry’s smallest, most rugged programmable 3G/4G LTE cellular gateway with Ethernet. The FX30 integrates the Legato® Open Source Linux Platform that simplifies application-level development with a secure application framework, maintained Linux distribution, and feature-rich development environment. The FX30 3G operates on six 3G bands, with fallback on four 2G bands, enabling worldwide deployments with a single product.

See the FX30 in action in our exclusive application video

View our wide range of 2G / 3G / 4G-LTE Wireless Gateways and Modems

View our portfolio of IoT and Wireless

See all products from our supplier Sierra Wireless

Programmable IoT Gateway with Serial

Sierra Wireless FX30-Serie IoT Gateway

MPN:

FX30s

Manufacturer L3 Communications

Sierra Wireless

Description:

The FX30S is the industry’s smallest, most rugged programmable 3G/4G LTE cellular gateway with serial. FX30s can be monitored, managed and controlled remotely through AirVantage® IoT Platform.

See the FX30 in action in our exclusive application video

View our wide range of 2G / 3G / 4G-LTE Wireless Gateways and Modems

View our portfolio of IoT and Wireless

See all products from our supplier Sierra Wireless

Wireless IoT Gateway

LANTRONIX SGX5150 Serie Wireless IoTGateway

MPN:

SGX 5150 Serie

Manufacturer L3 Communications

Lantronix

Description:

Lantronix SGX 5150 is a next generation IoT device gateway that allows you to connect your business-critical assets and data securely to your enterprise network. Its advanced turnkey design provides everything you need for secure wireless connectivity. The SGX 5150 platform was designed from the ground up to support critical enterprise, government and military standards, so that your private data is delivered securely with absolute data integrity.

The SGX 5150 provides multiple interface options to connect to virtually any asset with singular or dual RS-232/485 serial ports, USB 2.0 with host and device modes and Ethernet interfaces.

View our wide range of WiFi 802.11

View our portfolio of M2M and Wireless

See all products from our supplier Lantronix

Features:

  • Easily configure and connect to the enterprise network, out-of-the-box
  • Unique Device ID feature allows you to make your device visible to authorized users
  • Linux SDK and Python runtime services allow quick development and deployment of custom apps
  • Experience the Lantronix industrial design quality and reliability
  • Wi-Fi® Alliance and USB Certification

WiCED IoT Module, IEEE 802.11 a/b/g/n

USI WM-AN-BM-23 WICED Module

MPN:

WM-AN-BM-23

Manufacturer L3 Communications

USI

Description:

The WM-AN-BM-23 SiP module is uniquely suited for Internet-of-Things applications. It supports all rates specified in the IEEE 802.11 a/b/g/n specifications. The module makes it easier for system design to enable high performance wireless connectivity without space constrain. The low power consumption and excellent radio performance make it the best solution for OEM customers who require embedded 802.11a/b/g/n dual-band WiFi such as industrial and medical sensor, home appliance, embedded audio markets, or wireless home devices.

View our wide range of WiFi 802.11

View our portfolio of M2M and Wireless

See all products from our supplier USI

Features:

  • ARM Cortex-R4 32-bit RISC processor
  • 2 MB of on-chip SRAM for code and data
  • An on-chip cryptography core
  • 640 KB of ROM containing WICED SDK components such as RTOS and TCP/IP stack
  • Full IEEE 802.11a/b/g/n legacy compatibility with enhanced performance
  • Single-stream spatial multiplexing up to 150 Mbps
  • Software architecture supported by standard WICED SDK allows easy migration from existing discrete MCU designs and to future devices
  • Lead Free design which supporting Green design requirement, RoHS Compliance, and halogen-free
  • 2.412-2.484 GHz and 5.15 -5.9GHz for worldwide market

Dual-Band Mini PCIe Module, 802.11ac/b/g/n, 2T2R, Industrial Grade

Sparklan WPEQ-256ACNI WiFi Module

MPN:

WPEQ-256ACNI

Manufacturer L3 Communications

Sparklan

Description:

SparkLAN WPEQ-256ACNI is an 802.11ac/b/g/n Dual-Band Mini PCI express module based on Qualcomm Atheros QCA9892-BR4B chipset. It supports 2T2R (2x2) technology, which runs up to 867Mbps. The WPEQ-256ACNI supports 20/40/80MHz and 256-QAM to maximize bandwidth efficiency.

View our wide range of WiFi 802.11

View our portfolio of M2M and Wireless

See all products from our supplier Sparklan

Features:

  • Standard: 802.11ac/b/g/n
  • Host interface: Mini PCI-E
  • Chipset: Qualcomm Atheros QCA9892-BR4B
  • Antenna: 2 x U.FL connectors, 2T2R
  • Data rate up to 867Mbps
  • Enhanced wireless security: WEP, WPA, WPA2, WPS, 802.1x
  • Support Linux

802.11 a/b/g/n Half Mini PCIe Module

Sparklan WPEA-128N Mini PCIe WiFi Module

MPN:

WPEA-128N

Manufacturer L3 Communications

Sparklan

Description:

SparkLAN WPEA-128N is an 802.11n Dual-Band Half Mini Card based on Atheros AR9380-AL1A chipset. It supports 3T3R (3x3 radio) MIMO technology, which provides maximum data rate up to 450Mbps and improves the overall Wi-Fi coverage area.

View our wide range of WiFi 802.11

View our portfolio of M2M and Wireless

See all products from our supplier Sparklan

Features:

  • Standard: 802.11a/b/g/n Mini Card
  • Host interface: Mini PCI-E
  • Chipset: Atheros AR9380-AL1A
  • Antenna: 3 x U.FL connectors, 3T3R
  • Data rate up to 450Mbps
  • Enhanced wireless security: WEP, WPA, WPA2
  • Support Windows XP/ Vista, Win 7, Linux

802.11n Dual-Band USB Dongle

Sparklan WUBR-508N USB Dongle

MPN:

WUBR-508N USB Dongle

Manufacturer L3 Communications

Sparklan

Description:

SparkLAN WUBR-508N is an 802.11n Wi-Fi USB Dongle, which is backward compatible with 802.11a/b/g standard. With advanced 2T2R MIMO technology, WUBR-508N delivers ultimate wireless data rate for up to 300Mbps. It allows users to enjoy seamless wireless connection.

View our wide range of WiFi 802.11

View our portfolio of M2M and Wireless

See all products from our supplier Sparklan

Features:

  • Standard: 802.11a/b/g/n
  • Interface: USB 2.0
  • Antenna: Integrated Printed antennas, 2T2R
  • Data rate up to 300Mbps
  • Enhanced wireless security: WEP, WPA, WPA2, WPS
  • Support Windows XP/ Vista/ Win7, Linux

Dual-Band Mini PCIe Module, 802.11ac/b/g/n, 3T3R, Industrial Grade

Sparklan WPEQ-353ACNI WiFi Module

MPN:

WPEQ-353ACNI

Manufacturer L3 Communications

Sparklan

Description:

SparkLAN WPEQ-353ACNI is an 802.11ac/b/g /n Dual-Band Mini PCI express module based on Qualcomm Atheros QCA9890-BR4B chipset. It supports 3T3R (3x3) technology, which runs up to 1.3Gbps. The WPEQ-353ACNI supports 20/40/80MHz and 256-QAM to maximize bandwidth efficiency.

View our wide range of WiFi 802.11

View our portfolio of M2M and Wireless

See all products from our supplier Sparklan

Features:

  • Standard: 802.11ac/b/g/n
  • Host interface: Mini PCI-E
  • Chipset: Qualcomm Atheros QCA9890-BR4B
  • Antenna: 3 x U.FL connectors, 3T3R
  • Data rate up to 1.3Gbps
  • Enhanced wireless security: WEP, WPA, WPA2, WPS, 802.1x
  • Support Linux

802.11 ac/b/g/n Wi-Fi Module with Bluetooth M.2 card

Sparklan WNFQ-158ACN-BT WiFi Module with Bluetooth

MPN:

WNFQ-158ACN(BT)

Manufacturer L3 Communications

Sparklan

Description:

See how we solve customer design challenges with our technical expertise and the latest technology

SparkLAN WNFQ-158ACN(BT) is an 802.11ac/b/g/n Dual-Band Wi-Fi + Bluetooth M.2 card based on Qualcomm Atheros QCA9377 chipset. It supports 1T1R with RX diversity (Support Wi-Fi/BT co-existence) technology, which runs up to 433Mbps and 1~3Mbps EDR for BT. The WNFQ-158ACN(BT) supports 20/40/80MHz and 256-QAM to maximize bandwidth efficiency.

View our wide range of WiFi 802.11

View our portfolio of M2M and Wireless

See all products from our supplier Sparklan

Features:

  • Standard: 802.11ac/b/g/n
  • Interface: M.2 Card (PCIe: WLAN; USB2.0: Bluetooth)
  • Chipset: Qualcomm Atheros QCA9377A
  • Antenna: 2 x IPEX MHF4 connector, 1T1R with RX diversity
  • Concurrent Wi-Fi and BT co-existence
  • 802.11ac 2.0 with MU-MIMO
  • Data rate up to 433Mbps
  • Enhanced wireless security: WEP, WPA, WPA2, WPS, 802.1x
  • Support Windows

802.11 b/g/n WiFi IoT Module

Sparklan WSDQ-103GN-Series WiFi Iot Module

MPN:

WSDQ-103GN Series

Manufacturer L3 Communications

Sparklan

Description:

See how we solve customer design challenges with our technical expertise and the latest technology

SparkLAN WSDQ-103GN is an ultra-low-power and cost effective Wi-Fi IoT module with 802.11 b/g/n support. WSDQ-103GN is based on Qualcomm QCA4010 single band SoC design that delivering Wi-Fi connectivity, integrated intelligence, security and advanced services for the devices and systems of the Internet of Everything.

SparkLAN WSDQ-103GNI is an ultra-low-power and cost effective Wi-Fi IoT module with 802.11 b/g/n support.WSDQ-103GNI is suited for embedded wireless IoT product, it provide an integrated and feature-rich intelligent Wi-Fi solution. WSDQ-103GNI is able to function under server weather condition (-40~85°C), which is ideal for manufacturers to integrate with their devices that are designed for extended temperature range.

View our wide range of WiFi 802.11

View our portfolio of M2M and Wireless

See all products from our supplier Sparklan

Features:

  • Standard: 802.11b/g/n
  • Host interface: UART
  • Chipset: Qualcomm Atheros QCA4010
  • Antenna: PCB Printed ANT, 1T1R

802.11 ac/b/g/n Dual-Band WiFi Module with Bluetooth M.2 card

Sparklan WNFQ-255ACN-BT WiFi Module with Bluetooth

MPN:

WNFQ-255ACN(BT)

Manufacturer L3 Communications

Sparklan

Description:

See how we solve customer design challenges with our technical expertise and the latest technology

SparkLAN WNFQ-255ACN(BT) is an 802.11ac/b/g/n Dual-Band WiFi + Bluetooth M.2 card based on Qualcomm Atheros QCA6174 chipset. It supports 2T2R (Support WiFi/BT co-existence) technology, which runs up to 867Mbps and 1~3Mbps EDR for BT. The WWNFQ-255ACN(BT) supports 20/40/80MHz and 256-QAM to maximize bandwidth efficiency.

View our wide range of WiFi 802.11

View our portfolio of M2M and Wireless

See all products from our supplier Sparklan

Features:

  • Standard: 802.11ac/b/g/n
  • Host interface: M.2 Card (PCIe: WLAN; USB: Bluetooth)
  • Chipset: Qualcomm Atheros QCA6174
  • Antenna: 2 x IPEX MHF4 connector, 2T2R
  • Concurrent Wi-Fi and BT co-existence
  • Data rate up to 867Mbps (MCS9)
  • Enhanced wireless security: WEP, WPA, WPA2, 802.1x
  • Support Windows

802.11b/g/n WiFi IoT Module with Bluetooth

Sparklan WSDB-104GN-BT WiFi Iot Module with Bluetooth

MPN:

WSDB-104GN(BT)

Manufacturer L3 Communications

Sparklan

Description:

See how we solve customer design challenges with our technical expertise and the latest technology

SparkLAN WSDB-104GN(BT) is a highly integrated 802.11 b/g/n Wi-Fi/BT combo IoT solution. It can support up to 150Mbps Wi-Fi throughput and Bluetooth can support BT4.1. WSDB-104GN(BT) embedded with Broadcom BCM43438 chipset, is a cost and power efficient solution, provides SDIO interface for Wi-Fi to connect with host processor and high speed UART interface for BT. It is suited for embedded wireless applications, such as home appliances, monitoring and control, smart meters and energy management.

View our wide range of WiFi 802.11

View our portfolio of M2M and Wireless

See all products from our supplier Sparklan

Features:

  • Standard: 802.11b/g/n
  • Host interface: SDIO, Hi-Speed UART
  • Chipset: Broadcom BCM43438
  • Antenna: PCB Printed ANT or U.FL connector, 1T1R

WiFi SiP Module, IEEE 802.11 a/b/g/n with Bluetooth 4.0

USI WM-BAN-BM-10_L WiFi SiP Module

MPN:

WM-BAN-BM-10_L

Manufacturer L3 Communications

USI

Description:

See how we solve customer design challenges with our technical expertise and the latest technology

NOT RECOMMENDED FOR NEW DESIGN

The Wireless SiP module WM-BAN-BM-10_L is a small size module that provides 802.11a/b/g/n MIMO with BT4.0 + HS, and FM Radio Receiver Sip module which refers as "SiP module" is a small size module based on QFN package that provides full function of 802.11a/b/g/n 2x2 spatial stream with Bluetooth 4.0 + High Speed and FM Radio receiver in a tiny module via 86 pins LGA Footprint.

View our wide range of WiFi 802.11

View our portfolio of M2M and Wireless

See all products from our supplier USI

Features:

  • Supports dual-antenna for Wi-Fi MIMO: single 2.4GHz antenna shared between Bluetooth and Wi-Fi
  • Supports a FM antenna
  • Excellent Sensitivity. Good Isolation between Wi-Fi and CDMA Small size suitable for low volume system
  • 2.412-2.484 GHz and 5.15 -5.9GHz two SKUs for worldwide market
  • Wi-Fi: SDIO Bluetooth: High speed UART

WiFi SiP Module, IEEE 802.11 b/g/n with Bluetooth 3.0

USI WM-BN-BM04 WiFi SiP Module

MPN:

WM-BN-BM-04

Manufacturer L3 Communications

USI

Description:

See how we solve customer design challenges with our technical expertise and the latest technology

NOT RECOMMENDED FOR NEW DESIGN

The 802.11b/g/n + BT + FM Receiver Wireless SiP module WM-BN-BM-04 which refers as "SiP 3 in One module" is a small size module that provides full function of 802.11b/g/n (draft n), Bluetooth class 4.0 + HS and FM Receiver in a tiny module via 54 pins LGA Foot Print.

View our wide range of WiFi 802.11

View our portfolio of M2M and Wireless

See all products from our supplier USI

Features:

  • Lead Free design which supporting Green design requirement, RoHS Compliance
  • The module can support Halogen Free
  • Support single Antenna for WiFi and Bluetooth
  • Small size suitable for low volume system integration
  • Low power consumption & excellent power management performance extend battery life
  • 2.412-2.484 GHz two SKUs for worldwide market
  • Easy for integration into mobile and handheld device with flexible system configuration and antenna design
  • Supports per packet Rx Antenna diversity

WiFi SiP Module, IEEE 802.11 a/b/g/n with Bluetooth 4.0

USI WM-BAN-BM-16 WiFi SiP Module

MPN:

WM-BAN-BM-16

Manufacturer L3 Communications

USI

Description:

See how we solve customer design challenges with our technical expertise and the latest technology

The 802.11a/b/g/n + BT + FM RX Wireless SiP module WM-BAN-BM-16 which refers as "SiP 3 in one module" is a small size module that provides full function of 802.11a/b/g/n, Bluetooth 4.0, and FM Receiver in a tiny module via 47 pins LGA footprint.

This multi-functionality and board to board physical interface provides SDIO /HSIC interface for Wi-Fi, UART for Bluetooth and FM RX.

View our wide range of WiFi 802.11

View our portfolio of M2M and Wireless

See all products from our supplier USI

Features:

  • Support single antenna for Wi-Fi and Bluetooth
  • Small size suitable for low volume system integration
  • Low power consumption & excellent power management performance extend battery life
  • 2.412-2.484 GHz and 4.9 -5.845GHz two SKUs for worldwide market
  • Easy for integration into mobile and handheld device with flexible system configuration and antenna design

WiFi SiP Module, IEEE 802.11 a/b/g/n with Bluetooth 4.0

USI WM-BAN-BM-07_S WiFi SiP Module

MPN:

WM-BAN-BM-07_S

Manufacturer L3 Communications

USI

Description:

See how we solve customer design challenges with our technical expertise and the latest technology

The WM-BAN-BM-07_S Wireless SiP module is small size module that provides full function of 802.11a/b/g/n, up to Bluetooth 4.0 and FM Receiver in a tiny module. The module is targeted to mobile devices including Mobile Phones, Tablet PC, Digital Still Cameras (DSCs), etc. which need small footprint package, low power consumption, multiple interfaces and OS support. Customers can easily enable Wi-Fi, BT and FM embedded applications with the benefits of high design flexibility, short development cycle, and time-to market. In addition to WEP 64/128, WPA and TKIP, AES, CCX is supported to provide the latest security requirement on your network.

View our wide range of WiFi 802.11

View our portfolio of M2M and Wireless

See all products from our supplier USI

Features:

  • Low power consumption & excellent power management performance extend battery life
  • WAPI support
  • Advanced security with WEP 64/128, WPA and TKIP, AES, CCX
  • Lead-free design
  • Interface: Wi-Fi: SDIO / Bluetooth: High speed UART

WiFi SiP Module, IEEE 802.11 b/g/n with Bluetooth 4.1, Chip antenna

USI WM-BN-BM-26A WiFi SiP Module

MPN:

WM-BN-BM-26A

Manufacturer L3 Communications

USI

Description:

See how we solve customer design challenges with our technical expertise and the latest technology

The 802.11b/g/n + BT 4.1 Wireless Sip module WM-BN-BM-26 which refers as "SiP 2 in one module" is a small size module based on QFN package that provides full function of 802.11b/g/n with Bluetooth 4.1 in a tiny module via 59 pins LGA Footprint.

This multi-functionality and board to board physical interface provides SDIO v3.0/GSPI interfaces for Wi-Fi, UART/PCM for Bluetooth.

View our wide range of WiFi 802.11

View our portfolio of M2M and Wireless

See all products from our supplier USI

Features:

  • Support explicit IEEE 802.11n transmit beamforming
  • Supports 20 MHz bandwidth channels with optional SGI (256QAM modulation)
  • Full IEEE 802.11b/g/n legacy compatibility with enhanced performance
  • Lead Free design which supporting Green design requirement, RoHS Compliance, and halogen-free.
  • Support a single-band antenna shared between Wi-Fi and Bluetooth
  • Small size suitable for low volume system integration.Low power consumption & excellent power management performance extend battery life
  • 2.412-2.484 GHz SKU for worldwide market
  • Easy for integration into mobile and handheld device with flexible system configuration and antenna design

WiFi SiP Module, 2x2 IEEE 802.11 ac with Bluetooth 4.1, PCIe interface

USI WM-BAC-BM-19 WiFi SiP Module

MPN:

WM-BAC-BM-19

Manufacturer L3 Communications

USI

Description:

See how we solve customer design challenges with our technical expertise and the latest technology

NOT RECOMMENDED FOR NEW DESIGN

The WM-BAC-BM-19 Wireless SiP module is a small size module that provides full function of 802.11ac with Bluetooth 4.1 in a tiny module. The module is targeted to mobile devices including Mobile Phone, Tablet PC, etc. which need small footprint package, low power consumption, multiple interfaces and OS support. Customers can easily enable Wi-Fi , BT and FM embedded applications with the benefits of high design flexibility, short development cycle, and time-to market. In addition to WEP 64/128, WPA and TKIP, AES, CCX is supported to provide the latest security requirement on your network.

View our wide range of WiFi 802.11

View our portfolio of M2M and Wireless

See all products from our supplier USI

Features:

  • Low power consumption & excellent power management performance extend battery life
  • WAPI support
  • Advanced security with WEP 64/128, WPA and TKIP, AES, CCX
  • Lead-free design
  • Supports per packet Rx Antenna diversity
  • Interfaces: Wi-Fi: SDIO, PCIe, Bluetooth: High speed UART

WiFi SiP Module, IEEE 802.11 ac with Bluetooth 4.0

USI WM-BAC-BM-21 WiFi SiP Module

MPN:

WM-BAC-BM-21

Manufacturer L3 Communications

USI

Description:

See how we solve customer design challenges with our technical expertise and the latest technology

NOT RECOMMENDED FOR NEW DESIGN

The WM-BAC-BM-21 Wireless SiP module is small size module that provides full function of 802.11ac, up to Bluetooth 4.0 and FM Receiver in a tiny module. The module is targeted to mobile devices including Mobile Phones, Tablet PC, Digital Still Cameras (DSCs), etc. which need small footprint package, low power consumption, multiple interfaces and OS support. Customers can easily enable Wi-Fi, BT and FM embedded applications with the benefits of high design flexibility, short development cycle, and time-to market. In addition to WEP 64/128, WPA and TKIP, AES, CCX is supported to provide the latest security requirement on your network.

View our wide range of WiFi 802.11

View our portfolio of M2M and Wireless

See all products from our supplier USI

Features:

  • Low power consumption & excellent power management performance extend battery life
  • WAPI support
  • Advanced security with WEP 64/128, WPA and TKIP, AES, CCX
  • Lead-free design
  • Interface: Wi-Fi: SDIO / Bluetooth: High speed UART

WiFi SiP Module, IEEE 802.11 ac with Bluetooth 4.1

USI WM-BAC-AT-09 WiFi SiP Module

MPN:

WM-BAC-AT-09

Manufacturer L3 Communications

USI

Description:

See how we solve customer design challenges with our technical expertise and the latest technology

WiFi802.11a/b/g/n/ac with BT4.1 SIP module WM-BAC-AT-09 is proposed for any portable consumer application. This module will use QCA9377-3 chipset. Coupler and diplexer will be included in the module to ensure maximum power flatness and optimum power accuracy and VSWR.

View our wide range of WiFi 802.11

View our portfolio of M2M and Wireless

See all products from our supplier USI

WiFi IoT Module, IEEE 802.11 b/g/n

USI WM-N-BM-09 WiFi IoT Module

MPN:

WM-N-BM-09

Manufacturer L3 Communications

USI

Description:

See how we solve customer design challenges with our technical expertise and the latest technology

WM-N-BM-09 Module is our first product supporting WICED concept (Wireless Internet Connectivity for Embedded Devices). Any device via this module can easily connect to Internet and perform peer-to-peer access with other Wi-Fi devices (like smartphone or tablet). WICED Module is designed for embedded Devices to Reduce Efforts on Internet Connectivity Activation and Shorten Development Cycle on Host Side.

View our wide range of WiFi 802.11

View our portfolio of M2M and Wireless

See all products from our supplier USI

Features:

  • Broadcom 43362 Compliant with IEEE 802.11b/g and 802.11n 1x1 Single-Band 2.4GHz
  • Wireless Data Rate up to 65Mbit/s
  • Integrated RF Power Amplifier
  • Wi-Fi Security Support (Including WAPI)
  • Soft AP Support
  • Capable for Wi-Fi Direct

WiFi IoT Module, IEEE 802.11 b/g/n, Printed antenna

USI WM-N-BM-14 WiFi IoT Module

MPN:

WM-N-BM-14

Manufacturer L3 Communications

USI

Description:

See how we solve customer design challenges with our technical expertise and the latest technology

The WM-N-BM-14 Wi-Fi IoT module featuring the Broadcom BCM43362 Wireless LAN MAC/baseband/radio, includes an embedded processor and unique "self-hosted" Wi-Fi networking library and software application stack. WICED-based modules enable the addition of secure, interoperable Wi-Fi functionality via a simple serial port using a basic command set that does not require any significant changes in product micro-controller architectures.

View our wide range of WiFi 802.11

View our portfolio of M2M and Wireless

See all products from our supplier USI

Features:

  • RF Spec, MCU Spec and the deliverable are same as WM-N-BM-09
  • Add 2.4G antenna and U.FL connector on the module
  • Hardware evaluation kit and development utilities will be released base on listed OS and processors to OEM customers
  • Finished Regulatory Test on FCC, CE, etc
  • Dimensions: 28 mm (W) x 20 mm (L) x 2.0 mm (H)

WiFi IoT Module, IEEE 802.11 b/g/n, Printed antenna

USI WM-N-BM-30 WiFi IoT Module

MPN:

WM-N-BM-30

Manufacturer L3 Communications

USI

Description:

See how we solve customer design challenges with our technical expertise and the latest technology

The WM-N-BM-30 Wi-Fi IoT module featuring the Broadcom BCM43362 Wireless LAN MAC/baseband/radio, includes an STM411F embedded processor and unique "self-hosted" Wi-Fi networking library and software application stack. WICED-based modules enable the addition of secure, interoperable Wi-Fi functionality via a simple serial port using a basic command set that does not require any significant changes in product micro-controller architectures.

View our wide range of WiFi 802.11

View our portfolio of M2M and Wireless

See all products from our supplier USI

Features:

  • ARM Cortex--M4 up to 100 MHz
  • 802.11 b/g/n 1x1 2.4 GHz radio
  • 128KB of SRAM and 1MB Flash (MCU 512KB + 2MB Flash)
  • Apple Homekit Support(Limited @2MB Flash)
  • UART, GPIO, SPI, I2C, Interface support
  • SPI master interface for serial flash extension
  • Antenna Diversity Support
  • Dimensions: 20 mm x 28 mm X2.7 mm

WiFi IoT Module, IEEE 802.11 b/g/n with Bluetooth 4.1

USI WM-BN-BM-22 WiFi SiP Module

MPN:

WM-BN-BM-22

Manufacturer L3 Communications

USI

Description:

See how we solve customer design challenges with our technical expertise and the latest technology

The WM-BN-BM-22 provides for the highest-level integration for electronic accessories on WICED licensing, featuring integrated IEEE 802.11b/g/n and BT4.1. The WM-BN-BM-22 wireless SiP module is a small size module and consists of a Broadcom BCM4343x single-chip, a ST STM32F4 MCU. It includes a 2.4 GHz WLAN CMOS power amplifier (PA) that meets the output power requirements of most handheld systems.

View our wide range of WiFi 802.11

View our portfolio of M2M and Wireless

See all products from our supplier USI

Features:

  • Single band 2.4GHz IEEE 802.11b/g/n + Bluetooth 4.1
  • Supports wireless data rates up to 65Mbit/s
  • Integrated RF power amplifier
  • 1 MB Flash memory
  • Support Rx Antenna diversity
  • Up to 30 programmable GPIOs

Bluetooth 4.0 Smart Ready Module (Bluetooth Classic + Low Energy) with Chip antenna

USI GP-BR-65 Bluetooth Module

MPN:

BM-GP-BR-65

Manufacturer L3 Communications

USI

Description:

The BM-GP-BR-65 Bluetooth module featuring the BCM20702 single-chip, Bluetooth 4.0+EDR and Low Energy compliant, stand-alone baseband processor with an integrated 2.4GHz transceiver. It is fully compliant with Bluetooth 4.0 and all prior standard features. The BCM20702 has an architecture that has been designed to take advantage of the Bluetooth low energy (BLE) standard, enabling both modes in PCs and consumer electronics devices.

View our wide range of Bluetooth products

View our portfolio of M2M and Wireless

See all products from our supplier USI

Features:

  • Main Chip is BCM chipset 20702
  • Bluetooth V4.0+EDR compliant embedded USB Module
  • Programmable output power control meets Class 1, Class 2 or Class 3 requirements
  • Dimension :-16.5mm x 10mm x 1.9mm (with components and shielding)

WiFi IoT Module, IEEE 802.11 a/ b/g/n with Bluetooth 4.2

USI WM-BAN-BM-33 WiFi IoT Module

MPN:

WM-BAN-BM-33

Manufacturer L3 Communications

USI

Description:

See how we solve customer design challenges with our technical expertise and the latest technology

The WM-BAN-BM-33 embedded wireless system-in-package (SiP) module is uniquely suited for Internet-of-Things applications in the industrial and medical sensor, home application and embedded audio markets. It supports all rates specified in the IEEE 802.11 a/b/g/n specifications and Bluetooth 4.1 compliant.

View our wide range of WiFi 802.11

View our portfolio of M2M and Wireless

See all products from our supplier USI

Features:

  • ARM Cortex-R4 32-bit RISC processor
  • Memory: 640 KB of ROM, 2MB of on-chip SRAM
  • 17 GPIOs supported
  • Frequency bands: 2 GHz and 5 GHz for WLAN and 2.4 GHz for Bluetooth
  • Supports battery voltage range from 3.0V to 4.8V with an internal switching regulator
  • Two antenna ports: ANT0: 2.4 GHz/5 GHz. ANT1: 2.4 GHz

Bluetooth 4.2 Low Energy Module based on the nRF52, Integrated antenna

Fujitsu FWM7BLZ20 Bluetooth 4.2 Module

MPN:

FWM7BLZ20-109049

Manufacturer L3 Communications

Fujitsu Wireless Solutions

Description:

FUJITSU Component Wireless Module FWM7BLZ20 series is a compact wireless module corresponds to Bluetooth version 4.2. Its size is same as the Bluetooth version 4.1 enabled module MBH7BLZ02 series, though it achieves about half of the power consumption and about double the transmission distance. FWM7BLZ20 series embeds Nordic Semiconductor’s nRF52832 SoC. The module offers significant increase of user’s usable memory area and higher data transmission speed by improved processing power and enhanced memory size of embedded processor.

You can develop and embed your own application code by using SDK (Software Development Kit) and software stack provided by Nordic Semiconductor.

In addition, the module embeds NFC function to make it possible to connect NFC-enabled devices by using an external antenna.

View our wide range of Bluetooth

View our portfolio of M2M and Wireless

See all products from our supplier Fujitsu Wireless Solutions

Features:

  • Bluetooth Specification Version 4.2 (Single mode) compliant
  • Supports concurrent Bluetooth Smart/ANT protocol operation
  • Nordic Semiconductor nRF52832 with powerful 32-bit ARM Cortex-M4F processor
  • 64kB RAM, 512kB Flash available for flexible development
  • GPIO pins (30 pins) of nRF52832 are assigned to this module
  • Integrated 32MHz and 32.768kHz crystal oscillators
  • Transmission output: up to +4dBm
  • Receiving sensitivity: -96dBm
  • Interface: UART, SPI, I2C, GPIO
  • OOB pairing by using NFC-A Tag interface
  • Operating temperature: -40°C to +85 °C
  • Power supply: 1.7 to 3.6V DC
  • LGA package
  • Size: 15.7 x 9.8 x 1.7 mm

WiFi SiP Module, IEEE 802.11 b/g/n

USI WM-N-BM-02 WiFi SiP Module

MPN:

WM-N-BM-02

Manufacturer L3 Communications

USI

Description:

The WM-N-BM-02 Wireless SiP module is a small size module that provides full function of 802.11b/g/n in a tiny module. The module is targeted to mobile devices including Home Appliance, Digital Still Cameras (DSCs), Recorder, Photo Frame, etc. which need small footprint package, low power consumption, multiple interfaces and OS support. Customers can easily enable Wi-Fi embedded applications with the benefits of high design flexibility, short development cycle, and time-to market. In addition to WEP 64/128, WPA and TKIP, AES, CCX is supported to provide the latest security requirement on your network.

View our wide range of WiFi 802.11

View our portfolio of M2M and Wireless

See all products from our supplier USI

Features:

  • Low power consumption & excellent power management performance extend battery life
  • WAPI support
  • Advanced security with WEP 64/128, WPA and TKIP, AES, CCX
  • Lead-free design
  • Supports per packet Rx Antenna diversity
  • Interface : Wi-Fi - SDIO

868MHz ZigBee/802.15.4 Evaluation kit

Embit EMB-ZRF212B-EVK ZigBee evaluation kit

MPN:

EMB-ZRF212B-EVK

Manufacturer L3 Communications

Embit

Description:

EMB-ZRF212B-EVK is the evaluation kit dedicated to the EMB-ZRF212B. The kit allows you to develop your own 802.15.4-based, ZigBee-based or Atmel® LightWeight Mesh-based application; the firmware can then be downloaded and debugged on Embit EMB-ZRF212B modules, by means of the Atmel® ICE programmer, included in the kit.

View our wide range of ISM Modules

View our portfolio of M2M and Wireless

See all products from our supplier Embit

Features:

  • The kit includes:

  • 2 Evaluation boards with EMB-ZRF212B modules
  • 2 USB cables for PC connection
  • 2 Rubber duck antennas (EMB-AN868-BB24)
  • 1 Atmel® ICE programmer
  • 1 Embit programmer adapter
  • 4 Batteries
  • 1 CD-ROM including drivers, software and manual
  • 2 Power supplies with standard plug

2.4GHz ZigBee/802.15.4 Evaluation kit

Embit EMB-Z253xPA-Serie-EVK ZigBee evaluation kit

MPN:

EMB-Z2530PA-EVK

Manufacturer L3 Communications

Embit

Description:

EMB-Z2530PA-EVK contains all hardware and software tools required to get started with Embit 2.4GHz EMB-Z2530PA wireless modules. The kit allows you to develop your own IEEE 802.15.4-based or ZigBee-based application; the firmware can then be downloaded and debugged on Embit EMB-Z2530PA modules, by means of the Texas Instruments® CC debugger, included in the kit.

View our wide range of ISM Modules

View our portfolio of M2M and Wireless

See all products from our supplier Embit

Features:

  • The kit includes:

  • 2 Evaluation Boards with EMB-Z2530PA modules
  • 1 EMB-Z2531PA-USB USB dongle
  • 2 Rubber Duck Antennas (EMB-AN24-20)
  • 2 Power Supplies with multiple standard plug
  • 1 USB Power Adapters
  • 4 Batteries
  • 2 USB Cables for PC connection
  • 1 CD-ROM including drivers, software and manual

169MHz Wireless M-Bus Evaluation kit

Embit EMB-WMB-Serie-EVK MBus evaluation kit

MPN:

EMB-WMB169PA-EVK

Manufacturer L3 Communications

Embit

Description:

EMB-WMB169PA-EVK contains all hardware and software tools required to get started with Embit 169MHz EMB-WMB169PA modules. The kit is available in two variants: FULL and LIGHT. The FULL variant provides 4 evaluation boards, the USB JTAG programming interface, the Embit Wireless M-Bus SDK, documentation and a sample application (wireless pulse counter). This variant of the kit allows you to develop your own W-MBus compliant application and to download your software on Embit EMB-WMB169PA modules, by means of Texas Instruments' programmer, included in the kit.

View our wide range of ISM Modules

View our portfolio of M2M and Wireless

See all products from our supplier Embit

Features:

  • The kit includes:

  • 2 Evaluation Boards with EMB-WMB169PA modules
  • 2 EMB-AN169-M4EL Antennas
  • 1 EMB-AN169-001 Antenna with Ground Plane
  • 2 USB Cables for PC connection
  • 2 Power Supplies with multiple standard plug
  • 1 CD-ROM including drivers, software and manual

2.4GHz ZigBee/IEEE 802.15.4 Module

Embit EMB-Z2530PA ZigBee module

MPN:

EMB-Z2530PA

Manufacturer L3 Communications

Embit

Description:

EMB-Z2530PA is a 2.4 GHz low-power wireless module capable of operating in 802.15.4 or ZigBee networks as a coordinator, router or end device. The module features an integrated PA and LNA that increase the link budget and thus increase the communication range. An integrated PCB antenna makes the module a low-cost solution, removing costs typically associated with external antenna mounting.

View our wide range of ISM Modules

View our portfolio of M2M and Wireless

See all products from our supplier Embit

Features:

  • Output power up to +20 dBm (100 mW)
  • RF sensitivity up to -100 dBm
  • Integrated PCB antenna or uFL connector option
  • Open platform
  • Program memory: 256 kB
  • RAM: 8 kB
  • Output power (MAX): +20 dBm
  • Based on TI CC2530
  • Form factor: 29 x 22 mm
  • Power consumption (standby): 1.1 µA
  • Supply voltage: 3.3 V

Zigbee USB Dongle

Embit EMB-Z2531USB Dongle module

MPN:

EMB-Z2531USB

Manufacturer L3 Communications

Embit

Description:

EMB-Z2531PA-USB is a performant low-power USB dongle capable of operating in IEEE 802.15.4 or ZigBee networks as a coordinator, router or end device. It is the USB adapter version of the EMB-Z2530PA. The RF section of the USB dongle employs a PA and LNA to provide up to 120dB of link budget. The integrated PCB antenna makes the EMB-Z2531PA-USB ready to transmit/receive over-the-air data out of the box. Two LEDs and one button are also available to build a basic user-interface. All these features allow to get started in few minutes with either firmware development or over-the-air transmission/sniffing.

View our wide range of ISM Modules

View our portfolio of M2M and Wireless

See all products from our supplier Embit

Features:

  • output power up to +20 dBm (100 mW)
  • RF sensitivity up to -100 dBm
  • integrated PCB antenna or uFL connector option
  • open platform
  • Program memory: 256KB
  • RAM: 8KB
  • Output power (MAX): +20dBm
  • Based on TI CC2531
  • Form factor: 60 x 22.6 x 7 mm
  • Power consumption (standby): 1.1µA
  • Supply: 5V (from USB)

2.4GHz ZigBee/IEEE 802.15.4, ARM Cortex Module

Embit EMB-Z2538PA ZigBee Module

MPN:

EMB-Z2538PA

Manufacturer L3 Communications

Embit

Description:

EMB-Z2538PA is a 2.4 GHz wireless module integrating a cutting-edge 32 bit ARM Cortex-M3 core and a state-of-art radio transceiver. The advanced ARM architecture makes easy the development of IEEE 802.15.4 / ZigBee / 6LoWPAN low-power applications to add wireless connectivity and multi-hop networking into existing products.

View our wide range of ISM Modules

View our portfolio of M2M and Wireless

See all products from our supplier Embit

Features:

  • 32 bit ARM Cortex M3 with 512 kB FLASH and 32 kB of SRAM (TI CC2538)
  • up to +20 dBm (100 mW) RF output power
  • integrated PCB antenna or U.FL connector
  • open platform
  • Program memory: 512 kB
  • RAM: 32 kB
  • RF output power (MAX): +20 dBm
  • RF sensitivity: -100 dBm
  • Based on TI CC2538
  • Form factor: 29 x 22 mm
  • Power consumption (standby): 1.7 µA
  • Supply voltage: 3.3 V

868MHz Wireless M-Bus Module

Embit EMB-WMB-Series MBus Module

MPN:

EMB-WBM868

Manufacturer L3 Communications

Embit

Description:

EMB-WMB868 is a 868 MHz wireless module that combines high performance to small dimensions and low cost, providing the system integrator a simple and easy way to add Wireless M-Bus connectivity and multi-hop networking into existing products.

The EMB-WMB868 modules can be provided with a W-MBus stack specifically developed by Embit for the platform that allows to integrate the module in the desired system without effort and simplify the interaction in WMBus networks.

View our wide range of ISM Modules

View our portfolio of M2M and Wireless

See all products from our supplier Embit

Features:

  • Based on TI MSP430 & CC1120
  • Program memory: 128 kB / 96 kB / 64 kB
  • RAM: 10 kB / 8 kB / 6 kB
  • Output power (MAX): +30 dBm / +27 dBm / +15 dBm
  • Sensitivity: -122 dBm
  • AES software encryption available
  • Form factor: 29 x 22 mm
  • Power consumption (deep sleep): 2 µA
  • Supply voltage: 3.3 V

169MHz Wireless M-Bus Module

Embit EMB-WMB-Series MBus Module

MPN:

EMB-WBM169PA

Manufacturer L3 Communications

Embit

Description:

EMB-WMB169PA is a 169 MHz wireless module that combines high performance to small dimensions and low cost, providing the system integrator a simple and easy way to add Wireless M-Bus connectivity and multi-hop networking into existing products.

The EMB-WMB169PA modules can be provided with a W-MBus stack specifically developed by Embit for the platform that allows to integrate the module in the desired system without effort and simplify the interaction in WMBus networks. This makes the EMB-WMB169PA a perfect match for Automatic Meter Reading (AMR) applications.

View our wide range of ISM Modules

View our portfolio of M2M and Wireless

See all products from our supplier Embit

Features:

  • Based on TI MSP430 & CC1120
  • Program memory: 128 kB / 96 kB / 64 kB
  • RAM: 10 kB / 8 kB / 6 kB
  • Output power (MAX): +30 dBm / +27 dBm / +15 dBm
  • Sensitivity: -122 dBm
  • AES software encryption available
  • Form factor: 29 x 22 mm
  • Power consumption (deep sleep): 2 µA
  • Supply voltage: 3.3 V

868/915MHz ZigBee/802.15.4 Module

Embit EMB-ZRF21B ZigBee Module

MPN:

EMB-ZRF212B

Manufacturer L3 Communications

Embit

Description:

EMB-ZRF212B is an 868 / 915 MHz wireless module that combines high performance to small dimensions and low cost, providing the system integrator a simple and easy way to add IEEE® 802.15.4 / ZigBee / Atmel® LightWeight Mesh 868 MHz wireless connectivity; in particular, mesh networking features provide high flexibility and reliability in over-the-air protocol development.

View our wide range of ISM Modules

View our portfolio of M2M and Wireless

See all products from our supplier Embit

Features:

  • Program memory: 128 kB
  • RAM: 8 kB
  • Output power (MAX): +10 dBm
  • Sensitivity: -110 dBm
  • Based on Atmel ATxmega & AT86RF212B
  • Form factor: 29 x 22 mm
  • Power consumption (sleep): 1.3 µA
  • Supply voltage: 3.3 V

Embit General purpose USB Dongle

Embit EMB-GPDONGLE-USB Dongle

MPN:

EMB-GPDONGLE-USB

Manufacturer L3 Communications

Embit

Description:

EMB-GPDONGLE-USB is a USB dongle developed by embit to allow customers to quickly get started with embit wireless modules. The EMB-GPDONGLE-USB is a generic USB dongle that can host any embit module (since they all employ the same form factor); the embit wireless module selected by the customer can be soldered on the available pads of the EMB-GPDONGLE-USB in a few minutes.

Then, connecting the USB dongle to an host device (e.g., a notebook) the customer can immediately communicate and transfer data with the embit wireless module soldered on the EMB-GPDONGLE-USB, and, through that module, over-the-air data can be transmitted and received.

View our wide range of Radio modem

View our portfolio of M2M and Wireless

See all products from our supplier Embit

Features:

  • USB 2.0 full speed transceiver
  • 1 LED and 1 push button
  • 32 kHz crystal
  • embit programming interface
  • Compact form factor: 52 x 25 x 7 mm
  • Supply: 5V (from USB)

2.4GHz ZigBee/802.15.4 Evaluation kit, AMR Cortex M3

Embit EMB-Z253xPA-Serie-EVK ZigBee evaluation kit

MPN:

EMB-Z2538PA-EVK

Manufacturer L3 Communications

Embit

Description:

EMB-Z2538PA-EVK contains all hardware and software tools required to get started with Embit 2.4GHz EMB-Z2538PA wireless modules. The kit allows you to develop your own IEEE 802.15.4-based or ZigBee-based application; the firmware can then be downloaded and debugged on Embit EMB-Z2538PA modules, by means of the Olimex TMS320-XDS100-V3 programmer/debugger included in the kit.

The evaluation boards provided in this kit expose most of the EMB-Z2538PA module's features, and, thanks to their many interfaces (USB, RS232, JTAG, etc), allows for a fast development-deploy-debugging cycle.

View our wide range of ISM Modules

View our portfolio of M2M and Wireless

See all products from our supplier Embit

Features:

  • The kit includes:

  • 2 Evaluation Boards with EMB-Z2538PA modules
  • 1 EMB-Z2531PA-USB USB dongle (sniffer)
  • 2 Rubber Duck Antennas (EMB-AN24-20)
  • 4 AA batteries
  • 1 Olimex TMS320-XDS100-V3 programmer
  • 1 EMB-MULTIPROG programming adapter
  • 2 USB Cables for PC connection
  • 1 CD-ROM including drivers, software and manual

868MHz Wireless M-Bus Evaluation kit

Embit EMB-WMB-Serie-EVK MBus evaluation kit

MPN:

EMB-WMB868-EVK

Manufacturer L3 Communications

Embit

Description:

EMB-WMB868-EVK contains all hardware and software tools required to get started with Embit 868 MHz EMB-WMB868 wireless modules. The kit is available in two variants: FULL and LIGHT. The FULL variant provides 4 evaluation boards, the USB JTAG programming interface, the Embit Wireless M-Bus SDK, documentation and a sample application (wireless pulse counter). This variant of the kit allows you to develop your own W-MBus compliant application and to download your software on Embit EMB-WMB868 modules, by means of Texas Instruments' programmer, included in the kit.

View our wide range of ISM Modules

View our portfolio of M2M and Wireless

See all products from our supplier Embit

Features:

  • The kit includes:

  • 2 Evaluation Boards with EMB-WMB868 modules
  • 2 EMB-AN868-BB24 Antenna
  • 2 Power Supplies with multiple standard plug
  • 1 USB Power Adapter
  • 2 USB Cable for PC connection
  • 1 CD-ROM including drivers, software and manual

LoRA/LoRAWAN Evaluation kit

Embit EMB-LR1272-EVK LoRa evaluation kit

MPN:

EMB-LR1272-EVK

Manufacturer L3 Communications

Embit

Description:

See how we solve customer design challenges with our technical expertise and the latest technology

EMB-LR1272-EVK is the evaluation kit dedicated to the EMB-LR1272. The kit allows to develop your LoRa ™or LoRaWAN™ firmware application and manage a compatible LoRaWAN eco-system. EMB-LR1272-EVK is fully compliant with the latest LoRaWAN specifications with support for all features. The evaluation boards provided in this kit expose most of the EMB-LR1272 module's features, and, thanks to their many interfaces (USB, JTAG, etc), allows for a fast development-deploy-debugging cycle.

View our wide range of ISM Modules

View our portfolio of M2M and Wireless

See all products from our supplier Embit

Features:

  • The kit includes:

  • 2 Evaluation boards with EMB-LR1272E modules
  • 2 USB cables for PC connection
  • 2 Rubber duck antennas (EMB-AN868-BB24)
  • 1 SEGGER J-Link LITE JTAG programmer
  • 1 EMB-MULTIPROG Embit programmer adapter
  • 4 Batteries
  • access to Embit repository including drivers, software and manual

868/915MHz LoRA Module

Embit EMB-LR1272E LoRa Module

MPN:

EMB-LR1272E

Manufacturer L3 Communications

Embit

Description:

See how we solve customer design challenges with our technical expertise and the latest technology

EMB-LR1272 / EMB-LR1272E is a 868 / 915 MHz wireless module that combines high performance to small dimensions and low cost, providing the system integrator a simple and easy way to add LoRa / LoRaWAN long range connectivity into existing products. The EMB-LR1272 modules is provided with a embedded LoRa/LoRaWAN stack specifically developed by Embit that allows to be compliant with the latest LoRaWAN specifications, allowing customer to develop firmware application and manage a compatible LoRa eco-system.

View our wide range of Radio modem

View our portfolio of M2M and Wireless

See all products from our supplier Embit

Features:

  • Based on Atmel SAMD20
  • Transceiver: Semtech sx1272
  • Program memory: 64 KB / 128 KB / 256 KB
  • RAM: 8 KB / 16 KB / 32 KB
  • Output power (MAX): +19 dBm / +14 dBm
  • Sensitivity: -137 dBm
  • AES software encryption available
  • Form factor: 29 x 22 mm
  • Power consumption (sleep): 1 µA / 3 µA (with a RTC clock running)
  • Supply voltage: 3.3 V

LoRa Monochannel Wireless-to-Ethernet Gateway

Embit EMB-GATE-LR LoRa Gateway

MPN:

EMB-GATE-LR

Manufacturer L3 Communications

Embit

Description:

See how we solve customer design challenges with our technical expertise and the latest technology

The EMB-GATE-LR Wireless-to-Ethernet gateway offers a cost effective solution for end users and integrators, allowing to collect data and to remote control LoRa™ End devices. The EMB-GATE-LR comes with an embedded web interface that allows the user to manage the radio network and to retrieve data from end nodes. A web service protocol is also available to get all the information in an autonomous way.

View our wide range of Radio Modem

View our portfolio of M2M and Wireless

See all products from our supplier Embit

Features:

  • LoRa™ compliant wireless interface
  • Embedded web server
  • Web configuration and management
  • RAM Memory: 512 MB / 1 GB
  • Processor: ARM Cortex™-A
  • Dimensions: 130 x 80 x 30 mm

LoRaWAN Gateway for IoT Connectivity

Embit EMB-GW1301 LoRaWAN Gateway

MPN:

EMB-GW1301

Manufacturer L3 Communications

Embit

Description:

See how we solve customer design challenges with our technical expertise and the latest technology

The LoRaWAN™ EMB-GW1301 gateway is a multi service upgradable platform designed to meet IoT and M2M scenarios. It enables LoRaWAN™ connectivity to the cloud, providing a cost effective solution for IoT wireless infrastructure. The EMB-GW1301 can be preloaded with a specific customer's firmware and configuration or with the most well known LoRaWAN™ network provider configuration.

View our wide range of Radio Modem

View our portfolio of M2M and Wireless

See all products from our supplier Embit

Features:

  • Full Compliance with LoRaWAN™ network protocol on 868 MHz radio band
  • Embedded web server for system supervising
  • Secure communication protocols support
  • Fully supports the LoRaWAN™ 1.0.1 specification
  • Processor: ARM Cortex™ / A5Atmel SAMA5D31 (@536MHz)
  • RAM Memory: 256 MB DDR2
  • Flash Memory: up to 8 GB

SMD Bluetooth module for IOS accessory without Antenna

Fujitsu MBH7BTZ39 Bluetooth Module

MPN:

MBH7BTZ39A

Manufacturer L3 Communications

Fujitsu Wireless Solutions

Description:

The MBH7BTZ39A version is SMD Bluetooth module without antenna suitable for IoS accessory with power Class 2, CSR BC4-External.

Since the upper level protocol stacks and Serial Port Profile (SPP) are incorporated in the module, you can control Bluetooth® through text-based simple commands. Therefore, the module is the most suitable cable replacement solution for electronic devices that are connected via serial cable, and you can reduce development time and cost to develop Bluetooth® enabled applications. In addition, the module makes it possible for you to communicate with the application software on iOS devices such as iPhone and iPad. (It is necessary to connect CP chip to the module on your printed circuit board). Before using the module, please note that you must join the MFi licensing program provided by Apple Inc.

View our wide range of Bluetooth modules

View our portfolio of M2M and Wireless

See all products from our supplier Fujitsu Communication

Features:

  • Bluetooth Specification Version 2.1 + EDR compliant
  • CSR BlueCore4-External based
  • Power Class 2 (+4 dBm max)
  • Upper layer protocol stack (L2CAP, SDP, RFCOMM), and profiles(GAP, SPP), iPod accessory protocol (iAP1/iAP2)
  • Receiving senstivity: Basic rate -87dBm typical
  • Host interface: UART (9.6k ~ 1,382.4kbps)
  • Software interface: Simple proprietary command
  • Power supply: 2.7 to 3.6V DC

SMD Bluetooth module for IOS accessory with Antenna

Fujitsu MBH7BTZ42 Bluetooth Module

MPN:

MBH7BTZ42A

Manufacturer L3 Communications

Fujitsu Wireless Solutions

Description:

The MBH7BTZ42A version is SMD SPP Bluetooth module with antenna suitable for IoS accessory with power Class 2, CSR BC4-External.

Since the upper level protocol stacks and Serial Port Profile (SPP) are incorporated in the module, you can control Bluetooth® through text-based simple commands. Therefore, the module is the most suitable cable replacement solution for electronic devices that are connected via serial cable, and you can reduce development time and cost to develop Bluetooth® enabled applications. In addition, the module makes it possible for you to communicate with the application software on iOS devices such as iPhone and iPad. (It is necessary to connect CP chip to the module on your printed circuit board). Before using the module, please note that you must join the MFi licensing program provided by Apple Inc.

View our wide range of Bluetooth modules

View our portfolio of M2M and Wireless

See all products from our supplier Fujitsu Communication

Features:

  • Bluetooth Specification Version 2.1 + EDR compliant
  • CSR BlueCore4-External based
  • Power Class 2 (+4 dBm max)
  • Upper layer protocol stack (L2CAP, SDP, RFCOMM), and profiles(GAP, SPP), iPod accessory protocol (iAP1/iAP2)
  • Receiving senstivity: Basic rate -87dBm typical
  • Host interface: UART (9.6k ~ 1,382.4kbps)
  • Software interface: Simple proprietary command
  • Power supply: 2.7 to 3.6V DC
  • Dimensions: 17.6 x 10.6 x 1.9mm

Bluetooth smart module evaluation kit for MBH7BLZ07

Fujitsu  Evalluation Kit Bluetooth Module

MPN:

MBH7BLZ07-EF-KIT

Manufacturer L3 Communications

Fujitsu Wireless Solutions

Description:

Bluetooth smart module evaluation kit for MBH7BLZ07.

View our wide range of Bluetooth modules

View our portfolio of M2M and Wireless

See all products from our supplier Fujitsu Communication

Bluetooth smart module evaluation kit for MBH7BLZ07-1090xx

Fujitsu  Evalluation Kit Bluetooth Module

MPN:

MBH7BLZ07-EB-KIT

Manufacturer L3 Communications

Fujitsu Wireless Solutions

Description:

Bluetooth smart module evaluation kit for MBH7BLZ07-1090xx. The evaluation kit includes MBH-FUJI-E board, DAU-EB1 module mounted on daugther board with USB cable

View our wide range of Bluetooth modules

View our portfolio of M2M and Wireless

See all products from our supplier Fujitsu Communication

SMD SPP Bluetooth module without Antenna

Fujitsu MBH7BTZ39 Bluetooth Module

MPN:

MBH7BTZ39

Manufacturer L3 Communications

Fujitsu Wireless Solutions

Description:

The MBH7BTZ39 version is SPP Bluetooth module without antenna suitable for wireless communication of serial data with power Class 2, CSR BC4-External.

Since the upper level protocol stacks and Serial Port Profile (SPP) are incorporated in the module, you can control Bluetooth® through text-based simple commands. Therefore, the module is the most suitable cable replacement solution for electronic devices that are connected via serial cable, and you can reduce development time and cost to develop Bluetooth® enabled applications.

View our wide range of Bluetooth modules

View our portfolio of M2M and Wireless

See all products from our supplier Fujitsu Communication

Features:

  • Bluetooth specification version 2.1 + EDR compliant
  • Power Class 2 (+4dBm max.)
  • Upper layer protocol stack (L2CAP, SDP, RFCOMM) and profiles (GAP, SPP)
  • Receiver sensitivity: basic rate -87dBm typical
  • Hardware interface: UART (9.6k ~1,382.4kbps)
  • Software interface: simple proprietary command
  • Operating temperature: -40 to +85 °C
  • Supply voltage: 2.7 to 3.6VDC (VDD_REG)
  • I/O voltage: 1.7 to 3.6VDC
  • Built-in crystal
  • Built-in 8Mbit flash memory
  • Dimensions: 12.4 x 9.4 x 1.5mm

SMD Bluetooth module with Antenna

Fujitsu MBH7BTZ42 Bluetooth Module

MPN:

MBH7BTZ42

Manufacturer L3 Communications

Fujitsu Wireless Solutions

Description:

The MBH7BTZ42 version is SPP Bluetooth module with antenna suitable for wireless communication of serial data with power Class 2, CSR BC4-External.

Since the upper level protocol stacks and Serial Port Profile (SPP) are incorporated in the module, you can control Bluetooth® through text-based simple commands. Therefore, the module is the most suitable cable replacement solution for electronic devices that are connected via serial cable, and you can reduce development time and cost to develop Bluetooth® enabled applications.

View our wide range of Bluetooth modules

View our portfolio of M2M and Wireless

See all products from our supplier Fujitsu Communication

Features:

  • Bluetooth specification version 2.1 + EDR compliant
  • Power Class 2 (+4dBm max.)
  • Upper layer protocol stack (L2CAP, SDP, RFCOMM) and profiles (GAP, SPP)
  • Receiver sensitivity: basic rate -87dBm typical
  • Hardware interface: UART (9.6k ~1,382.4kbps)
  • Software interface: simple proprietary command
  • Operating temperature: -40 to +85 °C
  • Supply voltage: 2.7 to 3.6VDC (VDD_REG)
  • I/O voltage: 1.7 to 3.6VDC
  • Built-in crystal
  • Built-in 8Mbit flash memory
  • Dimensions: 17.6 x 10.6 x 1.9mm

Bluetooth Smart Module with Software Embedded

Fujitsu Communication MBH7BLZ0x serie Bluetooth-Smart-BLE

MPN:

MBH7BLZ0x(A) Series

Manufacturer L3 Communications

Fujitsu Wireless Solutions

Description:

The MBH7BLZ0x series is a Bluetooth smart module with software embedded with Fujitsu Components' Data Communication (FDC) profile for model MBH7BLZ01(A) (no antenna) and MBH7BLZ02(A) (with antenna) for serial data communication.

View our wide range of Bluetooth modules

View our portfolio of M2M and Wireless

See all products from our supplier Fujitsu Communication

Features:


  • Available version module with or withtout PCB antenna
  • Bluetooth Specification Version 4.1 (Single mode) compliant
  • Nordic Semiconductor nRF51822
  • Upper layer protocol stack (L2CAP, SM, ATT) and profiles (GATT, GAP, Fujitsu Component Data Communication)
  • Transmission output: 0dBm (4dBm max)
  • Receiving sensitivity: -88 dBm typical
  • Host interface: UART (115.2kbps)
  • Software interface: Simple proprietary command
  • Power supply: 1.9 to 3.6V DC

Bluetooth Smart Module, Software not Embedded

Fujitsu Communication MBH7BLZ0x serie Bluetooth-Smart-BLE

MPN:

MBH7BLZ0x-1090xx / MBH7BLZ0xA-1090xx Series

Manufacturer L3 Communications

Fujitsu Wireless Solutions

Description:

The MBH7BLZ0x(A)-1090xx and the MBH7BLZ02(A)-1090xx are a unique Bluetooth smart modules which has high flexibility of programming for user free designing (Blank module). Nordic semiconductor provides source program for upper profiles which are selectable according to customer's applications.

The MBH7BLZ01(A)-1090xx series have no antenna and MBH7BLZ02(A)-1090xx series have an antenna and is FCC/IC/CE certified.

View our wide range of Bluetooth modules

View our portfolio of M2M and Wireless

See all products from our supplier Fujitsu Communication

Features:

  • Bluetooth Specification Version 4.1 (Single mode) compliant
  • Nordic Semiconductor nRF51822 with 32-bit ARM® Cortex™ M0 CPU
  • 31 GPIO’s available
  • Transmission output: 0dBm (4dBm max)
  • Receiving sensitivity: -88dBm typical
  • Interface: UART, SPI, I2C, GPIO
  • Power supply: 1.9 to 3.6V DC

Ultra small Bluetooth Smart Peripheral Module with PCB Antenna

Fujitsu Communication MBH7BLZ07 Bluetooth-Smart

MPN:

MBH7BLZ07/MBH7BLZ07-1090xx

Manufacturer L3 Communications

Fujitsu Wireless Solutions

Description:

MBH7BLZ07 model is ultra small low power consumption Bluetooth smart module with embedded software with Fujitsu components' data devices. The MBH7BLZ07-1090xx series is low energy Bluetooth smart peripheral blank module with Nordic semiconductor S110 SoftDevice.

View our wide range of Bluetooth modules

View our portfolio of M2M and Wireless

See all products from our supplier Fujitsu Communication

Features:

  • Module with PCB antenna
  • Output Power: +4dBm max
  • Host interface: UART (115.2kbps), SPI, I2C, GPIO
  • Bluetooth specification version 4.1 (single mode, Peripheral module)
  • Output Power: +4dBm max
  • Host interface: UART (115.2kbps), SPI, I2C, GPIO
  • Operating temperature: -40 to +85 °C at power supply 1.9VDC to 3.6VDC, -25 to +75 °C at 1.8VDC to 3.6VDC
  • Module has embedded 32MHz clock
  • Dimensions: 11.5 x 7.9 x 1.7mm

Bluetooth smart module evaluation kit for MBH7BLZ0x-1090xx

Fujitsu  Evalluation Kit Bluetooth Module

MPN:

MBH7BLZ02-EB-KIT2

Manufacturer L3 Communications

Fujitsu Wireless Solutions

Description:

Bluetooth smart module evaluation kit for MBH7BLZ0x-1090xx.

View our wide range of Bluetooth modules

View our portfolio of M2M and Wireless

See all products from our supplier Fujitsu Communication

Bluetooth smart module evaluation kit for MBH7BLZ0x

Fujitsu  Evalluation Kit Bluetooth Module

MPN:

MBH7BLZ02-EF-KIT2

Manufacturer L3 Communications

Fujitsu Wireless Solutions

Description:

Bluetooth smart module evaluation kit for MBH7BLZ0x.

View our wide range of Bluetooth modules

View our portfolio of M2M and Wireless

See all products from our supplier Fujitsu Communication

Bluetooth smart module evaluation kit for MBH7BLZ0xA-1090xx

Fujitsu  Evalluation Kit Bluetooth Module

MPN:

MBH7BLZ02A-EB-KIT

Manufacturer L3 Communications

Fujitsu Wireless Solutions

Description:

Bluetooth smart module evaluation kit for MBH7BLZ0xA-1090xx.

View our wide range of Bluetooth modules

View our portfolio of M2M and Wireless

See all products from our supplier Fujitsu Communication

Bluetooth smart module evaluation kit for MBH7BLZ0xA

Fujitsu  Evalluation Kit Bluetooth Module

MPN:

MBH7BLZ02A-EF-KIT

Manufacturer L3 Communications

Fujitsu Wireless Solutions

Description:

Bluetooth smart module evaluation kit for MBH7BLZ0xA.

View our wide range of Bluetooth modules

View our portfolio of M2M and Wireless

See all products from our supplier Fujitsu Communication

Bluetooth Smart Beacon with Sensors

Fujitsu Communication MBH7BLZ07 Bluetooth Smart-Beacon

MPN:

FWM8BLZ02

Manufacturer L3 Communications

Fujitsu Wireless Solutions

Description:

The Fujitsu FWM8BLZ02 is a broadcast-only beacon with a 20m transmission range (typical) and a battery life of up to two years. The FWM8BLZ02-109042 model is Bluetooth smart beacon without sensor, and the FWM8BLZ02A-109047 model is a Bluetooth Smart sensor beacon with temperature and accelerometer sensors. Packaged in a 40.0mm x 31.0mm x 12.0mm plastic case, weighing only 10g, the beacon is powered by a CR2450 coin-cell battery and is based on Fujitsu's MBH7BLZ02 Bluetooth Smart module.

View our wide range of Bluetooth modules

View our portfolio of M2M and Wireless

See all products from our supplier Fujitsu Communication

Features:

  • Conforms to Bluetooth Smart Technology
  • With temperature and accelerometer sensors
  • OTA configuration mode and data can be re-configured
  • LED status
  • Pattern antenna
  • Transmit power: -16, -12, -8, -4, 0, +4dBm
  • Power supply: CR family Li coin battery
  • Operating temperature: -30 to +60 °C
  • 40 x 31 x 12 mm
  • Certifications: QDID, FCC, IC, CE, Radio Act

802.11ac Enterprise Wi-Fi IoT Module, Dual u.fl

Lantronix PremierWave-2050 WiFi IoT Module

MPN:

PremierWave 2050-Dual u.fl

Manufacturer L3 Communications

Lantronix

Description:

See how we solve customer design challenges with our technical expertise and the latest technology

Lantronix® PremierWave® 2050 enterprise Wi-Fi® IoT module is a series of embedded modules offering reliable and always-on 5G (802.11ac) enterprise Wi-Fi connectivity for mission critical industrial and commercial applications. The PW20501 module supports wireless connectivity via the U.FL connector on the module for transmit and receive along with a second U.FL for receive diversity.

View our wide range of WiFi 802.11

View our portfolio of M2M and Wireless

See all products from our supplier Lantronix

Features:

  • Industrial grade 5G (802.11ac) Wi-Fi module for high performance enterprise IoT
  • Enterprise grade security (WPA2 enterprise, SSL, TLS)
  • Fully certified module mitigates regulatory and product availability risks
  • Production ready SW with compact footprint
  • Simplified manufacturing and deployment time provisioning workflows
  • Simultaneous AP and client access
  • Ethernet to Wi-Fi bridge (AP and/or Wi-Fi client)
  • U.FL connectors
  • Industrial operating temperature: -40C to +85C
  • 5 Year Warranty

802.11ac Enterprise Wi-Fi IoT Module, Chip Ant and u.fl

Lantronix PremierWave-2050 Chip-Ant+u-FL WiFi Module

MPN:

PremierWave 2050-Chip Ant + u.fl

Manufacturer L3 Communications

Lantronix

Description:

See how we solve customer design challenges with our technical expertise and the latest technology

Lantronix® PremierWave® 2050 enterprise Wi-Fi® IoT module is a series of embedded modules offering reliable and always-on 5G (802.11ac) enterprise Wi-Fi connectivity for mission critical industrial and commercial applications. The PW20502 module offers an on-module ceramic chip antenna for transmit and receive along with a U.FL for connection to an additional antenna for receive diversity.

View our wide range of WiFi 802.11

View our portfolio of M2M and Wireless

See all products from our supplier Lantronix

Features:

  • Industrial grade 5G (802.11ac) Wi-Fi module for high performance enterprise IoT
  • Enterprise grade security (WPA2 enterprise, SSL, TLS)
  • Fully certified module mitigates regulatory and product availability risks
  • Production ready SW with compact footprint
  • Simplified manufacturing and deployment time provisioning workflows
  • Simultaneous AP and client access
  • Ethernet to Wi-Fi bridge (AP and/or Wi-Fi client)
  • Antenna diversity with on-module antenna
  • Industrial operating temperature: -40C to +85C
  • 5 Year Warranty

Evaluation Kit, 802.11ac Enterprise Wi-Fi IoT Module, Dual u.fl

Evaluation Kit WiFi IoT Module with Dual Antenna

MPN:

PremierWave 2050-EVAL KIT- Dual u.fl

Manufacturer L3 Communications

Lantronix

Description:

This kit identified by part number PWGG2051000K includes an evaluation board with installed PW20501 module which has two U.FL connectors and two RP-SMA connectors. The evaluation kit for the PremierWave 2050 module provides an excellent starting point for evaluating the key features and capabilities of the module. The kit can also be used with other elements of the system to facilitate quick integration via the available interface ports.

Evaluation Kit includes:

  • Evaluation board with installed PremierWave 2050 module
  • 5V, 1A wall adaptor
  • 2 dBi swivel type antenna (2x in PWGG2051000K)
  • CAT5 Ethernet cable (10 feet)
  • View our wide range of WiFi 802.11

    View our portfolio of M2M and Wireless

    See all products from our supplier Lantronix

    Features:

    • Two DB9 serial port connectors with multi-protocol RS232, RS422, RS485 transceivers at rates up to 1 Mbps. Serial port modes are configured by on-board jumpers.
    • One RJ45 10/100 Ethernet port with an integrated PoE regulator to allow powering from a standard POE PSE.
    • One mini-type B USB device port connector for 5V input power. This port also has an integrated USB-to-serial converter. The USB-to-s
    • A second mini-type B USB device port is available for connection to the PremierWave 2050 module USB 2.0 high speed device port.
    • Two USB host ports are available on a dual USB type A connector. One of the ports is USB 2.0 high speed and the second is USB 2.0 full speed.
    • LEDs are available for the Ethernet, WLAN, and system status outputs. The Ethernet LEDs are integrated with the RJ45 Jack.
    • Access to all logic level IO signals on the PremierWave 2050 via header pins for measurements and connections to other places.

    Evaluation Kit, 802.11ac Enterprise Wi-Fi IoT Module, Chip Ant and u.fl

    Lantronix PremierWave-2050 Evaluation Kit WiFi- IoT Module with Chip Antenna

    MPN:

    PremierWave 2050-EVAL KIT-Chip Ant + u.fl

    Manufacturer L3 Communications

    Lantronix

    Description:

    This kit with part number PWGG2052000K includes an evaluation board with installed PW20502 module which has one on-module antenna, one U.FL connector, and one RP-SMA connector. The evaluation kit for the PremierWave 2050 module provides an excellent starting point for evaluating the key features and capabilities of the module. The kit can also be used with other elements of the system to facilitate quick integration via the available interface ports.

    Evaluation Kit includes:

    • Evaluation board with installed PremierWave 2050 module
    • 5V, 1A wall adaptor
    • 1 dBi swivel type antenna (1x in PWGG2052000K)
    • CAT5 Ethernet cable (10 feet)

    View our wide range of WiFi 802.11

    View our portfolio of M2M and Wireless

    See all products from our supplier Lantronix

    Features:

    • Two DB9 serial port connectors with multi-protocol RS232, RS422, RS485 transceivers at rates up to 1 Mbps. Serial port modes are configured by on-board jumpers.
    • One RJ45 10/100 Ethernet port with an integrated PoE regulator to allow powering from a standard POE PSE.
    • One mini-type B USB device port connector for 5V input power. This port also has an integrated USB-to-serial converter. The USB-to-s
    • A second mini-type B USB device port is available for connection to the PremierWave 2050 module USB 2.0 high speed device port.
    • Two USB host ports are available on a dual USB type A connector. One of the ports is USB 2.0 high speed and the second is USB 2.0 full speed.
    • LEDs are available for the Ethernet, WLAN, and system status outputs. The Ethernet LEDs are integrated with the RJ45 Jack.
    • Access to all logic level IO signals on the PremierWave 2050 via header pins for measurements and connections to other places.

    Module Adds Multi-GNSS, World’s Smallest Footprint

    OriginGPS ORG4033-MK04 Multi Micro Spider Module

    MPN:

    ORG4033-MK04

    Manufacturer L3 Communications

    OriginGPS

    Description:

    OriginGPS’ORG4033-MK04 model is a New Multi Micro Spider Supports GPS, Glonass, BeiDou and Galileo, Featuring MediaTek Technology for Optimal Performance, Signal Accuracy and Power Efficiency Within Ultra-Small Size. The Multi Micro Spider is uniquely positioned for applications that require quick movement, minimal power consumption and ultra-small form factors, ranging from wearables to drones.

    Multi Micro Spider ORG4033 module offers superior sensitivity and outstanding performance, achieving rapid TTFF in less than one second, accuracy of approximately two meters, and tracking sensitivity of -165dBm.

    Sized only 5.6mm x 5.6mm Multi Micro Spider ORG4033 module is industry’s small sized, record breaking solution.

    View our wide range of GPS Navigation

    View our portfolio of M2M and Wireless

    See all products from our supplier OriginGPS

    Features:

    • Autonomous operation
    • OriginGPS Noise Free Zone System (NFZ™)
    • technology
    • Active or Passive antenna support
    • Fully integrating: Dual-stage LNA, SAW filter, TCXO, RTC crystal, GNSS SoC, LDO regulator, RF shield, PMU
    • Concurrent tracking of multiple constellations
    • Uses GPS and GLONASS/BEIDOU, QZSS constellations.
    • GPS L1 1575.42 frequency, C/A code
    • GLONASS L1 FDMA 1598-1606MHz frequency band, SP signal.
    • BEIDOU B1 1561.098MHz frequency band.
    • SBAS (WAAS, EGNOS, MSAS and GAGAN)
    • Concurrent tracking of multiple constellations
    • DGPS capability
    • 99 search channels and 33 simultaneous tracking channels
    • Ultra-high Sensitivity down to -165dBm enabling Indoor Tracking
    • TTFF of < 1s in 50% of trials under Hot Start conditions
    • Low Power Consumption of 15mW
    • High Accuracy of < 2.5m in 50% of trials
    • AGPS support: Embedded Assist System (EASY) and Extended Prediction Orbit (EPO) and HotStill
    • Indoor and outdoor Multipath and cross-correlation mitigation
    • Jamming Rejection – 12 multi-tone Active Interference Cancellation (AIC)
    • 8 Megabit built in flash
    • Power management modes: Full Power Continuous, Standby, Periodic and AlwaysLocate™
    • NMEA commands and data output over UART serial interface
    • High update messages rate of 1,2,5,10Hz
    • 1PPS Output
    • Static Navigation
    • Single voltage supply 3.3V
    • Ultra-small LGA footprint of 5.6mm x 5.6mm
    • Ultra-low weight of 0.2g
    • Surface Mount Device (SMD)
    • Optimized for automatic assembly and reflow equipment
    • Operating from -40°C to +85°C
    • FCC, CE, VCCI compliant
    • RoHS II/REACH compliant

    HL8529, 3G-HSPA, CF3 SMD Module

    Sierra Wireless AirPrime-HL Series

    MPN:

    AirPrime HL8529

    Manufacturer L3 Communications

    Sierra Wireless

    Description:

    HL8529 is a 3G-HSPA module with voice primarily for North America. Supported frequency bands are: 3G-HSPA 850/1900 FREE unlimited FOTA, AirVantage Cloud ready. Very low power consumption. Separate base band and PA power supply inputs simplifies power supply design and extend operational life for battery powered devices. Package is a 22 x 23 mm CF3 SMD LGA package. As an option to soldering, adding flexibility, the HL series Snap-in socket can be soldered on the same PCB pattern. The AirPrime® HL Series modules is the smallest, scalable, flexible solution in a compact and easy-to-integrate form factor that is completely interchangeable among 2G, 3G, and 4G technologies. Compact form factor, network scalability, and ready-to-use firmware upgrades make these modules ideal for industrial M2M solution designs where size and deployment longevity are important considerations.

    View our wide range of 2G / 3G / 4G-LTE Wireless Modules

    View our portfolio of M2M and Wireless

    See all products from our supplier Sierra Wireless

    Features:

    • Region: Primarily for North America

    • Air interface: 3G-HSPA
    • 3G Bands: B2 (1900), B5 (850)
    • Peak data rate: DL 7.2 Mbps, UL 5.76 Mbps
    • Form factor: CF3 SMD LGA package, 22 x 23 x 2.5 mm
    • Supply Voltage: 3.7 V nominal, max 4.5 V
    • Separate Base Band (min 3.2 V) and PA (min 2.8 V) power supply inputs for extended battery life.
    • Operating Temperature: -40°C to +85°C
    • Control, Software and Features

    • Control options: AT Commands
    • Internet services: TCP, UDP, FTP, HTTP, HTTPS, SMTP, POP3, SSL
    • Host OS: Android, Linux, Windows
    • FOTA: Free and unlimited through AirVantage
    • Cloud service: AirVantage Cloud ready
    • Network scan and monitoring
    • Jamming detection
    • Antenna detection
    • Interfaces

    • 1x UART, 8 wire
    • 1x USB 2.0 Full Speed
    • 2x ADC
    • 12x GPIO
    • 1x VGPIO
    • 2x PWM
    • 2x System Clock Out
    • 1x Active Low Reset
    • 1x Active Low Power On
    • 1x SIM interface: 1.8/3V
    • 1x Tx Burst indicator
    • 1x RF
    • 1x Debug
    • 1x JTAG
    • 1x Backup Battery In, Charging Out
    • 1x Digital Audio, PCM

    HL7519, 4G-LTE cat 4, CF3 SMD Module

    Sierra Wireless AirPrime-HL Series

    MPN:

    AirPrime HL7519

    Manufacturer L3 Communications

    Sierra Wireless

    Description:

    HL7519 is a 4G-LTE cat 4 module primarily for North America. Supported frequency bands are: 4G-LTE B2 (1900), B4 (1700), B13 (700) FREE unlimited FOTA, AirVantage Cloud ready. Very low power consumption. Separate base band and PA power supply inputs simplifies power supply design and extend operational life for battery powered devices. Package is a 22 x 23 mm CF3 SMD LGA package. As an option to soldering, adding flexibility, the HL series Snap-in socket can be soldered on the same PCB pattern. The AirPrime® HL Series modules is the smallest, scalable, flexible solution in a compact and easy-to-integrate form factor that is completely interchangeable among 2G, 3G, and 4G technologies. Compact form factor, network scalability, and ready-to-use firmware upgrades make these modules ideal for industrial M2M solution designs where size and deployment longevity are important considerations.

    View our wide range of 2G / 3G / 4G-LTE Wireless Modules

    View our portfolio of M2M and Wireless

    See all products from our supplier Sierra Wireless

    Features:

    • Region: Primarily for North America

    • Air interface: 4G-LTE cat 4
    • 4G Bands: B2 (1900), B4 (1700), B13 (700)
    • Carrier: Verizon
    • Peak data rate: DL 150 Mbps, UL 50 Mbps
    • Form factor: CF3 SMD LGA package, 22 x 23 x 2.5 mm
    • Supply Voltage: 3.7 V nominal, max 4.5 V
    • Separate Base Band (min 3.2 V) and PA (min 2.8 V) power supply inputs for extended battery life.
    • Operating Temperature: -40°C to +85°C
    • Control, Software and Features

    • Control options: AT Commands
    • Internet services: TCP, UDP, FTP, HTTP, HTTPS, SMTP, POP3, SSL
    • Host OS: Android, Linux, Windows
    • FOTA: Free and unlimited through AirVantage
    • Cloud service: AirVantage Cloud ready
    • Network scan and monitoring
    • Jamming detection
    • Antenna detection
    • Interfaces

    • 1x UART, 8 wire
    • 1x USB 2.0 Full Speed
    • 1x ADC
    • 12x GPIO
    • 1x VGPIO
    • 2x System Clock Out
    • 1x Active Low RESET
    • 1x Active Low POWER ON
    • 1x SIM interface: 1.8/3V
    • 1x Tx On
    • 1x Rx/Tx port
    • 1x Rx Diversity port
    • 1x Debug
    • 1x JTAG
    • 1x Backup Battery

    HL7528, 4G-LTE cat 4, CF3 SMD Module

    Sierra Wireless AirPrime-HL Series

    MPN:

    AirPrime HL7528

    Manufacturer L3 Communications

    Sierra Wireless

    Description:

    HL7528 is a 4G-LTE cat 4 module primarily for South Korea. Supported frequency bands are: B1 (2100), B3 (1800), B5 (850), B7 (2600) FREE unlimited FOTA, AirVantage Cloud ready. Very low power consumption. Separate base band and PA power supply inputs simplifies power supply design and extend operational life for battery powered devices. Package is a 22 x 23 mm CF3 SMD LGA package. As an option to soldering, adding flexibility, the HL series Snap-in socket can be soldered on the same PCB pattern. The AirPrime® HL Series modules is the smallest, scalable, flexible solution in a compact and easy-to-integrate form factor that is completely interchangeable among 2G, 3G, and 4G technologies. Compact form factor, network scalability, and ready-to-use firmware upgrades make these modules ideal for industrial M2M solution designs where size and deployment longevity are important considerations.

    View our wide range of 2G / 3G / 4G-LTE Wireless Modules

    View our portfolio of M2M and Wireless

    See all products from our supplier Sierra Wireless

    Features:

    • Region: Primarily for South Korea

    • Air interface: 4G-LTE cat 4
    • 4G Bands: B1 (2100), B3 (1800), B5 (850), B7 (2600)
    • Carrier: Korea
    • Peak data rate: DL 150 Mbps, UL 50 Mbps
    • Form factor: CF3 SMD LGA package, 22 x 23 x 2.5 mm
    • Supply Voltage: 3.7 V nominal, max 4.5 V
    • Separate Base Band (min 3.2 V) and PA (min 2.8 V) power supply inputs for extended battery life.
    • Operating Temperature: -40°C to +85°C
    • Control, Software and Features

    • Control options: AT Commands
    • Internet services: TCP, UDP, FTP, HTTP, HTTPS, SMTP, POP3, SSL
    • Host OS: Android, Linux, Windows
    • FOTA: Free and unlimited through AirVantage
    • Cloud service: AirVantage Cloud ready
    • Network scan and monitoring
    • Jamming detection
    • Antenna detection
    • Interfaces

    • 1x UART, 8 wire
    • 1x USB 2.0 Full Speed
    • 1x HSIC
    • 1x ADC
    • 14x GPIO
    • 1x VGPIO
    • 2x System Clock Out
    • 1x Active Low RESET
    • 1x Active Low POWER ON
    • 2x SIM interface: 1.8/3V
    • 1x Tx On
    • 1x Rx/Tx port
    • 1x Rx Diversity port
    • 1x Debug
    • 1x JTAG
    • 1x Backup Battery
    • 1x PCM

    HL7548, 4G-LTE cat 4, CF3 SMD Module

    Sierra Wireless AirPrime-HL Series

    MPN:

    AirPrime HL7548

    Manufacturer L3 Communications

    Sierra Wireless

    Description:

    HL7548 is a 4G-LTE cat 4 module primarily for North America. Supported frequency bands are: B2 (1900), B4 (1700), B5 (850), B17 (700) FREE unlimited FOTA, AirVantage Cloud ready. Very low power consumption. Separate base band and PA power supply inputs simplifies power supply design and extend operational life for battery powered devices. Package is a 22 x 23 mm CF3 SMD LGA package. As an option to soldering, adding flexibility, the HL series Snap-in socket can be soldered on the same PCB pattern. The AirPrime® HL Series modules is the smallest, scalable, flexible solution in a compact and easy-to-integrate form factor that is completely interchangeable among 2G, 3G, and 4G technologies. Compact form factor, network scalability, and ready-to-use firmware upgrades make these modules ideal for industrial M2M solution designs where size and deployment longevity are important considerations.

    View our wide range of 2G / 3G / 4G-LTE Wireless Modules

    View our portfolio of M2M and Wireless

    See all products from our supplier Sierra Wireless

    Features:

    • Region: Primarily for North America

    • Air interface: 4G-LTE cat 4
    • 4G Bands: B2 (1900), B4 (1700), B5 (850), B17 (700)
    • Carrier: AT&T, T-Mobile, Verizon, Canada
    • Peak data rate: DL 150 Mbps, UL 50 Mbps
    • Form factor: CF3 SMD LGA package, 22 x 23 x 2.5 mm
    • Supply Voltage: 3.7 V nominal, max 4.5 V
    • Separate Base Band (min 3.2 V) and PA (min 2.8 V) power supply inputs for extended battery life.
    • Operating Temperature: -40°C to +85°C
    • Control, Software and Features

    • Control options: AT Commands
    • Internet services: TCP, UDP, FTP, HTTP, HTTPS, SMTP, POP3, SSL
    • Host OS: Android, Linux, Windows
    • FOTA: Free and unlimited through AirVantage
    • Cloud service: AirVantage Cloud ready
    • Network scan and monitoring
    • Jamming detection
    • Antenna detection
    • Interfaces

    • 1x UART, 4 wire
    • 1x USB 2.0 Full Speed
    • 1x ADC
    • 12x GPIO
    • 1x VGPIO
    • 2x System Clock Out
    • 1x Active Low RESET
    • 1x Active Low POWER ON
    • 1x SIM interface: 1.8/3V
    • 1x Tx On
    • 1x Rx/Tx port
    • 1x Rx Diversity port
    • 1x Debug
    • 1x JTAG
    • 1x Backup Battery

    HL7549, 4G-LTE cat 4, CF3 SMD Module

    Sierra Wireless AirPrime-HL Series

    MPN:

    AirPrime HL7549

    Manufacturer L3 Communications

    Sierra Wireless

    Description:

    HL7549 is a 4G-LTE cat 4 module primarily for Australia and New Zealand. Supported frequency bands are: B3 (1800), B7 (2600), B28 (700) FREE unlimited FOTA, AirVantage Cloud ready. Very low power consumption. Separate base band and PA power supply inputs simplifies power supply design and extend operational life for battery powered devices. Package is a 22 x 23 mm CF3 SMD LGA package. As an option to soldering, adding flexibility, the HL series Snap-in socket can be soldered on the same PCB pattern. The AirPrime® HL Series modules is the smallest, scalable, flexible solution in a compact and easy-to-integrate form factor that is completely interchangeable among 2G, 3G, and 4G technologies. Compact form factor, network scalability, and ready-to-use firmware upgrades make these modules ideal for industrial M2M solution designs where size and deployment longevity are important considerations.

    View our wide range of 2G / 3G / 4G-LTE Wireless Modules

    View our portfolio of M2M and Wireless

    See all products from our supplier Sierra Wireless

    Features:

    • Region: Primarily for Australia and New Zealand

    • Air interface: 4G-LTE cat 4
    • 4G Bands: B3 (1800), B7 (2600), B28 (700)
    • Carrier: Telstra
    • Peak data rate: DL 150 Mbps, UL 50 Mbps
    • Form factor: CF3 SMD LGA package, 22 x 23 x 2.5 mm
    • Supply Voltage: 3.7 V nominal, max 4.5 V
    • Separate Base Band (min 3.2 V) and PA (min 2.8 V) power supply inputs for extended battery life.
    • Operating Temperature: -40°C to +85°C
    • Control, Software and Features

    • Control options: AT Commands
    • Internet services: TCP, UDP, FTP, HTTP, HTTPS, SMTP, POP3, SSL
    • Host OS: Android, Linux, Windows
    • FOTA: Free and unlimited through AirVantage
    • Cloud service: AirVantage Cloud ready
    • Network scan and monitoring
    • Jamming detection
    • Antenna detection
    • Interfaces

    • 1x UART, 8 wire
    • 1x USB 2.0 Full Speed
    • 1x ADC
    • 12x GPIO
    • 1x VGPIO
    • 2x System Clock Out
    • 1x Active Low RESET
    • 1x Active Low POWER ON
    • 1x SIM interface: 1.8/3V
    • 1x Tx On
    • 1x Rx/Tx port
    • 1x Rx Diversity port
    • 1x Debug
    • 1x JTAG
    • 1x Backup Battery

    HL7588, 4G-LTE cat 4, CF3 SMD Module

    Sierra Wireless AirPrime-HL Series

    MPN:

    AirPrime HL7588

    Manufacturer L3 Communications

    Sierra Wireless

    Description:

    HL7588 is a 4G-LTE cat 4 module with 3G fall back primarily for North America. Supported frequency bands are: 4G B2 (1900), B4 (1700), B5 (850), B17 (700) ; 3G B2 (1900), B5 (850) FREE unlimited FOTA, AirVantage Cloud ready. Very low power consumption. Separate base band and PA power supply inputs simplifies power supply design and extend operational life for battery powered devices. Package is a 22 x 23 mm CF3 SMD LGA package. As an option to soldering, adding flexibility, the HL series Snap-in socket can be soldered on the same PCB pattern. The AirPrime® HL Series modules is the smallest, scalable, flexible solution in a compact and easy-to-integrate form factor that is completely interchangeable among 2G, 3G, and 4G technologies. Compact form factor, network scalability, and ready-to-use firmware upgrades make these modules ideal for industrial M2M solution designs where size and deployment longevity are important considerations.

    View our wide range of 2G / 3G / 4G-LTE Wireless Modules

    View our portfolio of M2M and Wireless

    See all products from our supplier Sierra Wireless

    Features:

    • Region: Primarily for North America

    • Air interface: 4G-LTE cat 4 with fall back to 3G-HSPA+
    • 4G Bands: B2 (1900), B4 (1700), B5 (850), B17 (700)
    • 3G Bands: B2 (1900), B5 (850)
    • Carrier: AT&T, T-Mobile, Verizon, Canada
    • Peak data rate: DL 150 Mbps, UL 50 Mbps
    • Form factor: CF3 SMD LGA package, 22 x 23 x 2.5 mm
    • Supply Voltage: 3.7 V nominal, max 4.5 V
    • Separate Base Band (min 3.2 V) and PA (min 2.8 V) power supply inputs for extended battery life.
    • Operating Temperature: -40°C to +85°C
    • Control, Software and Features

    • Control options: AT Commands
    • Internet services: TCP, UDP, FTP, HTTP, HTTPS, SMTP, POP3, SSL
    • Host OS: Android, Linux, Windows
    • FOTA: Free and unlimited through AirVantage
    • Cloud service: AirVantage Cloud ready
    • Network scan and monitoring
    • Jamming detection
    • Antenna detection
    • Interfaces

    • 1x UART, 8 wire
    • 1x USB 2.0 Full Speed
    • 1x ADC
    • 12x GPIO
    • 1x VGPIO
    • 2x System Clock Out
    • 1x Active Low RESET
    • 1x Active Low POWER ON
    • 1x SIM interface: 1.8/3V
    • 1x Tx On
    • 1x Rx/Tx port
    • 1x Rx Diversity port
    • 1x Debug
    • 1x JTAG
    • 1x Backup Battery
    • 1x Digital Audio(PCM)
    • Audio

    • Digital audio: PCM
    • Codec: FR, EFR, HR, AMR
    • Echo cancellation
    • Noise reduction

    HL7648, 4G-LTE cat 1, CF3 SMD Module

    Sierra Wireless AirPrime-HL Series

    MPN:

    AirPrime HL7648

    Manufacturer L3 Communications

    Sierra Wireless

    Description:

    HL7648 is a 4G-LTE cat 1 module primarily for North America. Supported frequency bands are: 4G-LTE B2 (1900), B4 (1700), B13 (700) FREE unlimited FOTA, AirVantage Cloud ready. HL7648 is optimised for IoT and M2M applications where for example low cost and low power consumption are key parameters. Very low power consumption. Separate base band and PA power supply inputs simplifies power supply design and extend operational life for battery powered devices. Package is a 22 x 23 mm CF3 SMD LGA package. As an option to soldering, adding flexibility, the HL series Snap-in socket can be soldered on the same PCB pattern. The AirPrime® HL Series modules is the smallest, scalable, flexible solution in a compact and easy-to-integrate form factor that is completely interchangeable among 2G, 3G, and 4G technologies. Compact form factor, network scalability, and ready-to-use firmware upgrades make these modules ideal for industrial M2M solution designs where size and deployment longevity are important considerations.

    View our wide range of 2G / 3G / 4G-LTE Wireless Modules

    View our portfolio of M2M and Wireless

    See all products from our supplier Sierra Wireless

    Features:

    • Region: Primarily for North America

    • Air interface: 4G-LTE cat 1
    • 4G Bands: B2 (1900), B4 (1700), B12 (700)
    • Carrier: AT&T, T-Mobile, Canada
    • Peak data rate: DL 10 Mbps, UL 5 Mbps
    • Form factor: CF3 SMD LGA package, 22 x 23 x 2.5 mm
    • Supply Voltage: 3.7 V nominal, max 4.5 V
    • Separate Base Band (min 3.2 V) and PA (min 2.8 V) power supply inputs for extended battery life.
    • Operating Temperature: -40°C to +85°C
    • Control, Software and Features

    • Control options: AT Commands
    • Internet services: TCP, UDP, FTP, HTTP, HTTPS, SMTP, POP3, SSL
    • Host OS: Android, Linux, Windows
    • FOTA: Free and unlimited through AirVantage
    • Cloud service: AirVantage Cloud ready
    • Network scan and monitoring
    • Jamming detection
    • Antenna detection
    • Interfaces

    • 1x UART, 8 wire
    • 1x USB 2.0 Full Speed
    • 1x ADC
    • 12x GPIO
    • 1x VGPIO
    • 2x System Clock Out
    • 1x Active Low RESET
    • 1x Active Low POWER ON
    • 1x SIM interface: 1.8/3V
    • 1x Tx On
    • 1x RF Rx/Tx port
    • 1x Debug
    • 1x JTAG
    • 1x Backup Battery

    HL7690, 4G-LTE cat 1, CF3 SMD Module

    Sierra Wireless AirPrime-HL Series

    MPN:

    AirPrime HL7690

    Manufacturer L3 Communications

    Sierra Wireless

    Description:

    HL7690 is a 4G-LTE cat 1 band module primarily for Europe. Supported frequency bands are: 4G-LTE B3 (1800), B8 (900), B20 (800) FREE unlimited FOTA, AirVantage Cloud ready. HL7690 is optimised for IoT and M2M applications where for example low cost and low power consumption are key parameters. Very low power consumption. Separate base band and PA power supply inputs simplifies power supply design and extend operational life for battery powered devices. Package is a 22 x 23 mm CF3 SMD LGA package. As an option to soldering, adding flexibility, the HL series Snap-in socket can be soldered on the same PCB pattern. The AirPrime® HL Series modules is the smallest, scalable, flexible solution in a compact and easy-to-integrate form factor that is completely interchangeable among 2G, 3G, and 4G technologies. Compact form factor, network scalability, and ready-to-use firmware upgrades make these modules ideal for industrial M2M solution designs where size and deployment longevity are important considerations.

    View our wide range of 2G / 3G / 4G-LTE Wireless Modules

    View our portfolio of M2M and Wireless

    See all products from our supplier Sierra Wireless

    Features:

    • Region: Primarily for Europe

    • Air interface: 4G-LTE cat 1
    • 4G Bands: B3 (1800), B8 (900), B20 (800)
    • Carrier: Europe
    • Peak data rate: DL 10 Mbps, UL 5 Mbps
    • Form factor: CF3 SMD LGA package, 22 x 23 x 2.5 mm
    • Supply Voltage: 3.7 V nominal, max 4.5 V
    • Separate Base Band (min 3.2 V) and PA (min 2.8 V) power supply inputs for extended battery life.
    • Operating Temperature: -40°C to +85°C
    • Control, Software and Features

    • Control options: AT Commands
    • Internet services: TCP, UDP, FTP, HTTP, HTTPS, SMTP, POP3, SSL
    • Host OS: Android, Linux, Windows
    • FOTA: Free and unlimited through AirVantage
    • Cloud service: AirVantage Cloud ready
    • Network scan and monitoring
    • Jamming detection
    • Antenna detection
    • Interfaces

    • 1x UART, 8 wire
    • 1x USB 2.0 Full Speed
    • 1x ADC
    • 12x GPIO
    • 1x VGPIO
    • 2x System Clock Out
    • 1x Active Low RESET
    • 1x Active Low POWER ON
    • 1x SIM interface: 1.8/3V
    • 1x Tx On
    • 1x RF Rx/Tx port
    • 1x Debug
    • 1x JTAG
    • 1x Backup Battery
    • rature: -40°C to +85°C

    HL7692, 4G-LTE cat 1, CF3 SMD Module

    Sierra Wireless AirPrime-HL Series

    MPN:

    AirPrime HL7692

    Manufacturer L3 Communications

    Sierra Wireless

    Description:

    HL7692 is a 4G-LTE cat 1 module primarily for Europe with fall back to 2G-GSM/GPRS/EDGE. Supported frequency bands are: 4G-LTE B3 (1800), B8 (900), B20 (800) ; 2G-900/1800. FREE unlimited FOTA, AirVantage Cloud ready. HL7692 is optimised for IoT and M2M applications where for example low cost and low power consumption are key parameters. Very low power consumption. Separate base band and PA power supply inputs simplifies power supply design and extend operational life for battery powered devices. Package is a 22 x 23 mm CF3 SMD LGA package. As an option to soldering, adding flexibility, the HL series Snap-in socket can be soldered on the same PCB pattern. The AirPrime® HL Series modules is the smallest, scalable, flexible solution in a compact and easy-to-integrate form factor that is completely interchangeable among 2G, 3G, and 4G technologies. Compact form factor, network scalability, and ready-to-use firmware upgrades make these modules ideal for industrial M2M solution designs where size and deployment longevity are important considerations.

    View our wide range of 2G / 3G / 4G-LTE Wireless Modules

    View our portfolio of M2M and Wireless

    See all products from our supplier Sierra Wireless

    Features:

    • Region: Primarily for Europe

    • Air interface: 4G-LTE cat 1 with fall back to 2G-GSM/GPRS/EDGE
    • 4G Bands: B3 (1800), B8 (900), B20 (800)
    • 2G Bands:
    • 2G Bands: E-GSM 900, DCS 1800
    • Carrier: Europe
    • Peak data rate: DL 10 Mbps, UL 5 Mbps
    • Form factor: CF3 SMD LGA package, 22 x 23 x 2.5 mm
    • Supply Voltage: 3.7 V nominal, max 4.5 V
    • Separate Base Band (min 3.2 V) and PA (min 2.8 V) power supply inputs for extended battery life.
    • Operating Temperature: -40°C to +85°C
    • Control, Software and Features

    • Control options: AT Commands
    • Internet services: TCP, UDP, FTP, HTTP, HTTPS, SMTP, POP3, SSL
    • Host OS: Android, Linux, Windows
    • FOTA: Free and unlimited through AirVantage
    • Cloud service: AirVantage Cloud ready
    • Network scan and monitoring
    • Jamming detection
    • Antenna detection
    • Interfaces

    • 1x UART, 8 wire
    • 1x USB 2.0 Full Speed
    • 1x ADC
    • 12x GPIO
    • 1x VGPIO
    • 2x System Clock Out
    • 1x Active Low RESET
    • 1x Active Low POWER ON
    • 1x SIM interface: 1.8/3V
    • 1x Tx On
    • 1x RF Rx/Tx port
    • 1x Debug
    • 1x JTAG
    • 1x Backup Battery

    MC7455, 4G-LTE cat 6, Mini PCIe Module

    Sierra Wireless AirPrime-MC Series

    MPN:

    AirPrime MC7455

    Manufacturer L3 Communications

    Sierra Wireless

    Description:

    MC7455 is a 4G-LTE cat 6 module (FDD & TDD), with a down link data rate of up to 300 Mbps, primarily for Europe, North and South America. Support for Carrier Aggregation (CA) and MIMO. Fall back to 3G-HSPA+DC with Rx diversity. A GNSS receiver is integrated. Supported frequency bands: 4G B1-B5, B7, B8, B12, B13, B20, B25, B26, B29, B30, B41 ; 3G B1-B5, B8. Form factor is PCIe Mini Card F1, 51 x 30 mm. Designed for high speed industrial M2M and mobile computing solutions, the AirPrime® MC74 series embedded modules deliver high speed connectivity on LTE and HSPA+ networks. Based on the PCI Express Mini Card standard with a USB host interface, the MC series modules offer an easy upgrade path to new network technologies and global access to high speed networks.

    View our wide range of 2G / 3G / 4G-LTE Wireless Modules

    View our portfolio of M2M and Wireless

    See all products from our supplier Sierra Wireless

    Features:

    • Region: Primarily for Europe, North America, South America

    • Air interface: 4G-LTE cat 6 (FDD & TDD) with CA (Carrier Aggregation) and MIMO, 3G-HSPA+DC with Rx Diversity, GNSS
    • 4G bands: B1 (2100), B2 (1900), B3 (1800), B4 (1700), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B20 (800), B25 (1900), B26 (850), B29 (700), B30 (2300), B41 (2500/TDD)
    • 3G bands: B1 (2100), B2 (1900), B3 (1800), B4 (1700), B5 (850), B8 (900)
    • Peak Data rate: DL 300 Mbps, UL 50 Mbps
    • GNSS (GPS, Glonass, Beidou, Galileo*): Qualcomm
    • Form factor: PCIe Mini Card F1, 51 x 30 x 2.5 mm
    • Supply Voltage: 3.3 V nominal
    • Operating Temperature: -40°C to +85°C
    • Control, Software and Features

    • Control options: AT Commands, QMI SDK, MBIM
    • For optimum control the QMI SDK is recommended
    • Drivers: Android, Linux, Windows
    • Switch networks anytime with up to three different certified firmware variants on board.
    • Connectors

    • System connector: 52 position Mini PCIe
    • Antenna RF connector: 3x U.FL (Main RF, Aux RF, GPS with DC bias)
    • Interfaces

    • 1x USB 3.0 and USB 2.0 High Speed
    • 1x Wake host
    • 1x Wireless disable
    • 1x System RESET
    • 3x Antenna Control (muxed with GPIO 1-3)
    • 1x Dynamic Power Control, DPR (muxed with GPIO 4)
    • 4x GPIO (muxed with Antenna control or DPR)
    • 1x LED driver output
    • 2x SIM interface: 1.8/3V
    • 1x Digital Audio
    • Audio

    • Optional
    • Digital audio: PCM/I2S
    • 4G: VoLTE
    • 3G: Circuit Switched Fall Back (CSFB voice)

    MC7430, 4G-LTE cat 6, Mini PCIe Module

    Sierra Wireless AirPrime-MC Series

    MPN:

    AirPrime MC7430

    Manufacturer L3 Communications

    Sierra Wireless

    Description:

    MC7430 is a 4G-LTE cat 6 module (FDD & TDD), with a down link data rate of up to 300 Mbps, primarily for Asia Pacific (APAC). Support for Carrier Aggregation (CA) and MIMO. Fall back to 3G-HSPA+DC with Rx diversity. A GNSS receiver is integrated. Supported frequency bands: 4G B1, B3, B5, B7, B8, B18, B19, B21, B28, B38, B39, B40, B41 ; 3G B1, B5, B6, B8, B9, B19, B39. Form factor is PCIe Mini Card F1, 51 x 30 mm. Designed for high speed industrial M2M and mobile computing solutions, the AirPrime® MC74 series embedded modules deliver high speed connectivity on LTE and HSPA+ networks. Based on the PCI Express Mini Card standard with a USB host interface, the MC series modules offer an easy upgrade path to new network technologies and global access to high speed networks.

    View our wide range of 2G / 3G / 4G-LTE Wireless Modules

    View our portfolio of M2M and Wireless

    See all products from our supplier Sierra Wireless

    Features:

    • Region: Primarily for Asia Pacific (APAC)

    • Air interface: 4G-LTE cat 6 (FDD & TDD) with CA (Carrier Aggregation) and MIMO, 3G-HSPA+DC (FDD & TDD) with Rx Diversity, GNSS
    • 4G bands: B1 (2100), B3 (1800), B5 (850), B7 (2600), B8 (900), B18 (850), B19 (850), B21 (1500), B28 (700), B38 (2600/TDD), B39 (1900/TDD), B40 (2300/TDD), B41 (2500/TDD)
    • 3G bands: B1 (2100), B5 (850), B6 (800), B8 (900), B9 (1700), B19 (800), B39 (1900/TD-SCDMA)
    • Peak Data rate: DL 300 Mbps, UL 50 Mbps
    • GNSS (GPS, Glonass, Beidou, Galileo*): Qualcomm
    • Form factor: PCIe Mini Card F1, 51 x 30 x 2.5 mm
    • Supply Voltage: 3.3 V nominal
    • Operating Temperature: -40°C to +85°C
    • Control, Software and Features

    • Control options: AT Commands, QMI SDK, MBIM
    • For optimum control the QMI SDK is recommended
    • Drivers: Android, Linux, Windows
    • Switch networks anytime with up to three different certified firmware variants on board.
    • Connectors

    • System connector: 52 position Mini PCIe
    • Antenna RF connector: 3x U.FL (Main RF, Aux RF, GPS with DC bias)
    • Interfaces

    • 1x USB 3.0 and USB 2.0 High Speed
    • 1x Wake host
    • 1x Wireless disable
    • 1x System RESET
    • 3x Antenna Control (muxed with GPIO 1-3)
    • 1x Dynamic Power Control, DPR (muxed with GPIO 4)
    • 4x GPIO (muxed with Antenna control or DPR)
    • 1x LED driver output
    • 2x SIM interface: 1.8/3V
    • 1x Digital Audio
    • Audio

    • Optional

    • Digital audio: PCM/I2S
    • 4G: VoLTE
    • 3G: Circuit Switched Fall Back (CSFB voice)

    EM7430, 4G-LTE cat 6, M.2 Module

    Sierra Wireless AirPrime-EM Series

    MPN:

    AirPrime EM7430

    Manufacturer L3 Communications

    Sierra Wireless

    Description:

    EM7430 is a 4G-LTE cat 6 module (FDD & TDD), with a down link data rate of up to 300 Mbps, primarily for Asia Pacific (APAC). Support for Carrier Aggregation (CA) and MIMO. Fall back to 3G-HSPA+DC with Rx diversity. A GNSS receiver is integrated. Supported frequency bands: 4G B1, B3, B5, B7, B8, B18, B19, B21, B28, B38, B39, B40, B41 ; 3G B1, B5, B6, B8, B9, B19, B39. Form factor is M.2, 42 x 30 mm. Designed for high speed industrial M2M and mobile computing solutions, the AirPrime® EM74 series embedded modules deliver high speed connectivity on LTE and HSPA+ networks. Based on the M.2 standard with a USB host interface, the EM series modules offer an easy upgrade path to new network technologies and global access to high speed networks. The M.2 formfactor is also known as NGFF (New Generation Form Factor).

    View our wide range of 2G / 3G / 4G-LTE Wireless Modules

    View our portfolio of M2M and Wireless

    See all products from our supplier Sierra Wireless

    Features:

    • Region: Primarily for Asia Pacific (APAC)

    • Air interface: 4G-LTE cat 6 (FDD & TDD) with CA (Carrier Aggregation) and MIMO, 3G-HSPA+DC (FDD & TDD) with Rx Diversity, GNSS
    • 4G bands: B1 (2100), B3 (1800), B5 (850), B7 (2600), B8 (900), B18 (850), B19 (850), B21 (1500), B28 (700), B38 (2600/TDD), B39 (1900/TDD), B40 (2300/TDD), B41 (2500/TDD)
    • 3G bands: B1 (2100), B5 (850), B6 (800), B8 (900), B9 (1700), B19 (800), B39 (1900/TD-SCDMA)
    • Peak Data rate: DL 300 Mbps, UL 50 Mbps
    • GNSS (GPS, Glonass, Beidou, Galileo*): Qualcomm
    • Form factor: M.2 module, 42 x 30 x 2.3 mm
    • Supply Voltage: 3.3 V nominal
    • Operating Temperature: -40°C to +85°C
    • Control, Software and Features

    • Control options: AT Commands, QMI SDK, MBIM
    • For optimum control the QMI SDK is recommended
    • Drivers: Android, Linux, Windows
    • Switch networks anytime with up to three different certified firmware variants on board.
    • Connectors

    • System connector: 75/67 position M.2
    • Antenna RF connector: 3x IPEX MHF4 (Main RF, Aux RF, GPS with DC bias)
    • Interfaces

    • 1x USB 3.0 and USB 2.0 High Speed
    • 1x Wake host
    • 1x Wireless disable (main RF)
    • 1x Wireless disable (GNSS)
    • 1x System RESET
    • 1x Power ON/OFF
    • 4x Antenna Control(muxed with GPIO 1-3)
    • 3x Wireless COEX (future firmware upgrade)
    • 1x Dynamic Power Control, DPR
    • 3x Config
    • 1x LED driver output
    • 2x SIM interface: 1.8/3V
    • 1x Digital Audio
    • Audio

    • Optional

    • Digital audio: PCM/I2S
    • 4G: VoLTE
    • 3G: Circuit Switched Fall Back (CSFB voice)

    WP7500, 4G-LTE cat 3, Programmable CF3 SMD Module

    Sierra Wireless AirPrime-WP Series

    MPN:

    AirPrime WP7500

    Manufacturer L3 Communications

    Sierra Wireless

    Description:

    WP7500 is a 4G-LTE cat 3 programmable module primarily for North America. Fall back to 3G-HSPA+DC. Supported frequency bands: 4G B2, B4, B5, B12, B13 ; 3G B2, B4, B5 The WP series modules have an embedded Linux Operating System with the Legato application framework running on a Cortex A5, 550 MHz, application core. Flash and RAM is integrated. FREE unlimited FOTA. Full support for connecting to the AirVantage Cloud or any other cloud. Package is a 22 x 23 mm CF3 SMD LGA package. Sierra Wireless® AirPrime® WP series provides an integrated device-to-cloud architecture enabling IoT developers to build a Linux-based product on a single module and seamlessly send valuable user and product data to the cloud. Offering an application processor running the open source Legato™ platform, GNSS receiver, and 3G or 4G cellular modem with an ultra-low power domain, WP modules reduce system complexity and get you to market faster. The Open Hardware mangOH prototype and development kit enable rapid hardware and software development.

    View our wide range of 2G / 3G / 4G-LTE Wireless Modules

    View our portfolio of M2M and Wireless

    See all products from our supplier Sierra Wireless

    Features:

    • Region: Primarily North America

    • Air interface: 4G-LTE cat 3, 3G-HSPA+DC, 2G-GSM/GPRS/EDGE, GNSS
    • 4G Bands: B2 (1900), B4 (1700), B5 (850), B12 (700), B13 (700)
    • 3G Bands: B2 (1900), B4 (1700), B5 (850)
    • Peak data rate: DL 100 Mbps, UL 50 Mbps
    • GNSS: Optional
    • Form factor: CF3 SMD LGA package, 22 x 23 x 4.35 mm
    • Supply Voltage: 3.7 V nominal
    • Operating Temperature: -40°C to +85°C
    • Control, Software and Features

    • Embedded Linux/Legato application framework
    • Control option: AT Commands
    • Internet services: TCP, UDP, FTP, HTTP, SMTP, POP3, SSL
    • Drivers: Android, Linux, Windows
    • FOTA: Free and unlimited through AirVantage
    • Cloud service: AirVantage Cloud for management, diagnostics and business data
    • Embedded application performance

    • CPU: Cortex A5, 550 MHz
    • User MIPS available: 860 MIPS
    • Memory: 256 MB Flash, 128 MB RAM
    • Interfaces

    • 2x SIM interface: 1.8/3V
    • 1x UART, 8 wire
    • 1x UART, 4 wire
    • 1x USB OTG 2.0 High Speed
    • 1x HSIC
    • 1x SPI
    • 1x I2C
    • 1x SDIO
    • 12x GPIO
    • 1x VGPIO
    • 5x Interrupt
    • 2x ADC
    • 1x 19.2 MHz clock
    • 1x 32.768 kHz clock
    • 1x Battery In / Charging Out
    • 1x Power On
    • 1x Reset In
    • 1x Reset Out
    • 1x Safe Power Remove
    • 1x Dead Reckoning Sync
    • 1x Wireless Disable
    • 1x Tx ON
    • 1x LED driver
    • 1x Wake on WWAN
    • 1x Digital Audio, PCM/I2S
    • 1x RF, Main
    • 1x RF, GNSS
    • 4x Antenna control
    • Test points

    HL8518, 3G-HSPA, CF3 SMD Module

    Sierra Wireless AirPrime-HL Series

    MPN:

    AirPrime HL8518

    Manufacturer L3 Communications

    Sierra Wireless

    Description:

    HL8518 is a 3G-HSPA module with voice primarily for Europe and Asia. Fall back to 2G-GSM/GPRS/EDGE. Supported frequency bands are: 3G-HSPA 900/2100, 2G-900/1800. FREE unlimited FOTA, AirVantage Cloud ready. Very low power consumption. Separate base band and PA power supply inputs simplifies power supply design and extend operational life for battery powered devices. Package is a 22 x 23 mm CF3 SMD LGA package. As an option to soldering, adding flexibility, the HL series Snap-in socket can be soldered on the same PCB pattern. The AirPrime® HL Series modules is the smallest, scalable, flexible solution in a compact and easy-to-integrate form factor that is completely interchangeable among 2G, 3G, and 4G technologies. Compact form factor, network scalability, and ready-to-use firmware upgrades make these modules ideal for industrial M2M solution designs where size and deployment longevity are important considerations.

    View our wide range of 2G / 3G / 4G-LTE Wireless Modules

    View our portfolio of M2M and Wireless

    See all products from our supplier Sierra Wireless

    Features:

    • Region: Primarily for Europe and Asia

    • Air interface: 3G-HSPA with fall back to 2G-GSM/GPRS/EDGE
    • 3G Bands: B1 (2100), B8 (900)
    • 2G Bands: E-GSM 900, DCS 1800
    • Peak data rate: DL 7.2 Mbps, UL 5.76 Mbps
    • Form factor: CF3 SMD LGA package, 22 x 23 x 2.5 mm
    • Supply Voltage: 3.7 V nominal, max 4.5 V
    • Separate Base Band (min 3.2 V) and PA (min 2.8 V) power supply inputs for extended battery life.
    • Operating Temperature: -40°C to +85°C
    • Control, Software and Features

    • Control options: AT Commands
    • Internet services: TCP, UDP, FTP, HTTP, HTTPS, SMTP, POP3, SSL
    • Host OS: Android, Linux, Windows
    • FOTA: Free and unlimited through AirVantage
    • Cloud service: AirVantage Cloud ready
    • Network scan and monitoring
    • Jamming detection
    • Antenna detection
    • Interfaces

    • 1x UART, 8 wire
    • 1x USB 2.0 Full Speed
    • 2x ADC
    • 12x GPIO
    • 1x VGPIO
    • 2x PWM
    • 2x System Clock Out
    • 1x Active Low Reset
    • 1x Active Low Power On
    • 1x SIM interface: 1.8/3V
    • 1x Tx Burst indicator
    • 1x RF
    • 1x Debug
    • 1x JTAG
    • 1x Backup Battery In, Charging Out
    • 1x Digital Audio, PCM

    HL8528, 3G-HSPA, CF3 SMD Module

    Sierra Wireless AirPrime-HL Series

    MPN:

    AirPrime HL8528

    Manufacturer L3 Communications

    Sierra Wireless

    Description:

    HL8528 is a 3G-HSPA module with voice primarily for North America. Fall back to 2G-GSM/GPRS/EDGE. Supported frequency bands are: 3G-HSPA 850/1900, 2G-850/1900. FREE unlimited FOTA, AirVantage Cloud ready. Very low power consumption. Separate base band and PA power supply inputs simplifies power supply design and extend operational life for battery powered devices. Package is a 22 x 23 mm CF3 SMD LGA package. As an option to soldering, adding flexibility, the HL series Snap-in socket can be soldered on the same PCB pattern. The AirPrime® HL Series modules is the smallest, scalable, flexible solution in a compact and easy-to-integrate form factor that is completely interchangeable among 2G, 3G, and 4G technologies. Compact form factor, network scalability, and ready-to-use firmware upgrades make these modules ideal for industrial M2M solution designs where size and deployment longevity are important considerations.

    View our wide range of 2G / 3G / 4G-LTE Wireless Modules

    View our portfolio of M2M and Wireless

    See all products from our supplier Sierra Wireless

    Features:

    • Region: Primarily for North America

    • Air interface: 3G-HSPA with fall back to 2G-GSM/GPRS/EDGE
    • 3G Bands: B2 (1900), B5 (850)
    • 2G Bands: GSM 850, PCS 1900
    • Peak data rate: DL 7.2 Mbps, UL 5.76 Mbps
    • Form factor: CF3 SMD LGA package, 22 x 23 x 2.5 mm
    • Supply Voltage: 3.7 V nominal, max 4.5 V
    • Separate Base Band (min 3.2 V) and PA (min 2.8 V) power supply inputs for extended battery life.
    • Operating Temperature: -40°C to +85°C
    • Control, Software and Features

    • Control options: AT Commands
    • Internet services: TCP, UDP, FTP, HTTP, HTTPS, SMTP, POP3, SSL
    • Host OS: Android, Linux, Windows
    • FOTA: Free and unlimited through AirVantage
    • Cloud service: AirVantage Cloud ready
    • Network scan and monitoring
    • Jamming detection
    • Antenna detection
    • Interfaces

    • 1x UART, 8 wire
    • 1x USB 2.0 Full Speed
    • 2x ADC
    • 12x GPIO
    • 1x VGPIO
    • 2x PWM
    • 2x System Clock Out
    • 1x Active Low Reset
    • 1x Active Low Power On
    • 1x SIM interface: 1.8/3V
    • 1x Tx Burst indicator
    • 1x RF
    • 1x Debug
    • 1x JTAG
    • 1x Backup Battery In, Charging Out
    • 1x Digital Audio, PCM

    EM7455, 4G-LTE cat 6, M.2 Module

    Sierra Wireless AirPrime-EM Series

    MPN:

    AirPrime EM7455

    Manufacturer L3 Communications

    Sierra Wireless

    Description:

    EM7455 is a 4G-LTE cat 6 module (FDD & TDD), with a down link data rate of up to 300 Mbps, primarily for Europe, North and South America. Support for Carrier Aggregation (CA) and MIMO. Fall back to 3G-HSPA+DC with Rx diversity. A GNSS receiver is integrated. Supported frequency bands: 4G B1-B5, B7, B8, B12, B13, B20, B25, B26, B29, B30, B41 ; 3G B1-B5, B8. Form factor is M.2, 42 x 30 mm. Designed for high speed industrial M2M and mobile computing solutions, the AirPrime® EM74 series embedded modules deliver high speed connectivity on LTE and HSPA+ networks. Based on the M.2 standard with a USB host interface, the EM series modules offer an easy upgrade path to new network technologies and global access to high speed networks. The M.2 formfactor is also known as NGFF (New Generation Form Factor).

    View our wide range of 2G / 3G / 4G-LTE Wireless Modules

    View our portfolio of M2M and Wireless

    See all products from our supplier Sierra Wireless

    Features:

    • Region: Primarily for Europe, North America, South America

    • Air interface: 4G-LTE cat 6 (FDD & TDD) with CA (Carrier Aggregation) and MIMO, 3G-HSPA+DC with Rx Diversity, GNSS
    • 4G bands: B1 (2100), B2 (1900), B3 (1800), B4 (1700), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B20 (800), B25 (1900), B26 (850), B29 (700), B30 (2300), B41 (2500/TDD)
    • 3G bands: B1 (2100), B2 (1900), B3 (1800), B4 (1700), B5 (850), B8 (900)
    • Peak Data rate: DL 300 Mbps, UL 50 Mbps
    • GNSS (GPS, Glonass, Beidou, Galileo*): Qualcomm
    • Form factor: M.2 module, 42 x 30 x 2.3 mm
    • Supply Voltage: 3.3 V nominal
    • Operating Temperature: -40°C to +85°C
    • Control, Software and Features

    • Control options: AT Commands, QMI SDK, MBIM
    • For optimum control the QMI SDK is recommended
    • Drivers: Android, Linux, Windows
    • Switch networks anytime with up to three different certified firmware variants on board.
    • Connectors

    • System connector: 75/67 position M.2
    • Antenna RF connector: 3x IPEX MHF4 (Main RF, Aux RF, GPS with DC bias)
    • Interfaces

    • 1x USB 3.0 and USB 2.0 High Speed
    • 1x Wake host
    • 1x Wireless disable (main RF)
    • 1x Wireless disable (GNSS)
    • 1x System RESET
    • 1x Power ON/OFF
    • 4x Antenna Control(muxed with GPIO 1-3)
    • 3x Wireless COEX
    • 1x Dynamic Power Control, DPR
    • 3x Config
    • 1x LED driver output
    • 2x SIM interface: 1.8/3V
    • 1x Digital Audio
    • Audio

    • Optional

    • Digital audio: PCM/I2S
    • 4G: VoLTE
    • 3G: Circuit Switched Fall Back (CSFB voice)

    WP7501, 4G-LTE cat 3, Programmable CF3 SMD Module

    Sierra Wireless AirPrime-WP Series

    MPN:

    AirPrime WP7501

    Manufacturer L3 Communications

    Sierra Wireless

    Description:

    WP7501 is a 4G-LTE cat 3 programmable module primarily for North America. Supported frequency bands: 4G B2, B4, B13 The WP series modules have an embedded Linux Operating System with the Legato application framework running on a Cortex A5, 550 MHz, application core. Flash and RAM is integrated. FREE unlimited FOTA. Full support for connecting to the AirVantage Cloud or any other cloud. Package is a 22 x 23 mm CF3 SMD LGA package. Sierra Wireless® AirPrime® WP series provides an integrated device-to-cloud architecture enabling IoT developers to build a Linux-based product on a single module and seamlessly send valuable user and product data to the cloud. Offering an application processor running the open source Legato™ platform, GNSS receiver, and 3G or 4G cellular modem with an ultra-low power domain, WP modules reduce system complexity and get you to market faster. The Open Hardware mangOH prototype and development kit enable rapid hardware and software development.

    View our wide range of 2G / 3G / 4G-LTE Wireless Modules

    View our portfolio of M2M and Wireless

    See all products from our supplier Sierra Wireless

    Features:

    • Region: Primarily North America

    • Air interface: 4G-LTE cat 3
    • 4G Bands: B2 (1900), B4 (1700), B13 (700)
    • 3G Bands: B1 (2100), B2 (1900), B5 (850), B6 (800), B8 (900)
    • 2G Bands: GSM 850, E-GSM 900, DCS 1800, PCS 1900
    • Peak data rate: DL 100 Mbps, UL 50 Mbps
    • GNSS: Optional
    • Form factor: CF3 SMD LGA package, 22 x 23 x 4.35 mm
    • Supply Voltage: 3.7 V nominal
    • Operating Temperature: -40°C to +85°C
    • Control, Software and Features

    • Embedded Linux/Legato application framework
    • Control option: AT Commands
    • Internet services: TCP, UDP, FTP, HTTP, SMTP, POP3, SSL
    • Drivers: Android, Linux, Windows
    • FOTA: Free and unlimited through AirVantage
    • Cloud service: AirVantage Cloud for management, diagnostics and business data
    • Embedded application performance

    • CPU: Cortex A5, 550 MHz
    • User MIPS available: 860 MIPS
    • Memory: 256 MB Flash, 128 MB RAM
    • Interfaces

    • 2x SIM interface: 1.8/3V
    • 1x UART, 8 wire
    • 1x UART, 4 wire
    • 1x USB OTG 2.0 High Speed
    • 1x HSIC
    • 1x SPI
    • 1x I2C
    • 1x SDIO
    • 12x GPIO
    • 1x VGPIO
    • 5x Interrupt
    • 2x ADC
    • 1x 19.2 MHz clock
    • 1x 32.768 kHz clock
    • 1x Battery In / Charging Out
    • 1x Power On
    • 1x Reset In
    • 1x Reset Out
    • 1x Safe Power Remove
    • 1x Dead Reckoning Sync
    • 1x Wireless Disable
    • 1x Tx ON
    • 1x LED driver
    • 1x Wake on WWAN
    • 1x Digital Audio, PCM/I2S
    • 1x RF, Main
    • 1x RF, GNSS
    • 4x Antenna control
    • Test points

    WP7502, 4G-LTE cat 3, Programmable CF3 SMD Module

    Sierra Wireless AirPrime-WP Series

    MPN:

    AirPrime WP7502

    Manufacturer L3 Communications

    Sierra Wireless

    Description:

    WP7502 is a 4G-LTE cat 3 programmable module primarily for Europe. Fall back to 3G-HSPA+DC and 2G-GSM/GPRS/EDGE. Supported frequency bands: 4G B3, B7, B8, B20 ; 3G B1, B8 ; 2G 900/1800. The WP series modules have an embedded Linux Operating System with the Legato application framework running on a Cortex A5, 550 MHz, application core. Flash and RAM is integrated. FREE unlimited FOTA. Full support for connecting to the AirVantage Cloud or any other cloud. Package is a 22 x 23 mm CF3 SMD LGA package. Sierra Wireless® AirPrime® WP series provides an integrated device-to-cloud architecture enabling IoT developers to build a Linux-based product on a single module and seamlessly send valuable user and product data to the cloud. Offering an application processor running the open source Legato™ platform, GNSS receiver, and 3G or 4G cellular modem with an ultra-low power domain, WP modules reduce system complexity and get you to market faster. The Open Hardware mangOH prototype and development kit enable rapid hardware and software development.

    View our wide range of 2G / 3G / 4G-LTE Wireless Modules

    View our portfolio of M2M and Wireless

    See all products from our supplier Sierra Wireless

    Features:

    • Region: Primarily Europe

    • Air interface: 4G-LTE cat 3, 3G-HSPA+DC, 2G-GSM/GPRS/EDGE, GNSS
    • 4G Bands: B3 (1800), B7 (2600), B8 (900), B20 (800)
    • 3G Bands: B1 (2100), B8 (900)
    • 2G Bands: E-GSM 900, DCS 1800
    • Peak data rate: DL 100 Mbps, UL 50 Mbps
    • GNSS: Optional
    • Form factor: CF3 SMD LGA package, 22 x 23 x 4.35 mm
    • Supply Voltage: 3.7 V nominal
    • Operating Temperature: -40°C to +85°C
    • Control, Software and Features

    • Embedded Linux/Legato application framework
    • Control option: AT Commands
    • Internet services: TCP, UDP, FTP, HTTP, SMTP, POP3, SSL
    • Drivers: Android, Linux, Windows
    • FOTA: Free and unlimited through AirVantage
    • Cloud service: AirVantage Cloud for management, diagnostics and business data
    • Embedded application performance

    • CPU: Cortex A5, 550 MHz
    • User MIPS available: 860 MIPS
    • Memory: 256 MB Flash, 128 MB RAM
    • Interfaces

    • 2x SIM interface: 1.8/3V
    • 1x UART, 8 wire
    • 1x UART, 4 wire
    • 1x USB OTG 2.0 High Speed
    • 1x HSIC
    • 1x SPI
    • 1x I2C
    • 1x SDIO
    • 12x GPIO
    • 1x VGPIO
    • 5x Interrupt
    • 2x ADC
    • 1x 19.2 MHz clock
    • 1x 32.768 kHz clock
    • 1x Battery In / Charging Out
    • 1x Power On
    • 1x Reset In
    • 1x Reset Out
    • 1x Safe Power Remove
    • 1x Dead Reckoning Sync
    • 1x Wireless Disable
    • 1x Tx ON
    • 1x LED driver
    • 1x Wake on WWAN
    • 1x Digital Audio, PCM/I2S
    • 1x RF, Main
    • 1x RF, GNSS
    • 4x Antenna control
    • Test points

    HL7618, 4G-LTE cat 1, CF3 SMD Module

    Sierra Wireless AirPrime-HL Series

    MPN:

    AirPrime HL7618

    Manufacturer L3 Communications

    Sierra Wireless

    Description:

    HL7618 is a 4G-LTE cat 1 module primarily for North America. Supported frequency bands are: 4G-LTE B4 (1700), B13 (700) FREE unlimited FOTA, AirVantage Cloud ready. HL7618 is optimised for IoT and M2M applications where for example low cost and low power consumption are key parameters. Very low power consumption. Separate base band and PA power supply inputs simplifies power supply design and extend operational life for battery powered devices. Package is a 22 x 23 mm CF3 SMD LGA package. As an option to soldering, adding flexibility, the HL series Snap-in socket can be soldered on the same PCB pattern. The AirPrime® HL Series modules is the smallest, scalable, flexible solution in a compact and easy-to-integrate form factor that is completely interchangeable among 2G, 3G, and 4G technologies. Compact form factor, network scalability, and ready-to-use firmware upgrades make these modules ideal for industrial M2M solution designs where size and deployment longevity are important considerations.

    View our wide range of 2G / 3G / 4G-LTE Wireless Modules

    View our portfolio of M2M and Wireless

    See all products from our supplier Sierra Wireless

    Features:

    • Region: Primarily for North America

    • Air interface: 4G-LTE cat 1
    • 4G Bands: B4 (1700), B13 (700)
    • Carrier: Verizon
    • Peak data rate: DL 10 Mbps, UL 5 Mbps
    • Form factor: CF3 SMD LGA package, 22 x 23 x 2.5 mm
    • Supply Voltage: 3.7 V nominal, max 4.5 V
    • Separate Base Band (min 3.2 V) and PA (min 2.8 V) power supply inputs for extended battery life.
    • Operating Temperature: -40°C to +85°C
    • Control, Software and Features

    • Control options: AT Commands
    • Internet services: TCP, UDP, FTP, HTTP, HTTPS, SMTP, POP3, SSL
    • Host OS: Android, Linux, Windows
    • FOTA: Free and unlimited through AirVantage
    • Cloud service: AirVantage Cloud ready
    • Network scan and monitoring
    • Jamming detection
    • Antenna detection
    • Interfaces

    • 1x UART, 8 wire
    • 1x USB 2.0 Full Speed
    • 1x ADC
    • 12x GPIO
    • 1x VGPIO
    • 2x System Clock Out
    • 1x Active Low RESET
    • 1x Active Low POWER ON
    • 1x SIM interface: 1.8/3V
    • 1x Tx On
    • 1x RF Rx/Tx port
    • 1x Debug
    • 1x JTAG
    • 1x Backup Battery

    WP8548, 3G-HSPA/HSPA+, Programmable CF3 SMD Module

    Sierra Wireless AirPrime-WP Series

    MPN:

    AirPrime WP8548

    Manufacturer L3 Communications

    Sierra Wireless

    Description:

    WP8548 is a Global 3G-HSPA+DC programmable module with an integrated GNSS receiver. Fall back to 2G-GSM/GPRS/EDGE. Supported frequency bands: 3G B1, B2, B5, B6, B8 ; 2G 850/900/1800/1900 The WP series modules have an embedded Linux Operating System with the Legato application framework running on a Cortex A5, 550 MHz, application core. Flash and RAM is integrated. FREE unlimited FOTA. Full support for connecting to the AirVantage Cloud or any other cloud. Package is a 22 x 23 mm CF3 SMD LGA package. Sierra Wireless® AirPrime® WP series provides an integrated device-to-cloud architecture enabling IoT developers to build a Linux-based product on a single module and seamlessly send valuable user and product data to the cloud. Offering an application processor running the open source Legato™ platform, GNSS receiver, and 3G or 4G cellular modem with an ultra-low power domain, WP modules reduce system complexity and get you to market faster. The Open Hardware mangOH prototype and development kit enable rapid hardware and software development.

    View our wide range of 2G / 3G / 4G-LTE Wireless Modules

    View our portfolio of M2M and Wireless

    See all products from our supplier Sierra Wireless

    Features:

    • Region: Global

    • Air interface: 3G-HSPA+DC, 2G-GSM/GPRS/EDGE, GNSS
    • 3G Bands: B1 (2100), B2 (1900), B5 (850), B6 (800), B8 (900)
    • 2G Bands: GSM 850, E-GSM 900, DCS 1800, PCS 1900
    • Peak data rate: DL 42 Mbps, UL 5.76 Mbps
    • GNSS: GPS, Glonass
    • Form factor: CF3 SMD LGA package, 22 x 23 x 4.35 mm
    • Supply Voltage: 3.7 V nominal
    • Operating Temperature: -40°C to +85°C
    • Control, Software and Features

    • Embedded Linux/Legato application framework
    • Control option: AT Commands
    • Internet services: TCP, UDP, FTP, HTTP, SMTP, POP3, SSL
    • Drivers: Android, Linux, Windows
    • FOTA: Free and unlimited through AirVantage
    • Cloud service: AirVantage Cloud for management, diagnostics and business data
    • Embedded application performance

    • CPU: Cortex A5, 550 MHz
    • User MIPS available: 860 MIPS
    • Memory: 256 MB Flash, 128 MB RAM
    • Interfaces

    • 2x SIM interface: 1.8/3V
    • 1x UART, 8 wire
    • 1x UART, 4 wire
    • 1x USB OTG 2.0 High Speed
    • 1x HSIC
    • 1x SPI
    • 1x I2C
    • 1x SDIO
    • 12x GPIO
    • 1x VGPIO
    • 5x Interrupt
    • 2x ADC
    • 1x 19.2 MHz clock
    • 1x 32.768 kHz clock
    • 1x Battery In / Charging Out
    • 1x Power On
    • 1x Reset In
    • 1x Reset Out
    • 1x Safe Power Remove
    • 1x Dead Reckoning Sync
    • 1x Wireless Disable
    • 1x Tx ON
    • 1x LED driver
    • 1x Wake on WWAN
    • 1x Digital Audio, PCM/I2S
    • 1x RF, Main
    • 1x RF, GNSS
    • 4x Antenna control
    • Test points

    mangOH Prototype Kit

    Sierra-Wireless AirPrime-MangOH Board

    MPN:

    AirPrime mangOH prototype kit

    Manufacturer L3 Communications

    Sierra Wireless

    Description:

    A complete development kit which provides all the tools and accessories you need to test AirPrime WP Series modules, deliver prototypes and develop an end user application. The WP series development kit and the mangOH prototype kit are the same.

    The WP series development kit and the mangOH prototype kit are the same. WP series modules are NOT included and needs to be ordered separately.

    View our wide range of 2G / 3G / 4G-LTE Wireless Modules

    View our portfolio of M2M and Wireless

    See all products from our supplier Sierra Wireless

    Features:

    • This prototype kit includes:

    • 1x mangOH mother board
    • 3x IoT breakout board
    • 1x Snap-In cover for WP modules
    • 1x Snap-In cover removal tool
    • 1x Cellular antenna
    • 1x GPS/Glonass antenna
    • 1x Micro USB to USB type A cable
    • 1x power supply AC100/240V, DC 12V/2A with multiple plugs
    • Designed to fit in a Euro card standard size casing (120mm x 100mm)

    WP series development kit

    Sierra-Wireless AirPrime-MangOH Board

    MPN:

    AirPrime WP series development kit

    Manufacturer L3 Communications

    Sierra Wireless

    Description:

    A complete development kit which provides all the tools and accessories you need to test AirPrime WP Series modules, deliver prototypes and develop an end user application. The WP series development kit and the mangOH prototype kit are the same.

    WP series modules are NOT included and needs to be ordered separately. The WP series development kit and the mangOH prototype kit are the same.

    View our wide range of 2G / 3G / 4G-LTE Wireless Modules

    View our portfolio of M2M and Wireless

    See all products from our supplier Sierra Wireless

    Features:

    • This prototype kit includes:

    • 1x mangOH mother board
    • 3x IoT breakout board
    • 1x Snap-In cover for WP modules
    • 1x Snap-In cover removal tool
    • 1x Cellular antenna
    • 1x GPS/Glonass antenna
    • 1x Micro USB to USB type A cable
    • 1x power supply AC100/240V, DC 12V/2A with multiple plugs
    • Designed to fit in a Euro card standard size casing (120mm x 100mm)

    WP series Snap-in Socket for CF3 modules, SMD mount

    Sierra-Wireless AirPrime-WP Snap-in-sockett

    MPN:

    AirPrime WP Snap-in Socket

    Manufacturer L3 Communications

    Sierra Wireless

    Description:

    The WP series Snap-in socket mounts on the same solder pads as the WP module add flexibility to deploy a 3G or 4G module at any stage of the production cycle or, if required, to swap between modules in the field. The AirPrime® WP Series modules is the smallest, scalable, flexible solution with an integrated application processor, with Flash and RAM, running Linux in a compact and easy-to-integrate form factor that is completely interchangeable among 3G, and 4G technologies. Compact form factor, network scalability, and ready-to-use firmware upgrades make these modules ideal for industrial M2M solution designs where size and deployment longevity are important considerations. 4G is in development.

    View our wide range of 2G / 3G / 4G-LTE Wireless Modules

    View our portfolio of M2M and Wireless

    See all products from our supplier Sierra Wireless

    Features:

    • The Snap-in socket allows you to add or swap modules at any point in the production cycle or after deployment in the field.
    • Use 3G or 4G or a mix across your deployment.
    • Socket Size: 28.4 x 27.4 mm

    3G-HSPA Programmable Modem

    Sierra Wireless AirLink-GL Series

    MPN:

    GL8200

    Manufacturer L3 Communications

    Sierra Wireless

    Description:

    GL8200 is an easy to use Global 3G-HSPA modem with a UART host interface. Fall back to 2G-GSM/GPRS/EDGE. FREE unlimited FOTA, AirVantage Cloud ready. Package is a 67 x 51.5 x 23.5 mm plastic enclosure. The AirLink® GL8200 modem is among the smallest devices in the industry for connecting products to a cellular network. Its compact form factor fits easily into existing equipment or machinery.

    View our wide range of 2G / 3G / 4G-LTE Wireless Gateways and Modems

    View our portfolio of M2M and Wireless

    See all products from our supplier Sierra Wireless

    Features:

    • Region: Global

    • Air interface: 3G-HSPA with fall back to 2G-GSM/GPRS/EDGE
    • 3G Bands: B1 (2100), B2 (1900), B5 (850), B6 (800), B8 (900)
    • 2G Bands: GSM 850, E-GSM 900, DCS 1800, PCS 1900
    • Form factor: Plastic enclosure, 67 x 51.5 x 23.5 mm
    • Supply Voltage: DC 4.75V to 32V, 800 mA peak
    • Operating Temperature: -30°C to +75°C
    • Control, Software and Features

    • Control options: AT Commands
    • Internet services: TCP, UDP, FTP, HTTP, HTTPS, SMTP, POP3, SSL
    • Host OS: Android, Linux, Windows
    • Cloud service: AirVantage Management Services, FREE unlimited FOTA (Firmware Over The Air)
    • Interfaces / Connectors

    • SIM (1.8/3V), Spring socket with lid
    • RF connector, FME male
    • UART (RS232), 8 pole Micro-Fit
    • Power supply, 8 pole Micro-Fit
    • Flash LED
    • Adapter cable, 8 pole Micro-fit to DB9 + 2-pole Micro-fit, and power supply wire with 2-pole Micro-fit is included.
    • Antenna is NOT included.

    Multi Micro Hornet GPS/GNSS Receiver Module, with integrated Antenna

    OriginGPS ORG1510 Multi Micro-Hornet

    MPN:

    ORG1510-MK04

    Manufacturer L3 Communications

    OriginGPS

    Description:

    Multi Micro Hornet ORG1510MK-04 module is a miniature multi-channel GPS and GLONASS/BEIDOU, SBAS, QZSS overlay systems receiver that continuously tracks all satellites in view, providing real-time positioning data in industry’s standard NMEA format.

    Multi Micro Hornet ORG1510 module offers superior sensitivity and outstanding performance, achieving rapid TTFF in less than one second, accuracy of approximately two meters, and tracking sensitivity of -165dBm.

    MMulti Micro Hornet ORG1510MK-04 module is a complete SiP featuring miniature LGA SMT footprint designed to commit unique integration features for high volume cost sensitive applications.

    View our wide range of GPS Navigation

    View our portfolio of M2M and Wireless

    See all products from our supplier OriginGPS

    Features:

    • Autonomous operation
    • Active antenna on-board
    • Pin to pin compatible with ORG1410 GPS module
    • OriginGPS Noise Free Zone System (NFZ™) technology
    • Fully integrating: Antenna element, Dual-stage LNA, SAW filter, TCXO, RTC crystal, GNSS SoC, LDO regulator, RF shield
    • Concurrent tracking of multiple constellations
    • Uses GPS and GLONASS/BEIDOU, QZSS constellations
    • GPS L1 1575.42 frequency, C/A code
    • GLONASS L1 FDMA 1598-1606MHz frequency band, SP signal
    • BEIDOU B1 1561.098MHz frequency band.
    • SBAS (WAAS, EGNOS, MSAS and GAGAN)
    • DGPS capability (using RTCM)
    • 99 search channels and 33 simultaneous tracking channels
    • Ultra-high Sensitivity down to -165dBm enabling Indoor Tracking
    • TTFF of < 1s in 50% of trials under Hot Start conditions
    • Low Power Consumption of ≤ 15mW
    • High Accuracy of < 2.5m in 50% of trials
    • AGPS support: Embedded Assist System (EASY) and Extended Prediction Orbit (EPO) and HotStill
    • Indoor and outdoor Multipath and cross-correlation mitigation
    • Jamming Rejection – 12 multi-tone Active Interference Cancellation (AIC)
    • 8 Megabit built in flash
    • High update messages rate of 1,2,5,10Hz
    • Single voltage supply 2.8V to 4.3V
    • Ultra-small LGA footprint of 10mm x 10mm
    • Ultra-low weight of 2.4g
    • Surface Mount Device (SMD)
    • Operating from -40°C to +85°C
    • Optimized for automatic assembly and reflow equipment

       

    Multi Micro Hornet, GPS/GNSS module with integrated antenna

    OriginGPS ORG1510 Multi Micro-Hornet

    MPN:

    ORG1510

    Manufacturer L3 Communications

    OriginGPS

    Description:

    ORG1510 Micro Hornet module is a complete SiP featuring miniature LGA SMT footprint designed to commit unique integration features for high volume cost sensitive applications. Designed to support compact and traditional applications such as smart watches, wearable devices, asset trackers, Multi Micro Hornet ORG1510 module is a miniature multi-channel GPS/ GLONASS with SBAS, QZSS and other regional overlay systems receiver that continuously tracks all satellites in view, providing real-time positioning data in industry’s standard NMEA format.

    Multi Micro Hornet ORG1510 module offers superior sensitivity and outstanding performance, achieving rapid TTFF in less than one second, accuracy of approximately two meters, and tracking sensitivity of -165dBm. Sized only 10mm x 10mm Multi Micro Hornet ORG1510 module is industry’s small sized, record breaking solution.

    View our wide range of GPS Navigation

    View our portfolio of M2M and Wireless

    See all products from our supplier OriginGPS

    Features:

    • Autonomous operation
    • Active antenna on-board
    • Pin to pin compatible with ORG1410 GPS module
    • OriginGPS Noise Free Zone System (NFZ™) technology
    • Fully integrating: Antenna element, Dual-stage LNA, SAW filter, TCXO, RTC crystal, GNSS SoC, LDO regulator, RF shield
    • GPS L1 1575.42 frequency, C/A code
    • GLONASS L1 FDMA 1598-1606MHz frequency band, SP signal
    • SBAS (WAAS, EGNOS, MSAS) and QZSS support
    • Concurrent tracking of multiple constellations
    • 52 channels
    • Ultra-high Sensitivity down to -165dBm enabling Indoor Tracking
    • TTFF of < 1s in 50% of trials under Hot Start conditions
    • Low Power Consumption of ≤ 15mW in ATP™ mode
    • High Accuracy of < 1.5m in 50% of trials
    • High update rate of 5Hz, 1Hz by default
    • Autonomous A-GNSS by Client Generated Extended Ephemeris (CGEE™) for non-networked devices
    • Predictive A-GNSS by Server Generated Extended Ephemeris (SGEE™) for connected devices
    • Ephemeris Push™ for storing and loading broadcast ephemeris
    • Host controlled power saving mode
    • Self-managed low power modes - ATP™, PTF™, APM™ and SiRFAware® MPM™
    • Almanac Based Positioning (ABP™)
    • Multipath and cross-correlation mitigation
    • Active Jammer Detector and Remover
    • Smart Data Logging to external memory
    • Fast Time Synchronization for rapid single satellite time solution
    • ARM7® microprocessor system
    • Selectable UART, SPI or I2C host interface
    • NMEA protocol by default, switchable into One Socket Protocol (OSP®)
    • Programmable baud rate and messages rate
    • 1PPS Output
    • Single voltage supply 1.8V or 2V to 5.5V (2V to 5.5V not yet available)
    • Ultra-small LGA footprint of 10mm x 10mm
    • Ultra-low weight of 2.5g
    • Surface Mount Device (SMD)

    Half size Mini PCIe module, 802.11b/g/n, with Bluetooth, single band

    Sparklan WPEA-152GNBT WiFi 802.11

    MPN:

    WPEA-152GN(BT)

    Manufacturer L3 Communications

    Sparklan

    Description:

    Half size Mini PCI express module, WiFi 802.11b/g/n, with Bluetooth (via USB: 4.0 LE, 3.0 HS, 2.1 EDR), single band, 1x1, up to 150 Mbps, U.FL RF connector, 0 to +75°C operating temp, Qualcomm Atheros AR3012 + AR9485.

    Features:

    • Standard: 802.11b/g/n, Bluetooth 4.0 LE/ 3.0 HS/ 2.1 EDR standard
    • Chipset: Mac/BB/RF - Atheros AR9485 + AR3012
    • Host Interface: Half Mini Card (PCIe: WLAN; USB: Bluetooth)
    • Radio: Antenna - 2 x U.FL connectors (1T/1R), Support WLAN / BT co-existence
    • Operating Frequency: Wi-Fi: b/g/n ISM Band: 2.400GHz ~ 2.4835GHz; Bluetooth: 2402GHz ~ 2480GHz
    • Modulation: Wi-Fi: 802.11b: DSSS (DBPSK, DQPSK, CCK), 802.11g/n: OFDM (BPSK, QPSK, 16-QAM, 64-QAM), Bluetooth: Header: GFSK / Payload 2M: 4-DQPSK / Payload 3M: 8-DPSK
    • Output Power: Wi-Fi, 802.11b: 17dBm ± 2dBm@11Mbps, 802.11g: 13dBm ± 2dBm@54Mbps, 802.11gn HT20: 11dBm ± 2dBm@MCS7, 802.11gn HT40: 11dBm ± 2dBm@MCS7, Bluetooth, 0 ≦ Output Power Avg. ≦ +10dBm (Class 1 Device)
    • Receive Sensitivity: Wi-Fi, 802.11b: -85dBm ± 2dBm@11Mbps, 802.11g: -68dBm ± 2dBm@54Mbps, 802.11gn HT20: -68dBm ± 2dBm@MCS7, 802.11gn HT40: -65dBm ± 2dBm@MCS7, Bluetooth: BER < 0.1% at -70dBm
    • Power consumption: Continue TX - Max. 310mA, Continue RX - Max. 180mA
    • Operating Voltage: DC 3.3V ± 9% 
    • Environmental: Temperature Range - 0 ~ 75°C (Operating)  -40 ~ 85°C (Storing), Humidity (Non-Condensing) - 5 ~ 90% (Operating)   5 ~ 95% (Storing)
    • Physical Specification: Dimensions - 30.0mm x 26.80mm x 3.4mm, Weight - 7g
    • Software: Driver - Windows XP/ Vista, Win 7, Linux, Android by request, Security - 64/128-bits WEP, WPA, WPA2

    Half size Mini PCIe module, USB host interface, 802.11b/g/n, single band

    Sparklan WPER-172GN WiFi 802.11

    MPN:

    WPER-172GN

    Manufacturer L3 Communications

    Sparklan

    Description:

    Half size Mini PCI express module, USB host interface, WiFi 802.11b/g/n, single band, 1x1, up to 150 Mbps, U.FL RF connector, 0 to +70℃ operating temp, Ralink RT5390U.

    Features:

    • Standard: 802.11b/g/n
    • Chipset: Mac/BB/RF - Ralink RT5390U
    • Host Interface: USB Interface, Half Mini Card form factor
    • Radio: Antenna - 2 x U.FL connectors (diversity antenna), 1T2R
    • Operating Frequency - 802.11b/g/n ISM Band: 2.400 ~ 2.4835GHz
    • Modulation - 802.11b: DSSS (DBPSK, DQPSK, CCK), 802.11g: OFDM (BPSK, QPSK, 16-QAM, 64-QAM), 802.11n: OFDM (BPSK, QPSK, 16-QAM, 64-QAM)
    • Output Power - 802.11b: 17dBm ± 2dBm@11Mbps , 802.11g: 15dBm ± 2dBm@54Mbps, 802.11gn (HT20): 14dBm ± 2dBm@MCS7, 802.11gn (HT40): 14dBm ± 2dBm@MCS7
    • Receive Sensitivity - 802.11b: -80dBm ± 2dBm@11Mbps, 802.11g: -70dBm ± 2dBm@54Mbps, 802.11gn (HT20): -64dBm ± 2dBm@MCS7, 802.11gn (HT40): -61dBm ± 2dBm@MCS7
    • Power consumption: Continue TX - Max. 385mA, Continue RX - Max. 263mA
    • Operating Voltage: DC 3.3V ± 10%  
    • Environmental: Temperature Range - 0 ~ 70°C (Operating)  -40 ~ 85°C (Storing), Humidity (Non-Condensing) - 5 ~ 90% (Operating)   5 ~ 90% (Storing)
    • Physical Specification: Dimensions - 29.85mm x 26.65mm x 3.05mm, Weight - 3.8g
    • Software: Driver - Windows XP/ Vista, Win 7, Linux, Android by request, Security - 64/128-bits WEP, WPA, WPA2

    Mini PCIe module, 802.11a/b/g/n, dual band

    Sparklan WPEA-121N WiFi 802.11

    MPN:

    WPEA-121N

    Manufacturer L3 Communications

    Sparklan

    Description:

    Mini PCI express module, WiFi 802.11a/b/g/n, dual band, 2x2, up to 300 Mbps, 2x U.FL RF connectors, 0 to +75°C operating temp, Qualcomm Atheros AR9382.

    Features:

    • Standard: 802.11a/b/g/n
    • Chipset: Mac/BB/RF - Atheros AR9382
    • Host Interface: PCI Express
    • Radio: Antenna - 2 x U.FL connectors, 2T2R
    • Operating Frequency: 802.11b/g/n ISM Band: 2.412 ~ 2.4835 GHz, 802.11a ISM Band: 5.15 ~ 5.85 GHz
    • Modulation: 802.11b: DSSS (DBPSK, DQPSK, CCK), 802.11a/g: OFDM (BPSK, QPSK, 16-QAM, 64-QAM), 802.11n: OFDM (BPSK, QPSK, 16-QAM, 64-QAM)
    • Output Power: 802.11a: 12dBm ± 2dBm, 802.11b: 17dBm ± 2dBm, 802.11g: 16dBm ± 2dBm, 802.11an (HT20): 12dBm ± 2dBm@MCS7, 802.11an (HT40): 11dBm ± 2dBm@MCS7, 802.11gn (HT20): 15dBm ± 2dBm@MCS7, 802.11gn (HT40): 14dBm ± 2dBm@MCS7
    • Receive Sensitivity: 802.11a: ≤ -76dBm@54Mbps, 802.11b: ≤ -85dBm@11Mbps, 802.11g: ≤ -76dBm@54Mbps, 802.11gn (HT20): ≤ -75dBm@MCS7, 802.11gn (HT40): ≤ -72dBm@MCS7, 802.11an (HT20): ≤ -74dBm@MCS7, 802.11an (HT40): ≤ -71dBm@MCS7
    • Power consumption: Continue TX - 600mA, Continue RX - 237mA
    • Operating Voltage: DC 3.3V ± 10% I/O supply voltage 
    • Environmental: Temperature Range - 0 ~ 75°C (Operating)  -40 ~ 85°C (Storing), Humidity (Non-Condensing) - 5 ~ 90% (Operating)   5 ~ 95% (Storing)
    • Physical Specification: Dimensions - 30mm x 26.8mm x 4.5mm, Weight - ≤ 9g
    • Software: Driver - Windows 2000/ XP/ Vista, Win 7, Linux, Android by request, Security - 64/128-bits WEP, WPA, WPA2

    Half size Mini PCIe module, 802.11a/b/g/n, with Bluetooth, dual band

    Sparklan WPEA-251NBT WiFi 802.11

    MPN:

    WPEA-251N(BT)

    Manufacturer L3 Communications

    Sparklan

    Description:

    Half size Mini PCI express module, WiFi 802.11a/b/g/n, with Bluetooth (via USB: 4.0 LE, 3.0 HS, 2.1 EDR), dual band, 2x2, up to 300 Mbps, 2x U.FL RF connectors, 0 to +75°C operating temp, Qualcomm Atheros AR9462.

    Features:

    • Standard: 802.11a/b/g/n, Bluetooth 4.0 LE/ 3.0 HS/ 2.1 EDR standard
    • Chipset: Mac/BB/RF - Atheros AR9462
    • Host Interface: Half Mini Card (PCIe: WLAN; USB: Bluetooth)
    • Radio: Antenna: 2 x U.FL connectors (2T/2R) Support WLAN / BT co-existence
    • Operating Frequency: Wi-Fi, b/g/n ISM Band: 2.414GHz ~ 2.4835GHz; a: 5.15GHz ~ 5.85GHz, Bluetooth: 2402GHz ~ 2480GHz
    • Modulation: Wi-Fi: 802.11a/g/n: OFDM (BPSK, QPSK, 16-QAM, 64-QAM), 802.11b: DSSS (DBPSK, DQPSK, CCK), Bluetooth: Header: GFSK / Payload 2M: 4-DQPSK / Payload 3M: 8-DPSK
    • Output Power: Wi-Fi: 802.11a: 11dBm ± 2dBm@54Mbps, 802.11b: 17dBm ± 2dBm@11Mbps, 802.11g: 15dBm ± 2dBm@54Mbps, 802.11gn (HT20): 14dBm ± 2dBm@MCS7, 802.11gn (HT40): 14dBm ± 2dBm@MCS7, 802.11an (HT20): 10dBm ± 2dBm@MCS7, 802.11an (HT40): 10dBm ± 2dBm@MCS7, Bluetooth: -6 ≦ Output Power Avg. ≦ +4dBm (Class 2 Device)
    • Receive Sensitivity: Wi-Fi: 802.11a: ≤ -73dBm@54Mbps, 802.11b: ≤ -85dBm@11Mbps, 802.11g: ≤ -74dBm@54Mbps, 802.11gn (HT20): ≤ -72dBm@MCS7, 802.11gn (HT40): ≤ -69dBm@MCS7, 802.11an (HT20): ≤ -69dBm@MCS7, 802.11an (HT40): ≤ -68dBm@MCS7, Bluetooth: BER < 0.1% at -70dBm
    • Power consumption: Continue TX - Max. 523mA, Continue RX - Max. 202mA
    • Operating Voltage: DC 3.3V ± 9% I/O Supply Voltage
    • Environmental: Temperature Range - 0 ~ 75°C (Operating)  -40 ~ 85°C (Storing), Humidity (Non-Condensing) - 5 ~ 90% (Operating)   5 ~ 95% (Storing)
    • Physical Specification: Dimensions - 30.mm x 26.80mm, Weight - ≤ 7g
    • Software: Driver - Windows XP/ Vista, Win 7, Linux, Android by request, Security - 64/128-bits WEP, WPA, WPA2

    Mini PCIe module, 802.11a/b/g/n, dual band

    Sparklan WPEA-252NI WiFi 802.11

    MPN:

    WPEA-252NI

    Manufacturer L3 Communications

    Sparklan

    Description:

    Mini PCI express module, WiFi 802.11a/b/g/n, dual band, 2x2, up to 300 Mbps, 2x U.FL RF connectors, Industrial grade, -40 to +85℃ operating temp, Qualcomm Atheros AR9592-AR1B.

    Features:

    • Standard: 802.11a/b/g/n
    • Chipset: Mac/BB/RF - Qualcomm Atheros AR9592-AR1B
    • Host Interface: PCI Express
    • Radio: Antenna: 2 x U.FL connectors
    • Operating Frequency: 802.11g ISM Band: 2.400 ~ 2.4835GHz, 802.11a ISM Band: 5.150 ~ 5.825GHz
    • Modulation: 802.11b: DSSS (DBPSK, DQPSK, CCK), 802.11a/g: OFDM (BPSK, QPSK, 16-QAM, 64-QAM), 802.11n: OFDM (BPSK, QPSK, 16-QAM, 64-QAM)
    • Output Power: 802.11a: 14dBm ± 2dBm@54Mbps, 802.11b: 19dBm ± 2dBm@11Mbps, 802.11g: 16dBm ± 2dBm@54Mbps, 802.11an (HT20): 12dBm ± 2dBm@MCS7, 802.11an (HT40): 11dBm ± 2dBm@MCS7, 802.11gn (HT20): 15dBm ± 2dBm@MCS7, 802.11gn (HT40): 14dBm ± 2dBm@MCS7
    • Receive Sensitivity: 802.11a: ≤ -77dBm@54Mbps, 802.11b: ≤ -85dBm@11Mbps, 802.11g: ≤ -77dBm@54Mbps, 802.11an (HT20): ≤ -73dBm@MCS7, 802.11an (HT40): ≤ -70dBm@MCS7, 802.11gn (HT20): ≤ -74dBm@MCS7, 802.11gn (HT40): ≤ -71dBm@MCS7
    • Power consumption: Continue TX - Max. 700mA, Continue RX - Max. 300mA
    • Operating Voltage: DC 3.3V ± 10%
    • Environmental: Temperature Range - -40 ~ 85°C (Operating) -50 ~ 90°C (Storing), Humidity (Non-Condensing) - 10 ~ 85% (Operating) 5 ~ 90% (Storing)
    • Physical Specification: Dimensions - 29.85mm x 50.80mm x 2.86mm, Weight - ≤ 10g
    • Software: Driver - Linux, Android by request, Security - 64/128-bits WEP, WPA, WPA2, 802.1x

    Dual Band Mini PCIe module, WiFi 802.11a/b/g/n, 3T3R

    Sparklan WPEA-127NI WiFi 802.11

    MPN:

    WPEA-127N Series

    Manufacturer L3 Communications

    Sparklan

    Description:

    See how we solve customer design challenges with our technical expertise and the latest technology

    SparkLAN Industrial grade WPEA-127NI is a high-speed 802.11n pcie module based on Atheros XB114 Reference Design (AR9390-AL1B chipset), which delivers up to 450Mbps data rate.

    SparkLAN WPEA-127N is an 802.11n Dual-Band Mini PCI express card based on Atheros AR9380-AL1A chipset. It supports 3T3R (3x3 radios) MIMO technology, which provides maximum data rate up to 450Mbps and improves the overall WiFi coverage area.

    View our wide range of WiFi 802.11

    View our portfolio of M2M and Wireless

    See all products from our supplier Sparklan

    Features:

    • Standard: 802.11a/b/g/n
    • Chipset: Mac/BB/RF - Atheros AR9390-AL1B / Atheros AR9380-AL1A
    • Host Interface: PCI Express
    • Radio: Antenna: 3 x U.FL connectors
    • Operating Frequency: 802.11g ISM Band: 2.400 ~ 2.4835GHz, 802.11a ISM Band: 5.180 ~ 5.825GHz

    USB module, 802.11b/g/n, single band

    Sparklan WUBA-171GN WiFi 802.11

    MPN:

    WUBA-171GN

    Manufacturer L3 Communications

    Sparklan

    Description:

    USB module, WiFi 802.11b/g/n, single band, 1x1, up to 150 Mbps, 5 pole Pin connector, U.FL RF connector, Industrial grade, -30 to +75℃ operating temp, Qualcomm Atheros AR9271.

    Features:

    • Standard: 802.11b/g/n
    • Chipset: Mac/BB/RF - Atheros AR9271
    • Host Interface: USB 2.0 5-Pin connector
    • Radio: Antenna: 1 x U.FL connector, 1T1R
    • Operating Frequency: 802.11g ISM Band: 2.412 ~ 2.472GHz
    • Modulation: 802.11b: DSSS (DBPSK, DQPSK, CCK), 802.11g: OFDM (BPSK, QPSK, 16-QAM, 64-QAM), 802.11n: OFDM (BPSK, QPSK, 16-QAM, 64-QAM)
    • Output Power: 802.11b: 23dBm ± 2.0dBm@11Mbps, 802.11g: 21dBm ± 2.0dBm@54Mbps, 802.11gn HT20: 21dBm ± 2.0dBm@MCS7, 80.211gn HT40: 21dBm ± 2.0dBm@MCS7
    • Receive Sensitivity: 802.11b: ≤ -90dBm@11Mbps, 802.11g: ≤ -75dBm@54Mbps, 802.11gn (HT20): ≤ -72dBm@MCS7, 802.11gn (HT40): ≤ -68dBm@MCS7
    • Power consumption: Continue TX - Max. 650mA, Continue RX - Max. 300mA
    • Operating Voltage: DC 5V ± 5%
    • Environmental: Temperature Range - (-30 ~ 75°C (Operating) -30 ~ 80°C (Storing), Humidity (Non-Condensing) - 10 ~ 90% (Operating) 10 ~ 90% (Storing)
    • Physical Specification: Dimensions - 65.0mm x 20.9mm x 11.6mm, Weight - < 10g
    • Software: Driver - Windows XP/ Vista/ Win 7, Linux, Security - 64/128-bits WEP, WPA, WPA2

    Mini PCIe module, 802.11ac/a/b/g/n, dual band

    Sparklan WPEA-352ACN WiFi module

    MPN:

    WPEA-352ACN

    Manufacturer L3 Communications

    Sparklan

    Description:

    Mini PCI express module, WiFi 802.11ac/a/b/g/n, dual band, 3x3, up to 1300 Mbps, 3x U.FL RF connectors, 0 to +40°C operating temp, Qualcomm Atheros QCA9880-BR4A.

    Features:

    • Standard: 802.11ac/b/g/n
    • Chipset: Mac/BB/RF - Qualcomm Atheros QCA9880-BR4A
    • Host Interface: PCI Express
    • Radio: Antenna: 3 x U.FL connectors
    • Operating Frequency: 11b/g/n ISM Band: 2.400GHz ~ 2.4835GHz, 11ac ISM Band: 5.150GHz ~ 5.825GHz
    • Modulation: 802.11b: DSSS (DBPSK, DQPSK, CCK), 802.11a/g: OFDM (BPSK, QPSK, 16-QAM, 64-QAM), 802.11n: OFDM (BPSK, QPSK, 16-QAM, 64-QAM), 802.11ac: OFDM (BPSK, QPSK, 16-QAM, 64-QAM, 256-QAM)
    • Output Power: 802.11a: 15dBm ± 2dBm@54Mbps, 802.11b: 18dBm ± 2dBm@11Mbps, 802.11g: 15dBm ± 2dBm@54Mbps, 802.11an (HT20): 13dBm ± 2dBm@MCS7, 802.11an (HT40): 12dBm ± 2dBm@MCS7, 802.11gn (HT20): 13dBm ± 2dBm@MCS7, 802.11gn (HT40): 13dBm ± 2dBm@MCS7, 802.11ac (VHT80): 10dBm ± 2dBm@MCS9
    • Receive Sensitivity: 802.11a: ≤-65dBm@54Mbps, 802.11b: ≤-76dBm@11Mbps, 802.11g: ≤-65dBm@54Mbps, 802.11an HT20: ≤-64dBm@MCS7, 802.11an HT40: ≤-61dBm@MCS7, 802.11gn HT20: ≤-64dBm@MCS7, 802.11gn HT40: ≤-61dBm@MCS7, 802.11ac (VHT80): ≤-51dBm@MCS9
    • Power consumption: Continue TX - Max 1250mA, Continue RX - Max. 350mA
    • Operating Voltage: DC 3.3V
    • Environmental: Temperature Range - 0 ~ 40°C (Operating) -10 ~ 70°C (Storing), Humidity (Non-Condensing) - 10 ~ 85% (Operating) 5 ~ 90% (Storing)
    • Physical Specification: Dimensions - 50.8mm x 29.85mm x 3.95mm(±0.5mm), Weight - ≤ 8g
    • Software: Driver - Linux, Security - WEP, WPA, WPA2, 802.1x

    USB module, 802.11a/b/g/n, dual band

    Sparklan WUBR-508N WiFi module

    MPN:

    WUBR-508N Series

    Manufacturer L3 Communications

    Sparklan

    Description:

    SparkLAN WUBR-508N Module Series, embedded with Ralink RT5572 chipset, is an 802.11n WiFi USB module. With advanced 2T2R MIMO technology, WUBR-508N Module Series delivers ultimate wireless data rate for up to 300Mbps. It is designed for any wireless enabled device with standard USB 2.0 Type A connector, 4-Pin connector, or 4-Pin Wafer connector. Customer can also choose either printed or U.FL antenna based on individual's requirements. With the possibilities of different combinations of the host interface and antenna, the manufactures or designers have a variety of choices with higher flexibility to their needs.

    Features:

    • Standard: 802.11a/b/g/n
    • Interface: USB 2.0 Type A, 4-Pin, or 4-Pin Wafer connector
    • Chipset: Ralink RT5572
    • Antenna: Printed antennas or 2 x U.FL connectors (optional), 2T2R
    • Data rate up to 300Mbps
    • Enhanced wireless security: WEP, WPA, WPA2, 802.1x
    • Support Windows XP/ Vista/ Win7, Linux, Android by request

    Half size Mini PCIe module, 802.11ac/a/b/g/n, dual band

    Sparklan WPET-232ACN WiFi module

    MPN:

    WPET-232ACN

    Manufacturer L3 Communications

    Sparklan

    Description:

    Half size Mini PCI express module, WiFi 802.11ac/a/b/g/n, dual band, 2x2, up to 867 Mbps, 2x U.FL RF connectors, 0 to +40℃ operating temp, Realtek RTL8812AE.

    Features:

    • Standard: 802.11ac/b/g/n
    • Chipset: Mac/BB/RF - MediaTek MT7612U
    • Host Interface: USB Type A or 12-pin wafer connector
    • Radio: Antenna: 2 x U.FL connectors or printing antenna
    • Operating Frequency: ac/n ISM Band: 5.150 ~ 5.825GHz, b/g/n ISM Band: 2.400 ~ 2.4835GHz
    • Modulation: 802.11b: DSSS (DBPSK, DQPSK, CCK), 802.11a/g: OFDM (BPSK, QPSK, 16-QAM, 64-QAM), 802.11n: OFDM (BPSK, QPSK, 16-QAM, 64-QAM), 802.11ac: OFDM (BPSK, QPSK, 16-QAM, 64-QAM, 256-QAM)
    • Output Power: 802.11b: 15dBm ± 2dBm@11Mbps, 802.11a: 12dBm ± 2dBm@54Mbps, 802.11g: 13dBm ± 2dBm@54Mbps, 802.11gn (HT20): 12dBm ± 2dBm@MCS7, 802.11gn (HT40): 12dBm ± 2dBm@MCS7, 802.11an (HT20): 11dBm ± 2dBm@MCS7, 802.11an (HT40): 11dBm ± 2dBm@MCS7, 802.11ac (VHT80): 10dBm ± 2dBm@MCS9
    • Receive Sensitivity: 802.11b: ≤ -76dBm@11Mbps, 802.11a: ≤ -65dBm@54Mbps, 802.11g: ≤ -65dBm@54Mbps, 802.11gn (HT20): ≤ -64dBm@MCS7, 802.11gn (HT40): ≤ -61dBm@MCS7, 802.11an (HT20): ≤ -64dBm@MCS7, 802.11an (HT40): ≤ -61dBm@MCS7, 802.11ac (VHT80): ≤ -51dBm@MCS9
    • Power consumption: Continue TX - Max 460mA, Continue RX - Max. 390mA
    • Operating Voltage: DC 5V
    • Environmental: Temperature Range - 0 ~ 40°C (Operating) -10 ~ 70°C (Storing), Humidity (Non-Condensing) - 10 ~ 85% (Operating) 5 ~ 90% (Storing)
    • Physical Specification: Dimensions - 55.0mm x 25mm x 4.2mm(0.5mm), Weight - ≤ 7g
    • Software: Driver - Windows XP/ Win 7/ Win 8.1, Linux, Android by request, Security - WEP, WPA, WPA2, 802.1x

    Dual band USB module, 802.11ac/a/b/g/n

    Sparklan WUBM-273ACN WiFi module

    MPN:

    WUBM-273ACN Series

    Manufacturer L3 Communications

    Sparklan

    Description:

    SparkLAN WUBM-273ACN is an 802.11ac/b/g/n 2.4GHz + 5GHz USB module based on MediaTek MT7612U chipset. It supports 2T2R (2x2) technology, which runs up to 867Mbps (MSC9).

    Features:

    • Standard: 802.11ac/b/g/n
    • Host interface: USB Type A or 12-pin wafer connector
    • Chipset: MediaTek MT7612U
    • Antenna: 2x U.FL connectors or Printing antenna, 2T2R
    • Data rate up to 867Mbps
    • Enhanced wireless security: WEP, WPA, WPA2, 802.1x
    • Support Windows XP/ Vista, Win 7, Win 8, Linux, Android by request

    Industrial Embedded Device Server, Serial to Ethernet, Modbus

    LAntronix xPico-IAP Embedded Device Server Module

    MPN:

    xPico™ IAP

    Manufacturer L3 Communications

    Lantronix

    Description:

    xPico IAP is an extremely compact networking solution that enables Ethernet connectivity on virtually any device with a serial interface. Designed for robust operation and with support of Modbus, the chip-sized xPico™ IAP module provides simplicity and flexibility making it the easiest and fastest industrial network-enabling module on the market.

    As the smallest embedded device server in the world, xPico IAP can be utilized in designs typically intended for chip solutions. A key difference with the xPico IAP is that there is virtually no need to write a single line of code, translating to a much lower development cost and faster time-to-market.

    View our wide range of Embedded Networking

    View our portfolio of M2M and Wireless

    See all products from our supplier Lantronix

    Features:

    • Chip-sized Footprint: 24mm x 16.5mm
    • Complete Device Server Application with Full IP Stack
    • Modbus TCP, ASCII, RTU Support
    • Serial Port Supporting Up to 115.2kbps
    • Extended Temperature: -40° to +85°C

    Serial-to-Ethernet Device Server, RS-232 Single port

    Lantronix XDirect Serial-to-Ethernet

    MPN:

    xDirect232

    Manufacturer L3 Communications

    Lantronix

    Description:

    xDirect™ 232 is a sleek and compact Serial-to- Ethernet single Port RS232 10/100 device server, providing quick and easy Ethernet connectivity to virtually any device or machine with a serial interface. With an integrated Ethernet port and serial cable, multiple power options including PoE, and an industry-best five year warranty, xDirect provides a portable, extremely flexible, and highly affordable network connectivity solution.

    View our wide range of Embedded Networking

    View our portfolio of M2M and Wireless

    See all products from our supplier Lantronix

    Features:

    • Integrated 10/100 Ethernet Port and Serial Cable
    • Serial Data Rate of up to 921.6 Kbps
    • Serial Interface: RS232
    • Protocols: UDP, TCP, ARP, Telnet, ICMP, SNMP, DHCP, BOOTP, TFTP, Auto IP, HTTP, Telnet Com Port Control
    • 128/192/256-bit AES Encryption
    • Flexible Power Options including PoE
    • Extended Temperature Range of -40° to 85°C
    • 5-year Limited Warranty

    Serial-to-Ethernet Device Server, S232/422/485 Single port

    Lantronix XDirect Serial-to-Ethernet

    MPN:

    xDirect485

    Manufacturer L3 Communications

    Lantronix

    Description:

    xDirect™ 485 is a sleek and compact Serial-to- Ethernet single Port RS232/422/485 10/100 device server, providing quick and easy Ethernet connectivity to virtually any device or machine with a serial interface. With an integrated Ethernet port and serial cable, multiple power options including PoE, and an industry-best five year warranty, xDirect provides a portable, extremely flexible, and highly affordable network connectivity solution.

    View our wide range of Embedded Networking

    View our portfolio of M2M and Wireless

    See all products from our supplier Lantronix

    Features:

    • Integrated 10/100 Ethernet Port and Serial Cable
    • Serial Data Rate of up to 921.6 Kbps
    • Serial Interface: RS232, RS422 or RS485 (2 and 4 wire support)
    • Protocols: UDP, TCP, ARP, Telnet, ICMP, SNMP, DHCP, BOOTP, TFTP, Auto IP, HTTP, Telnet Com Port Control
    • 128/192/256-bit AES Encryption
    • Flexible Power Options including PoE
    • Extended Temperature Range of -40° to 85°C
    • 5-year Limited Warranty

    Serial-to-Ethernet Device Server, PoE

    Lantronix XDirect Serial-to-Ethernet

    MPN:

    xDirect PoE

    Manufacturer L3 Communications

    Lantronix

    Description:

    xDirect™ PoE is a sleek and compact Serial-to- Ethernet single Port RS232/422/485 10/100 device server, providing quick and easy Ethernet connectivity to virtually any device or machine with a serial interface. With an integrated Ethernet port and serial cable, multiple power options including PoE, and an industry-best five year warranty, xDirect provides a portable, extremely flexible, and highly affordable network connectivity solution.

    View our wide range of Embedded Networking

    View our portfolio of M2M and Wireless

    See all products from our supplier Lantronix

    Features:

    • Integrated 10/100 Ethernet Port and Serial Cable
    • Serial Data Rate of up to 921.6 Kbps
    • Serial Interface: RS232, RS422 or RS485 (2 and 4 wire support)
    • Protocols: UDP, TCP, ARP, Telnet, ICMP, SNMP, DHCP, BOOTP, TFTP, Auto IP, HTTP, Telnet Com Port Control
    • 128/192/256-bit AES Encryption
    • Flexible Power Options including PoE
    • Extended Temperature Range of -40° to 85°C
    • 5-year Limited Warranty

    Industrial Serial-to-Ethernet Device Server, Modbus support, RS232/422/485

    Lantronix XDirect Serial-to-Ethernet

    MPN:

    xDirect-IAP

    Manufacturer L3 Communications

    Lantronix

    Description:

    xDirect™-IAP is a sleek and compact Serial-to-Ethernet device server with Modbus support, RS232/422/485 DB9F Serial Port, 10/100 Ethernet Port providing quick and easy Ethernet connectivity to manage and control industrial automation equipment over Ethernet or the Internet. With an integrated Ethernet port and serial cable, multiple power options including PoE, and an industry-best five year warranty, the xDirect-IAP device server provides a portable, extremely flexible, and highly affordable network connectivity solution.

    View our wide range of Embedded Networking

    View our portfolio of M2M and Wireless

    See all products from our supplier Lantronix

    Features:

    • Integrated 10/100 Ethernet Port and Serial Cable
    • Serial Interface: RS232, RS422 or RS485 (2 and 4 wire support)
    • Complete Device Server Application with Full IP Stack
    • Modbus TCP, ASCII, RTU Support
    • Space Saving Form Factor
    • Serial Data Rate of up to 115.2 Kbps
    • Flexible Power Options including PoE
    • Extended Temperature Range of -40° to 85°C
    • 5-year Limited Warranty

    Industrial Serial-to-Ethernet Device Server, PoE, Modbus support, RS232/422/485

    Lantronix XDirect Serial-to-Ethernet

    MPN:

    xDirect-IAP PoE

    Manufacturer L3 Communications

    Lantronix

    Description:

    xDirect™-IAP PoE is a sleek and compact Serial-to-Ethernet device server with Modbus support, RS232/422/485 DB9F Serial Port, 10/100 Ethernet Port providing quick and easy Ethernet connectivity to manage and control industrial automation equipment over Ethernet or the Internet. With an integrated Ethernet port and serial cable, multiple power options including PoE, and an industry-best five year warranty, the xDirect-IAP device server provides a portable, extremely flexible, and highly affordable network connectivity solution.

    View our wide range of Embedded Networking

    View our portfolio of M2M and Wireless

    See all products from our supplier Lantronix

    Features:

    • Integrated 10/100 Ethernet Port and Serial Cable
    • Serial Interface: RS232, RS422 or RS485 (2 and 4 wire support)
    • Complete Device Server Application with Full IP Stack
    • Modbus TCP, ASCII, RTU Support
    • Space Saving Form Factor
    • Serial Data Rate of up to 115.2 Kbps
    • Flexible Power Options including PoE
    • Extended Temperature Range of -40° to 85°C
    • 5-year Limited Warranty

    Intelligent Gateway, High Speed, 3.5G cellular, HSPA+

    Lantronix PremierWave-XC HSPA

    MPN:

    PremierWave® XC HSPA+

    Manufacturer L3 Communications

    Lantronix

    Description:

    PremierWave® XC HSPA+ is an industrialgrade 3.5G wireless solution offering Penta-band HSPA+ performance, network redundancy, and enterprise-level security for mission critical applications, time sensitive event tracking, and M2M connectivity. PremierWave® XC HSPA+ is a flexible and robust intelligent gateway and application server in a compact industrial-grade IP30 rated housing. It is ideal for deployment in remote locations either as a primary wireless connectivity to host multiple devices or as a backup when Ethernet connectivity fails. As with any Lantronix product, PremierWave XC HSPA+ is designed with ease of use in mind without compromising security.

    View our wide range of 2G / 3G / 4G-LTE Wireless Gateways and Modems

    View our portfolio of M2M and Wireless

    See all products from our supplier Lantronix

    Features:

    • Penta-band UMTS/HSPA+ (global coverage)
    • Quad-band GSM/GPRS/EDGE
    • Ethernet-to-Cellular Failover/Failback
    • Ethernet-to-Cellular Routing
    • Serial-to-Cellular Tunneling
    • Serial-to-Ethernet Tunneling
    • SMS - Shoulder Tap, Relay Control, Event Notification, SMS Tunneling*
    • Lantronix Device Server Application Suite
    • 1 10/100 Port, 2 Serial Ports, 2 Digital Inputs, 1 Relay Output, 1 USB Port
    • Industrial Grade Design
    • 5-Year Limited Warranty

    GSM/GPRS, Ethernet, Linux-Based Application/Device Server

    Lantronix PremierWave-XC GPRS

    MPN:

    PremierWave® XC

    Manufacturer L3 Communications

    Lantronix

    Description:

    PremierWave® XC is high performance, multi-port secure device server that offers Ethernet or GSM/GPRS connectivity for remote access and easy management of machines and equipment over the network and across the Internet. With GSM/GPRS and Ethernet connectivity with failover, PremierWave XC device server provides flexibility and redundancy. PremierWave XC can be configured remotely over a network using Telnet, SSH, or web browser (HTTP and HTTPS). With no special software required, setup is a breeze with the included Windows-based DeviceInstaller™ software.

    View our wide range of 2G / 3G / 4G-LTE Wireless Gateways and Modems

    View our portfolio of M2M and Wireless

    See all products from our supplier Lantronix

    Features:

    • Serial Interface Modes: Software selectable RS-232/422/485
    • USB Interface: USB 2.0
    • Ethernet: 10BaseT and 100Base-TX Link (auto sensing full and half duplex support)
    • GSM/GPRS Quad-band: 850/900/1800/1900 MHz

    Embedded device server, xPico Wi-Fi W1002, IEEE 802.11 b/g/n, extended temperature, SMT, bulk, RoHS

    XPCW1002100B

    MPN:

    xPico Wi-Fi SMT U.FL

    Manufacturer L3 Communications

    Lantronix

    Description:

    See how we solve customer design challenges with our technical expertise and the latest technology

    Reduce your development costs, shorten your time to market, and leverage mobile solutions with the Lantronix® xPico® Wi-Fi® family of embedded device servers. Based on the Broadcom® WICED™ Platform, it is one of the world's smallest and most flexible Wi-Fi® device servers. xPico Wi-Fi is a state-of-the-art member of the xPico family, providing low power, Soft AP and simultaneous client mode, full IP and WLAN stacks. The xPico Wi-Fi module is a complete device server suitable for mobile M2M applications and includes industry best 5-year warranty.

    Tablet and Smartphone Enable Your Devices: Access your data and devices from anywhere - wired or wireless. Lantronix industry-proven device server application and protocol stacks enables seamless remote access to device data, simplifying design integration, all while providing robust connectivity - including the ability to access data from any mobile device, including smartphones and tablets.

    Robust Networking Solution: The Lantronix xPico Wi-Fi Module is an extremely compact, low power networking solution that enables wireless LAN connectivity on virtually any solution with a SPI, USB (device) or serial interface.

    Simultaneous Access Point and Client Mode: The xPico Wi-Fi module is a state-of-the-art solution that offers all the functions one can expect including a unique simultaneous Soft AP and Client mode. This allows for easy points of access while maintaining a secure network connection.

    Flexibility: xPico Wi-Fi modules have a chip-sized footprint with 2 mounting options (40-pin Board-to-Board SMT Connector and direct SMT), providing unmatched flexibility for you to choose the right network device for your application.

    Cost Savings and Faster Time-To-Market: As one of the smallest embedded device servers in the world, the xPico Wi-Fi module can be utilized in designs typically intended for chip solutions, befitting in advantages to cost and time-to-market. Its "zero host load" eliminates any need for drivers on the connected microcontroller making implementation easy and fast with virtually no need to write a single line of code. This translates to considerably lower development costs and faster time-to-market. As xPico Wi-Fi meets FCC Class B, UL and EN EMC and safety compliance, your development time is shortened. The xPico Wi-Fi module can reduce the overall cost of ownership compared to the competition.

    Features:

    • Wireless lan interface
    • Ieee 802.11 b/g and ieee 802.11n (single stream) wlan interface (2.4 ghz only)
    • Ieee 802.11 d/h/i/j/k/w/r
    • On module antenna (xpcw1003100b)
    • U.Fl connector for external antenna (xpc100100b-01 and xpcw1002100b)
    • Serial interface
    • Two serial cmos ports (3.3v, 5v tolerant)
    • 300 to 921.6 kbps
    • Flow control xon/xoff, rts/cts (sport 1 only)
    • Lantronix tunneling application
    • Host interface
    • Dual serial port, spi, usb 2.0* (device)
    • 8 gpio
    • Network protocols
    • Tcp/ip, udp/ip, dhcp, arp, icmp, dhcp, auto-ip, dns
    • Networking capabilities
    • Soft access point with dhcp server
    • Quickconnect: dynamic profiles facilitate easy and rapid connections to access points
    • Management and control
    • Web server - landing page
    • Cli (serial monitor port)
    • Xml import and export (xcr)
    • Field upgradable firmware (ota)
    • Security
    • Ieee 802.11i support - wpa-personal, wpa2-personal
    • 256-bit aes encryption
    • Architecture
    • Arm cortex m3 class processor with on-chip flash and sram
    • 1mb flash and 128 kb sram
    • 1mb spi flash storage
    • Power
    • Input voltage: 3.3vdc
    • Low power consumption of approximately 6μa standby
    • Physical interface
    • 40-pin board-to-board smt connector (xpw100100b-01)
    • 56-pad smt castellation (xpcw1002100b and xpcw1003100b)
    • Environmental
    • Operating temp: -40° to +85° c
    • Xpw100100b-01: for operation over +70° c a thermal pad is required
    • Storage temp: -40° to +85° c
    • Relative humidity: 0% to 90% non-condensing
    • Certifications
    • Fcc class b, ul and en emc, japan, au/nz
    • Packaging
    • Dimensions:
    • Xpw100100b-01: 24mm (l) x 16.5mm (w) x 5.64mm (h)
    • Xpcw1002100b: 26.1mm (l) x 18.3mm (w) x 3.0 mm (h)
    • Xpcw1003100b: 30.1mm (l) x 18.3mm (w) x 3.0 mm (h)
    • Weight: 2.5g
    • Warranty
    • 5-year limited

    Embedded device server, xPico Wi-Fi W1003, IEEE 802.11 b/g/n, extended temperature, w/ on-module antenna SMT, bulk, RoHS

    XPCW1003100B

    MPN:

    xPico Wi-Fi SMT Antenna

    Manufacturer L3 Communications

    Lantronix

    Description:

    Reduce your development costs, shorten your time to market, and leverage mobile solutions with the Lantronix® xPico® Wi-Fi® family of embedded device servers. Based on the Broadcom® WICED™ Platform, it is one of the world's smallest and most flexible Wi-Fi® device servers. xPico Wi-Fi is a state-of-the-art member of the xPico family, providing low power, Soft AP and simultaneous client mode, full IP and WLAN stacks. The xPico Wi-Fi module is a complete device server suitable for mobile M2M applications and includes industry best 5-year warranty.

    Tablet and Smartphone Enable Your Devices: Access your data and devices from anywhere - wired or wireless. Lantronix industry-proven device server application and protocol stacks enables seamless remote access to device data, simplifying design integration, all while providing robust connectivity - including the ability to access data from any mobile device, including smartphones and tablets.

    Robust Networking Solution: The Lantronix xPico Wi-Fi Module is an extremely compact, low power networking solution that enables wireless LAN connectivity on virtually any solution with a SPI, USB (device) or serial interface.

    Simultaneous Access Point and Client Mode: The xPico Wi-Fi module is a state-of-the-art solution that offers all the functions one can expect including a unique simultaneous Soft AP and Client mode. This allows for easy points of access while maintaining a secure network connection.

    Flexibility: xPico Wi-Fi modules have a chip-sized footprint with 2 mounting options (40-pin Board-to-Board SMT Connector and direct SMT), providing unmatched flexibility for you to choose the right network device for your application.

    Cost Savings and Faster Time-To-Market: As one of the smallest embedded device servers in the world, the xPico Wi-Fi module can be utilized in designs typically intended for chip solutions, befitting in advantages to cost and time-to-market. Its "zero host load" eliminates any need for drivers on the connected microcontroller making implementation easy and fast with virtually no need to write a single line of code. This translates to considerably lower development costs and faster time-to-market. As xPico Wi-Fi meets FCC Class B, UL and EN EMC and safety compliance, your development time is shortened. The xPico Wi-Fi module can reduce the overall cost of ownership compared to the competition.

    Features:

    • Wireless lan interface
    • Ieee 802.11 b/g and ieee 802.11n (single stream) wlan interface (2.4 ghz only)
    • Ieee 802.11 d/h/i/j/k/w/r
    • On module antenna (xpcw1003100b)
    • U.Fl connector for external antenna (xpc100100b-01 and xpcw1002100b)
    • Serial interface
    • Two serial cmos ports (3.3v, 5v tolerant)
    • 300 to 921.6 kbps
    • Flow control xon/xoff, rts/cts (sport 1 only)
    • Lantronix tunneling application
    • Host interface
    • Dual serial port, spi, usb 2.0* (device)
    • 8 gpio
    • Network protocols
    • Tcp/ip, udp/ip, dhcp, arp, icmp, dhcp, auto-ip, dns
    • Networking capabilities
    • Soft access point with dhcp server
    • Quickconnect: dynamic profiles facilitate easy and rapid connections to access points
    • Management and control
    • Web server - landing page
    • Cli (serial monitor port)
    • Xml import and export (xcr)
    • Field upgradable firmware (ota)
    • Security
    • Ieee 802.11i support - wpa-personal, wpa2-personal
    • 256-bit aes encryption*
    • Architecture
    • Arm cortex m3 class processor with on-chip flash and sram
    • 1mb flash and 128 kb sram
    • 1mb spi flash storage
    • Power
    • Input voltage: 3.3vdc
    • Low power consumption of approximately 6μa standby
    • Physical interface
    • 40-pin board-to-board smt connector (xpw100100b-01)
    • 56-pad smt castellation (xpcw1002100b and xpcw1003100b)
    • Environmental
    • Operating temp: -40° to +85° c
    • Xpw100100b-01: for operation over +70° c a thermal pad is required
    • Storage temp: -40° to +85° c
    • Relative humidity: 0% to 90% non-condensing
    • Certifications
    • Fcc class b, ul and en emc, japan, au/nz
    • Packaging
    • Dimensions:
    • Xpw100100b-01: 24mm (l) x 16.5mm (w) x 5.64mm (h)
    • Xpcw1002100b: 26.1mm (l) x 18.3mm (w) x 3.0 mm (h)
    • Xpcw1003100b: 30.1mm (l) x 18.3mm (w) x 3.0 mm (h)
    • Weight: 2.5g
    • Warranty
    • 5-year limited

    Device server evaluation kit with xPico Wi-Fi W1002 Wi-Fi module, SMT on carrier board, IEEE 802.11 b/g/n

    XPCW1002100K

    MPN:

    xPico Wi-Fi SMT w/U.FL Evaluation kit

    Manufacturer L3 Communications

    Lantronix

    Description:

    An xPico Wi-Fi device server evaluation kit is available to provide a simple, quick and cost effective way to evaluate the xPico Wi-Fi device server. Use the Evaluation kit to integrate the device into to your product design and find out how simple, easy it is to get started.

    The XPCW1002100K, which is a bundle of an evaluation board plus the xPico Wi-Fi W1002 module on a carrier board. This system mounts the carrier board onto a 40-pin Hirose connector (same as used for the xPIco Wi-Fi B2B connector version).

    Features:

    • xPico Evaluation Board with xPico Wi-Fi SMT module (XPCW1002100)
    • 2dBi, Whip Antenna with RP SMA connector (930-033-R)
    • 1.5 to 2.5dBi, PCB Strip Antenna with 50mm U.FL cable (930-099-R)
    • 5Vdc Wall-mount power supply AC/DC, 1A with mini-USB connector

    Device server evaluation kit with xPico Wi-Fi W1003 Wi-Fi module, SMT 802.11 b/g/n, on-module antenna

    XPCW1003100K

    MPN:

    xPico Wi-Fi SMT w/ Antenna Evaluation kit

    Manufacturer L3 Communications

    Lantronix

    Description:

    An xPico Wi-Fi device server evaluation kit is available to provide a simple, quick and cost effective way to evaluate the xPico Wi-Fi device server. Use the Evaluation kit to integrate the device into to your product design and find out how simple, easy it is to get started.

    The XPCW1003100K, is a single board with the xPico Wi-Fi W1003 module mounted. This allows the simple use of the device and using the on module antenna version. The Board includes the necessary keep out areas, so performance and positioning can be evaluated.

    Features:

    • xPico Evaluation Board with xPico Wi-Fi SMT W1003 module (XPCW1003100)
    • 5 Vdc Wall-mount power supply AC/DC, 1A with mini-USB connector

    GPS Receiver Module, Nano Spider, Ultra small, fully integrated, high performance

    ORG4400

    MPN:

    ORG4400

    Manufacturer L3 Communications

    OriginGPS

    Description:

    Designed to support ultra-compact applications such as smart watches, wearable devices, trackers and digital cameras, Spider is a miniature GPS receiver that continuously tracks all satellites in view, providing real-time positioning data in standard NMEA format.

    Fully integrated in a small form factor Measuring only 4.1×4.1×2.1mm, the Spider is a fully integrated GPS module. Unlike GPS modules of similar size, it includes LNA, SAW Filter, TCXO and RTC crystal as well as a power management unit.

    Outstanding performance and sensitivity. The Spider module offers superior sensitivity and outstanding performance, achieving rapid time to first fix (TTFF) in less than one second, accuracy of approximately one meter, and tracking sensitivity of -163dBm.Low power consumption

    Spider's architecture can detect changes in context, temperature, and satellite signals by maintaining and opportunistically updating its internal fine time, frequency, and ephemeris data, thereby achieving a state of near continuous availability, while consuming mere microwatts of battery power.

    Features:

    • Autonomous operation
    • OriginGPS Noise Free Zone System (NFZ™) technology
    • Fully integrating: LNA, SAW Filter, TCXO, RTC Crystal, GPS SoC, Power Management Unit
    • Active or Passive antenna support
    • GPS L1 1575.42 frequency, C/A code
    • SBAS (WAAS, EGNOS, MSAS) and QZSS support
    • 48 channels
    • Ultra-high Sensitivity down to -163dBm enabling Indoor Tracking
    • TTFF of < 1s in 50% of trials under Hot Start conditions
    • Low Power Consumption of < 9mW in ATP™ mode
    • High Accuracy of < 2.5m in 50% of trials
    • High update rate of 5Hz, 1Hz by default
    • Autonomous A-GPS by Client Generated Extended Ephemeris (CGEE™) for non-networked devices
    • Predictive A-GPS by Server Generated Extended Ephemeris (SGEE™) for connected devices
    • Ephemeris Push™ for storing and loading broadcast ephemeris
    • Host controlled power saving mode
    • Self-managed low power modes - ATP™, PTF™, APM™ and SiRFAware™ MPM
    • Almanac Based Positioning (ABP™)
    • Multipath and cross-correlation mitigation
    • Active Jammer Detector and Remover
    • Fast Time Synchronization for rapid single satellite time solution
    • ARM7® microprocessor system
    • Selectable UART, SPI or I2C host interface
    • NMEA protocol by default, switchable into One Socket Protocol (OSP™)
    • Programmable baud rate and messages rate
    • 1PPS output
    • Antenna input DC blocked and matched 50Ω
    • Single voltage supply
    • Ultra-small LGA footprint of 4.1mm x 4.1mm
    • Surface Mount Device (SMD)
    • Optimized for automatic assembly and reflow processes
    • Operating from -40°C to +85°C
    • FCC, CE, VCCI certified
    • RoHS II/REACH compliant

    4G-LTE M.2 PCIe Module with GPS+Glonass for EMEA and APAC

    EM7305

    MPN:

    AirPrime EM7305

    Manufacturer L3 Communications

    Sierra Wireless

    Description:

    EM7305 is a second generation 4G-LTE module with an integrated GPS+Glonass receiver primarily for EMEA and APAC. Fall back to 3G HSPA+/DC-HSPA+ and 2G GSM/GPRS/EDGE.

    Supported frequency bands:
    - 4G-LTE 800/900/1800/2100/2600
    - 3G 800/850/900/1900/2100
    - 2G 850/900/1800/1900

    Form factor: M.2 PCIe 42 x 30 x 2.3 mm.

    Ideal for M2M and mobile computing solutions, AirPrime® EM embedded modules deliver high speed connectivity on 4G-LTE networks. Based on the M.2 PCI Express Card standard with a USB interface, the EM Series modules offer an easy upgrade path to new network technologies and global access to high speed networks. The M.2 formfactor is also known as NGFF (New Generation Form Factor)

    Features:

    • Air interface: 4G-LTE MIMO, 3G-HSPA+/DC-HSPA+ Rx Diversity, 2G-GSM/GPRS/EDGE, GNSS (GPS+Glonass)
    • 4G bands: B1 (2100), B3 (1800), B7 (2600), B8 (900), B20 (800)
    • 3G bands: B1 (2100), B2 (1900), B5 (850), B8 (900)
    • 2G bands: B2 (1900), B3 (1800), B5 (850), B8 (900)
    • Peak data rate: DL 100 Mbps, UL 50 Mbps
    • GNSS (GPS+Glonass): Qualcomm
    • Form factor: M.2 PCI Express, 42x30x2.3 mm
    • Supply voltage: 3.3 V nominal
    • Operating temperature: -25°C to +60°C

       

      Control, software and features

    • Control options: AT commands, GOBI API, Linux QMI SDK
    • Drivers: Android, Linux, Windows

       

      Connectors

    • System connector: 67 position M.2
    • Antenna RF connector: 3x MHF4 (Main RF, Aux RF, GNSS)

       

      Interfaces

    • USB 2.0 high speed
    • Active antenna control
    • Dynamic power control
    • Main radio disable
    • GNSS disable
    • Flash LED output
    • Wake on Wan
    • On/Off
    • Reset
    • SIM interface: 1.8/3V

       

    4G-LTE M.2 PCIe Module with GPS+Glonass for North America / Multi operator

    Sierra Wireless AirPrime-EM Series

    MPN:

    AirPrime EM7355

    Manufacturer L3 Communications

    Sierra Wireless

    Description:

    EM7355 is a second generation 4G-LTE module with an integrated GPS+Glonass receiver primarily for North America / AT&T, Verizon, Sprint. Fall back to 3G HSPA+/DC-HSPA+, CDMA EVDO Rev A and 2G GSM/GPRS/EDGE, CDMA 1xRTT.

    Supported frequency bands:
    - 4G-LTE 700/700/850/AWS1700/1900/2100
    - 3G 800/850/900/AWS1700/1900/2100
    - 2G 850/900/1800/1900
    - CDMA EVDO 800/1700/1900
    - CDMA 1xRTT 800/1900

    Multi operator support through host-based image switching.

    Form factor: M.2 PCIe 42 x 30 x 2.3 mm.

    Ideal for M2M and mobile computing solutions, AirPrime® EM embedded modules deliver high speed connectivity on 4G-LTE networks. Based on the M.2 PCI Express Card standard with a USB interface, the EM Series modules offer an easy upgrade path to new network technologies and global access to high speed networks. The M.2 formfactor is also known as NGFF (New Generation Form Factor).

    Features:

    • Air interface: 4G-LTE MIMO, 3G-HSPA+/DC-HSPA+ Rx Diversity, 3G-CDMA EVDO Rev A, 2G-GSM/GPRS/EDGE, 2G-CDMA 1xRTT, GPS+Glonass
    • 4G bands: B2 (2100), B4 (AWS/1700), B5 (850), B13 (700), B17 (700), B25 (1900G)
    • 3G-HSPA+ bands: B1 (2100), B2 (1900), B4 (AWS/1700), B5 (850), B8 (900)
    • 3G-EVDO bands: BC0 (800), BC1 (1900), BC10 (800)
    • 2G bands: B2 (1900), B3 (1800), B5 (850), B8 (900)
    • 2G 1xRTT bands: 800/1900
    • Multi operator support through host based image switching.
    • Peak data rate: DL 100 Mbps, UL 50 Mbps
    • GNSS (GPS+Glonass): Qualcomm
    • Form factor: M.2 PCI Express, 42x30x2.3 mm
    • Supply voltage: 3.3 V nominal
    • Operating temperature: -25°C to +60°C

      Control, software and features

    • Control options: AT commands, GOBI API, Linux QMI SDK
    • Drivers: Android, Linux, Windows

      Connectors

    • System connector: 67 position M.2
    • Antenna RF connector: 3x MHF4 (Main RF, Aux RF, GNSS)

      Interfaces

    • USB 2.0 high speed
    • Active antenna control
    • Dynamic power control
    • Main radio disable
    • GNSS disable
    • Flash LED output
    • Wake on Wan
    • On/Off
    • Reset
    • SIM interface: 1.8/3V

    4G-LTE M.2 PCIe Module with GPS+Glonass for Japan

    Sierra Wireless AirPrime-EM Series

    MPN:

    AirPrime EM7330

    Manufacturer L3 Communications

    Sierra Wireless

    Description:

    EM7330 is a second generation 4G-LTE module with an integrated GPS+Glonass receiver primarily for Japan / NTT Docomo. Fall back to 3G HSPA+/DC-HSPA+ and 2G GSM/GPRS/EDGE.

    Supported frequency bands:
    - 4G-LTE 850/1500/2100
    - 3G 850/850/850/2100
    - 2G 850/900/1800/1900

    Form factor: M.2 PCIe 42 x 30 x 2.3 mm.

    Ideal for M2M and mobile computing solutions, AirPrime® EM embedded modules deliver high speed connectivity on 4G-LTE networks. Based on the M.2 PCI Express Card standard with a USB interface, the EM Series modules offer an easy upgrade path to new network technologies and global access to high speed networks. The M.2 formfactor is also known as NGFF (New Generation Form Factor).

    Features:

    • Air interface: 4G-LTE MIMO, 3G-HSPA+/DC-HSPA+ Rx Diversity, 2G-GSM/GPRS/EDGE, GNSS
    • 4G bands: B1 (2100), B19 (850), B21 (1500)
    • 3G bands: B1 (2100), B5 (850), B6 (850), B19 (850)
    • 2G bands: B2 (1900), B3 (1800), B5 (850), B8 (900)
    • Peak Data rate: DL 100 Mbps, UL 50 Mbps
    • GNSS (GPS+Glonass): Qualcomm
    • Form factor: M.2 PCI Express, 42x30x2.3 mm
    • Supply voltage: 3.3 V nominal
    • Operating temperature: -25°C to +60°C

      Control, software and features

    • Control options: AT commands, GOBI API, Linux QMI SDK
    • Drivers: Android, Linux, Windows

      Connectors

    • System connector: 67 position M.2
    • Antenna RF connector: 3x MHF4 (Main RF, Aux RF, GNSS)

      Interfaces

    • USB 2.0 high speed
    • Active antenna control
    • Dynamic power control
    • Main radio disable
    • GNSS disable
    • Flash LED output
    • Wake on Wan
    • On/Off
    • Reset
    • SIM interface: 1.8/3V

    FXTE02, Ethernet expansion card for FX series Programmable Modems

    FXTE02

    MPN:

    AirLink FXTE02

    Manufacturer L3 Communications

    Sierra Wireless

    Description:

    The FXTE02 Ethernet expansion card (X-card) provide an easy way to Ethernet enable Sierra Wireless 2G or 3G FX series modems (FXT009 and FX100).

    The AirLink FX Series of programmable modems offer unparalleled expansion possibilities in a durable, aluminum form-factor that is ideal for industrial applications. FX Series supports low-power mode and features an open standards expansion card interface, enabling you to add additional I/O, fieldbus, LAN, or any wireless interface such as GPS or Wi-Fi. It comes standard with Audio, Digital I/O, Serial, USB, and optional Ethernet interface.

    Features:

    • The FXTE02 kit contains:
    • 1x Ethernet expansion card
    • 1x RJ45 dongle
    • 1x Cover plate

    • Ethernet LAN interface

    • IEEE 802.3 Compatible
    • Integrated MAC and 10 BASE-T PHY
    • Receiver and collision squelch circuit
    • Supports one 10BASE-T port
    • Supports Full and Half-Duplex modes
    • Shielded RJ-45

    • Operating Temperature: -30°C to +75°C

    GX400, 3G-HSPA+ Rugged Intelligent Gateway for Global use

    Airlink GX400

    MPN:

    AirLink GX400

    Manufacturer L3 Communications

    Sierra Wireless

    Description:

    GX400 is a 3G-HSPA+ Pentaband intelligent gateway with an integrated GPS receiver. Fall back to 2G GSM/GPRS/EDGE Quad band. Supported frequency bands: 3G 800/850/900/1900/2100 and 2G 850/900/1800/1900. Support for Aleos embedded application framework and AirVantage management services is integrated. Form factor: 142 x 98 x 40 mm rugged metal housing. The GX4xx intelligent gateway is also available in 4G-LTE and 3G-EVDO versions for North America.

    The AirLink® GX Series of mobile gateways delivers high performance, mission-critical cellular communication and GPS location. Its rugged military spec design (MIL-STD 810) and water-resistant aluminum casing (IP-64 rating) enables it to withstand the extreme temperature changes, humidity, shock, and vibration found in mobile applications. Supporting 4G LTE (GX440) and 3G (GX400) networks, the GX Series is ideal for in-vehicle field deployments such as connecting police cars, fire trucks, ambulances, public transit, taxis, or any other fleet application.

    Features:

    • Air interface: 3G HSPA+ with Rx Diversity, 2G GSM/GPRS/EDGE
    • 3G bands: 800/850/900/1900/2100 MHz
    • 2G bands: 850/900/1800/1900 MHz
    • Peak data rate: DL 21 Mbps, UL 5.76 Mbps
    • GPS: Qualcomm
    • Supply voltage: 9 to 36 V
    • Operating temperature: -30°C to +70°C
    • Water and dust resistant design.
    • 5-year warranty

    • Control, software and features

    • Control options: ACEManager device configuration utility, Aleos
    • Cloud service: AirVantage Management Services ready
    • Aleos embedded application framework

    • Protocols

    • Network: TCP/IP, UDP/IP, DNS
    • Routing: NAT, Host Port Routing, DHCP, PPPoE, VLAN, VRRP, Reliable Static Route
    • Application: SMS, Telnet/SSH, Reverse Telnet, SMTP, SNMP, SNTP
    • Serial: TCP/UDP PAD Mode, Modbus (ASCII, RTU, Variable), PPP
    • GPS: NMEA 0183 V3.0, TAIP, RAP

    • VPN/Security

    • IPsec, SSL, and GRE VPN Client
    • Up to 5 VPN Tunnels
    • IKE Encryption
    • Port Forwarding and DMZ
    • Port Filtering
    • Trusted IP
    • MAC Address Filtering

    • Connectors and I/Os

    • 1x RJ45, Ethernet 10/100 Base-T
    • 1x DB9 RS232 serial
    • 1x USB 2.0 micro B
    • 1x digital I/O
    • 3x SMA, Main RF, Aux RF, GPS

    • Expansion options

    • Wi-Fi option Adds 802.11 b/g/n Wi-Fi hotspot with simultaneous client mode for cellular offloading
    • I/O option Adds 4 Digital I/O, 4 analog I/O, and a second RS-232 Serial port
    • Ethernet option Adds 2 more Ethernet ports for a total of 3

    Nano Hornet GPS Antenna Module, 10mmx10mm

    Origin GPS Nano Hornet ORG1411 GPS Antenna Module

    MPN:

    ORG1411

    Manufacturer L3 Communications

    OriginGPS

    Description:

    Designed to support space constrained applications such as smart watches, action cameras and wearable devices, Nano Hornet ORG1411 module is an ultra-compact, ultra-low profile and ultra-low weight multi-channel GPS with SBAS, QZSS and other regional overlay systems receiver that continuously tracks all satellites in view, providing real-time positioning data in industry’s standard NMEA format.

    Nano Hornet ORG1411 module offers superior sensitivity and outstanding performance, achieving rapid TTFF in less than one second, accuracy of approximately two meters, and tracking sensitivity of -163dBm. Sized only 10mm x 10mm Nano Hornet ORG1411 module is industry’s small sized, record breaking solution.

    Nano Hornet module integrates OriginGPS proprietary low profile GPS antenna, dual-stage LNA, RF LDO, SAW filter, TCXO, RTC crystal and RF shield with market-leading SiRFstarIV™ GPS SoC. Nano Hornet ORG1411 module is introducing industry’s lowest energy per fix ratio, unparalleled accuracy and extremely fast fixes even under challenging signal conditions, such as in built-up urban areas, dense foliage or even indoor.

    View our wide range of GPS Navigation

    View our portfolio of M2M and Wireless Modules

    See all products from our supplier Origin GPS

    Features:

    • Autonomous operation
    • Active antenna on-board
    • OriginGPS Noise Free Zone System (NFZ™) technolog
    • Fully integrating: Low profile antenna element, Dual-stage LNA, SAW filter, TCXO, RTC crystal, GPS SoC, PMU, RF shield
    • GPS L1 1575.42 frequency, C/A code SBAS (WAAS, EGNOS, MSAS) and QZSS support
    • 48 channels
    • Ultra-high Sensitivity down to -163dBm enabling Indoor Tracking
    • TTFF of < 1s in 50% of trials under Hot Start conditions
    • Low Power Consumption of ≤ 11mW in ATP™ mode
    • High Accuracy of < 2.5m in 50% of trials
    • High update rate of 5Hz, 1Hz by default Autonomous A-GPS by Client Generated Extended Ephemeris (CGEE™) for non-networked devices
    • Predictive A-GPS by Server Generated Extended Ephemeris (SGEE™) for connected devices
    • Ephemeris Push™ for storing and loading broadcast ephemeris
    • Host controlled power saving mode
    • Self-managed low power modes - ATP™, PTF™, APM™ and SiRFAware® MPM™
    • Almanac Based Positioning (ABP™)
    • Multipath and cross-correlation mitigation
    • Active Jammer Detector and Remover
    • Fast Time Synchronization for rapid single satellite time solution
    • ARM7® microprocessor system
    • Selectable UART, SPI or I2C host interface
    • NMEA protocol by default, switchable into One Socket Protocol (OSP®)
    • Programmable baud rate and messages rate
    • PPS output less than 30ns synchronized to GPS epoch
    • Single voltage supply of 1.8V
    • Ultra-small LGA footprint of 10mm x 10mm
    • Ultra-low height of 3.8mm Ultra-low weight of 1.4g
    • Surface Mount Device (SMD)
    • Optimized for automatic assembly and reflow processes
    • Operating from -40°C to +85°C
    • FCC, CE, VCCI certified
    • RoHS II/REACH compliant

    Embedded Linux System On Module with 10/100 Ethernet, 64MB and 254MB Flash

    Lantronix PWSE1000 System On Module with 10/100 Ethernet

    MPN:

    PWSE1000

    Manufacturer L3 Communications

    Lantronix

    Description:

    The Lantronix® PremierWave® SE1000 is a high performance programmable, Ethernet based System on Module (SOM) that enables OEM customers to easily develop and deploy secure IoT applications. PremierWave SE1000 family of devices are small form factor SOM which are easy to integrate into your product design via the 80-pin board to board connector. With a comprehensive set of peripheral interfaces, Lantronix smart connectivity software, and SDK/runtime tools you can build and deploy your custom IoT product both easily and rapidly.

    View our wide range of Embedded Networking

    View our portfolio of M2M and Wireless Modules

    See all products from our supplier Lantronix

    Features:

    • Flash options: 64MB Flash bulk (model PWSE1000100B) / 256MB Flash Bulk (model PWSE10000200B) and 256MB Flash Sample (model PWSE1000200S)
    • Powerful applications customization platform with a high-performance 32-bit ARM 9 Processor
    • Small form factor measuring 55mm x 30mm
    • Robust set of interfaces that include Ethernet, Serial, USB, I2C, and SPI
    • Linux Operating System with IPv6 Support
    • Low power consumption modes
    • Includes full TCP/IP stack and web server
    • Security and authentication protocols
    • Lantronix Robust and Hardened Advanced Applications Suite includes: Tunneling, Secure Tunneling, Configuration Manager, Web-based Configuration Manager
    • Simple to use
    • Operating temperature: -40 °C to +85 °C

    SL8082T, 3G-HSDPA SMD Programmable Module with GPS for EMEA

    Sierra Wireless 3G-HSDPA SMD Programmable Module with GPS

    MPN:

    AirPrime SL8082T

    Manufacturer L3 Communications

    Sierra Wireless

    Description:

    SL8082T is a 3G HSDPA Dual band programmable module with an integrated GPS receiver primarily for EMEA. Fall back to 2G GSM/GPRS/EDGE Quad band. Supported frequency bands: 3G 900/2100 and 2G 850/900/1800/1900. Support for OpenAT embedded application framework and AirVantage management services is integrated. Form factor: 25x30 mm, SMD LGA package.

    AirPrime® SL Series come in standard LGA packages for cost-effective, fully-automated high-volume production. Ensure easy upgrade paths to next-generation network technologies with a wide selection of air interfaces. Accelerate your M2M development and deployment with its application framework and cloud-based device management services.

    Features:

    • Air interface: 3G-HSDPA, 2G-GSM/GPRS/EDGE, GPS
    • 3G bands: 900/2100 MHz
    • 2G bands: 850/900/1800/1900 MHz
    • Peak data rate: DL 3.6 Mbps, UL 384 kbps
    • GPS: Qualcomm
    • Form factor: SMD LGA package, 25x30x2.35mm
    • Supply Voltage: 3.6V nominal
    • Operating Temperature: -40°C to +85°C

    • Control, software and features

    • Control options: AT Commands, C/C++ through OpenAT
    • Internet services: TCP, UDP, FTP, HTTP, SMTP, POP3, SNMP, SSL
    • Drivers: Android, Linux, Windows
    • Cloud service: AirVantage Management Services ready
    • OpenAT embedded application framework

    • Embedded application performance

    • CPU: ARM926EJS / QDSP4
    • Core frequency: 184 MHz / 92 MHz
    • User MIPS available: 180 MIPS
    • Memory: Embedded Flash and RAM

    • Interfaces

    • UART: 1x 4 wire or 1x 8 wire
    • USB: 1x 2.0 High Speed
    • SPI: 1x 4 wire
    • I2C
    • GPIO: up to 5
    • Interrupt
    • Flash LED output
    • PWM (Buzzer)
    • SIM interface: 1.8/3V

    • Audio

    • Analog audio: 1x microphone, 1x speaker
    • Digital audio: PCM
    • Codec: FR, EFR, HR, AMR, QCELP-13K
    • Quality: VDA2A
    • Echo cancellation
    • Noise reduction
    • DTMF

    SL8084T, 3G-HSDPA SMD Programmable Module with GPS for Australia

    Sierra Wireless 3G-HSDPA SMD Programmable Module with GPS

    MPN:

    AirPrime SL8084T

    Manufacturer L3 Communications

    Sierra Wireless

    Description:

    SL8084T is a 3G HSDPA Tri band programmable module with an integrated GPS receiver primarily for Australia. Fall back to 2G-GSM/GPRS/EDGE Quad band. Supported frequency bands: 3G 800/850/2100 and 2G-850/900/1800/1900. Support for OpenAT embedded application framework and AirVantage management services is integrated. Form factor: 25x30 mm, SMD LGA package.

    AirPrime® SL Series come in standard LGA packages for cost-effective, fully-automated high-volume production. Ensure easy upgrade paths to next-generation network technologies with a wide selection of air interfaces. Accelerate your M2M development and deployment with its application framework and cloud-based device management services.

    Features:

    • Air interface: 3G-HSDPA, 2G-GSM/GPRS/EDGE, GPS
    • 3G bands: 800/850/2100 MHz
    • 2G bands: 850/900/1800/1900 MHz
    • Peak data rate: DL 3.6 Mbps, UL 384 kbps
    • GPS: Qualcomm
    • Form factor: SMD LGA package, 25x30x2.35mm
    • Supply Voltage: 3.6V nominal
    • Operating Temperature: -40°C to +85°C

    • Control, software and features

    • Control options: AT Commands, C/C++ through OpenAT
    • Internet services: TCP, UDP, FTP, HTTP, SMTP, POP3, SNMP, SSL
    • Drivers: Android, Linux, Windows
    • Cloud service: AirVantage Management Services ready
    • OpenAT embedded application framework

    • Embedded application performance

    • CPU: ARM926EJS / QDSP4
    • Core frequency: 184 MHz / 92 MHz
    • User MIPS available: 180 MIPS
    • Memory: Embedded Flash and RAM

    • Interfaces

    • UART: 1x 4 wire or 1x 8 wire
    • USB: 1x 2.0 High Speed
    • SPI: 1x 4 wire
    • I2C
    • GPIO: up to 5
    • Interrupt
    • Flash LED output
    • PWM (Buzzer)
    • SIM interface: 1.8/3V

    • Audio

    • Analog audio: 1x microphone, 1x speaker
    • Digital audio: PCM
    • Codec: FR, EFR, HR, AMR, QCELP-13K
    • Quality: VDA2A
    • Echo cancellation
    • Noise reduction
    • DTMF

    SL8090 3G-HSPA+ SMD Module with GPS for Americas, APAC & Japan

    Sierra Wireless SL8090 3G-HSPA+ SMD Module with GPS

    MPN:

    AirPrime SL8090

    Manufacturer L3 Communications

    Sierra Wireless

    Description:

    SL8090 is a 3G-HSPA+ Quad band module with an integrated GPS receiver primarily for Americas, APAC and Japan. Fall back to 2G-GSM/GPRS/EDGE Quad band. Supported frequency bands: 3G-900/2100 and 2G-850/900/1800/1900. Form factor: 25x30 mm, SMD LGA package.

    AirPrime® SL Series come in standard LGA packages for cost-effective, fully-automated high-volume production. Ensure easy upgrade paths to next-generation network technologies with a wide selection of air interfaces. Accelerate your M2M development and deployment with its application framework and cloud-based device management services.

    Features:

    • Air interface: 3G-HSPA+ with Rx Diversity, 2G-GSM/GPRS/EDGE, GPS
    • 3G bands: 800/850/1900/2100 MHz
    • 2G bands: 850/900/1800/1900 MHz
    • Peak data rate: DL 14.4 Mbps, UL 5.76 Mbps
    • GPS: Qualcomm
    • Form factor: SMD LGA package, 25x30x2.35mm
    • Supply Voltage: 3.6V nominal
    • Operating Temperature: -40°C to +85°C

    • Control, software and features

    • Control options: AT Commands
    • Drivers: Android, Linux, Windows
    • Internet services: TCP, UDP

    • Interfaces

    • UART: 1x 4 wire or 1x 8 wire
    • USB: 1x 2.0 High Speed
    • SPI: 1x 4 wire
    • GPIO: up to 3
    • Flash LED output
    • PWM (Buzzer)
    • Tx Burst indicator
    • SIM interface: 1.8/3V

    • Audio

    • Digital audio: PCM
    • Codec: FR, EFR, HR, AMR
    • Quality: VDA2A
    • Echo cancellation
    • Noise reduction
    • DTMF

    HL series Snap-in Socket for SMD mount

    Sierra Wireless HL series Snap-in Socket for SMD mount

    MPN:

    AirPrime HL Snap-in Socket

    Manufacturer L3 Communications

    Sierra Wireless

    Description:

    The HL series Snap-in socket mounts on the same solder pads as the HL module and add flexibility to deploy a 2G, 3G or 4G module at any stage of the production cycle or swap from 2G to 3G or 4G if required.

    The AirPrime® HL Series modules is the smallest, scalable, flexible solution that is interchangeable among 2G, 3G, and 4G* technologies. It provides voice and data connectivity in a single compact and easy-to-integrate form factor (22x23mm). The G version have an integrated GNSS receiver (GPS+Glonass). The compact form factor, network scalability, rich feature set and ready-to-use firmware upgrades make HL series modules ideal for industrial M2M solution designs where size and deployment longevity are important considerations.

    * 4G to be released in 2015.

    Features:

    • Choose to solder down the module or select the socket option to gain the flexibility to change modules at any time.
    • Swap modules at any point in the production cycle.
    • Use 2G, 3G, 4G or a mix across your deployment.
    • Socket Size: 28.4 x 27.4 mm

    • * 4G to be released in 2015.

    HL6528-G, 2G-GSM/GPRS SMD Module with GPS+Glonass

    Sierra Wireless AirPrime-HL Series

    MPN:

    AirPrime HL6528-G

    Manufacturer L3 Communications

    Sierra Wireless

    Description:

    HL6528-G is a 2G GSM/GPRS Quad band module with voice and an integrated GPS+Glonass receiver. Supported frequency bands: 2G 850/900/1800/1900. Form factor: 22x23 mm, SMD LGA package. Scalability between 2G, 3G and 4G with the same small size (22x23 mm), footprint and core pin layout. Very low power consumption and the separate base band and PA power supply inputs simplifies power supply design and extend operational life for battery powered devices.. Support for AirVantage management services is integrated.

    As an option to soldering, adding flexibility, the HL series Snap-in socket can be soldered on the same PCB pattern.

    The AirPrime® HL Series modules is the smallest, scalable, flexible solution that is interchangeable among 2G, 3G, and 4G* technologies. It provides voice and data connectivity in a single compact and easy-to-integrate form factor (22x23mm). The G version have an integrated GNSS receiver (GPS+Glonass). The compact form factor, network scalability, rich feature set and ready-to-use firmware upgrades make HL series modules ideal for industrial M2M solution designs where size and deployment longevity are important considerations.

    * 4G to be released in 2015.

    Features:

    • Air interface: 2G-GSM/GPRS, GNSS
    • 2G Bands: 850/900/1800/1900 MHz
    • GNSS (GPS+Glonass): SiRFstar V
    • Form factor: SMD LGA package, 22x23x2.5 mm
    • Supply Voltage: 3.7 V nominal, max 4.5 V
    • Separate Base Band (min 3.2 V) and PA (min 2.8 V) power supply inputs for extended battery life.
    • Operating Temperature: -40°C to +85°C

    • Control, software and features

    • Control options: AT Commands
    • Internet services: TCP, UDP, FTP, HTTP, HTTPS
    • Cloud service: FOTA through AirVantage Management Services is integrated
    • Network scan and monitoring
    • Jamming detection
    • Antenna detection
    • Flash memory available for storing files or logging data: 1 Mbyte

    • Interfaces

    • UART: 1x 8 wire
    • SPI: 1x for debug
    • ADC: 2x
    • GPIO: 8
    • PWM (Buzzer): 2x
    • Tx Burst indicator
    • SIM interface: 1.8/3V

    • Audio

    • Analog audio: 1x microphone, 1x speaker
    • Digital audio: PCM
    • Codec: FR, EFR, HR, AMR
    • Echo cancellation
    • Noise reduction
    • DTMF

    MC7330, 4G-LTE Mini PCIe Module with GPS+Glonass for Japan

    Sierra Wireless AirPrime-MC Series

    MPN:

    AirPrime MC7330

    Manufacturer L3 Communications

    Sierra Wireless

    Description:

    MC7330 is a second generation 4G-LTE module with or without voice and an integrated GPS+Glonass receiver primarily for Japan/NTT Docomo. Fall back to 3G HSPA+/DC-HSPA+ and 2G GSM/GPRS/EDGE. Supported frequency bands: 4G-LTE 850/1500/2100, 3G 850/2100 and 2G 850/900/1800/1900. Form factor: PCIe Mini Card F1, 51x30 mm.

    Ideal for industrial M2M and mobile computing solutions, AirPrime® MC embedded modules deliver high speed connectivity, with a wide selection of advanced air interfaces, including LTE frequencies. Based on the PCI Express Mini Card standard with a USB interface, the MC Series modules offer an easy upgrade path to new network technologies and global access to high speed networks.

    Features:

    • Air interface: 4G-LTE MIMO, 3G-HSPA+/DC-HSPA+ Rx Diversity, 2G-GSM/GPRS/EDGE, GNSS
    • 4G bands: 850/1500/2100 MHz
    • 3G bands: 850(B5,B6,B19)/2100 MHz
    • 2G bands: 850/900/1800/1900 MHz
    • Peak Data rate: DL 100 Mbps, UL 50 Mbps
    • GNSS (GPS+Glonass): Qualcomm
    • Form factor: PCIe Mini Card F1, 51x30x2.7 mm
    • Supply Voltage: 3.3 V nominal
    • Operating Temperature: -25°C to +85°C

    • Control, software and features

    • Control options: AT Commands, GOBI API, QMI SDK
    • Drivers: Android, Linux, Windows

    • Connectors

    • System connector: 52 position Mini PCIe
    • Antenna RF connector: 3x U.FL (Main RF, Aux RF, GPS with DC bias)

    • Interfaces

    • USB 2.0 High Speed
    • Main radio disable
    • GPIO: 4
    • Flash LED output
    • SIM interface: 1.8/3V

    • Audio (optional, specific SKU)

    • Digital audio: PCM/I2S
    • 4G: VoLTE to be released
    • 3G/2G: Circuit Switched Fall Back (CSFB voice)
    • Echo cancellation
    • Noise reduction
    • DTMF

    MC7350, 4G-LTE Mini PCIe Module with GPS+Glonass for North America/Verizon, Sprint

    Sierra Wireless AirPrime-MC Series

    MPN:

    AirPrime MC7350

    Manufacturer L3 Communications

    Sierra Wireless

    Description:

    MC7350 is a second generation 4G-LTE module with or without voice and an integrated GPS+Glonass receiver primarily for North America/Verizon, Sprint. >Fall back to 3G-CDMA EVDO Rev A and 2G-CDMA 1xRTT. Supported frequency bands:

    4G-LTE-700/1700AWS/1900. 3G-CDMA-800/1700/1900

    2G-CDMA-800/1900. Multi operator support through host based image switching. Form factor: PCIe Mini Card F1, 51x30 mm.

    Ideal for industrial M2M and mobile computing solutions, AirPrime® MC embedded modules deliver high speed connectivity, with a wide selection of advanced air interfaces, including LTE frequencies.

    Based on the PCI Express Mini Card standard with a USB interface, the MC Series modules offer an easy upgrade path to new network technologies and global access to high speed networks.

    Features:

    • Air interface: 4G-LTE MIMO, 3G-CDMA EVDO Rev A, 2G-CDMA 1xRTT, GNSS
    • 4G bands: 700/1700AWS/1900 MHz
    • 3G-EVDO bands: 800/1700/1900
    • 2G 1xRTT bands: 800/1900
    • Multi operator support through host based image switching.
    • Peak Data rate: DL 100 Mbps, UL 50 Mbps
    • GNSS (GPS+Glonass): Qualcomm
    • Form factor: PCIe Mini Card F1, 51x30x2.7 mm
    • Supply Voltage: 3.3 V nominal
    • Operating Temperature: -40°C to +85°C

    • Control, software and features

    • Control options: AT Commands, GOBI API, QMI SDK
    • Drivers: Android, Linux, Windows

    • Connectors

    • System connector: 52 position Mini PCIe
    • Antenna RF connector: 3x U.FL (Main RF, Aux RF, GPS with DC bias)

    • Interfaces

    • USB 2.0 High Speed
    • Main radio disable
    • GPIO: 4
    • Flash LED output
    • SIM interface: 1.8/3V

    • Audio (optional, specific SKU)

    • Digital audio: PCM/I2S
    • 4G: VoLTE to be released
    • 3G/2G: Circuit Switched Fall Back (CSFB voice)
    • Echo cancellation
    • Noise reduction
    • DTMF

    MC8090, 3G-HSPA+ SMD Module with GPS for Americas, APAC and Japan

    Sierra Wireless AirPrime-MC Series

    MPN:

    AirPrime MC8090

    Manufacturer L3 Communications

    Sierra Wireless

    Description:

    MC8090 is a 3G HSPA+ Quad band module with an integrated GPS receiver primarily for Americas, APAC and Japan. Fall back to 2G-GSM/GPRS/EDGE Quad band. Supported frequency bands: 3G 900/2100 and 2G 850/900/1800/1900. Form factor: PCIe Mini Card F1, 51x30 mm.

    Ideal for industrial M2M and mobile computing solutions, AirPrime® MC embedded modules deliver high speed connectivity, with a wide selection of advanced air interfaces, including LTE frequencies. Based on the PCI Express Mini Card standard with a USB interface, the MC Series modules offer an easy upgrade path to new network technologies and global access to high speed networks.

    Features:

    • Air interface: 3G-HSPA+ with Rx Diversity, 2G-GSM/GPRS/EDGE, GPS
    • 3G bands: 800/850/1900/2100 MHz
    • 2G bands: 850/900/1800/1900 MHz
    • Peak data rate: DL 14.4 Mbps, UL 5.76 Mbps
    • GPS: Qualcomm
    • Form factor: PCIe Mini Card F1, 51x30x4.5mm
    • Supply Voltage: 3.3 V nominal
    • Operating Temperature: -25°C to +85°C

    • Control, software and features

    • Control options: AT Commands, CnS
    • Drivers: Android, Linux, Windows

    • Connectors

    • System connector: 52 position Mini PCIe
    • Antenna RF connector: 2x U.FL (Main RF, Aux RF/GPS)

    • Interfaces

    • USB 2.0 High Speed
    • Main radio disable
    • GPIO: 6
    • Flash LED output
    • SIM interface: 1.8/3V

    • Audio

    • Digital audio: I2S
    • Codec: FR, EFR, HR, AMR, CTM
    • Echo cancellation
    • Noise reduction
    • DTMF

    MC9090, 3G-EVDO & HSPA+ Dual mode Mini PCIe Module with GPS for North America

    Sierra Wireless MC9090 3G-EVDO & HSPA+ Dual mode Mini PCIe Module with GPS for North America

    MPN:

    AirPrime MC9090

    Manufacturer L3 Communications

    Sierra Wireless

    Description:

    MC9090 is a 3G HSPA+ and CDMA EVDO Rev A Dual mode module with an integrated GPS receiver primarily for North America/AT&T, Sprint, Verizon. Fall back to 2G GSM/GPRS/EDGE Quad band and CDMA 1xRTT. Supported frequency bands: 3G 900/2100, 2G 850/900/1800/1900, CDMA EVDO 800/1900 and CDMA 1xRTT 800/1900. Form factor: PCIe Mini Card F1, 51x30 mm.

    Ideal for industrial M2M and mobile computing solutions, AirPrime® MC embedded modules deliver high speed connectivity, with a wide selection of advanced air interfaces, including LTE frequencies. Based on the PCI Express Mini Card standard with a USB interface, the MC Series modules offer an easy upgrade path to new network technologies and global access to high speed networks.

    Features:

    • Air interface: 3G-HSPA+ with Rx Diversity, 3G-CDMA EVDO Rev A, 2G-GSM/GPRS/EDGE, GPS
    • 3G-HSPA+ bands: 800/850/1900/2100 MHz
    • 3G-CDMA EVDO bands: 800/1900 MHz
    • 2G bands: 850/900/1800/1900 MHz
    • Peak data rate: DL 14.4 Mbps, UL 5.76 Mbps
    • GPS: Qualcomm
    • Form factor: PCIe Mini Card F1, 51x30x4.5mm
    • Supply Voltage: 3.3 V nominal
    • Operating Temperature: -40°C to +85°C

    • Control, software and features

    • Control options: AT Commands, Gobi API, Linux SDK
    • Drivers: Android, Linux, Windows
    • Internet services: TCP, UDP

    • Connectors

    • System connector: 52 position Mini PCIe
    • Antenna RF connector: 3x U.FL (Main RF, Aux RF, GPS)

    • Interfaces

    • UART: 1x 8 wire
    • USB: 1x 2.0 High Speed
    • Main Radio Disable
    • Vref: 1.8 V
    • GPIO: up to 4
    • Flash LED output
    • SIM interface: 1.8/3V

    • Audio

    • Digital audio: PCM
    • Echo cancellation
    • Noise reduction
    • DTMF

    SL series Development Kit, complete with modules and accessories

    Sierra Wireless SL series Development Kit modules and accessories

    MPN:

    AirPrime SL series DK complete

    Manufacturer L3 Communications

    Sierra Wireless

    Description:

    A complete development kit which provides all the tools and accessories you need to test concepts, deliver prototypes or develop an end user application with the AirPrime SL Series wireless modules using the embedded Open AT Application Framework or an external host processor.

    AirPrime® SL Series come in standard LGA packages for cost-effective, fully-automated high-volume production. Ensure easy upgrade paths to next-generation network technologies with a wide selection of air interfaces. Accelerate your M2M development and deployment with its application framework and cloud-based device management services.

    SL modules are ordered separately. Available in 2G, 3G, EVDO and Multi mode versions. AirPrime SL series modules are footprint compatible.

    Features:

    • Development kit includes:

    • 1x SL Mechanical Development Kit Board
    • 2x GSM Antenna
    • 1x GPS Antenna
    • 1x Headset
    • 1x Telephone handset
    • 1x RJ9 cable
    • 1x USB cable
    • 1x RS232 cable
    • 1x Set of board to board connectors
    • 1x Power supply
    • 1x USB Flash disk with documentation
    • SL modules are ordered separately. Available in 2G, 3G, EVDO and Multi mode versions. AirPrime SL series modules are footprint compatible.

      Designed to suit the needs of manufacturers of small host devices in high-volume production, the AirPrime SL Series offers EDGE, HSDPA, HSPA+ and EV-DO Rev A connectivity in a compact and lightweight form factor based on standard 25x30 mm LGA (Land Grid Array).

    SL9090, 3G-CDMA EVDO & HSPA+ Dual mode SMD Module with GPS for Americas & Japan

    Sierra Wireless SL9090 3G-CDMA EVDO & HSPA+ Dual mode SMD Module

    MPN:

    AirPrime SL9090

    Manufacturer L3 Communications

    Sierra Wireless

    Description:

    SL9090 is a 3G HSPA+ and CDMA EVDO Rev A Dual mode module with an integrated GPS receiver primarily for North America/AT&T, Sprint, Verizon. Fall back to 2G GSM/GPRS/EDGE Quad band. Supported frequency bands: 3G 900/2100, 2G 850/900/1800/1900, CDMA EVDO 800/1900 and CDMA 1xRTT 800/1900. Form factor: 25x30 mm, SMD LGA package.

    AirPrime® SL Series come in standard LGA packages for cost-effective, fully-automated high-volume production. Ensure easy upgrade paths to next-generation network technologies with a wide selection of air interfaces. Accelerate your M2M development and deployment with its application framework and cloud-based device management services.

    Features:

    • Air interface: 3G-HSPA+ with Rx Diversity, 3G-CDMA EVDO Rev A, 2G-GSM/GPRS/EDGE, GPS
    • 3G-HSPA+ bands: 800/850/1900/2100 MHz
    • 3G-CDMA EVDO bands: 800/1900 MHz
    • 2G bands: 850/900/1800/1900 MHz
    • Peak data rate: DL 14.4 Mbps, UL 5.76 Mbps
    • GPS: Qualcomm
    • Form factor: SMD LGA package, 25x30x2.35 mm
    • Supply Voltage: 3.6 V nominal
    • Operating Temperature: -40°C to +85°C

    • Control, software and features

    • Control options: AT Commands, Gobi API, Linux SDK
    • Drivers: Android, Linux, Windows
    • Internet services: TCP, UDP

    • Interfaces

    • UART: 1x 4 wire or 1x 8 wire
    • USB: 1x 2.0 High Speed
    • SPI: 1x 4 wire
    • GPIO: up to 4
    • Flash LED output
    • PWM (Buzzer)
    • Tx Burst indicator
    • SIM interface: 1.8/3V

    • Audio

    • Digital audio: PCM
    • Codec: FR, EFR, HR, AMR
    • Quality: VDA2A
    • Echo cancellation
    • Noise reduction
    • DTMF

    HL series development kit

    Sierra Wireless HL series Development Kit

    MPN:

    AirPrime HL series DK

    Manufacturer L3 Communications

    Sierra Wireless

    Description:

    A complete development kit which provides all the tools and accessories you need to develop M2M and Wireless solutions with the HL series of modules. Develop and test with HL Series modules and develop an end user application and speed up delivery of prototypes.

    The AirPrime® HL Series modules is the smallest, scalable, flexible solution that is interchangeable among 2G, 3G, and 4G* technologies. It provides voice and data connectivity in a single compact and easy-to-integrate form factor (22x23mm). The G version have an integrated GNSS receiver (GPS+Glonass). The compact form factor, network scalability, rich feature set and ready-to-use firmware upgrades make HL series modules ideal for industrial M2M solution designs where size and deployment longevity are important considerations.

    * HL modules are ordered separately. 2G and 3G are available, 4G is in development.

    Features:

    • Development kit includes:
    • 1x HL series development kit mother board with HL socket
    • 1x handset with cable
    • 1x socket removal tool
    • 1x power supply AC100/240V, DC 4V/2.5A
    • 1x multiple AC outlet adaptor
    • 1x 2G/3G antenna
    • 1x GNSS antenna
    • 1x handset with cable

    • The HL series provides voice and data connectivity in a single compact and easy-to-integrate form factor (22x23mm) covering 2G, 3G and 4G technologies. G versions have an integrated GNSS receiver (GPS+Glonass).

      * HL modules are ordered separately. 2G and 3G are available, 4G is in development.

    LTE Antennas for MC series Development Kit

    Image Not Available

    MPN:

    AirPrime LTE Antennas for MC series DK

    Manufacturer L3 Communications

    Sierra Wireless

    Description:

    These LTE antennas designed for the AirPrime MC series development kit will help to evaluate MC series 3G and 4G-LTE modules by enhancing signal strength and data rate. Ideal for industrial M2M and mobile computing solutions, AirPrime® MC embedded modules deliver high speed connectivity, with a wide selection of advanced air interfaces, including LTE frequencies.

    Based on the PCI Express Mini Card standard with a USB interface, the MC Series modules offer an easy upgrade path to new network technologies and global access to high speed networks.

    Features:

    • Multi band antennas for 4G, 3G and 2G frequencies intended for the MC series development kit.

    MC series Development Kit

    Sierra Wireless MC series Development Kit

    MPN:

    AirPrime MC series DK

    Manufacturer L3 Communications

    Sierra Wireless

    Description:

    A complete hardware development kit which provides all the tools and accessories you need to test concepts, deliver prototypes or develop a product with an AirPrime MC Series wireless module. Ideal for industrial M2M and mobile computing solutions, AirPrime® MC embedded modules deliver high speed connectivity, with a wide selection of advanced air interfaces, including LTE frequencies.

    Based on the PCI Express Mini Card standard with a USB interface, the MC Series modules offer an easy upgrade path to new network technologies and global access to high speed networks.

    Features:

    • Development kit includes:

    • 1x mother board
    • 1x mini card blank extender with ZIF cable
    • 2x spare mini PCIe right angle connectors
    • 2x SSMB to SMA connectors
    • x1 USB cable (A/B)
    • 1x RS232 cable
    • 2x UFL/UFL antenna cables
    • 1x UFL extractor tool
    • 1x power supply AC100/240V, DC 5V/3.2A
    • 2x quad-band 2G/3G antennas
    • 1x mono headset

    • MC Mini PCIe modules are not included, to be purchased separately. LTE antennas suitable for the kit can be purchased separately. Designed to work with 3G (EV-DO Rev A, HSPA, HSPA+) or 4G (LTE) networks.

    SL series Development Kit mother board

    Sierra Wireless SL series Development Kit mother board

    MPN:

    AirPrime SL series DK board

    Manufacturer L3 Communications

    Sierra Wireless

    Description:

    This development kit mother board will help to deliver prototypes or develop an end user application with the AirPrime SL Series wireless modules using the embedded Open AT Application Framework or an external host processor.

    AirPrime® SL Series come in standard LGA packages for cost-effective, fully-automated high-volume production. Ensure easy upgrade paths to next-generation network technologies with a wide selection of air interfaces. Accelerate your M2M development and deployment with its application framework and cloud-based device management services.

    Features:

    • This is an SL series development kit mother board only and does not come with any modules or accessories. In case modules and accessories are needed there is a complete SL series development kit available. Designed to suit the needs of manufacturers of small host devices in high-volume production, the AirPrime SL Series offers EDGE, HSDPA, HSPA+ and EV-DO Rev A connectivity in a compact and lightweight form factor based on standard 25x30 mm LGA (Land Grid Array).

    GX440, 4G-LTE Rugged Intelligent Gateway for North America

    Airlink™ GX440

    MPN:

    Airlink GX440

    Manufacturer L3 Communications

    Sierra Wireless

    Description:

    The AirLink GX Series of mobile gateways delivers high performance, mission-critical cellular communication and GPS location. Its rugged military spec design (MIL-STD 810) and water-resistant aluminum casing (IP-64 rating) enables it to withstand the extreme temperature changes, humidity, shock, and vibration found in mobile applications. Supporting 4G LTE (GX440) and 3G (GX400) networks, the GX Series is ideal for in-vehicle field deployments such as connecting police cars, fire trucks, ambulances, public transit, taxis, or any other fleet application.

    Features:

    • The first Rugged 4G-LTE gateway
    • Embedded intelligence
    • Mil-Spec 810-F, IP64 rated
    • Machine protocols
    • Class I Div 2 Compliant
    • Expansion Slot
    • Rugged enclosure
    • Compact form factor
    • Multiple Connections
    • USB on-the-go
    • Comprehensive device management and configuration
    • Easy to use interface
    • Low power mode/ wake up timer
    • Robust ARM 11-class processor
    • Configurable rules engine

    LS300, 3G-HSPA+ Rugged Intelligent Gateway with GPS

    AirLink_LS300_3G_Gateway

    MPN:

    AirLink LS300

    Manufacturer L3 Communications

    Sierra Wireless

    Description:

    LS300 is a 3G HSPA+ Dual band intelligent gateway with an integrated GPS receiver for EMEA. Fall back to 2G GSM/GPRS/EDGE Quad band. Supported frequency bands: 3G 900/2100 and 2G 850/900/1800/1900. Support for Aleos embedded application framework and AirVantage management services is integrated. Form factor: 76 x 90 x 25 mm rugged metal housing. >LS300 is also available in versions for North America.

    The AirLink LS300 gateway has a small footprint for easy installation and a rugged, military spec design (MIL-STD 810) that enables it to withstand extreme temperature changes, humidity, shock, and vibration. Certified for hazardous environments (Class I, Div 2), the LS300 is ideal for industrial deployments. Designed to be the next generation, all-in-one successor to the market leading Raven gateways, the LS300 comes standard with Ethernet, serial, digital I/O, and USB interfaces, as well as GPS.

    Features:

    • Air interface: 3G-HSPA+ with Rx Diversity, 2G-GSM/GPRS/EDGE, GPS
    • 3G bands: 900/2100 MHz
    • 2G bands: 850/900/1800/1900 MHz
    • Peak data rate: DL 21 Mbps, UL 5.76 Mbps
    • GPS: Qualcomm
    • Form factor is a 76 x 90 x 25 mm rugged metal housing.
    • Supply voltage: 9 to 36 V
    • Operating temperature: -30°C to +70°C
    • Robust and rugged design.
    • 3-year warranty

    • Control, software and features

    • Control options: ACEManager device configuration utility, Aleos
    • Cloud service: AirVantage Management Services ready
    • Aleos embedded application framework

    • Protocols

    • Network: TCP/IP, UDP/IP, DNS
    • Routing: NAT, Host Port Routing, DHCP, PPPoE, VLAN, VRRP, Reliable Static Route
    • Application: SMS, Telnet/SSH, Reverse Telnet, SMTP, SNMP, SNTP
    • Serial: TCP/UDP PAD Mode, Modbus (ASCII, RTU, Variable), PPP
    • GPS: NMEA 0183 V3.0, TAIP, RAP
    • VPN/SECURITY
    • IPsec, SSL, and GRE VPN Client
    • Up to 5 VPN Tunnels
    • IKE Encryption
    • Port Forwarding and DMZ
    • Port Filtering
    • Trusted IP
    • MAC Address Filtering

    • Connectors and I/Os

    • 1x RJ45, Ethernet 10/100 Base-T
    • 1x DB9 RS232 serial
    • 1x USB 2.0 micro B
    • 1x Digital I/O
    • 2x SMA, Main RF, Aux RF/GPS

    ES440, 4G-LTE Intelligent Gateway and Terminal Server

    ES440

    MPN:

    AirLink ES440

    Manufacturer L3 Communications

    Sierra Wireless

    Description:

    ES440 is an enterprise gateway that deliver mission-critical 4G LTE connectivity and is part of a best-in-class business continuity strategy. Deployed with an enterprise router, the ES440 provides remote out-of-band management (OOBM) to network operations while leveraging your routers instant failover and firewall features. The AirLink ES440 4G-LTE intelligent gatewayprovide fall back to 3G HSPA+ and 2G GSM/GPRS/EDGE Quad band. Supported frequency bands: 4G-LTE-800/900/1800/2100/2600, 3G 900/2100 and 2G 900/1800/1900. Support for AirVantage management services is integrated. Form factor: 142 x 98 x 40 mm rugged metal housing. The ES440 intelligent gateway is also available in versions for North America.

    Using the AirLink ES440 serial port to connect to the console port of the router, IT administrators can troubleshoot and repair network equipment over wireless wide area networks (WWAN). This terminal server capability allows operation centers to remotely reboot, configure, and update a router via the ES440 using Reverse Telnet and SSH protocols. As a result, remote personnel no longer need to manually reset their networking equipment and IT administrators can dramatically reduce the number of field visits.

    Features:

    • Air interface: 3G-HSPA+ with Rx Diversity, 2G-GSM/GPRS/EDGE
    • 4G bands
    • 3G bands: 900/2100 MHz
    • 2G bands: 900/1800/1900 MHz
    • Peak data rate: DL 100 Mbps, UL 50 Mbps
    • Form factor is a 142 x 98 x 40 mm rugged metal housing.
    • Supply voltage: 9 to 36 V
    • Operating temperature: -30°C to +70°C
    • Robust design
    • 3-year warranty

    • Control, software and features

    • ACE Manager device configuration utility, Aleos
    • Cloud service: AirVantage Management Services ready
    • Aleos embedded application framework

    • Protocols

    • Network: TCP/IP, UDP/IP, DNS
    • Routing: NAT, Host Port Routing, DHCP, PPPoE, VLAN, VRRP, Reliable Static Route
    • Application: SMS, Telnet/SSH, Reverse Telnet, SMTP, SNMP, SNTP
    • VPN/SECURITY
    • IPsec, SSL, and GRE VPN Client
    • Up to 5 VPN Tunnels
    • IKE Encryption
    • Port Forwarding and DMZ
    • Port Filtering
    • Trusted IP
    • MAC Address Filtering

    • Connectors and I/Os

    • 1x RJ45, Ethernet 10/100 Base-T
    • 1x DB9 RS232 serial
    • 1x USB 2.0 micro A
    • 2x SMA, Main RF, Aux RF

    LS300, DIN Rail mount bracket

    LS300-DIN-bracket

    MPN:

    AirLink LS300 DIN bracket

    Manufacturer L3 Communications

    Sierra Wireless

    Description:

    DIN Rail mount bracket for the AirLink LS300 Intelligent Gateway. The AirLink LS300 gateway has a small footprint for easy installation and a rugged, military spec design (MIL-STD 810) that enables it to withstand extreme temperature changes, humidity, shock, and vibration. Certified for hazardous environments (Class I, Div 2), the LS300 is ideal for industrial deployments.

    Designed to be the next generation, all-in-one successor to the market leading Raven gateways, the LS300 comes standard with Ethernet, serial, digital I/O, and USB interfaces, as well as GPS.

    Features:

    • The DIN rail mounting bracket transform the AirLink LS300 gateway into an easy to handle DIN mount device. Screws for fixing the bracket to the LS300 are included.

    LS300, Screw mount bracket

    LS300-Screw-bracket

    MPN:

    AirLink LS300 Screw bracket

    Manufacturer L3 Communications

    Sierra Wireless

    Description:

    DIN Rail mount bracket for the AirLink LS300 Intelligent Gateway. The AirLink LS300 gateway has a small footprint for easy installation and a rugged, military spec design (MIL-STD 810) that enables it to withstand extreme temperature changes, humidity, shock, and vibration. Certified for hazardous environments (Class I, Div 2), the LS300 is ideal for industrial deployments.

    Designed to be the next generation, all-in-one successor to the market leading Raven gateways, the LS300 comes standard with Ethernet, serial, digital I/O, and USB interfaces, as well as GPS.

    Features:

    • The screw mount bracket transform the AirLink LS300 gateway into an easy to handle screw mount device. Screws for fixing the bracket to the LS300 are included.

    Multi Spider GNSS Receiver Modules

    Origin GPS ORG4572  Multi Spider GNSS Receiver Modules

    MPN:

    ORG4572

    Manufacturer L3 Communications

    OriginGPS

    Description:

    GNSS Module (GPS+GLONASS Simultaneously), 7mm x 7mm Small size, High Performance, Fully-Integrated

    Multi spider (ORG4572) is a fully-integrated, highly-sensitive GNSS module. Designed to support ultra-compact applications such as smart watches, wearable devices, trackers and digital cameras, Spider is a miniature GNSS receiver that continuously tracks all satellites in view, providing real-time positioning data in standard NMEA format.

    Fully integrated in a small form factor

    Measuring only 7x7mm, the Spider is a fully integrated GNSS module. Unlike GNSS modules of similar size, it includes LNA, SAW Filter, TCXO and RTC crystal, a power management unit as well as RF shield.

    Outstanding performance and sensitivity

    The Spider module offers superior sensitivity and outstanding performance, achieving rapid time to first fix (TTFF) in less than one second, accuracy of approximately one meter, and tracking sensitivity of -165dBm.

    Low power consumption

    Spider's architecture can detect changes in context, temperature, and satellite signals by maintaining and opportunistically updating its internal fine time, frequency, and ephemeris data, thereby achieving a state of near continuous availability, while consuming mere microwatts of battery power.

    View our wide range of GPS - Navigation products

    View our portfolio of M2M and Wireless products

    See all products from our supplier Origin GPS

    Features:

    • Autonomous operation
    • Pin compatible with ORG4472 GPS module
    • OriginGPS Noise Free Zone System (NFZ™) technology
    • Fully integrating: GNSS LNA, GNSS SAW Filter, TCXO, RTC Crystal, RF Shield, GNSS SoC, Power Management Unit
    • Active or Passive antenna support
    • GPS L1 1575.42 frequency, C/A code
    • GLONASS L1 FDMA 1598-1606MHz frequency band, SP signal
    • SBAS (WAAS, EGNOS, MSAS) and QZSS support
    • Concurrent tracking of multiple constellations
    • 52 channels
    • Ultra-high Sensitivity down to -165dBm enabling Indoor Tracking
    • TTFF of < 1s in 50% of trials under Hot Start conditions
    • Low Power Consumption of < 15mW in ATP™ mode
    • High Accuracy of < 1.5m in 50% of trials
    • High update rate of 5Hz, 1Hz by default
    • Autonomous A-GNSS by Client Generated Extended Ephemeris (CGEE™) for non-networked devices
    • Predictive A-GNSS by Server Generated Extended Ephemeris (SGEE™) for connected devices
    • Ephemeris Push™ for storing and loading broadcast ephemeris
    • Host controlled power saving mode
    • Self-managed low power modes - ATP™, PTF™, APM™ and SiRFAware™ MPM
    • Almanac Based Positioning (ABP™)
    • Multipath and cross-correlation mitigation
    • Active Jammer Detector and Remover
    • Smart Data Logging to external memory
    • Fast Time Synchronization for rapid single satellite time solution
    • ARM7® microprocessor system
    • Selectable UART, SPI or I2C host interface
    • NMEA protocol by default, switchable into One Socket Protocol (OSP™).
    • Programmable baud rate and messages rate
    • 1PPS output
    • Smart sensors auxiliary I2C interface
    • Flash memory auxiliary SPI interface
    • Antenna input matched 50Ω
    • Single voltage supply
    • Miniature LGA footprint of 7mm x 7mm
    • Surface Mount Device (SMD)
    • Optimized for automatic assembly and reflow equipment
    • Operating from -40°C to +85°C
    • FCC, CE, VCCI certified
    • RoHS II/REACH compliant

    HL8548-G, 3G-HSPA SMD Module with GPS+Glonass

    Sierra Wireless AirPrime-HL Series

    MPN:

    AirPrime HL8548-G

    Manufacturer L3 Communications

    Sierra Wireless

    Description:

    HL8548-G is a 3G HSPA Penta band module with voice and an integrated GPS+Glonass receiver. Fall back to 2G GSM/GPRS/EDGE Quad band. Supported frequency bands: 3G 800/850/900/1900/2100 and 2G 850/900/1800/1900. Form factor: 22x23 mm, SMD LGA package. Scalability between 2G, 3G and 4G with the same small size (22x23 mm), footprint and core pin layout. Very low power consumption and the separate base band and PA power supply inputs simplifies power supply design and extend operational life for battery powered devices. Support for AirVantage management services is integrated.

    As an option to soldering, adding flexibility, the HL series Snap-in socket can be soldered on the same PCB pattern.

    The AirPrime® HL Series modules is the smallest, scalable, flexible solution that is interchangeable among 2G, 3G, and 4G* technologies. It provides voice and data connectivity in a single compact and easy-to-integrate form factor (22x23mm). The G version have an integrated GNSS receiver (GPS+Glonass). The compact form factor, network scalability, rich feature set and ready-to-use firmware upgrades make HL series modules ideal for industrial M2M solution designs where size and deployment longevity are important considerations.

    * 4G to be released in 2015.

    Features:

    • Air interface: 3G-HSPA, 2G-GSM/GPRS/EDGE, GNSS
    • 3G bands: 80/850/900/1900/2100 MHz
    • 2G Bands: 850/900/1800/1900 MHz
    • Peak data rate: DL 7.2 Mbps, UL 5.76 Mbps
    • GNSS (GPS+Glonass): SiRFstar V
    • Form factor: SMD LGA package, 22x23x2.5 mm
    • Supply Voltage: 3.7 V nominal, max 4.5 V
    • Separate Base Band (min 3.2 V) and PA (min 2.8 V) power supply inputs for extended battery life.
    • Operating Temperature: -40°C to +85°C

    • Control, software and features

    • Control options: AT Commands
    • Internet services: TCP, UDP, FTP, HTTP, HTTPS
    • Cloud service: FOTA through AirVantage Management Services is integrated
    • Network scan and monitoring
    • Jamming detection
    • Antenna detection
    • Flash memory available for storing files or logging data TBD

    • Interfaces

    • UART: 1x 8 wire
    • USB: 1x 2.0 Full Speed
    • HSIC
    • ADC: 2x
    • GPIO: 8
    • Flash LED output
    • PWM (Buzzer)
    • Tx Burst indicator
    • SIM interface: 1.8/3V

    • Audio

    • Digital audio: PCM
    • Codec: FR, EFR, HR, AMR
    • Echo cancellation
    • Noise reduction
    • DTMF

    HL8548, 3G-HSPA SMD Module

    Sierra Wireless AirPrime-HL Series

    MPN:

    AirPrime HL8548

    Manufacturer L3 Communications

    Sierra Wireless

    Description:

    HL8548 is a 3G HSPA Penta band module with voice. Fall back to 2G GSM/GPRS/EDGE Quad band. Supported frequency bands: 3G 800/850/900/1900/2100 and 2G 850/900/1800/1900. Form factor: 22x23 mm, SMD LGA package. Scalability between 2G, 3G and 4G with the same small size (22x23 mm), footprint and core pin layout. Very low power consumption and the separate base band and PA power supply inputs simplifies power supply design and extend operational life for battery powered devices. Support for AirVantage management services is integrated.

    As an option to soldering, adding flexibility, the HL series Snap-in socket can be soldered on the same PCB pattern.

    The AirPrime® HL Series modules is the smallest, scalable, flexible solution that is interchangeable among 2G, 3G, and 4G* technologies. It provides voice and data connectivity in a single compact and easy-to-integrate form factor (22x23mm). The G version have an integrated GNSS receiver (GPS+Glonass). The compact form factor, network scalability, rich feature set and ready-to-use firmware upgrades make HL series modules ideal for industrial M2M solution designs where size and deployment longevity are important considerations.

    * 4G to be released in 2015.

    Features:

    • Air interface: 3G-HSPA, 2G-GSM/GPRS/EDGE
    • 3G bands: 80/850/900/1900/2100 MHz
    • 2G Bands: 850/900/1800/1900 MHz
    • Peak data rate: DL 7.2 Mbps, UL 5.76 Mbps
    • Form factor: SMD LGA package, 22x23x2.5 mm
    • Supply Voltage: 3.7 V nominal, max 4.5 V
    • Separate Base Band (min 3.2 V) and PA (min 2.8 V) power supply inputs for extended battery life.
    • Operating Temperature: -40°C to +85°C

    • Control, software and features

    • Control options: AT Commands
    • Internet services: TCP, UDP, FTP, HTTP, HTTPS
    • Cloud service: FOTA through AirVantage Management Services is integrated
    • Network scan and monitoring
    • Jamming detection
    • Antenna detection
    • Flash memory available for storing files or logging data TBD

    • Interfaces

    • UART: 1x 8 wire
    • USB: 1x 2.0 Full Speed
    • HSIC
    • ADC: 2x
    • GPIO: 8
    • Flash LED output
    • PWM (Buzzer)
    • Tx Burst indicator
    • SIM interface: 1.8/3V

    • Audio

    • Digital audio: PCM
    • Codec: FR, EFR, HR, AMR
    • Echo cancellation
    • Noise reduction
    • DTMF

    HL6528, 2G-GSM/GPRS SMD Module

    Sierra Wireless AirPrime-HL Series

    MPN:

    AirPrime HL6528

    Manufacturer L3 Communications

    Sierra Wireless

    Description:

    HL6528 is a 2G GSM/GPRS Quad band module with voice. Supported frequency bands: 2G 850/900/1800/1900. Form factor: 22x23 mm, SMD LGA package. Scalability between 2G, 3G and 4G with the same small size (22x23 mm), footprint and core pin layout. Very low power consumption and the separate base band and PA power supply inputs simplifies power supply design and extend operational life for battery powered devices.. Support for AirVantage management services is integrated.

    As an option to soldering, adding flexibility, the HL series Snap-in socket can be soldered on the same PCB pattern.

    The AirPrime® HL Series modules is the smallest, scalable, flexible solution that is interchangeable among 2G, 3G, and 4G* technologies. It provides voice and data connectivity in a single compact and easy-to-integrate form factor (22x23mm). The G version have an integrated GNSS receiver (GPS+Glonass). The compact form factor, network scalability, rich feature set and ready-to-use firmware upgrades make HL series modules ideal for industrial M2M solution designs where size and deployment longevity are important considerations.

    * 4G to be released in 2015.

    Features:

    • Air interface: 2G-GSM/GPRS
    • 2G Bands: 850/900/1800/1900 MHz
    • Form factor: SMD LGA package, 22x23x2.5 mm
    • Supply Voltage: 3.7 V nominal, max 4.5 V
    • Separate Base Band (min 3.2 V) and PA (min 2.8 V) power supply inputs for extended battery life.
    • Operating Temperature: -40°C to +85°C

    • Control, software and features

    • Control options: AT Commands
    • Internet services: TCP, UDP, FTP, HTTP, HTTPS
    • Cloud service: FOTA through AirVantage Management Services is integrated
    • Network scan and monitoring
    • Jamming detection
    • Antenna detection
    • Flash memory available for storing files or logging data: 1 Mbyte

    • Interfaces

    • UART: 1x 8 wire
    • SPI: 1x for debug
    • ADC: 2x
    • GPIO: 8
    • PWM (Buzzer): 2x
    • Tx Burst indicator
    • SIM interface: 1.8/3V

    • Audio

    • Analog audio: 1x microphone, 1x speaker
    • Digital audio: PCM
    • Codec: FR, EFR, HR, AMR
    • Echo cancellation
    • Noise reduction
    • DTMF

    MC7304, 4G-LTE Mini PCIe Module with GPS+Glonass for EMEA & APAC

    Sierra Wireless AirPrime-MC Series

    MPN:

    AirPrime MC7304

    Manufacturer L3 Communications

    Sierra Wireless

    Description:

    MC7304 is a second generation 4G-LTE module with or without voice and an integrated GPS+Glonass receiver primarily for EMEA and APAC. Fall back to 3G HSPA+/DC-HSPA+ and 2G GSM/GPRS/EDGE. Supported frequency bands: 4G-LTE 800/900/1800/2100/2600, 3G 800/850/900/1900/2100 and 2G 850/900/1800/1900. Form factor: PCIe Mini Card F1, 51x30 mm.

    Ideal for industrial M2M and mobile computing solutions, AirPrime® MC embedded modules deliver high speed connectivity, with a wide selection of advanced air interfaces, including LTE frequencies. Based on the PCI Express Mini Card standard with a USB interface, the MC Series modules offer an easy upgrade path to new network technologies and global access to high speed networks.

    Features:

    • Air interface: 4G-LTE MIMO, 3G-HSPA+/DC-HSPA+ Rx Diversity, 2G-GSM/GPRS/EDGE, GPS+Glonass
    • 4G bands: 800/900/1800/2100/2600 MHz
    • 3G bands: 800/850/900/1900/2100 MHz
    • 2G bands: 850/900/1800/1900 MHz
    • Peak Data rate: DL 100 Mbps, UL 50 Mbps
    • GNSS (GPS+Glonass): Qualcomm
    • Form factor: PCIe Mini Card F1, 51x30x2.7 mm
    • Supply Voltage: 3.3 V nominal
    • Operating Temperature: -25°C to +85°C

    • Control, software and features

    • Control options: AT Commands, GOBI API, QMI SDK
    • Drivers: Android, Linux, Windows

    • Connectors

    • System connector: 52 position Mini PCIe
    • Antenna RF connector: 3x U.FL (Main RF, Aux RF, GPS with DC bias)

    • Interfaces

    • USB 2.0 High Speed
    • Main radio disable
    • GPIO: 4
    • Flash LED output
    • SIM interface: 1.8/3V

    • Audio (optional, specific SKU)

    • Digital audio: PCM/I2S
    • 4G: VoLTE (to be released)
    • 3G/2G: Circuit Switched Fall Back (CSFB voice)
    • Echo cancellation
    • Noise reduction
    • DTMF

    MC7354, 4G-LTE Mini PCIe Module with GPS+Glonass for North America/Multi operator

    Sierra Wireless AirPrime-MC Series

    MPN:

    AirPrime MC7354

    Manufacturer L3 Communications

    Sierra Wireless

    Description:

    MC7354 is a second generation 4G-LTE module with or without voice and an integrated GPS+Glonass receiver primarily for North America/AT&T, Verizon, Sprint. Fall back to 3G HSPA+/DC-HSPA+, CDMA EVDO Rev A and 2G GSM/GPRS/EDGE, CDMA 1xRTT. Supported frequency bands: 4G-LTE 700/850/1700AWS/1900, 3G 800/850/1700AWS/1900/2100, 2G 850/900/1800/1900, CDMA EVDO 800/1700/1900 and CDMA 1xRTT 800/1900. Multi operator support through host based image switching. Form factor: PCIe Mini Card F1, 51x30 mm.

    Ideal for industrial M2M and mobile computing solutions, AirPrime® MC embedded modules deliver high speed connectivity, with a wide selection of advanced air interfaces, including LTE frequencies. Based on the PCI Express Mini Card standard with a USB interface, the MC Series modules offer an easy upgrade path to new network technologies and global access to high speed networks.

    Features:

    • Air interface: 4G-LTE MIMO, 3G-HSPA+/DC-HSPA+ Rx Diversity, 3G-CDMA EVDO Rev A, 2G-GSM/GPRS/EDGE, 2G-CDMA 1xRTT, GPS+Glonass
    • 4G bands: 700(B13,B17)/850/1700AWS/1900(B2,B25) MHz
    • 3G-HSPA+ bands: 800/850/900/1700AWS/1900/2100 MHz
    • 3G-EVDO bands: 800/1700/1900
    • 2G bands: 850/900/1800/1900 MHz
    • 2G 1xRTT bands: 800/1900
    • Multi operator support through host based image switching.
    • Peak Data rate: DL 100 Mbps, UL 50 Mbps
    • GNSS (GPS+Glonass): Qualcomm
    • Form factor: PCIe Mini Card F1, 51x30x2.7 mm
    • Supply Voltage: 3.3 V nominal
    • Operating Temperature: -40°C to +85°C

    • Control, software and features

    • Control options: AT Commands, GOBI API, QMI SDK
    • Drivers: Android, Linux, Windows

    • Connectors

    • System connector: 52 position Mini PCIe
    • Antenna RF connector: 3x U.FL (Main RF, Aux RF, GPS with DC bias)

    • Interfaces

    • USB 2.0 High Speed
    • Main radio disable
    • GPIO: 4
    • Flash LED output
    • SIM interface: 1.8/3V

    • Audio (optional, specific SKU)

    • Digital audio: PCM/I2S
    • 4G: VoLTE (to be released)
    • 3G/2G: Circuit Switched Fall Back (CSFB voice)
    • Echo cancellation
    • Noise reduction
    • DTMF

    ORG1218 GPS / Glonass (GNSS) antenna module

    Origin ORG1218 GPS + GLONASS Antenna modules

    MPN:

    ORG1218

    Manufacturer L3 Communications

    OriginGPS

    Description:

    The ORG12XX Series from Origin GPS is the world's first GPS+GLONASS Module with on-board Antenna. The ORG1218 has an integrated antenna, and Dual stage LNA, and an auxillary I2C port for MEMS sensors.

    View our wide range of GPS - Navigation products

    View our portfolio of M2M and Wireless products

    See all products from our supplier Origin GPS

    Features:

    • Integrated antenna
    • Dual-stage LNA
    • ESD protection on antenna
    • Auxiliary i²C port MEMS sensors
    • USB interface option
    • Secondary UART for RTCM-104 option
    • Stand alone operation
    • OriginGPS Noise Free Zone System (NFZTM)
    • Active antenna or RF connector on-board
    • Fully integrated including: LNA and SAW filter, TCXO and RTC crystal, RF shield, power Management
    • GPS/GLONASS/GALILEO/COMPASS engine
    • SBAS (WAAS, EGNOS, SDCM, QZSS) support
    • 32 Tracking channels
    • Jammer barrier filtering and removal
    • Assisted GNSS (A-GNSS) support
    • Fast position fix of <1 sec.
    • High sensitivity of -162dBm
    • Single voltage supply
    • 1PPS Time mark accuracy <40 ns
    • UART or SPI host interface
    • Surface mount device (SMD)
    • Miniature foot print of 17 x 17mm
    • Operating from -40 to +85°C
    • FCC, CE, VCCI certified
    • Pb-free RoHs/REACH complaint
    • ISO/TS 16949 manufacturing standard
    • AEC-Q100/Q200 ordering option

    ORG1208 GPS / Glonass (GNSS) antenna module

    Origin ORG1208 GPS + GLONASS Antenna modules

    MPN:

    ORG1208

    Manufacturer L3 Communications

    OriginGPS

    Description:

    The ORG12XX Series from Origin GPS is the world's first GPS+GLONASS Module with on-board Antenna. The ORG1208 has an integrated RF connector, and an auxillary I2C port for MEMS sensors.

    View our wide range of GPS - Navigation products

    View our portfolio of M2M and Wireless products

    See all products from our supplier Origin GPS

    Features:

    • Integrated RF connector
    • Active or passive antenna support
    • Load switch
    • ESD protection on RF connector
    • Auxiliary i²C port MEMS sensors
    • USB interface option
    • Secondary UART for RTCM-104 option
    • Stand alone operation
    • OriginGPS Noise Free Zone System (NFZTM)
    • Active antenna or RF connector on-board
    • Fully integrated including: LNA and SAW filter, TCXO and RTC crystal, RF shield, power Management
    • GPS/GLONASS/GALILEO/COMPASS engine
    • SBAS (WAAS, EGNOS, SDCM, QZSS) support
    • 32 Tracking channels
    • Jammer barrier filtering and removal
    • Assisted GNSS (A-GNSS) support
    • Fast position fix of <1 sec.
    • High sensitivity of -162dBm
    • Single voltage supply
    • 1PPS Time mark accuracy <40 ns
    • UART or SPI host interface
    • Surface mount device (SMD)
    • Miniature foot print of 17 x 17mm
    • Operating from -40 to +85°C
    • FCC, CE, VCCI certified
    • Pb-free RoHs/REACH complaint
    • ISO/TS 16949 manufacturing standard
    • AEC-Q100/Q200 ordering option

    xPico Wi-Fi - IEEE 802.11 b, g or n Device Server Module

    Lantronix XPW100100B-01 xPico Wi-Fi - IEEE 802.11 b/g/n Device Server Module

    MPN:

    xPico Wi-Fi

    Manufacturer L3 Communications

    Lantronix

    Description:

    See how we solve customer design challenges with our technical expertise and the latest technology

    See how we instantly created a mobile gas sensing solution with the Lantronix xPico Wi-Fi in our exclusive video.

    Reduce your development costs and shorten your time to market with xPico™ Wi-Fi®, one of the world's most flexible Wi-Fi® device servers. xPico Wi-Fi is a pin and form factor compatible state-of-the-art member of the xPico family, providing low power, simultaneous Soft AP and client mode, full IP and WLAN stacks, complete device server application and industry best 5-year warranty.

    Robust Networking Solution:Lantronix' xPico Wi-Fi is an extremely compact, low power networking solution that enables wireless LAN connectivity on virtually any solution with a SPI, USB (device) or serial interface. Lantronix industry-proven device server application and full IP stack enables seamless remote access to device data simplifying design integration, all while providing robust connectivity.

    Simultaneous Access Point & Client Mode:The xPico Wi-Fi is a state-of-the-art solution that offers all the functions one can expect including a unique simultaneous Soft-AP and Client mode. This allows for easy points of access while maintaining a secure network.

    Flexibility:All members of the xPico product family use the same pin compatible interface, providing unmatched flexibility whether it is Wi-Fi or Ethernet when it comes to choosing the right network device for your application.

    Cost Savings & Faster Time-To-Market:As one of the smallest embedded device servers in the world, xPico Wi-Fi can be utilized in designs typically intended for chip solutions, befitting in advantages to cost and time-to-market. Its 'zero host load' eliminates any need for drivers on the connected microcontroller making implementation easy and fast with virtually no need to write a single line of code. This translates to considerably lower development costs and faster time-to-market. As xPico Wi-Fi meets FCC Class B, UL and EN EMC and safety compliance, your development time is shortened.

    View our wide range of Embedded Networking products

    View our portfolio of M2M and Wireless products

    See all products from our supplier Lantronix

    Features:

    • Wireless LAN Interface
    • IEEE 802.11 b/g and IEEE 802.11n (single stream) WLAN interface (2.4 GHz only)
    • IEEE 802.11 d/h/i/j/k/w/r
    • WPS 2.0 support
    • u.FL connector for external antenna
    • Serial Interface
    • Two Serial CMOS Ports (3.3V, 5V tolerant)
    • 300 to 921.6 Kbps
    • Flow control XON/XOFF, RTS/CTS (SPort 1 only)
    • Lantronix tunneling application
    • Host Interface
    • Dual Serial Port, SPI, USB 2.0 (device)
    • 8 GPIO
    • Network Protocols
    • TCP/IP, UDP/IP, DHCP, ARP, ICMP, DHCP, Auto-IP, DNS, SNMPv1, TFTP
    • Networking Capabilities
    • Soft Access Point with DHCP Server
    • Lantronix SmartRoam™ Technology continually tracks Wi-Fi signal strength within range, along with preauthentication and caching resulting in smooth and automatic transition to access points without delay
    • QuickConnect: Dynamic Profiles facilitate easy and rapid connections to access points
    • Management and Control
    • Web Server - Landing Page
    • CLI (Serial Monitor Port), Telnet
    • XML import and Export (XCR)
    • Field upgradable firmware (OTA)
    • Security
    • IEEE 802.11i Support - WPA-Personal, WPA2-Personal
    • 256-bit AES Encryption
    • Architecture
    • ARM Cortex M3 class processor with on-chip Flash and SRAM
    • 1MB Flash and 128 KB SRAM
    • SPI Flash stores
    • Included Software
    • MS Windows-based DeviceInstaller™
    • MS Windows-based Com Port Redirector
    • Power
    • Input Voltage: 3.3VDC
    • Low power consumption of approximately 20μA standby
    • Physical Interface
    • 40-pin Board-to-Board SMT Connector
    • Environmental
    • Operating Temp: -40° to +85° C
    • Storage Temp: -40° to +85° C
    • Relative Humidity: 0% to 90% non-condensing
    • Certifications
    • FCC Class B, UL and EN EMC
    • Packaging
    • Dimensions: 24mm (L) x 16.5mm (W) x 5.64mm (H)
    • Weight: 2.5g
    • Warranty
    • 5-Year Limited

    xPico Wi-Fi - IEEE 802.11 b, g or n Device Server Development Kit

    Lantronix XPW100100K-01 xPico Wi-Fi - IEEE 802.11 b/g/n Device Server Development Kit with Module

    MPN:

    xPico Wi-Fi Evaluation kit

    Manufacturer L3 Communications

    Lantronix

    Description:

    Reduce your development costs and shorten your time to market with xPico™ Wi-Fi®, one of the world's most flexible Wi-Fi® device servers. xPico Wi-Fi is a pin and form factor compatible state-of-the-art member of the xPico family, providing low power, simultaneous Soft AP and client mode, full IP and WLAN stacks, complete device server application and industry best 5-year warranty.

    Robust Networking Solution:Lantronix' xPico Wi-Fi is an extremely compact, low power networking solution that enables wireless LAN connectivity on virtually any solution with a SPI, USB (device) or serial interface. Lantronix industry-proven device server application and full IP stack enables seamless remote access to device data simplifying design integration, all while providing robust connectivity.

    Simultaneous Access Point & Client Mode:The xPico Wi-Fi is a state-of-the-art solution that offers all the functions one can expect including a unique simultaneous Soft-AP and Client mode. This allows for easy points of access while maintaining a secure network.

    Flexibility:All members of the xPico product family use the same pin compatible interface, providing unmatched flexibility whether it is Wi-Fi or Ethernet when it comes to choosing the right network device for your application.

    Cost Savings & Faster Time-To-Market:As one of the smallest embedded device servers in the world, xPico Wi-Fi can be utilized in designs typically intended for chip solutions, befitting in advantages to cost and time-to-market. Its 'zero host load' eliminates any need for drivers on the connected microcontroller making implementation easy and fast with virtually no need to write a single line of code. This translates to considerably lower development costs and faster time-to-market. As xPico Wi-Fi meets FCC Class B, UL and EN EMC and safety compliance, your development time is shortened.

    View our wide range of Embedded Networking products

    View our portfolio of M2M and Wireless products

    See all products from our supplier Lantronix

    Features:

    • Wireless LAN Interface
    • IEEE 802.11 b/g and IEEE 802.11n (single stream) WLAN interface (2.4 GHz only)
    • IEEE 802.11 d/h/i/j/k/w/r
    • WPS 2.0 support
    • u.FL connector for external antenna
    • Serial Interface
    • Two Serial CMOS Ports (3.3V, 5V tolerant)
    • 300 to 921.6 Kbps
    • Flow control XON/XOFF, RTS/CTS (SPort 1 only)
    • Lantronix tunneling application
    • ModBus TCP, Modbus ASCII, Modbus RTU
    • Host Interface
    • Dual Serial Port, SPI, USB 2.0 (device)
    • 8 GPIO
    • Network Protocols
    • TCP/IP, UDP/IP, DHCP, ARP, ICMP, DHCP, Auto-IP, DNS, SNMPv1, TFTP
    • Networking Capabilities
    • Soft Access Point with DHCP Server
    • Lantronix SmartRoam™ Technology continually tracks Wi-Fi signal strength within range, along with preauthentication and caching resulting in smooth and automatic transition to access points without delay
    • QuickConnect: Dynamic Profiles facilitate easy and rapid connections to access points
    • Management and Control
    • Web Server - Landing Page
    • CLI (Serial Monitor Port), Telnet
    • XML import and Export (XCR)
    • Field upgradable firmware (OTA)
    • Security
    • IEEE 802.11i Support - WPA-Personal, WPA2-Personal
    • 256-bit AES Encryption
    • Architecture
    • ARM Cortex M3 class processor with on-chip Flash and SRAM
    • 1MB Flash and 128 KB SRAM
    • SPI Flash stores
    • Included Software
    • MS Windows-based DeviceInstaller™
    • MS Windows-based Com Port Redirector
    • Power
    • Input Voltage: 3.3VDC
    • Low power consumption of approximately 20μA standby
    • Physical Interface
    • 40-pin Board-to-Board SMT Connector
    • Environmental
    • Operating Temp: -40° to +85° C
    • Storage Temp: -40° to +85° C
    • Relative Humidity: 0% to 90% non-condensing
    • Certifications
    • FCC Class B, UL and EN EMC
    • Packaging
    • Dimensions: 24mm (L) x 16.5mm (W) x 5.64mm (H)
    • Weight: 2.5g
    • Warranty
    • 5-Year Limited

    Internal antenna - InSide™ 2.4 GHz - WLAN

    ProAnt InSide 2.4 GHz - WLAN Internal antenna - InSide 2.4 GHz - WLAN

    MPN:

    InSide™ 2.4 GHz - WLAN

    Manufacturer L3 Communications

    Proant

    Description:

    Antenna covering the ISM band 2400 – 2485 MHz and 5150-5875 MHz used for WLAN. The antenna is designed for inside mounting on non-conductive surfaces such as plastic and the antenna includes adhesive for attachment. InSideWLAN is a ground plane independent antenna including 10 cm coaxial cable with MHF connector. The antennamight need to be retuned to give optimum performance.

    View our wide range of Antennae products

    View our portfolio of M2M and Wireless products

    See all products from our supplier Proant

    Internal antenna - OnBoard™ 868 MHz

    ProAnt OnBoard 868 MHz Internal antenna - OnBoard 868 MHz

    MPN:

    OnBoard™ 868 MHz

    Manufacturer L3 Communications

    Proant

    Description:

    Antenna covering the 868 MHz ISM band. The antenna is designed for mounting on PCB/PWB by manual soldering of through hole connector pins. The antenna includes adhesive for attachment. The antenna might need optimization when integraded into products.

    View our wide range of Antennae products

    View our portfolio of M2M and Wireless products

    See all products from our supplier Proant

    Internal antenna - OnBoard™ 418 MHz

    ProAnt OnBoard 418 MHz Internal antenna - OnBoard 418 MHz

    MPN:

    OnBoard™ 418 MHz

    Manufacturer L3 Communications

    Proant

    Description:

    Antenna covering one of 418 MHz ISM band. The antenna is designed for mounting on PCB/PWB by manual soldering of through hole connector pins. The antenna includes adhesive for attachment. The antenna need tuning component to be optimized to correct frequency.

    View our wide range of Antennae products

    View our portfolio of M2M and Wireless products

    See all products from our supplier Proant

    Internal antenna - OnBoard™ 315 MHz

    ProAnt OnBoard 315 MHz Internal antenna - OnBoard 315 MHz

    MPN:

    OnBoard™ 315 MHz

    Manufacturer L3 Communications

    Proant

    Description:

    Antenna covering the 315 MHz ISM band. The antenna is designed for mounting on PCB/PWB by manual soldering of through hole connector pins. The antenna includes adhesive for attachment. The antenna need a tuning component to be optimized to correct frequency.

    View our wide range of Antennae products

    View our portfolio of M2M and Wireless products

    See all products from our supplier Proant

    Internal antenna - OnBoard™ 434 MHz

    ProAnt OnBoard 434 MHz Internal antenna - OnBoard 434 MHz

    MPN:

    OnBoard™ 434 MHz

    Manufacturer L3 Communications

    Proant

    Description:

    Antenna covering one of 434 MHz ISM band. The antenna is designed for mounting on PCB/PWB by manual soldering of through hole connector pins. The antenna includes adhesive for attachment. The antenna need tuning component to be optimized to correct frequency.

    View our wide range of Antennae products

    View our portfolio of M2M and Wireless products

    See all products from our supplier Proant

    Internal antenna - OnBoard™ 2.4 GHz - WLAN

    ProAnt OnBoard 2.4 GHz - WLAN Internal antenna - OnBoard 2.4 GHz - WLAN

    MPN:

    OnBoard™ 2.4 GHz - WLAN

    Manufacturer L3 Communications

    Proant

    Description:

    Antenna covering the ISM band 2400 – 2485, 5150 – 5875 MHz used for Bluetooth, Zigbee and other applications.. The antenna is designed for mounting on PCB/PWB by manual soldering of through hole connector pins. The antenna includes adhesive for attachment. The antenna might need to be retuned to give optimum performance.

    View our wide range of Antennae products

    View our portfolio of M2M and Wireless products

    See all products from our supplier Proant

    Internal antenna - OnBoard™ 915 MHz

    ProAnt OnBoard 915 MHz Internal antenna - OnBoard 915 MHz

    MPN:

    OnBoard™ 915 MHz

    Manufacturer L3 Communications

    Proant

    Description:

    Antenna covering the 915 MHz ISM band. The antenna is designed for mounting on PCB/PWB by manual soldering of through hole connector pins. The antenna includes adhesive for attachment. The antenna might need optimization when integraded into products.

    View our wide range of Antennae products

    View our portfolio of M2M and Wireless products

    See all products from our supplier Proant

    Internal antenna - OnBoard™ GSM EU+US

    ProAnt OnBoard GSM EU+US Internal antenna - OnBoard GSM EU+US

    MPN:

    OnBoard™ GSM EU+US

    Manufacturer L3 Communications

    Proant

    Description:

    Antenna covering the GSM 900, 1800 and 1900 bands. The antenna is designed for mounting on PCB/PWB by manual soldering of through hole connector pins. The antenna includes adhesive for attachment. The OnBoard GSM is also available for mounting onto GSM modules. OnBoard GSM is a ground plane dependent antenna and should be mounted on the PCB/PWB RF ground plane. The antenna might need to be retuned to give optimum performance and 3G (UMTS) frequency range.

    View our wide range of Antennae products

    View our portfolio of M2M and Wireless products

    See all products from our supplier Proant

    External antenna - Ex-It GSM/3G/868 MHz

    ProAnt Ex-It GSM/3G/868 MHz External antenna - Ex-It GSM/3G/868 MHz

    MPN:

    Ex-It GSM/3G/868 MHz

    Manufacturer L3 Communications

    Proant

    Description:

    Antenna covering, 868 MHz, GSM 850/900 (880-960 MHz) and GSM 1800, 2100 (1710-2170 MHz) when mounted on a small metal box.

    View our wide range of Antennae products

    View our portfolio of M2M and Wireless products

    See all products from our supplier Proant

    External antenna - Ex-It GSM/3G Magnet

    ProAnt Ex-It GSM/3G Magnet External antenna - Ex-It GSM/3G Magnet

    MPN:

    Ex-It GSM/3G Magnet

    Manufacturer L3 Communications

    Proant

    Description:

    Antenna covering GSM 850/900 (824-960 MHz) and GSM 1800, 2100 (1710-2170 MHz). Having connector options SMA, SMB and FME, on a 2.5m RG174 cable.

    View our wide range of Antennae products

    View our portfolio of M2M and Wireless products

    See all products from our supplier Proant

    External antenna - Ex-It GSM/3G T-shape

    ProAnt Ex-It GSM/3G T-Shape External antenna - Ex-It GSM/3G T-shape

    MPN:

    Ex-It GSM/3G T-Shape

    Manufacturer L3 Communications

    Proant

    Description:

    Antenna covering GSM 850/900 (824-960 MHz) and GSM 1800, 2100 (1710-2170 MHz). Having connector options SMA, SMB and FME, on a 2.5m RG174 cable.

    View our wide range of Antennae products

    View our portfolio of M2M and Wireless products

    See all products from our supplier Proant

    External antenna - Ex-It 434 MHz

    ProAnt Ex-It 434 MHz External antenna - Ex-It 434 MHz

    MPN:

    Ex-It 434 MHz

    Manufacturer L3 Communications

    Proant

    Description:

    Antenna covering, 434 MHz when mounted on a metal box.

    View our wide range of Antennae products

    View our portfolio of M2M and Wireless products

    See all products from our supplier Proant

    External antenna - Ex-It 2.4 GHz TNC

    ProAnt Ex-It 2.4 GHz TNC External antenna - Ex-It 2.4 GHz TNC

    MPN:

    Ex-It 2.4 GHz TNC

    Manufacturer L3 Communications

    Proant

    Description:

    Robust antenna covering the ISM band 2400 – 2485 MHz having TNC connector.

    View our wide range of Antennae products

    View our portfolio of M2M and Wireless products

    See all products from our supplier Proant

    External antenna - Ex-It 2.4 GHz Foldable

    ProAnt Ex-It 2.4 GHz Foldable External antenna - Ex-It 2.4 GHz Foldable

    MPN:

    Ex-It 2.4 GHz Foldable

    Manufacturer L3 Communications

    Proant

    Description:

    Antenna covering the ISM band from 2400 to 2485 MHz. The antenna has SMA or RPSMA connector and can be tilted 90 degrees.

    View our wide range of Antennae products

    View our portfolio of M2M and Wireless products

    See all products from our supplier Proant

    External antenna - Ex-It 2.4 GHz Cable

    ProAnt Ex-It 2.4 GHz Cable External antenna - Ex-It 2.4 GHz Cable

    MPN:

    Ex-It 2.4 GHz Cable

    Manufacturer L3 Communications

    Proant

    Description:

    Antenna covering the ISM band from 2400 to 2485 MHz. The antenna has U.FL (MHF) connector on cable and the antennahas a thread with a nut and washer for firm mounting on various material and thickness.

    View our wide range of Antennae products

    View our portfolio of M2M and Wireless products

    See all products from our supplier Proant

    External antenna - Ex-It WLAN Foldable

    ProAnt Ex-It WLAN Foldable External antenna - Ex-It WLAN Foldable

    MPN:

    Ex-It WLAN Foldable

    Manufacturer L3 Communications

    Proant

    Description:

    Antenna covering the ISM band for WLAN system 802.11 a/b/g/n. The antenna has SMA or RP-SMA connector and can be tilted 90 degrees.

    View our wide range of Antennae products

    View our portfolio of M2M and Wireless products

    See all products from our supplier Proant

    External antenna - Ex-It 2.4 GHz

    ProAnt Ex-It 2.4 GHz External antenna - Ex-It 2.4 GHz

    MPN:

    Ex-It 2.4 GHz

    Manufacturer L3 Communications

    Proant

    Description:

    Antenna covering the ISM band from 2400 to 2485 MHz. The antenna has integrated SMA/m or RP-SMA connector. The Ex-IT 2400 is a quarter wave antenna that gives optimum performance when mounting on ground plane or matched to a PCB.

    View our wide range of Antennae products

    View our portfolio of M2M and Wireless products

    See all products from our supplier Proant

    External antenna - Outside™ GP Wall 315

    ProAnt Outside GP Wall 315 External antenna - Outside GP Wall 315

    MPN:

    Outside™ GP Wall 315

    Manufacturer L3 Communications

    Proant

    Description:

    Antenna covering the 315MHz band for mounting on both metallic and non-metallic surfaces. The antenna can either be connected by RG174 or RG58 cables.

    View our wide range of Antennae products

    View our portfolio of M2M and Wireless products

    See all products from our supplier Proant

    External antenna - Outside™ GP Wall 418

    ProAnt Outside GP Wall 418 External antenna - Outside GP Wall 418

    MPN:

    Outside™ GP Wall 418

    Manufacturer L3 Communications

    Proant

    Description:

    Antenna covering 418 MHz ISM band for mounting on both metallic and non-metallic surfaces. The antenna can either be connected by RG174 or RG58 cables.

    View our wide range of Antennae products

    View our portfolio of M2M and Wireless products

    See all products from our supplier Proant

    External antenna - Outside™ GP Wall 434

    ProAnt Outside GP Wall 434 External antenna - Outside GP Wall 434

    MPN:

    Outside™ GP Wall 434

    Manufacturer L3 Communications

    Proant

    Description:

    Antenna covering 434 MHz ISM band for mounting on both metallic and non-metallic surfaces. The antenna can either be connected by RG174 or RG58 cables.

    View our wide range of Antennae products

    View our portfolio of M2M and Wireless products

    See all products from our supplier Proant

    External antenna - Outside™ GP Wall EU

    ProAnt Outside GP Wall EU External antenna - Outside GP Wall EU

    MPN:

    Outside™ GP Wall EU

    Manufacturer L3 Communications

    Proant

    Description:

    Antenna covering 434 MHz, 868 MHz, GSM 900/1800/1900 and UMTS for mounting on both metallic and non-metallic surfaces. The antenna is available as wall mount or through hole versions. The antenna can either be connected by RG174 or RG58 cables. Patent pending antenna giving good performance.

    View our wide range of Antennae products

    View our portfolio of M2M and Wireless products

    See all products from our supplier Proant

    External antenna - Outside™ GP Wall 3G/4G

    ProAnt Outside GP Wall 3G/4G External antenna - Outside GP Wall 3G/4G

    MPN:

    Outside™ GP Wall 3G/4G

    Manufacturer L3 Communications

    Proant

    Description:

    Antenna covering the European 3G and 4G bands, LTE I/III/VII/XX (800/1800/2100/2600), for mounting on both metallic and non-metallic surfaces. The antenna is available as wall mount or through hole versions. The antenna can either be connected by RG174 or RG58 cables. Patent pending giving antenna good performance.

    View our wide range of Antennae products

    View our portfolio of M2M and Wireless products

    See all products from our supplier Proant

    External antenna - Outside™ GP Wall US

    ProAnt Outside GP Wall US External antenna - Outside GP Wall US

    MPN:

    Outside™ GP Wall US

    Manufacturer L3 Communications

    Proant

    Description:

    Antenna covering 315, 868 MHz, and GSM 850/1900/band 4 for mounting on both metallic and non-metallic surfaces. The antenna is available as wall mount or through hole versions. The antenna can either be connected by RG174 or RG58 cables. Patent pending antenna giving good performance.

    View our wide range of Antennae products

    View our portfolio of M2M and Wireless products

    See all products from our supplier Proant

    External antenna - Outside™ GP Wall IP68

    ProAnt Outside GP Wall IP68 External antenna - Outside GP Wall IP68

    MPN:

    Outside™ GP Wall IP68

    Manufacturer L3 Communications

    Proant

    Description:

    Antenna covering 434 MHz, 868 MHz, GSM 900/1800/1900 and UMTS for mounting on both metallic and non-metallic surfaces. The antenna is available as wall mount or through hole versions. The antenna can either be connected by RG174 or RG58 cables. Patent pending antenna giving good performance. Special design for attractive look.

    View our wide range of Antennae products

    View our portfolio of M2M and Wireless products

    See all products from our supplier Proant

    External antenna - Outside™ GP TH 315

    ProAnt Outside GP TH 315 External antenna - Outside GP TH 315

    MPN:

    Outside™ GP TH 315

    Manufacturer L3 Communications

    Proant

    Description:

    Antenna covering 315 MHz ISM band for mounting on both metallic and non-metallic surfaces. The antenna can either be connected by RG174 or RG58 cables.

    View our wide range of Antennae products

    View our portfolio of M2M and Wireless products

    See all products from our supplier Proant

    External antenna - Outside™ GP TH 434

    ProAnt Outside GP TH 434 External antenna - Outside GP TH 434

    MPN:

    Outside™ GP TH 434

    Manufacturer L3 Communications

    Proant

    Description:

    Antenna covering 434 MHz ISM band for mounting on both metallic and non-metallic surfaces. The antenna can either be connected by RG174 or RG58 cables.

    View our wide range of Antennae products

    View our portfolio of M2M and Wireless products

    See all products from our supplier Proant

    External antenna - Outside™ GP TH 418

    ProAnt Outside GP TH 418 External antenna - Outside GP TH 418

    MPN:

    Outside™ GP TH 418

    Manufacturer L3 Communications

    Proant

    Description:

    Antenna covering 418 MHz ISM band for mounting on both metallic and non-metallic surfaces. The antenna can either be connected by RG174 or RG58 cables.

    View our wide range of Antennae products

    View our portfolio of M2M and Wireless products

    See all products from our supplier Proant

    External antenna - Outside™ GP TH EU

    ProAnt Outside GP TH EU External antenna - Outside GP TH EU

    MPN:

    Outside™ GP TH EU

    Manufacturer L3 Communications

    Proant

    Description:

    Antenna covering 434 , 868 MHz, GSM 900/1800/1900 and UMTS for mounting on both metallic and non-metallic surfaces. The antenna is available as wall mount or through hole versions. The antenna can either be connected by RG174 or RG58 cables. Patent pending antenna giving good performance.

    View our wide range of Antennae products

    View our portfolio of M2M and Wireless products

    See all products from our supplier Proant

    External antenna - Outside™ GP TH US

    ProAnt Outside GP TH US External antenna - Outside GP TH US

    MPN:

    Outside™ GP TH US

    Manufacturer L3 Communications

    Proant

    Description:

    Antenna covering 315, 868 MHz, and GSM 850/1900/band 4 for mounting on both metallic and non-metallic surfaces. The antenna is available as wall mount or through hole versions. The antenna can either be connected by RG174 or RG58 cables. Patent pending antenna giving good performance.

    View our wide range of Antennae products

    View our portfolio of M2M and Wireless products

    See all products from our supplier Proant

    External antenna - FlatWhip™ GSM/3G

    ProAnt FlatWhip GSM/3G External antenna - FlatWhip GSM/3G

    MPN:

    FlatWhip™ GSM/3G

    Manufacturer L3 Communications

    Proant

    Description:

    Antenna covering the GSM 900, 1800, 1900 and 3G (UMTS). The antenna is a robust replacement for whip antennas. It includes an integrated SMA connector for screw on mounting on fixed SMA jack. The antenna seals when mounting giving a water protection depending on the surface flatness and smoothness. To be mounted on metallic surfaces.

    View our wide range of Antennae products

    View our portfolio of M2M and Wireless products

    See all products from our supplier Proant

    External antenna - Outside™ LP EU

    ProAnt Outside LP EU External antenna - Outside LP EU

    MPN:

    Outside™ LP EU

    Manufacturer L3 Communications

    Proant

    Description:

    Antenna covering GSM 850, 900 (824-960 MHz) and GSM 1800, 1900, UMTS (1710-2170 MHz) for outside mounting on non-conductive such as wood and concrete. surfaces. The antenna has very low height and includes a cap covering the screw heads giving an attractive look. The technical design giving dual polarisation for robust communication inhouse and in citys.

    View our wide range of Antennae products

    View our portfolio of M2M and Wireless products

    See all products from our supplier Proant

    External antenna - Outside™ LP RFID

    ProAnt Outside LP RFID External antenna - Outside LP RFID

    MPN:

    Outside™ LP RFID

    Manufacturer L3 Communications

    Proant

    Description:

    Antenna covering 868 MHz range for RFID applications for mounting on non-conductive such as wood and concrete surfaces. The antenna has very low height and includes a cap covering the screw heads giving an attractive look. The technical design giving circular polarization giving robust reading of tags.

    View our wide range of Antennae products

    View our portfolio of M2M and Wireless products

    See all products from our supplier Proant

    <