CSP / BGA Burn-In Socket

Manufacturer's part number :


Manufacturer Wells CTI


Description :

The 772-B04196-XXX from Sensata is an Open Top burn-in/test socket for CSP / BGA packages on 0.4 mm pin pitch

View our wide range of Socket and Card products

View our portfolio of Connectors / Cables

See all products from our supplier Sensata



  • Quote and availability

  • Ask our experts


  • 0.4mm pitch for large array
  • Compression surface mount
  • Support up to 34x34 ball matrix
  • Z-axis compliant buckling beam contact provides stable contact performance independent of solder ball height and composition
  • Sharp edge of dual-point contact tip provides high electrical performance, minimizing ball damage
  • Staggered fan out footprint for PCB design consideration
  • Advanced latching system provide the ability to handle very thin package, limiting package warp
Features Similar products
Temperature Range 150 °C  

  similar products found

Search similar products
Package Type CSP / BGA  
Pitch (mm) 0.4  
Number of Positions 196  
Socket Style Open Top  
Termination Style Surface mount