CSP / BGA Burn-In Socket

Manufacturer's part number :

772-B04196-XXX

Manufacturer Wells CTI

Sensata

Description :

The 772-B04196-XXX from Sensata is an Open Top burn-in/test socket for CSP / BGA packages on 0.4 mm pin pitch

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    Features

  • 0.4mm pitch for large array
  • Compression surface mount
  • Support up to 34x34 ball matrix
  • Z-axis compliant buckling beam contact provides stable contact performance independent of solder ball height and composition
  • Sharp edge of dual-point contact tip provides high electrical performance, minimizing ball damage
  • Staggered fan out footprint for PCB design consideration
  • Advanced latching system provide the ability to handle very thin package, limiting package warp
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Temperature Range 150 °C  

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Package Type CSP / BGA  
Pitch (mm) 0.4  
Number of Positions 196  
Socket Style Open Top  
Termination Style Surface mount