USI | Acal BFi DE

Kontakt: Dietzenbach +49 (0) 6074 4098 0, Gröbenzell +49 (0) 8142 6520 0

Artikelnummer des Herstellers Produktbeschreibung Stk
Manufacturer's part number Product Description Qty

USI

World Leader in SiP Modules

USI are the leader in making the complex simple. Their wireless module technology is utilised by the world’s leading designers and manufacturers of consumer and communication products, with SiP and miniaturisation capabilities respected on a global scale. They pride themselves on being able to provide an end-to-end service of design, manufacture, test, distribution and repair for electronic components and assemblies for Original Equipment Manufacturers (OEM).


Why USI?

As an advanced provider of System in Package (SiP) modules, ranging from IoT solutions, through to Wi-Fi, Bluetooth and LoRa, USI work with the best chip suppliers in the world to offer a range of impressive capabilities and benefits such as:

  • Advanced SiP & Miniaturisation Technology

  • High Quality & Reliability

  • Wide Variety of Module Choice



SiP module


Acal BFi’s offer

Acal BFi have the capabilities to combine our own in-house expertise with the skill and resources of USI to assist from design through to post-production quickly and easily, helping you develop ground-breaking designs incorporating the most advanced technologies.

 

Need help choosing the right module for your application?

Our IoT and Wi-Fi experts are on hand to offer advice and answer any questions you may have on the USI range.

Contact us to discuss your requirements.

IoT Module Solutions

USI offer a wide range of miniaturised hosted and hostless IoT SiP solutions that have comprehensive design capabilities and advanced packaging solutions. Providing many advantages such as faster design cycles, simplified bill of materials (BoM) and increased performance within many different applications in multiple markets. Their lower power consumption and excellent radio performance makes them the best solutions for embedded 802.11 a/b/g/n dual-band Wi-Fi requirements such as industrial and wireless devices.

Key features

  • Lowest total cost solution
  • No driver porting required
  • Lower power consumption
  • Smaller footprint






Hosted vs Hostless IoT Solutions

Deciding if your IoT solution should be hosted or hostless is down to preference. Typical IoT applications will require smaller modules, especially for battery-operated applications, where these devices would benefit from using a hostless USI solution. The hostless module’s internal MCU acts as a host with the application running from the internal memory and connecting to the MCU using an interface such as UART, SPI, I2C, 12S, ADC, PWM and GPIOs.

Another option is to use an external Host MCU, where the customer application runs on the Host MCU and communicates to the IoT module where the Wi-Fi/ Bluetooth network stack/ drivers are located. Communication between the IoT module and Host MCU can be via an interface with a AT-Command set or an application specific protocol.

Module specifications

Module Chipset Wi-Fi 802.11 Band (GHz) Bluetooth Antenna
WM-N-BM-09 CYW43362 +
STM32F205
b/g/n 2.4 - -
WM-N-BM-14 CYW43362 +
STM32F205
b/g/n 2.4 - PCB Antenna +
U.FL
WM-BN-BM-22 CYW43438 +
STM32F412
b/g/n 2.4 4.1 U.FL
WM-AN-BM-23 CYW43907 a/b/g/n 2.4/5 - -
WM-N-BM-30 CYW43362 +
STM32F411
b/g/n 2.4 - PCB Antenna
WM-BAN-BM-33 CYW43907 +
CYW20707
a/b/g/n 2.4/5 - -

Wi-Fi & Combo Module Solutions

USI have over 20 years’ experience in wireless technology and have developed a unique SiP and miniaturisation process that enables embedded applications to have the benefits of high design flexibility and short-term development cycles, that will accelerate your time to market, as well as providing increased performance within multiple applications.

Both their Wi-Fi and Combo SiP modules are based on IEEE 802.11 standards and provide full function of 802.11 a/b/g/n, with the combo modules up to Bluetooth 4.0 and FM receiver in small modules.

Key features

  • More flexible and expanded set of peripheral interfaces
  • Large number of extra general purpose input/ output pins
  • Large amount of memory
  • Higher performance CPU/ MCU
  • High level operating system
  • Advances security with WEP 64/128, WPA and TKIP, AES, CCX

Hosted Wi-Fi Solutions:

If an application requires an MCU that performs functions that cannot be run on any available hostless solutions, USI hosted solutions are ideal. A host MCU has interfaces that can communicate with the Wi-Fi module to exchange the data being sent/received over Wi-Fi from the host MCU via an operating system supported device driver. This data exchange happens over UART, SPI, PCIe or USB.

Module specifications

Module Chipset Wi-Fi 802.11 Band (GHz) Bluetooth Antenna
WM-N-BM-02 CYW43362 b/g/n 2.4 - -
BWM-BAN-BM-16 CYW43340 a/b/g/n 2.4/5 4.0 -
WM-BN-BM-26A CYW43438 b/g/n 2.4 4.1 Chip Ant
WM-BAC-BM-25 CYW43455 ac/abgn 2.4/5 4.2 U.FL
WM-BAC-BM-28 CYW43455 ac/abgn 2.4/5 4.2 -
WM-BAC-AT-09 QCA9377 ac/b/g/n 2.4/5 4.2 -
WM-BN-CYW-48 CYW43364+
CYW20719
b/g/n 2.4 5.0 -




LoRa Module Solutions

USI provide a low cost, low power, wide area network (LPWAN) wireless module that supports the LoRaWAN long range wireless protocol with an AT command set. LoRa technology offers efficient, flexible and economical solutions to real-world problems for rural and indoor use cases, where cellular and Wi-Fi/ BLE based networks are ineffective.

Key features

  • Long range
  • Low power
  • Secure encryption
  • Enables GPS free tracking applications
  • Maintains mobile communication
  • High capacity
  • Low cost


Module specifications

Module Chipset Wi-Fi 802.11 Band (MHz) Bluetooth Antenna
WM-SG-SM-42 SX1272 +
STM32L052
LoRa 868~915 - U.FL



Get in touch

Please get in touch if you would like to find out more about the USI product range or to discuss your project with an M2M/ Communications expert.



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