Leaded Ceramic Chip Carrier

Artikelnummer des Herstellers :

CA-196-0.635-03

Hersteller Enplas

Enplas

Beschreibung :

The CA-196-0.635-03 from Enplas is a 196 way carrier for LDCC packages, for use with the mating socket in test and burn-in, or for stand alone package protection and transportation

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    Eigenschaften

  • Designed for maximum device lead protection.
  • Live and dead bug available.
Eigenschaften ähnliche Produkte
Temperature Range -65 to 150 °C  

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Package Type LDCC  
Pitch (mm) 0.635  
Number of Positions 196  
Package Size (mm) 34.29 x 4  
Termination Style Through hole